JPH043002Y2 - - Google Patents

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Publication number
JPH043002Y2
JPH043002Y2 JP18703086U JP18703086U JPH043002Y2 JP H043002 Y2 JPH043002 Y2 JP H043002Y2 JP 18703086 U JP18703086 U JP 18703086U JP 18703086 U JP18703086 U JP 18703086U JP H043002 Y2 JPH043002 Y2 JP H043002Y2
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JP
Japan
Prior art keywords
plating
motor
carrier
semi
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18703086U
Other languages
Japanese (ja)
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JPS6394963U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP18703086U priority Critical patent/JPH043002Y2/ja
Publication of JPS6394963U publication Critical patent/JPS6394963U/ja
Application granted granted Critical
Publication of JPH043002Y2 publication Critical patent/JPH043002Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、めつき用キヤリアに装着された被め
つき物を、回転させながらめつき液中を移動させ
てめつきを行うめつき装置に関する。
[Detailed description of the invention] [Industrial application field] The present invention is a plating device that performs plating by moving an object to be plated attached to a plating carrier through a plating liquid while rotating it. Regarding.

〔従来の技術〕[Conventional technology]

量産規模で多量の被めつき物にめつきを行うと
き、めつき用キヤリアを利用し、キヤリアに被め
つき物を装着し、めつき槽上方に配設された搬送
機構のレールにキヤリアをつるし、被めつき物を
めつき液中に浸漬させて移動させながらめつきを
行う方法が採られる。このとき、均一な膜厚で、
ピツト、ピンホールなどの欠陥のない均質なめつ
き膜を得るために、めつき作業中被めつき物を自
転させたり、公転させたりあるいは自公転させた
りすることが行われる。このような回転駆動を与
えるためにキヤリアにモータが搭載されることが
多い。ところが、めつき液は数十℃以上に加温さ
れていることが多く、めつき作業中にめつき液よ
り多量の水蒸気、ミスト、腐食性ガスが発生し、
キヤリアに搭載されているモータに強い電解質を
含んだ水が結露し絶縁障害が発生し、その結果モ
ータの回転が停止することがしばしば起こる。
When plating a large number of objects to be plated on a mass production scale, a carrier for plating is used, the objects to be plated are attached to the carrier, and the carrier is placed on the rail of the transport mechanism installed above the plating tank. A method is used in which the object to be plated is dipped in a plating solution and moved while plating is carried out. At this time, with a uniform film thickness,
In order to obtain a homogeneous plated film free of defects such as pits and pinholes, the object to be plated is rotated, revolved, or revolved during the plating process. A motor is often mounted on the carrier to provide such rotational drive. However, plating solutions are often heated to temperatures of several tens of degrees Celsius or higher, and during the plating process, more water vapor, mist, and corrosive gases are generated than the plating solution.
Water containing strong electrolytes condenses on the motor mounted on the carrier, causing insulation failure, which often causes the motor to stop rotating.

例えば、最近、コンピユータの外部記憶装置と
して磁気デイスク装置が多用されているが、この
磁気デイスク装置に用いられる金属薄膜磁気デイ
スクには、基板としてアルミニウム合金円板に無
電解Ni−Pめつきを施したものが一般的に用い
られる。このめつきは、デイスク表面に磁気ヘツ
ドが衝突したときの機械的衝撃に耐えるための下
地層として、また、デイスク製作時基板表面の鏡
面加工を容易とするための下地層として形成され
るが、このような目的のためにめつき膜厚は
10μm〜20μmと厚くされる。このめつきに際し
て、上述のめつき用キヤリアを利用しアルミニウ
ム合金円板を自公転させながらめつきを行う方法
が採られるが、めつき膜厚を厚くするために約90
℃に加温されためつき液中に2時間〜4時間の長
時間浸漬してめつきされる。その間、キヤリアに
搭載されているモータは有害雰囲気にさらされて
いることになり、モータの絶縁障害が多発してい
た。
For example, recently, magnetic disk devices have been widely used as external storage devices for computers, and the metal thin-film magnetic disks used in these magnetic disk devices use an aluminum alloy disk as a substrate with electroless Ni-P plating. are commonly used. This plating is formed as an underlayer to withstand mechanical shock when a magnetic head collides with the disk surface, and also as an underlayer to facilitate mirror finishing of the substrate surface during disk manufacture. For this purpose, the plating film thickness is
The thickness is 10 μm to 20 μm. For this plating, a method is adopted in which the plating is performed using the above-mentioned plating carrier while rotating and revolving the aluminum alloy disk.
Plating is performed by immersing the material in a plating solution heated to 0.degree. C. for a long time of 2 to 4 hours. During that time, the motor installed in the carrier was exposed to a harmful atmosphere, and motor insulation failures were occurring frequently.

このようなモータの絶縁障害の発生を防ぐため
に、キヤリアに密閉容器を設置し、その中にモー
タを収納して、有害雰囲気にモータをさらさない
ようにする対策が行われていた。
In order to prevent the occurrence of such motor insulation failures, measures have been taken to prevent the motor from being exposed to harmful atmospheres by installing a sealed container in the carrier and housing the motor therein.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

上述のように、モータを密閉容器内に収納する
と、有害雰囲気は遮断されて、モータに電解質の
強い水が結露することは防ぐことができるが、周
囲環境からの熱伝導と、モータ自体からの発熱に
より密閉容器内の温度が上昇し、モータが過熱す
るという問題が発生し、連続運転が難しいという
欠点があつた。
As mentioned above, housing the motor in a sealed container keeps out harmful atmospheres and prevents electrolyte-rich water from condensing on the motor, but it also reduces heat conduction from the surrounding environment and from the motor itself. The problem was that the temperature inside the closed container rose due to heat generation, causing the motor to overheat, making continuous operation difficult.

本考案は、上述の欠点を除去して、被めつき物
を回転させるためにめつき用キヤリアに搭載され
るモータを、簡便な方法で有害雰囲気から保護
し、かつ、モータの過熱を防止し、長期間連続使
用に耐え得るめつき装置を提供することを目的と
する。
The present invention eliminates the above-mentioned drawbacks, protects the motor mounted on the plating carrier for rotating the plated object from harmful atmosphere in a simple manner, and prevents the motor from overheating. The purpose of the present invention is to provide a plating device that can withstand continuous use for a long period of time.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的を達成するために、この考案によれ
ば、めつき用キヤリアに取り付けられためつき治
具に装着された被めつき物をめつき液中で回転さ
せながらめつきを行うめつき装置において、めつ
き用キヤリアに搭載され被めつき物を回転させる
ためのモータが、めつき用キヤリアに設けられた
2個の小孔を有する準密閉容器中に格納されてお
り、圧縮空気または不活性ガスがこの準密閉容器
内を常に外部より陽圧に維持するように一方の小
孔から導入され他方の小孔から排出される構成の
めつき装置とする。
In order to achieve the above object, this invention provides a plating device that performs plating while rotating an object to be plated, which is attached to a plating jig attached to a plating carrier, in a plating solution. A motor mounted on a plating carrier for rotating the object to be plated is housed in a semi-airtight container with two small holes provided in the plating carrier, and is powered by compressed air or inert air. The plating apparatus is configured such that gas is introduced through one small hole and discharged from the other small hole so that the inside of the semi-closed container is always maintained at a positive pressure from the outside.

〔作用〕[Effect]

準密閉容器内に、圧縮空気または不活性ガスを
容器内が常に陽圧を維持するように、一方の小孔
から導入し他方の小孔から排出することにより、
容器内に水蒸気、ミスト、腐食性ガスなどが侵入
できず、容器内に格納されているモータがこれら
有害物にさらされることはなくなる。また、準密
閉容器内を圧縮空気または不活性ガスが流れるこ
とにより内部のモータが冷却される。
By introducing compressed air or inert gas into a semi-closed container through one small hole and exhausting it through the other small hole so as to maintain a positive pressure inside the container at all times,
Water vapor, mist, corrosive gas, etc. cannot enter the container, and the motor housed in the container is no longer exposed to these harmful substances. Furthermore, the internal motor is cooled by flowing compressed air or inert gas inside the semi-closed container.

〔実施例〕〔Example〕

以下、本考案の実施例を図面を参照しながら説
明する。
Embodiments of the present invention will be described below with reference to the drawings.

第1図は本考案の一実施例の磁気デイスク用基
板の無電解Ni−Pめつき装置の断面図である。
第1図において、1はめつき槽、2は無電解Ni
−Pめつき液、3はめつき用キヤリア、4は準密
閉容器5内に格納されている、基板を回転さえる
ためのモータ、6は搬送用のレール7につるすた
めのキヤリアの支持棒、8はめつき治具、9は被
めつき物である基板、10はモータの回転をめつ
き治具を介して基板に伝えるためのギア機構、1
1は準密閉容器に設けられた2個の小孔の一方に
連結されたエア(圧縮空気)導入管、12は準密
閉容器の他の小孔に連結されたエア排出管、13
はめつき液加温用のヒータである。
FIG. 1 is a sectional view of an apparatus for electroless Ni--P plating of a magnetic disk substrate according to an embodiment of the present invention.
In Figure 1, 1 is a plating tank, 2 is an electroless Ni
- P plating liquid, 3 a carrier for plating, 4 a motor for rotating the substrate, which is stored in a semi-closed container 5, 6 a support rod for the carrier for hanging it on a transport rail 7, 8 A plating jig, 9 a substrate to be plated, 10 a gear mechanism for transmitting the rotation of the motor to the substrate via the plating jig, 1
1 is an air (compressed air) introduction pipe connected to one of two small holes provided in the semi-sealed container; 12 is an air discharge pipe connected to the other small hole in the semi-sealed container; 13
This is a heater for heating the plating liquid.

基板9は、めつき治具8の支持軸に、隣り合う
基板が接触しないような適当なピツチで切られた
溝に回動可能に装着されており、めつき中、モー
タ4によりギア10を介して自公転せしめられる
めつき治具8の回転につれて自公転しながらめつ
きされる。めつき治具8、従つて基板9の取り付
けられているキヤリア3は、基板9をめつき液2
に浸漬するように支持棒6により搬送レール7に
つるされ、図示されてはいない搬送機構により搬
送され、それにつれて基板9はめつき液中を移動
しながらめつきされる。
The board 9 is rotatably mounted on the support shaft of the plating jig 8 in a groove cut at an appropriate pitch so that adjacent boards do not come into contact with each other, and the gear 10 is driven by the motor 4 during plating. As the plating jig 8 rotates, the plating jig 8 rotates around itself and revolves around itself. The plating jig 8, and therefore the carrier 3 to which the substrate 9 is attached, is used to apply the plating liquid 2 to the substrate 9.
The substrate 9 is suspended from a transport rail 7 by a support rod 6 so as to be immersed in the plating liquid, and is transported by a transport mechanism (not shown), and is plated while moving in the plating solution.

めつき液は加温用ヒータ13により85℃〜96℃
に加熱される。このため、めつき作業中、常時、
多量の水蒸気、めつき反応によつて生じる水素ガ
ス、めつき液を含んだミスト、腐食性ガスがめつ
き槽より発散されている。従来のめつき装置で
は、モータを完全な密閉容器内に格納し、これら
有害雰囲気の悪影響を回避していたが、密閉され
ているため容器内の温度が上昇しモータが過熱さ
れるため、長時間の連続運転ができなかつた。
The plating liquid is heated to 85°C to 96°C by the heating heater 13.
heated to. For this reason, during plating work,
A large amount of water vapor, hydrogen gas generated by the plating reaction, mist containing plating solution, and corrosive gas are emitted from the plating tank. In conventional plating equipment, the motor is housed in a completely sealed container to avoid the negative effects of these harmful atmospheres. It was not possible to run continuously for hours.

本実施例では、モータ4は2個の小孔を設けら
れた準密閉容器5内に搭載されており、一方の小
孔にはエア導入管11、他方の小孔にはエア排出
管12が連結されている。そして、めつき作業中
常時常温かたは冷却したエアをエア導入管11か
ら準密閉容器5内に流入させエア排出管12より
外部へ流出させる。このとき、エア流量は準密閉
容器5内が外部より常に陽圧となる程度の量とす
る。このような状態でめつきを行えば、水蒸気な
どの有害物は準密閉容器5内に侵入することはな
く、容器内のモータ4は障害を受けることはな
い。また、常時エアが流れているためモータ4は
冷却されて過熱することはなく長時間の連続運転
が可能となる。
In this embodiment, the motor 4 is mounted in a semi-sealed container 5 provided with two small holes, one of which has an air introduction pipe 11 and the other small hole with an air discharge pipe 12. connected. During the plating work, room-temperature or cooled air is constantly flowed into the semi-closed container 5 through the air introduction pipe 11 and discharged to the outside through the air discharge pipe 12. At this time, the air flow rate is set to such an extent that the inside of the semi-closed container 5 always has a positive pressure compared to the outside. If plating is performed in such a state, harmful substances such as water vapor will not enter the semi-closed container 5, and the motor 4 inside the container will not be damaged. Furthermore, since air is constantly flowing, the motor 4 is cooled and does not overheat, allowing continuous operation for a long time.

本実施例では準密閉容器内にエア(圧縮空気)
を流したが、エアに限られることはなく、窒素な
どの不活性ガスを用いてもよい。また、このよう
な装置は磁気デイスク基板のめつきに有効なだけ
でなく、他のめつきの場合でも有効であり、特に
高温のめつき液を用いる場合にはその効果が顕著
である。
In this example, air (compressed air) is placed inside the semi-sealed container.
Although the flow is not limited to air, an inert gas such as nitrogen may also be used. Furthermore, such an apparatus is effective not only for plating magnetic disk substrates, but also for other types of plating, and is particularly effective when using a high-temperature plating solution.

〔考案の効果〕[Effect of idea]

本考案によれば、被めつき物を回転駆動させる
ためのモータをめつき用キヤリアに設置された準
密閉容器内に格納し、容器内に圧縮空気または不
活性ガスを導入排出させ得る構成のめつき装置と
する。
According to the present invention, a motor for rotationally driving an object to be plated is housed in a semi-closed container installed in a plating carrier, and compressed air or inert gas is introduced into and discharged from the container. It is used as a plating device.

このような装置を用いることにより、圧縮空気
または不活性ガスを準密閉容器内が常に外部より
陽圧となるように流しながらめつき作業を行うと
いう簡単な方法で、モータを強い電解質を含んだ
水蒸気などの有害雰囲気から保護し、かつ、モー
タの過熱を防止し、長期間連続してめつき作業を
行うことが可能となる。
By using such a device, plating can be easily performed by flowing compressed air or inert gas so that the inside of the semi-sealed container is always at a positive pressure from the outside. It protects from harmful atmospheres such as water vapor and prevents the motor from overheating, making it possible to perform plating work continuously for a long period of time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例のめつき装置の要部
断面図である。 1……めつき槽、2……めつき液、3……キヤ
リア、4……モータ、5……準密閉容器、6……
支持棒、7……レール、8……めつき治具、9…
…基板、10……ギア機構、11……エア導入
管、12……エア排出管、13……ヒータ。
FIG. 1 is a sectional view of a main part of a plating apparatus according to an embodiment of the present invention. 1...Plating tank, 2...Plating liquid, 3...Carrier, 4...Motor, 5...Semi-sealed container, 6...
Support rod, 7...Rail, 8...Plating jig, 9...
... Board, 10 ... Gear mechanism, 11 ... Air introduction pipe, 12 ... Air discharge pipe, 13 ... Heater.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] めつき用キヤリアに取り付けられためつき治具
に装着された被めつき物をめつき液中で回転させ
ながらめつきを行うめつき装置において、めつき
用キヤリアに搭載され被めつき物を回転させるた
めのモータが、めつき用キヤリアに設けられた2
個の小孔を有する準密閉容器中に格納されてお
り、圧縮空気または不活性ガスが該準密閉容器内
を常に外部より陽圧に維持するように一方の小孔
から導入され他方の小孔から排出されることを特
徴とするめつき装置。
In a plating device that performs plating while rotating an object to be plated, which is attached to a plating jig attached to a plating carrier, in a plating solution, the object to be plated is mounted on a plating carrier and rotates. A motor for plating is installed on the plating carrier.
The container is stored in a semi-sealed container with several small holes, and compressed air or inert gas is introduced into the semi-sealed container through one small hole to maintain a positive pressure inside the semi-sealed container from the outside. A plating device characterized in that the plating device is discharged from the plating device.
JP18703086U 1986-12-04 1986-12-04 Expired JPH043002Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18703086U JPH043002Y2 (en) 1986-12-04 1986-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18703086U JPH043002Y2 (en) 1986-12-04 1986-12-04

Publications (2)

Publication Number Publication Date
JPS6394963U JPS6394963U (en) 1988-06-18
JPH043002Y2 true JPH043002Y2 (en) 1992-01-31

Family

ID=31137132

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18703086U Expired JPH043002Y2 (en) 1986-12-04 1986-12-04

Country Status (1)

Country Link
JP (1) JPH043002Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4734697B2 (en) * 1999-09-07 2011-07-27 日立金属株式会社 Surface treatment equipment

Also Published As

Publication number Publication date
JPS6394963U (en) 1988-06-18

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