201128318 六、發明說明： 【發明所屬之技術領域】 本發明是有關用以在具有感光層的基板的曝光面照射 光’而於曝光面形成圖案之投影曝光方式的曝光裝置及曝 光方法。 【先前技術】 利用描繪有圖案的光罩之曝光方式，有使光罩與基板 緊貼而進行曝光的真空緊貼曝光方式、及不使緊貼的投影 曝光方式。 投影曝光方式相較於真空緊貼曝光方式，具有其次那 樣的優點。 (1)由於光罩與基板不接觸，所以對光罩無損傷。 因此，可半永久性地使用光罩。 (2 )在使光罩與基板彼此對位之後，不會有起因於 使兩者彼此緊貼的位移發生。因此，對位精度佳。 另一方面，投影曝光方式亦有其次那樣的缺點。 (3 )難以在表面平坦性差的基板的曝光面的全領域 使精度佳地結像。因此，需要使用具備自動對焦機能的光 學系之作業。因此，裝置高價，且生產性會降低。 【發明內容】 (發明所欲解決的課題） 本發明的課題是在於消除上述缺點，確立廉價且生產 201128318 性佳的投影曝光方式。 本發明的曝光裝置及曝光方法亦可適用於不利用光罩 的直接描繪曝光。 (用以解決課題的手段） 爲了解決上述課題，若根據本發明，則可提供一種曝 光裝置’係對具有感光層的基板的曝光面照射光，而於前 述曝光面形成圖案之曝光裝置，其特徵係具備： 基板支撐構件，其係用以支撐前述基板： 光源： 投影光學系，其係用以將來自前述光源的光照射於前 述曝光面； 光透過性構件，其係形成剛性的光透過性構件，具有 與前述曝光面對向的平面，配置成前述平面與前述投影光 學系的結像面一致：及 驅動機構，其係用以爲了使前述曝光面對於前述光透 過性構件的前述平面緊貼及背離，而使前述基板支撐構件 移動。 前述驅動機構可具備減壓機構，其係用以使形成於前 述光透過性構件的前述平面與前述基板的前述曝光面之間 的空間成爲比周邊空間更被減壓的狀態。 在前述光源與前述投影光學系之間規則性地配列有用 以將來自前述光源的光引導至前述投影光學系之複數的光 學調變元件，使前述光學調變元件及前述投影光學系與前 -6- 201128318 述基板，一面維持前述光透過性構件的前述平面與前述投 影光學系的前述結像面的一致性，一面相對性地移動，一 邊控制前述光學調變元件，藉此使所定的圖案曝光於前述 曝光面。 或者，在前述光源與前述投影光學系之間配置有多邊 is ’使目ij述多邊鏡及目υ述投影光學系與前述基板，一面維 持前述光透過性構件的前述平面與前述投影光學系的前述 結像面的一致性，一面相對性地移動，一邊控制前述光源 的ON· OFF，藉此使所定的圖案曝光於前述曝光面。 亦可在前述光源與前述投影光學系之間配置描繪有應 形成於前述曝光面的圖案之光罩，經由該光罩來使前述曝 光面曝光，藉此將前述圖案轉印於前述曝光面。 爲了使前述曝光面在各複數的分割領域曝光，亦可具 備滑動機構，其係用以一面維持前述光透過性構件的前述 平面與前述投影光學系的前述結像面的一致性，一面將前 述基板、前述基板支撐構件及前述光透過性構件設爲一體 而使移動。 爲了使分別設於前述光罩與前述基板之相對應的位置 之對位用標記彼此間對位，亦可更具備對位機構，其係藉 由標記檢測手段來檢測出前述對位用標記，根據檢測出的 資料來維持前述光透過性構件的前述平面與前述投影光學 系的前述結像面的一致性，且在將前述基板、前述基板支 撐構件及前述光透過性構件設爲一體的狀態下使前述光罩 及前述基板的一方對於另一方相對移動於X、Υ、Θ方向。 201128318 若根據本發明，則可更提供一種曝光方法，係將 源發出而經投影光學系的光照射至具有感光層的基板 光面’而於前述曝光面形成圖案之曝光方法，其特徵 將具有與前述曝光面對向的平面之剛性的光透過 件配置成前述平面與前述投影光學系的結像面一致， α前述曝光面緊貼於前述平面的方式使前述基板 > 在將前述基板推至前述光透過性構件的狀態下進 光。 在使前述曝光面緊貼於前述平面時，亦可使形成 述平面與前述曝光面之間的空間比周邊空間更減壓。 亦可使來自前述光源的光通過在前述光源與前述 光學系之間規則性地配列的複數個光學調變元件，而 性地引導至前述投影光學系，使前述光學調變元件及 投影光學系與前述基板，一面維持前述光透過性構件 述平面與前述投影光學系的前述結像面的一致性，— 對性地移動，一邊控制前述光學調變元件，藉此使所 圖案曝光於前述曝光面。 或者，亦可使來自前述光源的光通過在前述光源 述投影光學系之間配置的多邊鏡，引導至前述投影光 ，使前述多邊鏡及前述投影光學系與前述基板，一面 前述光透過性構件的前述平面與前述投影光學系的前 像面的一致性，一面相對性地移動，一邊控制前述光 ON，OFF，藉此使所定的圖案曝光於前述曝光面。 自光 的曝 性構 移動 行曝 於前 投影 選擇 前述 的前 面相 定的 與前 學系 維持 述結 源的 201128318 亦可取經由配置於前述光源與前述投影光學系之間的 光罩’亦即描繪有應形成於前述曝光面的圖案之光罩來使 前述曝光面曝光，藉此將前述圖案轉印於前述曝光面之方 法。 亦可一面維持前述光透過性構件的前述平面與前述投 影光學系的前述結像面的一致性，一面將前述基板及前述 光透過性構件設爲一體而使滑移，藉此將前述曝光面曝光 於各複數的分割領域。 亦可在曝光前，使分別設於前述光罩與前述基板之相 對應的位置之對位用標記彼此間，維持前述光透過性構件 的前述平面與前述投影光學系的前述結像面的一致性，且 在將前述基板及前述光透過性構件設爲一體的狀態下對位 〔發明的效果〕 若根據本發明的曝光裝置及曝光方法，則藉由使平坦 性差的基板的曝光面緊貼於具有與投影光學系的結像面一 致的平面之光透過性構件的該平面，可將該曝光面矯正成 平坦，且可維持其平坦性。而且，成爲平坦的曝光面與投 影光學系的結像面的一致性也會被維持。因此，之後可不 進行對焦的作業，在曝光面全體以高解像度來進行曝光。 若根據本發明的曝光裝置及曝光方法，則因爲不需要 具有自動對焦機能的設備，所以可廉價地製造裝置。 又，由於不需要對焦的作業，因此作業效率及生產效 -9 - 201128318 率會提升。 由於沒有使基板與光罩緊貼的情形，因此投影曝光方 式的優點會被維持。 【實施方式】 圖1 ( A )是本發明之一實施形態的曝光裝置的槪略側 面圖，圖1 (B)是上面圖。曝光裝置是具備：支撐基板1 的基板支撐構件2、及形成投影透鏡3的形態之投影光學系 、及構成剛性的光透過性構件之玻璃板4、及用以使基板 支撐構件2移動的驅動機構5。乘載基板1的剛性基板支撐 構件2的上面是形成平坦。曝光裝置更具備光源，但光源 在圖1中被圖示省略。 在圖1的實施形態中，曝光裝置更具備：光罩6、及用 以進行基板1與光罩6的對位之對位機構7。光罩6是位於光 源與投影透鏡3之間。對位機構7是由玻璃板支撐構件7a及 移動機構7b所構成。玻璃板支撐構件7a是把持玻璃板4的 周緣之框狀的構件。移動機構7b是以包圍玻璃板4的方式 配置複數個。各移動機構7b是連結玻璃板支撐構件7a與基 座構件8之間。各個的移動機構7b是互相作用來使玻璃板4 移動於X、Y、Θ方向。 在基板1的曝光面la (圖1(A)中上面）形成有感光 層。在光罩6中描繪有應形成於基板1的曝光面la的圖案。 從圖1 ( A )中位於光罩6上方的光源，經由光罩6、投影透 鏡3及玻璃板4來往基板1的曝光面1 a照射光，藉此可在曝 -10- 201128318 光面1 a轉印圖案。例如，可將電路作爲圖案來描繪於光罩 6。 玻璃板4是具有與基板1的曝光面U對向的平面4a (圖 1 ( A )中下面）。玻璃板4是配置成平面4a會與投影透鏡3 的結像面一致。玻璃板4是如上述般藉由對位機構7來移動 於平面內，但玻璃板4的平面4a與投影透鏡3的結像面的一 致性是經常被維持。 驅動機構5是以使基板1的曝光面1 a對於玻璃板4的平 面4 a緊貼或背離的方式來使基板支撐構件2移動。驅動機 構5是由：接觸於基板支撐構件2來使該基板支撐構件2移 動的汽缸機構9、及未接觸於基板支撐構件2來使該基板支 撐構件2移動的減壓機構所構成。 汽缸機構9是被安裝於基座構件8的中央，可推擠基板 支撐構件2的下面，而使被基板支撐構件2所支撐的基板1 能夠接近玻璃板4。在基板支撐構件2的上面周圍安裝有環 狀的彈性密封構件1 1。密封構件1 1的高度是設計成密封構 件1 1的頂部比基板1的曝光面1 a更高位置。一旦藉由汽缸 機構9來舉起基板1及基板支撐構件2，密封構件1 1的頂部 接觸於玻璃板4的下面’則會藉由玻璃板4、基板1及基板 支撐構件2以及密封構件Π來形成密閉空間S。 減壓機構是具備：外部的真空源（未圖示）、及連通 該真空源與密閉空間S的導管（未圖示）。導管的一端是 連接至真空源，另一端可例如連接至設於玻璃板4的孔（ 連通至空間S )。減壓機構是使密閉空間S內減壓，藉此可 -11 - 201128318 使基板1及基板支撐構件2朝玻璃板4的下面移動。 一邊參照圖2—邊說明藉由驅動機構5來使可能變形的 基板1的曝光面la緊貼於玻璃板4的平面4a而使平坦的工程 。乘載曝光前的基板1之基板支撐構件2是藉由搬送機構10 來搬入至玻璃板4與汽缸機構9之間（圖2 ( A))。搬送機 構〗〇是由下面來原封不動支撐基板支撐構件2之彼此對向 的2個緣部，圖示成對於紙面而言可前進及後退的2根橫桿 〇 一旦使汽缸機構9伸長，則汽缸機構9的上面會接觸於 被搬送至玻璃板4的下方而來的基板支撐構件2。若更使汽 缸機構9伸長，則基板支撐構件2會從搬送機構（橫桿）1 0 舉起，朝玻璃面4移動。搬送機構10會從玻璃板4的下方退 避。在密封構件11的頂部接觸於玻璃板4的平面（下面） 4a的時間點，汽缸機構9的伸長會被停止（圖2 ( B ))。 藉由玻璃板4、基板1、基板支撐構件2及密封構件1 1來形 成密閉空間S。 其次，將密閉空間S連接至上述外部的真空源（未圖 示），使空間S內減壓。 藉由周邊的大氣壓與空間S內被減少的壓力之間的差 壓力，乘載基板1的基板支撐構件2會從汽缸機構9的上面 離開而接近玻璃板4的平面4a。此時，彈性密封構件1 1是 以能擠壓的方式變形，一面維持密封作用，一面容許基板 支撐構件2的上方移動。 如此一來，基板1的曝光面1 a會緊貼於剛性的玻璃板4 -12- 201128318 的平面4a (圖2 ( C ))。即使基板1的曝光面la變形成波 浪狀，還是會因爲基板1的曝光面la緊貼於玻璃板4的平面 4a，曝光面1 a的變形被矯正而成平坦。此平坦性是只要曝 光面la緊貼於平面4a，便會被維持。 在此應注目於玻璃板4是配置成平面4a與投影透鏡3的 結像面一致。藉由在維持曝光面1 a與平面4a的緊貼狀態的 期間進行曝光，被描繪於光罩6的圖案會以高解像度來轉 印於被平坦化的曝光面1 a。高解像度可不使用自動對焦技 術，在曝光面1 a的領域全體取得。 在曝光作業之前，進行基板1與光罩6之間的對位作業 。各個的基板1及光罩6是分別在彼此對應的位置設有對位 用標記（未圖示）。藉由CCD攝影機之類的標記檢測手段 來檢測出該等的對位用標記。根據檢測出的資料，使光罩 6及基板1的其中一方對於另一方相對移動於X、Υ、Θ方向 ，而進行對位。在圖1及圖2所示的實施態樣中是使基板1 側對光罩6移動。亦可使光罩6側對基板1移動。總之，該 等的對位作業是在維持玻璃板4的平面4a與投影透鏡3的結 像面的一致性之狀態下進行，因此不會有對之後的曝光之 解像度造成不良影響的情形。 再稍微詳細說明有關圖1及圖2所示的實施態樣的對位 。如圖2(C)所示，藉由曝光面la與平面4 a維持緊貼，可 使基板1、玻璃板4及基板支撐構件2 —體移動。如前述般 ，構成對位機構7的玻璃板支撐構件7 a會把持玻璃板4的緣 部。連結玻璃板支撐構件7a與基座構件8之間的各個移動 -13- 201128318 機構7b會互相作用來使玻璃板4移動於 此緊貼於玻璃板4的基板1也與基板支捐 移動。藉此，可將設於光罩6的對位用| 對位用標記予以對位。 接續於對位作業的曝光作業是在基 的狀態下進行。來自光源的光會經由光 玻璃板4來照射至基板1的平坦的曝光面 6的圖案會被轉印於曝光面la。 在將基板1曝光時，亦可不一次將 曝光，而是分割曝光。使用於爲了如此 動機構12。滑動機構12是具備：被安裝 面之一對平行的下方導軌14，對於圖1 < 筆直地延伸於前後的下方導軌14、及被 的下面，可滑動地承接下方導軌14的下 、及被安裝於中間基板15的上面之一對 ，對於圖1 ( A )的紙面而言，平行延伸 安裝於基座構件8的下面，可滑動地承 方導軌承接構件18。下方導軌14與上方 的方式延伸。滑動機構12更含有用以使 構件8分別對於下方基板丨3及中間基板 (未圖示）。 如圖3(A)〜圖3(D)所示，可}t 區分成4個的分割曝光面la_〗，ia-2，： 的曝光面la與玻璃板4的平面4a會原封 X、Y、Θ方向，藉 言構件2 —起同樣地 票記與設於基板1的 板1被推至玻璃板4 罩6、投影透鏡3及 1 a。被描繪於光罩 曝光面1 a的全領域 的分割曝光者是滑 於下方基板1 3的上 〔A )的紙面而言， 安裝於中間基板15 方導軌承接構件16 平行的上方導軌1 7 的上方導軌17、及 接上方導軌17的上 導軌1 7是彼此正交 中間基板1 5及基座 15移動的驅動機構 夺基板1的曝光面la la-3 及 la-4。基板 1 不動維持緊貼狀態 • 14 - 201128318 ，使滑動機構1 2適當作動，藉此基板1、基板支撐構件2及 玻璃板4會一體滑移，可使該等的分割曝光面分別依序往 投影透鏡3的下方位置移動。圖1是表示4個分割曝光面1 a-1〜1 a - 4的其中一個位於投影透鏡3的下方之狀態。滑動機 構12的作動是在維持玻璃板4的平面4a與投影透鏡3的結像 面的一致性之狀態下進行。因此，分割曝光不會有對於曝 光的解像度造成不良影響的情形。 本發明的曝光裝置及曝光方法亦可適用於不使用光罩 的直接描繪曝光。圖4是表示直接描繪曝光裝置的一例。 圖4的曝光裝置是具備：光源19、透鏡（例如偏光透鏡） 20、及具有鏡子的光學調變元件2 1、以及投影透鏡22。而 且曝光裝置與圖1〜圖4所示的曝光裝置同樣具備：支撐基 板1的基板支撐構件2、及作爲光透過性構件的玻璃板（圖 示省略）、及用以爲了使基板1的曝光面1 a對於玻璃板的 平面緊貼及背離而使基板支撐構件2移動的驅動機構（圖 示省略）、及對位機構7。光源1 9 '透鏡2 0、光學調變元 件2 1及投影透鏡22是分別設置複數個，各個彼此對應。投 影透鏡22是作爲投影光學系作用。複數的光學調變元件21 是在光源1 9與投影透鏡2 2之間規則性地配列。光學調變元 件2 1是具有ON . OFF機能，將來自光源丨9的光予以選擇性 地引導至投影透鏡22。 在圖4的曝光裝置中，光學調變元件2丨及投影透鏡2 2 可與光源19及透鏡20 —起在與基板丨之間相對移動。與圖！ 〜圖3的曝光裝置時同樣’此相對移動是一邊維持玻璃板 -15- 201128318 的平面與投影透鏡22的結像面的一致性，一邊進行。此相 對移動時，可藉由控制光學調變元件2 1的ON · OFF來將所 定的圖案描繪曝光於基板1的曝光面la。 在圖4的曝光裝置中，光源19、透鏡20、光學調變元 件2 1及投影透鏡22是被固定，基板1側會移動。基板1的移 動是利用與圖1〜圖4的曝光裝置所說明的滑動機構12同等 的滑動機構2 3來進行。亦可固定基板1側，而使光源1 9、 透鏡20、光學調變元件21及投影透鏡22側移動。 圖5是表示圖4的曝光裝置的變形例。與圖4的曝光裝 置相異的點是光源（未圖示）及透鏡20分別爲單一。其他 的點則是與圖4的曝光裝置相同。 圖6是表示別形態的直線描繪曝光裝置的光學系。（A )是側面圖，（B )是上面圖。較理想是作爲半導體雷射 之來自光源（未圖示）的光是經由平行光透鏡單元24、柱 狀透鏡26及反射鏡27來往多邊鏡28傳送，由此進入至F9透 鏡單元29。光是從F9透鏡單元29經由反射鏡30來進入至柱 狀透鏡3 1。反射鏡3 0及柱狀透鏡3 1是構成本發明的投影光 學系。出自柱狀透鏡31的光是朝基板而去。有關光學系以 外的構成是與圖4及圖5的曝光裝置及圖6的曝光裝置相同 【圖式簡單說明】 圖1是表示本發明的曝光裝置之一實施形態的圖，（A )是側面圖’ （B )是（A )的A-A箭號視圖。 -16- 201128318 圖2是依序說明使基板緊貼於光透過性構件的工程圖 〇 圖3是將曝光面予以分割曝光時的各部動作圖。 圖4是將本發明適用於不利用光罩的直接描繪曝光^ 置時的曝光裝置之一實施形態的側面圖。 圖5是表示圖4的曝光裝置的變形例的側面圖。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and an exposure method for a projection exposure method in which a light is irradiated onto an exposure surface of a substrate having a photosensitive layer and a pattern is formed on an exposure surface. [Prior Art] The exposure method of the mask in which the pattern is drawn includes a vacuum adhesion exposure method in which the mask is brought into close contact with the substrate, and a projection exposure method in which the film is not adhered. The projection exposure method has the second advantage compared to the vacuum close exposure method. (1) Since the photomask does not contact the substrate, there is no damage to the photomask. Therefore, the photomask can be used semi-permanently. (2) After the reticle and the substrate are aligned with each other, there is no displacement due to bringing the two into close contact with each other. Therefore, the alignment accuracy is good. On the other hand, the projection exposure method has the following disadvantages. (3) It is difficult to accurately image the entire surface of the exposure surface of the substrate having poor surface flatness. Therefore, it is necessary to use an optical system with an autofocus function. Therefore, the device is expensive and productivity is lowered. DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and to establish a projection exposure method which is inexpensive and produces a good quality of 201128318. The exposure apparatus and exposure method of the present invention are also applicable to direct drawing exposure without using a photomask. In order to solve the above problems, according to the present invention, an exposure apparatus can be provided which is an exposure apparatus that forms light on an exposure surface of a substrate having a photosensitive layer and forms a pattern on the exposure surface. The feature system includes: a substrate supporting member for supporting the substrate: a light source: a projection optical system for irradiating light from the light source to the exposure surface; and a light transmissive member for forming rigid light transmission The functional member has a plane facing the exposure, and the plane is arranged to coincide with a junction image plane of the projection optical system: and a driving mechanism for causing the exposure surface to face the light transmissive member The substrate supporting member is moved while being in close contact with and facing away. The drive mechanism may include a pressure reducing mechanism for causing a space between the plane formed in the light transmissive member and the exposure surface of the substrate to be decompressed more than the peripheral space. Between the light source and the projection optical system, a plurality of optical modulation elements for guiding light from the light source to the projection optical system are regularly arranged, and the optical modulation element and the projection optical system are front- 6-201128318 The substrate is controlled while maintaining the uniformity between the plane of the light-transmitting member and the image plane of the projection optical system, and controlling the optical modulation element to thereby obtain a predetermined pattern Exposure to the aforementioned exposure surface. Alternatively, a polygon is disposed between the light source and the projection optical system, and the plane of the light transmissive member and the projection optical system are maintained while the polygon mirror and the projection optical system are aligned with the substrate. The image plane is relatively moved while controlling the ON/OFF of the light source, thereby exposing the predetermined pattern to the exposure surface. A photomask on which a pattern to be formed on the exposure surface is drawn may be disposed between the light source and the projection optical system, and the exposure surface may be exposed through the mask to transfer the pattern onto the exposure surface. In order to expose the exposure surface to each of the plurality of divided regions, a sliding mechanism may be provided for maintaining the uniformity between the plane of the light transmissive member and the image plane of the projection optical system. The substrate, the substrate supporting member, and the light transmissive member are integrally moved. In order to align the alignment marks respectively provided at the positions corresponding to the photomask and the substrate, the alignment mechanism may be further provided, and the alignment mark is detected by the mark detecting means. Maintaining the uniformity between the plane of the light transmissive member and the image plane of the projection optical system based on the detected data, and integrating the substrate, the substrate supporting member, and the light transmissive member One of the mask and the substrate is moved relative to the other in the X, Υ, and Θ directions. 201128318 According to the present invention, an exposure method may be further provided, which is an exposure method in which a source is emitted and light of a projection optical system is irradiated onto a substrate smooth surface having a photosensitive layer to form a pattern on the exposure surface, and the feature is characterized by The light transmissive member having a rigidity parallel to the plane facing the exposure is disposed such that the plane coincides with the image plane of the projection optical system, and the substrate is moved to the substrate by the α exposure surface being in close contact with the plane Light is introduced into the light transmissive member. When the exposure surface is brought into close contact with the plane, the space between the formation plane and the exposure surface may be decompressed more than the peripheral space. The light from the light source may be guided to the projection optical system by a plurality of optical modulation elements regularly arranged between the light source and the optical system, and the optical modulation element and the projection optical system may be And maintaining the uniformity of the plane of the light transmissive member and the image plane of the projection optical system while maintaining the uniformity of the substrate, and controlling the optical modulation element to expose the pattern to the exposure surface. Alternatively, the light from the light source may be guided to the projection light by a polygon mirror disposed between the light source and the projection optical system, and the polygon mirror, the projection optical system, and the substrate may be the light transmissive member. The plane between the plane and the front image plane of the projection optical system is relatively moved, and the light is turned ON and OFF while the predetermined pattern is exposed to the exposure surface. The exposure from the light is exposed to the front projection, and the previous phase and the previous school are used to maintain the source of the connection. 201128318 may also be taken through the photomask disposed between the light source and the projection optical system. A method of transferring the aforementioned pattern to the exposure surface by exposing the exposure surface to a mask having a pattern formed on the exposure surface. The substrate and the light transmissive member may be integrally slid while maintaining the uniformity between the plane of the light transmissive member and the image plane of the projection optical system, thereby exposing the exposure surface. Exposure to the segmentation field of each plural. Before the exposure, the alignment marks respectively provided at the positions corresponding to the photomask and the substrate may be maintained to maintain the plane of the light transmissive member and the image plane of the projection optical system. Alignment in the state in which the substrate and the light-transmitting member are integrated (effect of the invention) According to the exposure apparatus and the exposure method of the present invention, the exposure surface of the substrate having poor flatness is adhered to In the plane of the light transmissive member having a plane matching the image plane of the projection optical system, the exposure surface can be corrected to be flat and the flatness can be maintained. Moreover, the consistency between the flat exposure surface and the image plane of the projection optical system is maintained. Therefore, it is possible to perform exposure at a high resolution on the entire exposure surface without performing an operation of focusing. According to the exposure apparatus and the exposure method of the present invention, since an apparatus having an autofocus function is not required, the apparatus can be manufactured at low cost. Moreover, since the work of focusing is not required, the work efficiency and productivity -9 - 201128318 will increase. Since the substrate is not in close contact with the reticle, the advantages of the projection exposure mode are maintained. [Embodiment] Fig. 1 (A) is a schematic side view of an exposure apparatus according to an embodiment of the present invention, and Fig. 1 (B) is a top view. The exposure apparatus includes a substrate supporting member 2 that supports the substrate 1, a projection optical system that forms the projection lens 3, a glass plate 4 that constitutes a rigid light-transmitting member, and a drive for moving the substrate supporting member 2. Agency 5. The upper surface of the rigid substrate supporting member 2 of the carrier substrate 1 is formed flat. The exposure apparatus further includes a light source, but the light source is omitted as shown in Fig. 1 . In the embodiment of Fig. 1, the exposure apparatus further includes a mask 6 and a registration mechanism 7 for aligning the substrate 1 and the mask 6. The photomask 6 is located between the light source and the projection lens 3. The registration mechanism 7 is composed of a glass plate supporting member 7a and a moving mechanism 7b. The glass plate supporting member 7a is a frame-shaped member that grips the periphery of the glass plate 4. The moving mechanism 7b is disposed in plural so as to surround the glass sheet 4. Each of the moving mechanisms 7b is connected between the glass sheet supporting member 7a and the base member 8. Each of the moving mechanisms 7b interacts to move the glass sheet 4 in the X, Y, and Θ directions. A photosensitive layer is formed on the exposure surface 1a of the substrate 1 (upper surface in Fig. 1(A)). A pattern to be formed on the exposure surface 1a of the substrate 1 is drawn in the mask 6. The light source located above the reticle 6 in FIG. 1(A) is irradiated to the exposure surface 1a of the substrate 1 via the reticle 6, the projection lens 3, and the glass plate 4, thereby being exposed to the light surface of the -10-201128318 a transfer pattern. For example, the circuit can be depicted as a pattern on the reticle 6. The glass plate 4 is a flat surface 4a (the lower surface in Fig. 1 (A)) which faces the exposure surface U of the substrate 1. The glass plate 4 is disposed such that the plane 4a coincides with the image plane of the projection lens 3. The glass plate 4 is moved in the plane by the alignment mechanism 7 as described above, but the uniformity of the plane 4a of the glass plate 4 and the image plane of the projection lens 3 is often maintained. The drive mechanism 5 moves the substrate supporting member 2 such that the exposure surface 1a of the substrate 1 abuts or faces away from the flat surface 4a of the glass sheet 4. The driving mechanism 5 is composed of a cylinder mechanism 9 that contacts the substrate supporting member 2 to move the substrate supporting member 2, and a pressure reducing mechanism that does not contact the substrate supporting member 2 to move the substrate supporting member 2. The cylinder mechanism 9 is attached to the center of the base member 8, and can push the lower surface of the substrate supporting member 2 to bring the substrate 1 supported by the substrate supporting member 2 to the glass plate 4. An annular elastic sealing member 11 is attached around the upper surface of the substrate supporting member 2. The height of the sealing member 11 is designed such that the top of the sealing member 11 is higher than the exposure surface 1a of the substrate 1. Once the substrate 1 and the substrate supporting member 2 are lifted by the cylinder mechanism 9, the top of the sealing member 11 is in contact with the lower surface of the glass plate 4, and the glass plate 4, the substrate 1 and the substrate supporting member 2, and the sealing member are used. To form a confined space S. The pressure reducing mechanism includes an external vacuum source (not shown) and a conduit (not shown) that communicates the vacuum source and the sealed space S. One end of the conduit is connected to a vacuum source and the other end can be connected, for example, to a hole provided in the glass sheet 4 (connected to the space S). The pressure reducing mechanism decompresses the inside of the sealed space S, whereby the substrate 1 and the substrate supporting member 2 can be moved toward the lower surface of the glass plate 4 by -11 - 201128318. Referring to Fig. 2, it will be described that the exposure surface 1a of the substrate 1 which is likely to be deformed is brought into close contact with the flat surface 4a of the glass sheet 4 by the drive mechanism 5 to make the flat work. The substrate supporting member 2 of the substrate 1 before the load exposure is carried between the glass plate 4 and the cylinder mechanism 9 by the conveying mechanism 10 (FIG. 2 (A)). The transport mechanism 〇 is the two edge portions of the substrate support member 2 that are opposite to each other as shown below, and is illustrated as two cross bars that can advance and retreat to the paper surface. Once the cylinder mechanism 9 is extended, Then, the upper surface of the cylinder mechanism 9 comes into contact with the substrate supporting member 2 that is conveyed to the lower side of the glass sheet 4. When the cylinder mechanism 9 is further extended, the substrate supporting member 2 is lifted from the conveying mechanism (crossbar) 10 and moved toward the glass surface 4. The conveying mechanism 10 is retracted from below the glass plate 4. At the point of time when the top of the sealing member 11 contacts the plane (lower surface) 4a of the glass sheet 4, the elongation of the cylinder mechanism 9 is stopped (Fig. 2(B)). The sealed space S is formed by the glass plate 4, the substrate 1, the substrate supporting member 2, and the sealing member 1 1. Next, the sealed space S is connected to the external vacuum source (not shown) to decompress the space S. The substrate supporting member 2 of the carrier substrate 1 is separated from the upper surface of the cylinder mechanism 9 by the difference pressure between the peripheral atmospheric pressure and the reduced pressure in the space S, and approaches the plane 4a of the glass plate 4. At this time, the elastic sealing member 1 1 is deformed so as to be squeezable, and allows the upper side of the substrate supporting member 2 to move while maintaining the sealing action. As a result, the exposed surface 1a of the substrate 1 is in close contact with the plane 4a of the rigid glass plate 4-12-201128318 (Fig. 2(C)). Even if the exposure surface 1a of the substrate 1 is deformed into a wave shape, the exposure surface 1a of the substrate 1 is in close contact with the plane 4a of the glass plate 4, and the deformation of the exposure surface 1a is corrected to be flat. This flatness is maintained as long as the exposed surface la is in close contact with the flat surface 4a. It should be noted here that the glass plate 4 is arranged such that the plane 4a coincides with the image plane of the projection lens 3. By performing exposure while maintaining the contact state between the exposure surface 1a and the plane 4a, the pattern drawn on the mask 6 is transferred to the flattened exposure surface 1a with high resolution. The high resolution can be achieved without using the autofocus technology in the field of the exposure surface 1 a. The alignment operation between the substrate 1 and the reticle 6 is performed before the exposure operation. Each of the substrate 1 and the photomask 6 is provided with alignment marks (not shown) at positions corresponding to each other. The alignment marks are detected by a mark detecting means such as a CCD camera. Based on the detected data, one of the mask 6 and the substrate 1 is moved relative to the other in the X, Υ, and Θ directions to perform alignment. In the embodiment shown in Figs. 1 and 2, the substrate 1 side is moved to the mask 6. The substrate 6 can also be moved to the substrate 1 side. In short, the alignment operation is performed while maintaining the uniformity of the plane 4a of the glass plate 4 and the image plane of the projection lens 3, so that there is no possibility of adversely affecting the resolution of the subsequent exposure. The alignment of the embodiment shown in Figs. 1 and 2 will be described in more detail. As shown in Fig. 2(C), the substrate 1, the glass plate 4, and the substrate supporting member 2 can be moved by the exposure surface 1a and the plane 4a. As described above, the glass sheet supporting member 7a constituting the aligning mechanism 7 grips the edge of the glass sheet 4. Each movement between the joining glass sheet supporting member 7a and the base member 8 - 13 - 201128318 The mechanism 7b interacts to move the glass sheet 4 to the substrate 1 which is in close contact with the glass sheet 4 and also to the substrate. Thereby, the registration mark for the alignment of the photomask 6 can be aligned. The exposure operation following the alignment job is performed in the base state. The pattern from which the light from the light source is irradiated to the flat exposure surface 6 of the substrate 1 via the light glass plate 4 is transferred to the exposure surface 1a. When the substrate 1 is exposed, exposure may not be performed once, but the exposure may be divided. Used in order to move the mechanism 12 as such. The slide mechanism 12 is provided with a lower guide rail 14 that is parallel to one of the mounted surfaces, and is vertically slidably supported by the lower rail 14 and the lower surface of the front and rear, and slidably receives the lower rail 14 and the lower rail 14 One pair of the upper surface of the intermediate substrate 15 is attached to the lower surface of the base member 8 in parallel with respect to the paper surface of Fig. 1(A) to slidably receive the guide rail receiving member 18. The lower rail 14 extends in an upward manner. The slide mechanism 12 further includes a member 8 for the lower substrate 丨3 and the intermediate substrate (not shown). As shown in Fig. 3(A) to Fig. 3(D), the partitioned exposure surface la_〗, the exposure surface 1a of the ia-2, and the plane 4a of the glass plate 4 are originally sealed X and Y. In the Θ direction, the member 2 is similarly stamped and the plate 1 provided on the substrate 1 is pushed to the glass plate 4 cover 6, the projection lenses 3 and 1a. The segmenter exposed to the entire area of the mask exposure surface 1a is a paper surface that slides on the upper [A] of the lower substrate 13 and is mounted on the upper substrate 17 of the intermediate substrate 15 in which the side rail receiving members 16 are parallel. The upper rail 17 and the upper rail 17 connected to the upper rail 17 are exposure surfaces la la-3 and la-4 of the substrate 1 that drive the intermediate substrate 15 and the base 15 to move orthogonally. The substrate 1 is held in a non-moving state. 14 - 201128318, the sliding mechanism 1 2 is properly actuated, whereby the substrate 1, the substrate supporting member 2, and the glass plate 4 are integrally slid, and the divided exposure surfaces can be sequentially directed to The lower position of the projection lens 3 moves. 1 is a view showing a state in which one of the four divided exposure faces 1a-1 to 1a-4 is located below the projection lens 3. The operation of the slide mechanism 12 is performed while maintaining the uniformity of the plane 4a of the glass plate 4 and the image plane of the projection lens 3. Therefore, split exposure does not have a bad influence on the resolution of exposure. The exposure apparatus and exposure method of the present invention are also applicable to direct drawing exposure without using a photomask. 4 is a view showing an example of a direct drawing exposure device. The exposure apparatus of FIG. 4 includes a light source 19, a lens (for example, a polarizing lens) 20, an optical modulation element 21 having a mirror, and a projection lens 22. Further, the exposure apparatus includes the substrate supporting member 2 for supporting the substrate 1, the glass plate as a light transmissive member (not shown), and the exposure for the substrate 1 in the same manner as the exposure device shown in FIGS. 1 to 4 . The surface 1a is a driving mechanism (not shown) for moving the substrate supporting member 2 against the plane of the glass sheet and facing away from it, and the alignment mechanism 7. The light source 1 9 'the lens 20, the optical modulation element 2 1 and the projection lens 22 are respectively provided in plural, each corresponding to each other. The projection lens 22 functions as a projection optical system. The plurality of optical modulation elements 21 are regularly arranged between the light source 19 and the projection lens 22. The optical modulation element 2 1 has an ON. OFF function to selectively direct light from the light source 丨 9 to the projection lens 22. In the exposure apparatus of FIG. 4, the optical modulation element 2 and the projection lens 2 2 can move relative to the light source 19 and the lens 20 relative to the substrate 。. With the map! In the case of the exposure apparatus of Fig. 3, the relative movement is performed while maintaining the uniformity of the plane of the glass plate -15-201128318 and the image plane of the projection lens 22. At the time of the relative movement, the predetermined pattern can be exposed to the exposure surface 1a of the substrate 1 by controlling the ON/OFF of the optical modulation element 2 1 . In the exposure apparatus of Fig. 4, the light source 19, the lens 20, the optical modulation element 21, and the projection lens 22 are fixed, and the substrate 1 side is moved. The movement of the substrate 1 is performed by a sliding mechanism 23 equivalent to the sliding mechanism 12 described in the exposure apparatus of Figs. 1 to 4 . The side of the substrate 1 can be fixed, and the light source 19, the lens 20, the optical modulation element 21, and the projection lens 22 side can be moved. Fig. 5 is a view showing a modification of the exposure apparatus of Fig. 4; The point different from the exposure apparatus of Fig. 4 is that the light source (not shown) and the lens 20 are each single. The other points are the same as those of the exposure apparatus of Fig. 4. Fig. 6 is a view showing an optical system of a linear drawing exposure apparatus of another form. (A) is a side view and (B) is a top view. Preferably, light from a light source (not shown) as a semiconductor laser is transmitted to the polygon mirror 28 via the parallel light lens unit 24, the lenticular lens 26, and the mirror 27, thereby entering the F9 lens unit 29. Light enters the cylindrical lens 31 from the F9 lens unit 29 via the mirror 30. The mirror 30 and the lenticular lens 3 1 constitute the projection optical system of the present invention. The light from the lenticular lens 31 is directed toward the substrate. The configuration other than the optical system is the same as that of the exposure apparatus of Figs. 4 and 5 and the exposure apparatus of Fig. 6. Fig. 1 is a view showing an embodiment of the exposure apparatus of the present invention, and (A) is a side view. Figure '(B) is the AA arrow view of (A). -16-201128318 Fig. 2 is a view showing the construction of the substrate in close contact with the light transmissive member. Fig. 3 is a view showing the operation of each unit when the exposure surface is divided and exposed. Fig. 4 is a side view showing an embodiment of an exposure apparatus in which the present invention is applied to a direct drawing exposure without using a photomask. Fig. 5 is a side view showing a modification of the exposure apparatus of Fig. 4;
圖6是表示別形態的直接描繪曝光裝置的光學系0勺B 【主要元件符號說明】 1 :基板 1 a :曝光面 la-1’ la-2， la-3， la-4:分割曝光面 2 :基板支撐構件 3 :投影透鏡（投影光學系） 4 :玻璃板（光透過性構件） 4 a :玻璃板的平面 5 :驅動機構 6 :光罩 7 :對位機構 :玻璃板支撐構件 7b :移動機構 8 :基座構件 9 :汽缸機構 -17- 201128318 1 〇 :搬送機構 1 1 :密封構件 1 2 :滑動機構 1 3 :下方基板 14 :下方導軌 1 5 :中間基板 1 6 :下方導軌承接構件 1 7 :上方導軌 1 8 :上方導軌承接構件 1 9 :光源 20 :透鏡 21 :光學調變元件 22 :投影透鏡 23 :滑動機構 24 :平行光透鏡單元 2 6 :柱狀透鏡 2 7 :反射鏡 2 8 :多邊鏡 29 : F0透鏡單元 3 0 :反射鏡 3 1 :柱狀透鏡 S :密閉空間Fig. 6 is a view showing an optical system 0 scoop B of a direct drawing exposure apparatus of another form. [Explanation of main element symbols] 1 : Substrate 1 a : Exposure plane la-1' la-2, la-3, la-4: split exposure surface 2 : substrate supporting member 3 : projection lens (projection optical system) 4 : glass plate (light transmissive member) 4 a : plane 5 of glass plate : drive mechanism 6 : reticle 7 : alignment mechanism: glass plate supporting member 7 b : moving mechanism 8 : base member 9 : cylinder mechanism -17- 201128318 1 〇: conveying mechanism 1 1 : sealing member 1 2 : sliding mechanism 1 3 : lower substrate 14 : lower rail 1 5 : intermediate substrate 1 6 : lower rail Receiving member 1 7 : upper rail 1 8 : upper rail receiving member 1 9 : light source 20 : lens 21 : optical modulation element 22 : projection lens 23 : sliding mechanism 24 : parallel light lens unit 2 6 : lenticular lens 2 7 : Mirror 2 8 : Multi-mirror 29 : F0 Lens unit 3 0 : Mirror 3 1 : Cylindrical lens S : Confined space