CN102082109B - 基座单元和用于使用基座单元来处理衬底的设备 - Google Patents

基座单元和用于使用基座单元来处理衬底的设备 Download PDF

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Publication number
CN102082109B
CN102082109B CN2010105286736A CN201010528673A CN102082109B CN 102082109 B CN102082109 B CN 102082109B CN 2010105286736 A CN2010105286736 A CN 2010105286736A CN 201010528673 A CN201010528673 A CN 201010528673A CN 102082109 B CN102082109 B CN 102082109B
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China
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substrate
base
pedestal
main basal
subbase seat
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Chinese (zh)
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CN102082109A (zh
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南元植
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NPS CORP
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NPS CORP
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
CN2010105286736A 2009-10-27 2010-10-26 基座单元和用于使用基座单元来处理衬底的设备 Active CN102082109B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0102380 2009-10-27
KR1020090102380A KR100965143B1 (ko) 2009-10-27 2009-10-27 서셉터 유닛 및 이를 구비하는 기판 처리 장치

Publications (2)

Publication Number Publication Date
CN102082109A CN102082109A (zh) 2011-06-01
CN102082109B true CN102082109B (zh) 2013-11-13

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CN2010105286736A Active CN102082109B (zh) 2009-10-27 2010-10-26 基座单元和用于使用基座单元来处理衬底的设备

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Country Link
KR (1) KR100965143B1 (ko)
CN (1) CN102082109B (ko)
TW (1) TWI442510B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101900547B1 (ko) * 2016-03-07 2018-09-19 주식회사 케이씨씨 세라믹 기판 제조용 적층 시스템 및 이를 이용한 세라믹 기판의 제조 방법
CN108346613A (zh) * 2017-01-25 2018-07-31 上海新昇半导体科技有限公司 适用于单片式外延炉的分离式基座组件
CN109037136B (zh) * 2017-06-12 2021-10-26 上海新昇半导体科技有限公司 支撑台、改善晶圆或外延生长晶圆表面的顶针痕迹的方法
KR102053593B1 (ko) * 2017-11-29 2019-12-09 주식회사 테스 리프트핀유닛의 이동방법 및 기판처리장치
CN108461442A (zh) * 2018-03-27 2018-08-28 武汉华星光电技术有限公司 用于承载基板的承载装置及具有该承载装置的热退火设备
KR101992379B1 (ko) 2018-12-05 2019-06-25 (주)앤피에스 기판 처리 장치 및 기판 처리 방법
US20230070848A1 (en) * 2020-02-13 2023-03-09 Jabil Inc. Apparatus, system and method for providing a substrate chuck
US11581213B2 (en) 2020-09-23 2023-02-14 Applied Materials, Inc. Susceptor wafer chucks for bowed wafers
CN113539914B (zh) * 2021-06-28 2023-06-20 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆传输系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334257A (en) * 1992-05-26 1994-08-02 Tokyo Electron Kabushiki Kaisha Treatment object supporting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634882B2 (en) * 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US6868302B2 (en) * 2002-03-25 2005-03-15 Dainippon Screen Mfg. Co., Ltd. Thermal processing apparatus
JP2005191338A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd 基板の保持装置および方法
JP5038073B2 (ja) * 2007-09-11 2012-10-03 株式会社ニューフレアテクノロジー 半導体製造装置および半導体製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334257A (en) * 1992-05-26 1994-08-02 Tokyo Electron Kabushiki Kaisha Treatment object supporting device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-191338A 2005.07.14

Also Published As

Publication number Publication date
CN102082109A (zh) 2011-06-01
TWI442510B (zh) 2014-06-21
KR100965143B1 (ko) 2010-06-25
TW201120986A (en) 2011-06-16

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