CN102066052B - 改进的研磨抛光机 - Google Patents

改进的研磨抛光机 Download PDF

Info

Publication number
CN102066052B
CN102066052B CN200980123745.4A CN200980123745A CN102066052B CN 102066052 B CN102066052 B CN 102066052B CN 200980123745 A CN200980123745 A CN 200980123745A CN 102066052 B CN102066052 B CN 102066052B
Authority
CN
China
Prior art keywords
platen
head
sample holder
sample
drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200980123745.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102066052A (zh
Inventor
查尔斯·E·休伊
道格拉斯·A·希克考斯基
迈克尔·F·哈特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illinois Tool Works Inc
Original Assignee
Illinois Tool Works Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc filed Critical Illinois Tool Works Inc
Priority to CN201711115608.9A priority Critical patent/CN108081116B/zh
Priority to CN201610035016.5A priority patent/CN105522474B/zh
Publication of CN102066052A publication Critical patent/CN102066052A/zh
Application granted granted Critical
Publication of CN102066052B publication Critical patent/CN102066052B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32Polishing; Etching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2866Grinding or homogeneising

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN200980123745.4A 2008-06-20 2009-06-04 改进的研磨抛光机 Active CN102066052B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201711115608.9A CN108081116B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN201610035016.5A CN105522474B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US7445508P 2008-06-20 2008-06-20
US61/074,455 2008-06-20
US12/470,757 2009-05-22
US12/470,757 US8574028B2 (en) 2008-06-20 2009-05-22 Grinder/polisher
PCT/US2009/046190 WO2009155137A2 (en) 2008-06-20 2009-06-04 Improved grinder/polisher

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201610035016.5A Division CN105522474B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN201711115608.9A Division CN108081116B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Publications (2)

Publication Number Publication Date
CN102066052A CN102066052A (zh) 2011-05-18
CN102066052B true CN102066052B (zh) 2016-03-02

Family

ID=41431727

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201711115608.9A Active CN108081116B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN200980123745.4A Active CN102066052B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机
CN201610035016.5A Active CN105522474B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201711115608.9A Active CN108081116B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201610035016.5A Active CN105522474B (zh) 2008-06-20 2009-06-04 改进的研磨抛光机

Country Status (6)

Country Link
US (2) US8574028B2 (enExample)
EP (1) EP2300199B1 (enExample)
JP (2) JP2011524820A (enExample)
CN (3) CN108081116B (enExample)
DK (1) DK2300199T3 (enExample)
WO (1) WO2009155137A2 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6277075B2 (ja) * 2014-07-16 2018-02-07 株式会社ミツトヨ 硬さ試験機
EP3218147B1 (en) * 2014-11-12 2022-08-10 Illinois Tool Works Inc. Planar grinder
WO2016146557A1 (en) * 2015-03-13 2016-09-22 Struers A/S A specimen mover and a method of placing specimens in a specimen mover
CN104875103A (zh) * 2015-06-17 2015-09-02 高金建 一种简易防尘抛光机
JP6523872B2 (ja) * 2015-08-27 2019-06-05 株式会社ディスコ 研削装置
CN105299047A (zh) * 2015-11-16 2016-02-03 耒阳新达微科技有限公司 一种新型轴承加工设备
CN105904336B (zh) * 2016-06-29 2020-08-11 东北大学 金相研磨试样压力调节装置、金相磨抛设备及磨抛方法
US10206682B2 (en) * 2017-01-30 2019-02-19 Ethicon Llc Magnetic tissue compression device with backup mechanical latch
CN106863100A (zh) * 2017-02-23 2017-06-20 中山市森美模型科技有限公司 一种用于不规则形状树脂模型的抛光设备
US11397139B2 (en) 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
US11148175B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Nutplate rotary abrasion tool
US11149778B2 (en) * 2017-06-23 2021-10-19 Lockheed Martin Corporation Multiple nutplate rotary abrasion tool
US11787007B2 (en) 2018-06-21 2023-10-17 Illinois Tool Works Inc. Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine
US11491611B2 (en) * 2018-08-14 2022-11-08 Illinois Tool Works Inc. Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards
CN110202480B (zh) * 2019-07-09 2023-09-05 辽宁翔舜科技有限公司 一种全自动快速煤焦光片表面处理机系统及处理方法
CN110455572B (zh) * 2019-08-28 2022-03-29 广东风华高新科技股份有限公司 一种陶瓷电子元件金相切片及其制备方法
US12194589B2 (en) * 2020-03-31 2025-01-14 Illinois Tool Works Inc. Grinding/polishing devices with recall
CN111408995A (zh) * 2020-04-26 2020-07-14 佘小梅 一种红酒杯口打磨装置
CN112223067A (zh) * 2020-07-29 2021-01-15 莱州市蔚仪试验器械制造有限公司 增加试样磨削量控制的多用途磨抛机
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
US11897087B2 (en) * 2021-03-11 2024-02-13 Board Of Trustees Of Michigan State University Polishing apparatus for smoothing diamonds
CN113001386A (zh) * 2021-03-12 2021-06-22 湖州刻强制版有限公司 一种便于进行碎屑处理的防飞溅印刷版辊抛光装置
US11756814B1 (en) * 2021-05-27 2023-09-12 Meta Platforms, Inc. Vertical polishing system with multiple degrees of freedom
CN114952434B (zh) * 2022-04-22 2024-05-31 揭阳市奇达餐具有限公司 一种高良品率的机床打磨控制方法
DE102022125705A1 (de) * 2022-10-05 2024-04-11 Atm Qness Gmbh Teller-Schleif-/Poliergerät
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1031671A (zh) * 1987-04-10 1989-03-15 河北农业大学 金相试样抛光机
US4873792A (en) * 1988-06-01 1989-10-17 Buehler, Ltd. Polishing apparatus
US5800254A (en) * 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
JP2002331452A (ja) * 2001-03-08 2002-11-19 Hitachi Ltd 研磨装置及び磁気ヘッド並びにその製造方法
CN1462666A (zh) * 2003-06-27 2003-12-24 沈阳科晶设备制造有限公司 全自控无级调压双无级变速高精度研磨抛光机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3233370A (en) * 1963-07-19 1966-02-08 Falk Production of parallel lapped surfaces
US4020600A (en) * 1976-08-13 1977-05-03 Spitfire Tool & Machine Co., Inc. Polishing fixture
US4459785A (en) * 1982-11-08 1984-07-17 Buehler Ltd. Chuck for vertically hung specimen holder
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
CN2181367Y (zh) * 1993-10-06 1994-11-02 贾培清 连续抛丸清理机
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5816899A (en) * 1996-07-22 1998-10-06 Buehler, Ltd. Micro precise polishing apparatus
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
CN2379281Y (zh) * 1999-05-28 2000-05-24 曹苏 石材磨抛机的机头架行走导向机构
US7070067B1 (en) * 2001-11-02 2006-07-04 Buehler, Ltd. Modular fluid-dispensing system
USD509837S1 (en) * 2004-10-12 2005-09-20 Sesona Albert J Electric grinder

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1031671A (zh) * 1987-04-10 1989-03-15 河北农业大学 金相试样抛光机
US4873792A (en) * 1988-06-01 1989-10-17 Buehler, Ltd. Polishing apparatus
US5800254A (en) * 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
JP2002331452A (ja) * 2001-03-08 2002-11-19 Hitachi Ltd 研磨装置及び磁気ヘッド並びにその製造方法
CN1462666A (zh) * 2003-06-27 2003-12-24 沈阳科晶设备制造有限公司 全自控无级调压双无级变速高精度研磨抛光机

Also Published As

Publication number Publication date
EP2300199B1 (en) 2012-09-19
US8574028B2 (en) 2013-11-05
US20090318059A1 (en) 2009-12-24
DK2300199T3 (da) 2013-01-07
EP2300199A2 (en) 2011-03-30
JP2011524820A (ja) 2011-09-08
US9180571B2 (en) 2015-11-10
US20140030967A1 (en) 2014-01-30
CN105522474B (zh) 2018-06-08
CN108081116B (zh) 2020-05-26
WO2009155137A3 (en) 2010-03-25
CN105522474A (zh) 2016-04-27
CN108081116A (zh) 2018-05-29
WO2009155137A2 (en) 2009-12-23
CN102066052A (zh) 2011-05-18
JP3191524U (ja) 2014-06-26

Similar Documents

Publication Publication Date Title
CN102066052B (zh) 改进的研磨抛光机
CN108789080B (zh) 一种可适用不同尺寸led灯罩的抛光装置
KR20160078931A (ko) 집진수단을 구비한 자동차의 브레이크 디스크 연마장치
JP4079289B2 (ja) チャックテーブル洗浄装置
CN211103464U (zh) 一种不锈钢制品打磨机
CN210060747U (zh) 一种中心力加载自动磨抛机
KR101366811B1 (ko) 시편 연마장치
JP2002200559A (ja) 眼鏡レンズ加工装置
JP5150189B2 (ja) ねじ浚い加工装置
CN107932225A (zh) 一种用于玻璃打磨加工的设备
CN220944438U (zh) 一种带防护的数控外圆磨床
CN112192439B (zh) 一种塑料板材加工装置
CN116652724A (zh) 一种多工位金刚石衬底抛光装置及其加工方法
CN115582768A (zh) 一种铸造件打磨设备
JP5124034B2 (ja) バレル研磨装置
JP6044955B2 (ja) ウェーハ研磨ヘッドおよびウェーハ研磨装置
JP2002009022A (ja) 研削加工基板および基板の研削装置ならびに研削方法
CN214186747U (zh) 抛光装置
CN215919937U (zh) 一种防油雾飞溅且便于清洗的平面磨床
JP2009178799A (ja) 光ディスク研磨装置
CN218837267U (zh) 一种带有安全保护机构的五金件抛光机
CN214559768U (zh) 一种金属材料打磨装置
CN209998901U (zh) 一种电子锁加工用抛光机
CN212794288U (zh) 一种毛边打磨机
CN210255632U (zh) 一种抛光机用底盘旋转装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant