JP2001152388A - Surface treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the subject device that can be applicable to a member to be surface treated, which is light weight and not having high strength like a bond magnet, and allows an uniform surface treatment not having a contact trace. SOLUTION: In a surface treatment device to conduct a surface treatment to a member to be surface treated having the inner peripheral face of a cylindrical shape, etc., support members to conduct a revolution motion are arranged around a rotary shaft, the member to be surface treated is turnably supported by the support members from an inner peripheral face side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, and more particularly to an R-Fe-B-based permanent magnet,
The present invention relates to a surface treatment apparatus useful for performing electroplating on a ring-shaped bonded magnet or a cylindrical bonded magnet.

[0002]

2. Description of the Related Art Rare-earth permanent magnets such as R-Fe-B permanent magnets represented by Nd-Fe-B-based permanent magnets use abundant and inexpensive materials as resources and have high magnetic properties. Therefore, it is used in various fields today. However, since rare-earth permanent magnets contain R and Fe, which are susceptible to oxidative corrosion in the atmosphere, if they are used without any surface treatment, they will corrode from the surface due to the presence of a slight amount of acid, alkali or moisture. Has progressed and rust is generated, and accordingly, there is a problem that magnet characteristics are degraded or varied.

[0003] In order to solve the above problems, a method of applying a metal plating film or a resin coating as an oxidation-resistant film on the magnet surface has conventionally been adopted. For example, R-Fe-B
As a method of forming a corrosion-resistant film on the surface of a system-based permanent magnet by electroplating, a method of placing a member to be plated in a mesh basket and performing plating while rotating the mesh basket (barrel method),
A method (rack method) of performing plating by supporting a member to be plated on a conductive support member connected to a negative electrode has been adopted.

[0004]

Although the above-mentioned barrel plating and rack plating are excellent in versatility, the former method is applied to a bonded magnet in which the strength of the magnet itself is not necessarily high. However, there is a problem that the magnet may be cracked or chipped. In the latter method, since the position of the magnet during the plating step is constant, the distance from the anode differs depending on the position, and the film thickness varies. Further, in recent years, in the electronics industry and the home appliance industry in which rare-earth permanent magnets are used, miniaturization and precision of parts have been advanced, and correspondingly, the magnets themselves have been required to be further miniaturized. Particularly, in the case of a bonded magnet having an inner peripheral surface such as a ring shape, it is extremely difficult with the conventional technology to efficiently perform surface treatment of a small ring-shaped magnet with high dimensional accuracy at a low cost. For example, JP-A-60-1
No. 90599 proposes a method of plating a small member by a typical barrel method. However,
In this method, not only is the magnet prone to cracking and chipping as described above, but also the magnet is small and light, so it is difficult to always maintain conduction to all magnets during the plating process.
Poor plating efficiency. On the other hand, Japanese Patent Application Laid-Open No. 61-52367 proposes a plating apparatus in which a shaft is passed through a hole of a plate-shaped work, and the work itself is rotated by rotating the shaft. However, in this apparatus, in order to rotate the work, a shaft having a large diameter must be used, so that the plating solution is hardly wrapped around the contact point between the work and the shaft, and the plating efficiency on the inner surface is poor. There is a problem that.

[0005] In view of the above, an object of the present invention is to apply the present invention to a light-weight and not necessarily high-strength surface-treated member such as a bonded magnet, and to perform a uniform surface treatment without contact marks.

[0006]

According to a first aspect of the present invention, there is provided a surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape. And a support member that performs a revolving operation around the support member, and the support member rotatably supports the surface-treated member from the inner peripheral surface side. According to a second aspect of the present invention, in the surface treatment apparatus according to the first aspect, the support member is disposed such that an axis of the support member is substantially horizontal, and a plurality of the surface treatment members are provided. It is characterized by being arranged side by side on the support member. According to a third aspect of the present invention, in the surface treatment apparatus according to the first aspect, the support member is formed of a conductive member, and a plating current is applied to the surface-treated member by the support member. . According to a fourth aspect of the present invention, in the surface treatment apparatus according to the third aspect, an insulating spacer is provided on the support member, and the surface-treated member is disposed between the insulating spacers. According to a fifth aspect of the present invention, in the surface treatment apparatus according to the fourth aspect, the insulating spacers are arranged such that the surface-treated members are arranged at equal intervals. According to a sixth aspect of the present invention, in the surface treatment apparatus of the first aspect, the support member is formed of a spiral member. According to a seventh aspect of the present invention, in the surface treatment apparatus according to the second aspect, an electrode is arranged in parallel with an axis of the support member. According to an eighth aspect of the present invention, in the surface treatment apparatus according to the seventh aspect, a plurality of the support members are arranged such that respective axes of the support members are parallel to each other, and rotation of each of the support members is performed. It is characterized by having a common axis. Claim 9
According to the present invention, in the surface treatment apparatus according to the eighth aspect, each of the support members is arranged at an equal distance from the rotation axis. An electroplating apparatus according to a tenth aspect of the present invention is a surface treatment apparatus using a plurality of the surface treatment apparatuses according to any one of the first to ninth aspects arranged in a treatment tank. It is characterized in that the rotation axes of the surface treatment devices are arranged in parallel. According to an eleventh aspect of the present invention, there is provided an electroplating apparatus for bonded magnets, wherein the surface treatment apparatus according to any one of the first to tenth aspects is used to perform electroplating on the bonded magnet. The R-Fe- according to the present invention according to claim 12.
The B-based permanent magnet is characterized by being subjected to an electroplating process using the electroplating apparatus according to claim 11 and forming a corrosion-resistant film on the surface. According to a thirteenth aspect of the present invention, there is provided a surface treatment method for a surface-treated member, wherein the surface treatment is performed using the surface treatment apparatus according to any one of the first to tenth aspects. According to a fourteenth aspect of the present invention, there is provided a member to be surface-treated, wherein a film is formed on the surface by the surface treatment method for a member to be surface-treated according to the thirteenth aspect.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface treatment apparatus according to a first embodiment of the present invention is provided with a support member that performs a revolving operation around a rotation axis, and the support member moves a member to be surface-treated from an inner peripheral surface side. It is rotatably supported. According to the present embodiment, the surface-treated member performs a revolving operation together with the support member. Therefore, in the case of electroplating, for example, the revolving operation has the effect of stirring the plating solution, so that a fresh plating solution is always supplied to the periphery of the surface-treated member, and efficient plating can be performed. At the same time, since the plating solution can flow around the inner peripheral surface of the member to be surface-treated, it is possible to efficiently perform a uniform surface treatment on the inner peripheral surface side. Further, since the surface-treated member is rotatably supported from its inner peripheral surface side,
The surface-treated member rotates by the revolution of the support member, and the contact position with the support member moves. Therefore, it is possible to perform a uniform surface treatment without leaving traces of contact with the support member. Furthermore, since the surface-treated member is supported at one point from the inner peripheral surface side by the support member, the diameter of the surface-treated member that can be treated is small, and a small ring that is extremely difficult with the conventional technology. A uniform surface treatment with a uniform film thickness and no contact marks can be efficiently performed on the shaped member.

According to a second embodiment of the present invention, there is provided a surface treatment apparatus according to the first embodiment, wherein a support member is disposed so that an axis thereof is substantially horizontal, and a plurality of surface treatment members are connected to the support member. Are arranged side by side. According to the present embodiment, a plurality of surface-treated members can be revolved with the support member. Therefore, uniform surface treatment can be performed on many surface-treated members at the same time.

A third embodiment of the present invention is directed to a surface treatment apparatus according to the first embodiment, wherein the supporting member is formed of a conductive member, and a plating current is applied to the surface-treated member by the supporting member. is there. According to the present embodiment, the electroplating process can be effectively performed. In particular, even when a plurality of surface-treated members are subjected to plating at the same time, electricity can be reliably supplied to all the surface-treated members.

In a fourth embodiment of the present invention, in the surface treatment apparatus according to the third embodiment, an insulating spacer is provided on a support member, and a surface-treated member is disposed between the insulating spacers. According to the present embodiment, since the contact between the members to be surface-treated can be prevented by the insulating spacer, it is possible to prevent the nonuniform electroplating due to the contact.

According to a fifth embodiment of the present invention, in the surface treatment apparatus according to the fourth embodiment, insulating spacers are arranged so that members to be surface-treated are arranged at equal intervals. According to this embodiment, the position or axial width of the spacer is adjusted, and the distance between the surface-treated members is made equal to each other at a predetermined size, so that the electric force to the edge portion of the surface-treated member is adjusted. The concentration of lines can be reduced, and the uniformity of plating can be further improved. It is desirable to select an appropriate value for each interval such that concentration of lines of electric force on the edge of the surface-treated member is reduced and the film thickness at the edge is uniform. Further, the spacer may be one in which the interval is adjusted to a predetermined dimension in advance and integrated with the support member, or one that can be adjusted in position.

According to a sixth embodiment of the present invention, in the surface treatment apparatus according to the first embodiment, the support member is formed by a spiral member. According to the present embodiment, the member to be surface-treated can be hung at each lower portion of the spiral member, and the contact between the members to be surface-treated can be prevented. Can be prevented. In addition, by using a helical member in which the intervals between the surface-treated members are equal to each other at a predetermined dimension, the concentration of lines of electric force on the edge portion of the surface-treated member is reduced, and the uniformity of plating is further improved. Performance can be improved.

According to a seventh embodiment of the present invention, in the surface treatment apparatus according to the second embodiment, electrodes are arranged in parallel to the axis of the support member. According to the present embodiment, since all of the suspended surface-treated members have the same distance from the electrode, all the surface-treated members are subjected to the electroplating process uniformly without variation in film thickness. Can be.

According to an eighth embodiment of the present invention, in the surface treatment apparatus according to the seventh embodiment, a plurality of support members are arranged such that respective axes of the support members are parallel to each other. The support member has a common rotation axis. According to the present embodiment, the surface-treated members suspended from the respective support members perform a revolving operation around the rotation axis, and the distance between the electrodes and the electrodes changes with time. Since it moves, the electroplating process can be performed uniformly without causing a variation in film thickness depending on the position, and a large number of surface-treated members can be processed simultaneously.

According to a ninth embodiment of the present invention, in the surface treatment apparatus according to the eighth embodiment, the respective support members are arranged at an equal distance from the rotation axis. According to the present embodiment, the surface-treated member suspended from any of the support members is uniformly electroplated without a variation in film thickness.

An electroplating apparatus according to a tenth embodiment of the present invention is a surface treatment apparatus using a plurality of the surface treatment apparatuses according to the first to ninth embodiments arranged in a treatment tank. Are arranged so that their rotation axes are parallel. According to the present embodiment, more members to be treated can be treated simultaneously, and they can be effectively utilized according to the size of the plating tank in which the apparatus of the present invention is used.

An electroplating apparatus according to an eleventh embodiment of the present invention performs electroplating on a bonded magnet using the surface treatment apparatus according to the first to tenth embodiments. According to the present embodiment, also on the inner peripheral surface of the bonded magnet,
Electroplating can be performed uniformly without variation in film thickness.

RF according to a twelfth embodiment of the present invention
The eB-based permanent magnet has been subjected to electroplating using the electroplating apparatus according to the eleventh embodiment.
According to the present embodiment, it is possible to obtain an R-Fe-B-based permanent magnet in which a corrosion-resistant coating is uniformly formed on the inner peripheral surface without variation in film thickness.

A surface treatment method for a member to be surface-treated according to a thirteenth embodiment of the present invention performs a surface treatment using the surface treatment apparatus according to the first to tenth embodiments. According to the present embodiment, it is possible to uniformly perform the surface treatment on the inner peripheral surface of the member to be treated without variation in the film thickness.

The surface-treated member according to the fourteenth embodiment of the present invention has a film formed on the surface by the surface treatment method for the surface-treated member according to the thirteenth embodiment. According to the present embodiment, it is possible to obtain a surface-treated member in which a film is formed evenly on the inner peripheral surface without variation in film thickness.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface treatment apparatus according to an embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a conceptual configuration diagram of a bond magnet electroplating apparatus according to the present embodiment, FIG. 2 is an enlarged perspective view of a main part of FIG. 1, and FIG. 3 is a configuration diagram for explaining the movement of a support member and a bond magnet. FIG. 1 shows a positive electrode plate 10 arranged in an electrolytic plating solution in a plating tank and a surface treatment jig 30 for holding a ring-shaped bonded magnet 20 as a surface-treated member. The surface treatment jig 30 includes a support member 40 that rotatably supports the ring-shaped bonded magnet 20 from the inner peripheral surface side, and a rotating member 50 that causes the support member 40 to revolve. As shown in FIG. 1, two positive electrode plates 10 connected to the positive electrode 11 are arranged in parallel so as to face each other, and the surface treatment jig 30
The supporting member 40 is disposed between the anode electrodes 10 so that the axis thereof is parallel to the anode electrodes 10. Jig for surface treatment 3
0 denotes the power of the motor 31 installed outside
It has a gear 32 for transmission to zero.

As particularly shown in FIG. 2, the support member 40
It is composed of a metal supporting shaft 41 and a resin insulating spacer 42 arranged at a predetermined interval on the supporting shaft 41. The rotating member 50 is connected to a pair of rotating plates 51 rotatably provided on the surface treatment jig 30 and the pair of rotating plates 51, and is connected to a shaft of the gear 32 to be a rotation center. A shaft 52 is provided. The rotating member 50 is made of an insulating material, or has its surface insulated. The rotating plate 51 has bearings 53 at an equal distance from the rotating shaft 52 and at equal intervals. The support member 40 is held by the bearing 53. In this embodiment, eight support members 40 are provided. Further, the rotating plate 51 includes a negative electrode joint 54 connected to the negative electrode 33 therein.
Thus, the support member 40 is connected to the negative electrode 33. The negative electrode joints 54 are provided radially from the center of the rotating shaft 52 toward the respective bearings 53. The negative electrode bonding portion 54 may not be provided radially as in the present embodiment, but may be provided with a disk-shaped conductive member.

Next, the method of use and operation of the apparatus for electroplating bonded magnets according to the present embodiment will be described. First,
The ring-shaped bonded magnet 20 is disposed between the insulating spacers 42 of the support member 40. The support member 40 on which the ring-shaped bonded magnets 20 are arranged as described above is placed on the surface treatment jig 30. Although FIG. 1 shows an arrangement in which one ring-shaped bonded magnet 20 is provided, the ring-shaped bonded magnet 20 can be provided between the insulating spacers 42. After the installation of the support member 40 is completed, electroplating is performed. The motor 31 is driven while conducting the positive electrode 11 and the negative electrode 33. The driving force of the motor 31 is the gear 3
2 to the rotating member 50, and the rotating member 50
It rotates around the rotation shaft 52. Accordingly, each support member 40 performs a revolving operation around the rotation shaft 52. In the above description, the configuration having the rotating member 50 has been described. However, the rotating member is not necessarily required, and the power of the motor 31 is transmitted to one or both of the rotating plates 51 without providing the rotating member 50 to rotate the rotating plate 51. The structure may be such that In addition, the support member 4 is not limited to the embodiment.
The object of the present invention is achieved by a configuration in which 0 is revolvably arranged around a predetermined rotation axis.

Here, the movement of the support member 40 and the ring-shaped bonded magnet 20 will be described with reference to FIG. As shown in FIG. 3, the support member 40 revolves in a counterclockwise direction (arrow X) about the rotation shaft 52. That is,
The support member 40 at the position (a) moves to the position (b), and the support member 40 at the position (b) moves to the position (c). Here, the support member 40 is
It does not rotate on its own. However, focusing on the point A located on the outermost periphery from the rotation shaft 52 in the support member 40, at the position (a), the point A located on the uppermost portion is obtained.
Is 90 degrees counterclockwise in the position (c),
In the position of (e), it is rotated 180 degrees in the counterclockwise direction. Then, when returning to the position (a), 360
Will be rotated by degrees. Therefore, the ring-shaped bonded magnet 20 in contact with the support member 40 also rotates in the counterclockwise direction (arrow Y). At this time, the ring-shaped bonded magnet 20
When the inner diameter of the support member 40 is equal to the outer diameter of the support member 40, the ring-shaped bond magnet 20 makes one revolution with one revolution of the support member 40, if the slip is ignored.
As described above, since the contact position between the support member 40 and the ring-shaped bonded magnet 20 moves with the revolution of the support member 40, a contact mark with the support member 40 remains on the ring-shaped bonded magnet 20. And a uniform plating process can be performed.

As in the present embodiment, the support member 40 is arranged so that its axis is substantially horizontal, and a plurality of ring-shaped bond magnets 20 are arranged side by side on the support member 40, so that many ring-shaped The bond magnet 20 can revolve with the support member 40. Therefore, a uniform surface treatment
This can be performed on many ring-shaped bonded magnets 20 at the same time. Further, by disposing the support member 40 between the anode electrodes 10 such that the axis of the support member 40 is parallel to the anode electrodes 10 as in the present embodiment, the ring-shaped bonded magnets 20 are all at a distance from the anode electrode 10. Are equal, all the ring-shaped bonded magnets 20 can be uniformly electroplated without variation in film thickness. Further, as in the present embodiment, the plurality of support members 40 are arranged so that the respective axes of the support members 40 are parallel to each other.
The common rotation axis of each support member 40
The ring-shaped bonded magnets 20 suspended in this manner are uniformly electroplated without variation in film thickness, and many ring-shaped bonded magnets 20 can be processed simultaneously. Further, as in this embodiment, by disposing each support member 40 at an equal distance from the rotation shaft 52, any of the support members 4
The ring-shaped bonded magnet 20 hung at 0 is also uniformly electroplated without variation in film thickness.

FIG. 4 shows another embodiment. FIG. 4 is a perspective view of a support member according to another embodiment, and the other basic configuration is the same as that of FIG. The support member 40A shown in this embodiment is formed by a spiral member. By using the spiral member as the support member 40A, the ring-shaped bonded magnet 20 can be hung at each lower part of the spiral member, and the contact between the ring-shaped bonded magnets 20 can be prevented. Non-uniform surface treatment due to contact can be prevented. In the above embodiment, the support member 40 is provided with the insulating spacer 42. However, the insulating spacer 42 may not be provided, and even when the insulating spacer 42 is provided, substantially the same ring shape may be used. A simple protrusion may be used as long as the contact between the bond magnets 20 can be prevented. Also,
If the number of rotations is increased, a liquid flow can be generated and the contact between the bonded magnets can be prevented, so that the spacer can be omitted. Further, the surface treatment apparatus of the present invention is not limited to the electroplating treatment, and can be used for an apparatus for performing an electroless plating treatment, a chemical conversion treatment, an etching treatment and the like. Examples of the surface-treated member that is effectively surface-treated by the surface treatment apparatus of the present invention include an R—Fe—B-based ring-shaped bonded magnet and
It is a Fe-B based cylindrical bonded magnet. Further, in the above embodiment, the case of eight support members 40 has been described, but the number may be more or less. In the above embodiment,
Although the eight support members 40 are arranged at the same distance from the rotation shaft 52, the distances can be made different to further increase the number of surface-treated members that can be surface-treated at the same time without bringing the surface-treated members into contact with each other. it can. Further, by arranging a plurality of the surface treatment jigs 30 of the above embodiment such that the respective rotating members 50 are parallel to each other, it is possible to simultaneously treat more surface-treated members. In this case, all the surface treatment jigs 30 can be simultaneously moved by one motor 31 by directly connecting the respective rotating shafts with a belt or connecting them via respective gears. The bonded magnet that can be surface-treated by the apparatus of the present invention includes a liquid quenching system isotropic Nd
-Fe-B magnet powder (trade name: MQP-B, manufactured by MQI)
Etc.), an anisotropic R-Fe-B based bond magnet as disclosed in JP-A-9-92515, and a soft magnetic phase (for example, Fe3B) as disclosed in JP-A-8-203714. ) And a hard magnetic phase (Nd2-F)
e14-B) Nd-Fe-B based nanocomposite magnet, R-Fe disclosed in Japanese Patent Publication No. 5-82041
-N-based bonded magnets. All of these are formed into a predetermined shape using a binder such as an epoxy resin, and then subjected to a plating treatment after a surface is subjected to a conductive treatment. Further, the device of the present invention can be applied to a ring-shaped sintered magnet and the like in addition to the above-described bonded magnet.

[0027]

According to the present invention, the surface-treated member performs a revolving operation together with the support member. Therefore, for example, in the case of an electroplating process, the plating solution can be stirred and the plating solution can flow around the inner peripheral surface of the member to be surface-treated, so that a uniform surface treatment can be performed. Further, since the surface-treated member is rotatably supported from its inner peripheral surface side, the surface-treated member rotates by the revolution of the support member, and the contact position with the support member moves. . Therefore, it is possible to perform a uniform surface treatment without leaving traces of contact with the support member.

[Brief description of the drawings]

FIG. 1 is a conceptual configuration diagram of a bond magnet electroplating apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part of FIG. 1;

FIG. 3 is a configuration diagram for explaining movements of a support member and a bond magnet according to an embodiment of the present invention.

FIG. 4 is a perspective view of a main part of a support member according to another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 20 ring-shaped bonded magnet 40 support member 42 insulating spacer 50 rotating member

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Fumiaki Kikui 2-15-17 Egawa, Shimamoto-cho, Mishima-gun, Osaka Prefecture F-term in Sumitomo Special Metals Co., Ltd. Yamazaki Works (reference) 4K024 BB14 BC06 CB02 CB04 CB08 CB26

Claims (14)

[Claims] 1. A surface treatment apparatus for performing a surface treatment on a surface-treated member having an inner peripheral surface such as a cylindrical shape, wherein a supporting member that performs a revolving operation around a rotation axis is provided. A surface treatment apparatus, wherein the surface treatment member is rotatably supported from an inner peripheral surface side. 2. The method according to claim 1, wherein the supporting member is disposed such that an axis of the supporting member is substantially horizontal.
The surface treatment device according to claim 1, wherein the surface treatment device is arranged side by side on the support member. 3. The surface treatment apparatus according to claim 1, wherein the support member is formed of a conductive member, and a plating current is applied to the surface-treated member by the support member. 4. An insulating spacer is provided on the supporting member,
The surface treatment apparatus according to claim 3, wherein the member to be surface treated is arranged between the insulating spacers. 5. The surface treatment apparatus according to claim 4, wherein the insulating spacers are arranged so that the members to be surface-treated are arranged at equal intervals. 6. A surface treatment apparatus according to claim 1, wherein said support member is constituted by a spiral member. 7. The surface treatment apparatus according to claim 2, wherein an electrode is arranged parallel to an axis of the support member. 8. The apparatus according to claim 7, wherein a plurality of the support members are arranged such that respective axes of the support members are parallel to each other, and a rotation axis of each of the support members is common. Surface treatment equipment. 9. The surface treatment apparatus according to claim 8, wherein each of the support members is arranged at an equal distance from the rotation axis. 10. A surface treatment apparatus comprising a plurality of the surface treatment apparatuses according to claim 1 arranged in a treatment tank, wherein the rotation axes of the respective surface treatment apparatuses are parallel. A surface treatment device, wherein the surface treatment device is arranged so as to be: 11. An electroplating apparatus for bonded magnets, wherein electroplating is performed on a bonded magnet using the surface treatment apparatus according to any one of claims 1 to 10. 12. An R-Fe-B, which has been subjected to an electroplating treatment using the apparatus for electroplating a bonded magnet according to claim 11 to form a corrosion-resistant film on a surface thereof.
System permanent magnet. 13. A surface treatment method for a surface-treated member, wherein the surface treatment is performed using the surface treatment apparatus according to claim 1. Description: 14. A surface-treated member, wherein a film is formed on the surface by the surface-treating method for a surface-treated member according to claim 13.