CN102045955A - 等长金手指的镀金方法 - Google Patents
等长金手指的镀金方法 Download PDFInfo
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- CN102045955A CN102045955A CN 201010607991 CN201010607991A CN102045955A CN 102045955 A CN102045955 A CN 102045955A CN 201010607991 CN201010607991 CN 201010607991 CN 201010607991 A CN201010607991 A CN 201010607991A CN 102045955 A CN102045955 A CN 102045955A
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CN201010607991A CN102045955B (zh) | 2010-12-28 | 2010-12-28 | 等长金手指的镀金方法 |
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CN201010607991A CN102045955B (zh) | 2010-12-28 | 2010-12-28 | 等长金手指的镀金方法 |
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CN102045955A true CN102045955A (zh) | 2011-05-04 |
CN102045955B CN102045955B (zh) | 2012-09-05 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102905459A (zh) * | 2011-07-29 | 2013-01-30 | 昆山华扬电子有限公司 | 线路板电金用蓝胶 |
CN102958280A (zh) * | 2011-08-24 | 2013-03-06 | 深南电路有限公司 | 分段金手指的镀金方法 |
CN103702526A (zh) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | 一种无引线电镀金手指的处理方法 |
CN103731995A (zh) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | 无引线镀金封装基板及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
CN101594743A (zh) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | 用掩盖法制作电子线路板外层图形的方法 |
CN101624715A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 无镀金引线选择性电镀厚金工艺流程 |
CN101699940A (zh) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | 一种金手指印制板的制作方法 |
CN101702869A (zh) * | 2009-10-30 | 2010-05-05 | 陈国富 | 由无覆铜的绝缘基板直接制作线路板的方法 |
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2010
- 2010-12-28 CN CN201010607991A patent/CN102045955B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
CN101594743A (zh) * | 2008-05-28 | 2009-12-02 | 江苏苏杭电子有限公司 | 用掩盖法制作电子线路板外层图形的方法 |
CN101624715A (zh) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | 无镀金引线选择性电镀厚金工艺流程 |
CN101702869A (zh) * | 2009-10-30 | 2010-05-05 | 陈国富 | 由无覆铜的绝缘基板直接制作线路板的方法 |
CN101699940A (zh) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | 一种金手指印制板的制作方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102905459A (zh) * | 2011-07-29 | 2013-01-30 | 昆山华扬电子有限公司 | 线路板电金用蓝胶 |
CN102905459B (zh) * | 2011-07-29 | 2016-05-04 | 江苏普诺威电子股份有限公司 | 线路板电金用蓝胶 |
CN102958280A (zh) * | 2011-08-24 | 2013-03-06 | 深南电路有限公司 | 分段金手指的镀金方法 |
CN102958280B (zh) * | 2011-08-24 | 2015-06-03 | 深南电路有限公司 | 分段金手指的镀金方法 |
CN103731995A (zh) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | 无引线镀金封装基板及其制备方法 |
CN103731995B (zh) * | 2013-12-24 | 2017-05-03 | 广州兴森快捷电路科技有限公司 | 无引线镀金封装基板及其制备方法 |
CN103702526A (zh) * | 2013-12-30 | 2014-04-02 | 景旺电子科技(龙川)有限公司 | 一种无引线电镀金手指的处理方法 |
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Publication number | Publication date |
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CN102045955B (zh) | 2012-09-05 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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Effective date of registration: 20170113 Address after: 214000 Changjiang Road, New District, Jiangsu, Wuxi, No. 18 Patentee after: Wuxi Shennan Circuits Co., Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENZHEN SHENNAN CIRCUIT CO., LTD. |