CN102115906A - Device and method for electroplating substrate - Google Patents
Device and method for electroplating substrate Download PDFInfo
- Publication number
- CN102115906A CN102115906A CN2010101886825A CN201010188682A CN102115906A CN 102115906 A CN102115906 A CN 102115906A CN 2010101886825 A CN2010101886825 A CN 2010101886825A CN 201010188682 A CN201010188682 A CN 201010188682A CN 102115906 A CN102115906 A CN 102115906A
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- China
- Prior art keywords
- substrate
- electrode unit
- unit
- electrode
- rotary unit
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
Abstract
The invention discloses a device and a method for electroplating substrates.According to the embodiments of the present invention, the device comprises a first rotary unit, a second rotary unit and a supply part.The first rotary unit comprises an electrode unit facing the substrate and the electrode unit rotates with respect to the substrate.The second rotary unit drives the first rotary unit to rotate around the shaft parallel to the rotating shaft of the first rotary unit and arranged outside the first rotary unit.The supply part supplies the electroplating solution to the substrate.
Description
The reference of related application
The application requires the right of priority to the 10-2009-0134071 korean patent application of Korea S Department of Intellectual Property submission on December 30th, 2009, and its disclosed full content is incorporated into this by quoting as proof.
Technical field
The present invention relates to the method for substrate electroplanting device and electroplating substrate.
Background technology
In order on substrate, to form circuit pattern, can on this substrate, form conductive layer.Plating relates to such technology: metal ion moves to negative electrode by electric field from anode (by being made by electroplated metal) in electroplating liquid storage tank, and the metal ion that arrives cathode surface then combines with electronics to form metal cover on substrate.
Owing to trend towards high-density and littler circuit pattern recently, therefore on substrate, may produce the plating deviation in the plating circuit pattern.The plating deviation makes the electrical property deterioration of the circuit pattern on the substrate, causes the defective of electroplating technology.
Summary of the invention
The invention provides the substrate electroplanting device of deviation of the electroplating thickness that can reduce on substrate, to form and the method for electroplating substrate.
An aspect of of the present present invention provides the substrate that is used for electroplating substrate electroplanting device.Devices in accordance with embodiments of the present invention can comprise: first rotary unit, and it comprises towards substrate and with respect to the electrode unit of substrate rotation; Second rotary unit, it makes first rotary unit around parallel with the turning axle of first rotary unit and be positioned at the axle revolution (revolve) of the first rotary unit outside; And supply department, provide electroplating solution to substrate.
Described substrate is configured to a plurality of substrates, and a plurality of substrate is set to around electrode unit.Electrode unit can center on substrate.
Described substrate is configured to a plurality of substrates, and electrode unit can comprise internal electrode and outer electrode, and a plurality of substrates can be set to around internal electrode, and outer electrode can center on a plurality of substrates.
Substrate is revolved round the sun on the direction opposite with the sense of rotation of electrode unit, and supply department can make electroplating solution flow on the direction parallel with the turning axle of first rotary unit.
Another aspect of the present invention provides the substrate that is used for electroplating substrate electroplanting device.Devices in accordance with embodiments of the present invention can comprise: first rotary unit, and it comprises towards substrate and with respect to the electrode unit of substrate rotation; And supply department, it provides electroplating solution to substrate, and electroplating solution is flowed on the direction parallel with the turning axle of first rotary unit.
Substrate can be configured to a plurality of substrates, and a plurality of substrate can be set to around electrode unit.Electrode unit can center on substrate.
Substrate can be configured to a plurality of substrates, and electrode unit can comprise internal electrode and outside, and a plurality of substrates can be set to around internal electrode, and outer electrode can center on a plurality of substrates.
Substrate can revolve round the sun on the direction opposite with the sense of rotation of electrode unit.This device may further include second rotary unit, and it makes first rotary unit around parallel with the turning axle of first rotary unit and be positioned at the axle revolution of the first rotary unit outside.
Another aspect of the present invention provides a kind of method of electroplating substrate.Method can comprise according to an embodiment of the invention: electrode unit is rotated with respect to substrate, and wherein, electrode unit is towards substrate; Make substrate around parallel with the turning axle of electrode unit and be positioned at the axle revolution of the rotation radius outside of electrode unit; And provide electroplating solution to substrate.
Electrode unit can comprise with respect to the rotation of substrate: substrate is revolved round the sun on the direction opposite with the sense of rotation of electrode unit, and providing of electroplating solution can comprise: electroplating solution is flowed on the direction parallel with the turning axle of electrode unit.
Another aspect of the present invention provides a kind of method of electroplating substrate.Method can comprise according to an embodiment of the invention: electrode unit is rotated with respect to substrate, and wherein, electrode unit is towards substrate; And provide electroplating solution to substrate, electroplating solution is flowed on the direction parallel with the turning axle of electrode unit.
Electrode unit can comprise with respect to the rotation of substrate: substrate is revolved round the sun on the direction opposite with the sense of rotation of electrode unit.
This method may further include: make substrate around parallel with the turning axle of electrode unit and be positioned at the axle revolution of the rotation radius outside of electrode unit.
Other aspect and advantage of the present invention will be partly set forth in the following description, and partly apparent from specification sheets, perhaps can know by practice of the present invention.
Description of drawings
Fig. 1 shows electroplanting device according to an embodiment of the invention.
Fig. 2 shows first rotary unit of electroplanting device according to an embodiment of the invention.
Fig. 3 shows second rotary unit of electroplanting device according to an embodiment of the invention.
Fig. 4 shows according to one embodiment of present invention, and how electroplanting device moves.
Embodiment
By the following drawings and description, the features and advantages of the present invention will become apparent.
The apparatus and method that are used for electroplating substrate are according to an embodiment of the invention described in more detail hereinafter with reference to accompanying drawing.Those identical or corresponding parts all are endowed identical reference number and have nothing to do with figure number, and have omitted the multiple description.
Fig. 1 shows electroplanting device 1000 according to an embodiment of the invention.As shown in Figure 1, substrate electroplanting device 1000 according to an embodiment of the invention can make the plating minimum deviation by electroplating solution is provided equably on the surface of substrate 10.
Electroplate liquid storage tank 310 and can hold electroplating solution.First rotary unit 100 and second rotary unit 200 can be immersed in the electroplating solution.
Therefore, this set allows pump 330 to provide electroplating solution on the direction parallel with the axial direction due of revolution substrate 10, so that the electroplating solution surface of contact substrate 10 equably.Therefore, supply department 300 provides equably and will be helped to reduce the plating deviation by the electroplated metal ion by the whole surface at substrate 10.
Strainer 320 can be placed on pump 330 and electroplate between the liquid storage tank 310 and bag filter is contained in impurity in the electroplating solution.
Fig. 2 shows first rotary unit 100 of electroplanting device 1000 according to an embodiment of the invention.As shown in Figure 2, first rotary unit 100 can make substrate 10 and electrode relative to each other rotate.First rotary unit 100 can comprise: internal electrode 132, outer electrode 134, first driving mechanism 110, substrate fixer 140 and second driving mechanism 120.
Here, voltage can be put on internal electrode 132 and outer electrode 134, therefore, internal electrode 132 and outer electrode 134 can be with respect to substrate 10 as anodes.
Substrate fixer 140 can supporting substrate 10.A plurality of substrates 10 (for example, four substrates 10) that can support by substrate fixer 140.Substrate 10 can have the shape of longitudinal extension, and four substrates 10 can be set to around internal electrode 132, and is inserted in the outer electrode 134.
Here, substrate fixer 140 can be rotationally attached to internal electrode 132 and outer electrode 134.Can form opening on the two ends of first rotary unit 100, this opening relates to the surface towards substrate fixer 140 of substrate fixer 140 and outer electrode 134, so that the electroplating solution smooth flow.
By this set, a surface of substrate 10 can be towards internal electrode 132, and another surface of substrate 10 can be towards outer electrode 134.
Substrate fixer 140 can apply voltage to substrate 10, and this voltage is opposite with the voltage that is applied to internal electrode 132 and outer electrode 134, and therefore, substrate 10 can be used as negative electrode with respect to internal electrode 132 and outer electrode 134.Therefore, can on substrate 10, electroplate the metal ion that is included in the electroplating solution.
Second driving mechanism 120 can make substrate fixer 140 rotations.Second driving mechanism 120 can make substrate fixer 140 rotate on the direction opposite with the sense of rotation of first driving mechanism 110.Therefore, substrate 10, internal electrode 132 and outer electrode 134 can have circumferential motion, and wherein, substrate 10 revolves round the sun on the direction opposite with the sense of rotation of internal electrode 132 and outer electrode 134.
Here, if electroplating solution flows between substrate 10, internal electrode 132 and outer electrode 134 on the direction parallel with the turning axle (A shown in Fig. 2) of substrate 10, internal electrode 132 and outer electrode 134, then electroplating solution can be evenly distributed between substrate 10, internal electrode 132 and the outer electrode 134, has reduced the deviation in the electroplating substrate 10.
Fig. 3 shows second rotary unit 200 of electroplanting device 1000 according to an embodiment of the invention.As shown in FIG. 3, second rotary unit 200 can comprise: first rotary unit 100, cover keep lever 210 and the 3rd driving mechanism 220.
The 3rd driving mechanism 220 can make cover keep lever 210 rotations.Here, the 3rd driving mechanism 220 passes the center of four first rotary units 100 and can make four first rotary units 100 around axle (the B Fig. 3 shown in) revolution parallel with the turning axle (A shown in Fig. 3) of first rotary unit 100.
Simultaneously, electroplating liquid storage tank 310 can hold and rotatably support second rotary unit 200.
Fig. 4 shows according to one embodiment of present invention, and how electroplanting device 1000 turns round.As shown in FIG. 4, internal electrode 132 and substrate 10 can have circumferential motion on the reverse direction around the center of internal electrode 132, and outer electrode 134 can rotate on the direction identical with the sense of rotation of internal electrode 132 around the center of internal electrode 132, therefore with the revolution side of substrate 10 in the opposite direction on rotation.
Then, four first rotary units 100 can be around center that is positioned at four first rotary units 100 and axle (the B Fig. 4 shown in) revolution parallel with the turning axle of internal electrode 132.
Here, as shown in Figure 3, electroplating solution can be offered first rotary unit 100 and second rotary unit 200 on the direction parallel with turning axle, therefore, electroplating solution can spread all over the surperficial uniform distribution of substrate 10.
Therefore, owing to metal ion is evenly distributed between substrate 10, internal electrode 132 and the outer electrode 134, so can on the surface of substrate 10, form electrolytic coating with uniform thickness.
Although the substrate electroplanting device 1000 of present embodiment is respectively by using first driving mechanism 110, second driving mechanism 120 and the 3rd driving mechanism 220 to make electrode unit 130, substrate 10 and 100 rotations of first rotary unit, but also can utilize power transmission structure (for example, gear) to make electrode unit 130, substrate 10 and 100 rotations of first rotary unit by single drive source.
Can carry out the method for electroplating substrate by using aforesaid substrate electroplanting device 1000.Method according to an embodiment of the invention can comprise: make towards the electrode unit 130 of substrate 10 with respect to substrate 10 and rotate (S100); Make substrate 10 around parallel with the turning axle of electrode unit 130 and be positioned at the axle revolution (S200) of the rotation radius outside of electrode unit 130; And be provided at mobile electroplating solution (S300) on the direction parallel with the turning axle of electrode unit 130 to substrate 10.
In the step that makes electrode unit 130 rotations with respect to substrate 10 (S100), substrate 10 and electrode unit 130 can rotate in the opposite direction.
Can come performing step S100, S200 and S300 by above-mentioned first rotary unit 100, second rotary unit 200 and supply department 300 respectively.In addition, can carry out above step by the operation of substrate electroplanting device 1000.Yet above step is not limited only to above order, also can carry out above-mentioned steps simultaneously.
According to embodiments of the invention, can on the surface of substrate, form electrolytic coating with uniform thickness.
Though described spirit of the present invention in detail with reference to specific embodiment, these embodiment only are used for the example purpose, and should not limit the present invention.Be appreciated that under the situation that does not deviate from scope and spirit of the present invention, those skilled in the art can change these embodiments or revise.
Claims (18)
1. substrate electroplanting device that is used for electroplating substrate, described device comprises:
First rotary unit comprises electrode unit, and described electrode unit is towards described substrate and with respect to described substrate rotation;
Second rotary unit is configured to make described first rotary unit around parallel with the turning axle of described first rotary unit and be positioned at the axle revolution of the described first rotary unit outside; And
Supply department, being configured to provides electroplating solution to described substrate.
2. device according to claim 1, wherein, described substrate is configured to a plurality of substrates, and described a plurality of substrate is set to around described electrode unit.
3. device according to claim 1, wherein, described electrode unit is around described substrate.
4. device according to claim 1, wherein:
Described substrate is configured to a plurality of substrates;
Described electrode unit comprises internal electrode and outer electrode;
Described a plurality of substrate is set to around described internal electrode; And
Described outer electrode is around described a plurality of substrates.
5. device according to claim 1, wherein, described substrate revolves round the sun on the direction opposite with the sense of rotation of described electrode unit.
6. device according to claim 1, wherein, described electroplating solution is flowed in described supply department on the direction parallel with the described turning axle of described first rotary unit.
7. substrate electroplanting device that is used for electroplating substrate, described device comprises:
First rotary unit comprises electrode unit, and described electrode unit is towards described substrate and with respect to described substrate rotation; And
Supply department, being configured to provides electroplating solution to described substrate, and described electroplating solution is flowed on the direction parallel with the turning axle of described first rotary unit.
8. device according to claim 7, wherein, described substrate is configured to a plurality of substrates, and described a plurality of substrate is set to around described electrode unit.
9. device according to claim 7, wherein, described electrode unit is around described substrate.
10. device according to claim 7, wherein:
Described substrate is configured to a plurality of substrates;
Described electrode unit comprises internal electrode and outer electrode;
Described a plurality of substrate is set to around described internal electrode; And
Described outer electrode is around described a plurality of substrates.
11. device according to claim 7, wherein, described substrate revolves round the sun on the direction opposite with the sense of rotation of described electrode unit.
12. device according to claim 7 also comprises: second rotary unit is configured to make described first rotary unit around parallel with the described turning axle of described first rotary unit and be positioned at the axle revolution of the described first rotary unit outside.
13. the method for an electroplating substrate, described method comprises:
Electrode unit is rotated with respect to described substrate, and described electrode unit is towards described substrate;
Make described substrate around parallel with the turning axle of described electrode unit and be positioned at the axle revolution of the rotation radius outside of described electrode unit; And
Provide electroplating solution to described substrate.
14. method according to claim 13, wherein, described electrode unit comprises with respect to the rotation of described substrate revolves round the sun described substrate on the direction opposite with the sense of rotation of described electrode unit.
15. method according to claim 13 wherein, provides described electroplating solution to comprise described electroplating solution is flowed on the direction parallel with the described turning axle of described electrode unit.
16. the method for an electroplating substrate, described method comprises:
Electrode unit is rotated with respect to described substrate, and described electrode unit is towards described substrate; And
Provide electroplating solution to described substrate, described electroplating solution is flowed on the direction parallel with the turning axle of described electrode unit.
17. method according to claim 16, wherein, described electrode unit comprises with respect to the rotation of described substrate revolves round the sun described substrate on the direction opposite with the sense of rotation of described electrode unit.
18. method according to claim 16 also comprises: make described substrate around parallel with the described turning axle of described electrode unit and be positioned at the axle revolution of the rotation radius outside of described electrode unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090134071A KR101198412B1 (en) | 2009-12-30 | 2009-12-30 | Apparatus for Plating Substrate and Method for Plating Substrate |
| KR10-2009-0134071 | 2009-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102115906A true CN102115906A (en) | 2011-07-06 |
| CN102115906B CN102115906B (en) | 2013-01-02 |
Family
ID=44214825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101886825A Expired - Fee Related CN102115906B (en) | 2009-12-30 | 2010-05-25 | Device and method for electroplating substrate |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101198412B1 (en) |
| CN (1) | CN102115906B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112575354A (en) * | 2020-11-10 | 2021-03-30 | 宁波革创新材料科技有限公司 | Method and device for electroplating inner pipe with compact layer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102300421B1 (en) * | 2019-08-09 | 2021-09-13 | 한국에너지기술연구원 | Underpotential deposition apparatus installed with rotating electrode which has Particulate matter immobilizing filter module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2219309Y (en) * | 1994-11-23 | 1996-02-07 | 中国科学院金属腐蚀与防护研究所 | Double-rotation barrel type apparatus for composite electroplating |
| CN1387239A (en) * | 2001-05-21 | 2002-12-25 | 新光电气工业株式会社 | Circuit board, semiconductor device mfg. method, and electroplating system |
| CN1636267A (en) * | 2001-12-21 | 2005-07-06 | 纳托尔公司 | Electrochemical edge and bevel cleaning process and system |
| CN101435100A (en) * | 2007-11-16 | 2009-05-20 | 联华电子股份有限公司 | Fluid region control device and operation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001003177A (en) | 1999-06-18 | 2001-01-09 | Mitsubishi Materials Corp | Disk substrate plating device |
-
2009
- 2009-12-30 KR KR1020090134071A patent/KR101198412B1/en not_active IP Right Cessation
-
2010
- 2010-05-25 CN CN2010101886825A patent/CN102115906B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2219309Y (en) * | 1994-11-23 | 1996-02-07 | 中国科学院金属腐蚀与防护研究所 | Double-rotation barrel type apparatus for composite electroplating |
| CN1387239A (en) * | 2001-05-21 | 2002-12-25 | 新光电气工业株式会社 | Circuit board, semiconductor device mfg. method, and electroplating system |
| CN1636267A (en) * | 2001-12-21 | 2005-07-06 | 纳托尔公司 | Electrochemical edge and bevel cleaning process and system |
| CN101435100A (en) * | 2007-11-16 | 2009-05-20 | 联华电子股份有限公司 | Fluid region control device and operation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112575354A (en) * | 2020-11-10 | 2021-03-30 | 宁波革创新材料科技有限公司 | Method and device for electroplating inner pipe with compact layer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102115906B (en) | 2013-01-02 |
| KR20110077474A (en) | 2011-07-07 |
| KR101198412B1 (en) | 2012-11-07 |
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Granted publication date: 20130102 Termination date: 20170525 |