CN102063020A - 曝光装置和曝光方法 - Google Patents

曝光装置和曝光方法 Download PDF

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Publication number
CN102063020A
CN102063020A CN2010105707010A CN201010570701A CN102063020A CN 102063020 A CN102063020 A CN 102063020A CN 2010105707010 A CN2010105707010 A CN 2010105707010A CN 201010570701 A CN201010570701 A CN 201010570701A CN 102063020 A CN102063020 A CN 102063020A
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CN
China
Prior art keywords
mentioned
exposure
plane
optical system
projection optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105707010A
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English (en)
Chinese (zh)
Inventor
三宅健
高木俊博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanei Giken Co Ltd
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Publication of CN102063020A publication Critical patent/CN102063020A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70258Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70308Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026Focusing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2010105707010A 2009-10-09 2010-10-08 曝光装置和曝光方法 Pending CN102063020A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-235508 2009-10-09
JP2009235508A JP2011081317A (ja) 2009-10-09 2009-10-09 露光装置および露光方法

Publications (1)

Publication Number Publication Date
CN102063020A true CN102063020A (zh) 2011-05-18

Family

ID=43998351

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105707010A Pending CN102063020A (zh) 2009-10-09 2010-10-08 曝光装置和曝光方法

Country Status (4)

Country Link
JP (1) JP2011081317A (ko)
KR (1) KR20110039187A (ko)
CN (1) CN102063020A (ko)
TW (1) TW201128318A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105898168A (zh) * 2014-11-14 2016-08-24 王殿龙 一种蜂窝式手机投影仪

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020170059A (ja) * 2019-04-02 2020-10-15 サンエー技研株式会社 露光装置および露光方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281724A (ja) * 1989-04-24 1990-11-19 Matsushita Electric Ind Co Ltd 露光装置のウェーハ支持台
EP0762215A1 (en) * 1995-08-03 1997-03-12 Canon Kabushiki Kaisha Surface position detecting method and apparatus and scanning exposure method and apparatus
CN1603961A (zh) * 2003-09-22 2005-04-06 Asml荷兰有限公司 光刻装置和器件制造方法
CN1629729A (zh) * 2003-09-17 2005-06-22 Asml荷兰有限公司 自适应的光刻临界尺寸增强
CN1952787A (zh) * 2005-10-18 2007-04-25 国际商业机器公司 用于制造集成电路器件的方法和系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153434A (en) * 1981-03-17 1982-09-22 Nec Corp Manufacturing device for semiconductor
JP2000338432A (ja) * 1999-05-31 2000-12-08 Dainippon Screen Mfg Co Ltd レーザー露光装置及びその方法
JP2001022100A (ja) * 1999-07-13 2001-01-26 Sanee Giken Kk フォトマスクと基板との位置合わせ方法
JP2003215807A (ja) * 2002-01-18 2003-07-30 Sanee Giken Kk 分割露光方法
JP2006041124A (ja) * 2004-07-26 2006-02-09 Tohoku Univ パターン描画装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02281724A (ja) * 1989-04-24 1990-11-19 Matsushita Electric Ind Co Ltd 露光装置のウェーハ支持台
EP0762215A1 (en) * 1995-08-03 1997-03-12 Canon Kabushiki Kaisha Surface position detecting method and apparatus and scanning exposure method and apparatus
CN1629729A (zh) * 2003-09-17 2005-06-22 Asml荷兰有限公司 自适应的光刻临界尺寸增强
CN1603961A (zh) * 2003-09-22 2005-04-06 Asml荷兰有限公司 光刻装置和器件制造方法
CN1952787A (zh) * 2005-10-18 2007-04-25 国际商业机器公司 用于制造集成电路器件的方法和系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105898168A (zh) * 2014-11-14 2016-08-24 王殿龙 一种蜂窝式手机投影仪

Also Published As

Publication number Publication date
KR20110039187A (ko) 2011-04-15
JP2011081317A (ja) 2011-04-21
TW201128318A (en) 2011-08-16

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Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: TAKUHIROYASU CO., LTD.;TAKUHIROYASU CO., LTD.

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20110921

Address after: Tokyo Electron Limited

Applicant after: Sanei Giken Co., Ltd.

Co-applicant after: Topcon Corp.

Address before: Tokyo Electron Limited

Applicant before: Sanei Giken Co., Ltd.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Free format text: FORMER OWNER: TAKUHIROYASU CO., LTD.;TAKUHIROYASU CO., LTD.

Effective date: 20140318

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20140318

Address after: Tokyo Electron Limited

Applicant after: Sanei Giken Co., Ltd.

Address before: Tokyo Electron Limited

Applicant before: Sanei Giken Co., Ltd.

Applicant before: Topcon Corp.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110518