CN102066052B - 改进的研磨抛光机 - Google Patents
改进的研磨抛光机 Download PDFInfo
- Publication number
- CN102066052B CN102066052B CN200980123745.4A CN200980123745A CN102066052B CN 102066052 B CN102066052 B CN 102066052B CN 200980123745 A CN200980123745 A CN 200980123745A CN 102066052 B CN102066052 B CN 102066052B
- Authority
- CN
- China
- Prior art keywords
- platen
- head
- sample holder
- sample
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711115608.9A CN108081116B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
| CN201610035016.5A CN105522474B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7445508P | 2008-06-20 | 2008-06-20 | |
| US61/074,455 | 2008-06-20 | ||
| US12/470,757 | 2009-05-22 | ||
| US12/470,757 US8574028B2 (en) | 2008-06-20 | 2009-05-22 | Grinder/polisher |
| PCT/US2009/046190 WO2009155137A2 (en) | 2008-06-20 | 2009-06-04 | Improved grinder/polisher |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610035016.5A Division CN105522474B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
| CN201711115608.9A Division CN108081116B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102066052A CN102066052A (zh) | 2011-05-18 |
| CN102066052B true CN102066052B (zh) | 2016-03-02 |
Family
ID=41431727
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711115608.9A Active CN108081116B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
| CN200980123745.4A Active CN102066052B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
| CN201610035016.5A Active CN105522474B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711115608.9A Active CN108081116B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610035016.5A Active CN105522474B (zh) | 2008-06-20 | 2009-06-04 | 改进的研磨抛光机 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8574028B2 (enExample) |
| EP (1) | EP2300199B1 (enExample) |
| JP (2) | JP2011524820A (enExample) |
| CN (3) | CN108081116B (enExample) |
| DK (1) | DK2300199T3 (enExample) |
| WO (1) | WO2009155137A2 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6277075B2 (ja) * | 2014-07-16 | 2018-02-07 | 株式会社ミツトヨ | 硬さ試験機 |
| EP3218147B1 (en) * | 2014-11-12 | 2022-08-10 | Illinois Tool Works Inc. | Planar grinder |
| WO2016146557A1 (en) * | 2015-03-13 | 2016-09-22 | Struers A/S | A specimen mover and a method of placing specimens in a specimen mover |
| CN104875103A (zh) * | 2015-06-17 | 2015-09-02 | 高金建 | 一种简易防尘抛光机 |
| JP6523872B2 (ja) * | 2015-08-27 | 2019-06-05 | 株式会社ディスコ | 研削装置 |
| CN105299047A (zh) * | 2015-11-16 | 2016-02-03 | 耒阳新达微科技有限公司 | 一种新型轴承加工设备 |
| CN105904336B (zh) * | 2016-06-29 | 2020-08-11 | 东北大学 | 金相研磨试样压力调节装置、金相磨抛设备及磨抛方法 |
| US10206682B2 (en) * | 2017-01-30 | 2019-02-19 | Ethicon Llc | Magnetic tissue compression device with backup mechanical latch |
| CN106863100A (zh) * | 2017-02-23 | 2017-06-20 | 中山市森美模型科技有限公司 | 一种用于不规则形状树脂模型的抛光设备 |
| US11397139B2 (en) | 2017-02-27 | 2022-07-26 | Leco Corporation | Metallographic grinder and components thereof |
| US11148175B2 (en) * | 2017-06-23 | 2021-10-19 | Lockheed Martin Corporation | Nutplate rotary abrasion tool |
| US11149778B2 (en) * | 2017-06-23 | 2021-10-19 | Lockheed Martin Corporation | Multiple nutplate rotary abrasion tool |
| US11787007B2 (en) | 2018-06-21 | 2023-10-17 | Illinois Tool Works Inc. | Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine |
| US11491611B2 (en) * | 2018-08-14 | 2022-11-08 | Illinois Tool Works Inc. | Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards |
| CN110202480B (zh) * | 2019-07-09 | 2023-09-05 | 辽宁翔舜科技有限公司 | 一种全自动快速煤焦光片表面处理机系统及处理方法 |
| CN110455572B (zh) * | 2019-08-28 | 2022-03-29 | 广东风华高新科技股份有限公司 | 一种陶瓷电子元件金相切片及其制备方法 |
| US12194589B2 (en) * | 2020-03-31 | 2025-01-14 | Illinois Tool Works Inc. | Grinding/polishing devices with recall |
| CN111408995A (zh) * | 2020-04-26 | 2020-07-14 | 佘小梅 | 一种红酒杯口打磨装置 |
| CN112223067A (zh) * | 2020-07-29 | 2021-01-15 | 莱州市蔚仪试验器械制造有限公司 | 增加试样磨削量控制的多用途磨抛机 |
| US20220126418A1 (en) * | 2020-10-26 | 2022-04-28 | Illinois Tool Works Inc. | Grinding/polishing systems and methods having proximity sensors |
| US11897087B2 (en) * | 2021-03-11 | 2024-02-13 | Board Of Trustees Of Michigan State University | Polishing apparatus for smoothing diamonds |
| CN113001386A (zh) * | 2021-03-12 | 2021-06-22 | 湖州刻强制版有限公司 | 一种便于进行碎屑处理的防飞溅印刷版辊抛光装置 |
| US11756814B1 (en) * | 2021-05-27 | 2023-09-12 | Meta Platforms, Inc. | Vertical polishing system with multiple degrees of freedom |
| CN114952434B (zh) * | 2022-04-22 | 2024-05-31 | 揭阳市奇达餐具有限公司 | 一种高良品率的机床打磨控制方法 |
| DE102022125705A1 (de) * | 2022-10-05 | 2024-04-11 | Atm Qness Gmbh | Teller-Schleif-/Poliergerät |
| US20240189958A1 (en) * | 2022-12-07 | 2024-06-13 | Illinois Tool Works Inc. | Systems and methods to detect rotation of a vibratory polisher |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1031671A (zh) * | 1987-04-10 | 1989-03-15 | 河北农业大学 | 金相试样抛光机 |
| US4873792A (en) * | 1988-06-01 | 1989-10-17 | Buehler, Ltd. | Polishing apparatus |
| US5800254A (en) * | 1996-04-01 | 1998-09-01 | Buehler Ltd. | Automatic apparatus for grinding and polishing samples |
| JP2002331452A (ja) * | 2001-03-08 | 2002-11-19 | Hitachi Ltd | 研磨装置及び磁気ヘッド並びにその製造方法 |
| CN1462666A (zh) * | 2003-06-27 | 2003-12-24 | 沈阳科晶设备制造有限公司 | 全自控无级调压双无级变速高精度研磨抛光机 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3233370A (en) * | 1963-07-19 | 1966-02-08 | Falk | Production of parallel lapped surfaces |
| US4020600A (en) * | 1976-08-13 | 1977-05-03 | Spitfire Tool & Machine Co., Inc. | Polishing fixture |
| US4459785A (en) * | 1982-11-08 | 1984-07-17 | Buehler Ltd. | Chuck for vertically hung specimen holder |
| US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
| CN2181367Y (zh) * | 1993-10-06 | 1994-11-02 | 贾培清 | 连续抛丸清理机 |
| US5582534A (en) * | 1993-12-27 | 1996-12-10 | Applied Materials, Inc. | Orbital chemical mechanical polishing apparatus and method |
| US5816899A (en) * | 1996-07-22 | 1998-10-06 | Buehler, Ltd. | Micro precise polishing apparatus |
| US6224474B1 (en) * | 1999-01-06 | 2001-05-01 | Buehler, Ltd. | Magnetic disc system for grinding or polishing specimens |
| CN2379281Y (zh) * | 1999-05-28 | 2000-05-24 | 曹苏 | 石材磨抛机的机头架行走导向机构 |
| US7070067B1 (en) * | 2001-11-02 | 2006-07-04 | Buehler, Ltd. | Modular fluid-dispensing system |
| USD509837S1 (en) * | 2004-10-12 | 2005-09-20 | Sesona Albert J | Electric grinder |
-
2009
- 2009-05-22 US US12/470,757 patent/US8574028B2/en active Active
- 2009-06-04 CN CN201711115608.9A patent/CN108081116B/zh active Active
- 2009-06-04 DK DK09767448.5T patent/DK2300199T3/da active
- 2009-06-04 CN CN200980123745.4A patent/CN102066052B/zh active Active
- 2009-06-04 EP EP09767448A patent/EP2300199B1/en active Active
- 2009-06-04 CN CN201610035016.5A patent/CN105522474B/zh active Active
- 2009-06-04 JP JP2011514677A patent/JP2011524820A/ja active Pending
- 2009-06-04 WO PCT/US2009/046190 patent/WO2009155137A2/en not_active Ceased
-
2013
- 2013-09-30 US US14/041,691 patent/US9180571B2/en active Active
-
2014
- 2014-04-15 JP JP2014001960U patent/JP3191524U/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1031671A (zh) * | 1987-04-10 | 1989-03-15 | 河北农业大学 | 金相试样抛光机 |
| US4873792A (en) * | 1988-06-01 | 1989-10-17 | Buehler, Ltd. | Polishing apparatus |
| US5800254A (en) * | 1996-04-01 | 1998-09-01 | Buehler Ltd. | Automatic apparatus for grinding and polishing samples |
| JP2002331452A (ja) * | 2001-03-08 | 2002-11-19 | Hitachi Ltd | 研磨装置及び磁気ヘッド並びにその製造方法 |
| CN1462666A (zh) * | 2003-06-27 | 2003-12-24 | 沈阳科晶设备制造有限公司 | 全自控无级调压双无级变速高精度研磨抛光机 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2300199B1 (en) | 2012-09-19 |
| US8574028B2 (en) | 2013-11-05 |
| US20090318059A1 (en) | 2009-12-24 |
| DK2300199T3 (da) | 2013-01-07 |
| EP2300199A2 (en) | 2011-03-30 |
| JP2011524820A (ja) | 2011-09-08 |
| US9180571B2 (en) | 2015-11-10 |
| US20140030967A1 (en) | 2014-01-30 |
| CN105522474B (zh) | 2018-06-08 |
| CN108081116B (zh) | 2020-05-26 |
| WO2009155137A3 (en) | 2010-03-25 |
| CN105522474A (zh) | 2016-04-27 |
| CN108081116A (zh) | 2018-05-29 |
| WO2009155137A2 (en) | 2009-12-23 |
| CN102066052A (zh) | 2011-05-18 |
| JP3191524U (ja) | 2014-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |