CN102039708B - 一种粘合两基体的方法 - Google Patents

一种粘合两基体的方法 Download PDF

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CN102039708B
CN102039708B CN2009101103112A CN200910110311A CN102039708B CN 102039708 B CN102039708 B CN 102039708B CN 2009101103112 A CN2009101103112 A CN 2009101103112A CN 200910110311 A CN200910110311 A CN 200910110311A CN 102039708 B CN102039708 B CN 102039708B
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matrixes
stratiform structure
bonding
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CN102039708A (zh
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王佳平
范守善
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Tsinghua University
Hongfujin Precision Industry Shenzhen Co Ltd
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Tsinghua University
Hongfujin Precision Industry Shenzhen Co Ltd
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Priority to JP2010235501A priority patent/JP5255036B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
    • B29C65/3408—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
    • B29C65/3412—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements comprising fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/3404—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint
    • B29C65/3408—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" characterised by the type of heated elements which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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Abstract

本发明涉及一种粘合两基体的方法。该粘合两基体的方法包括以下步骤：提供一第一基体，该第一基体具有一表面；提供至少一碳纳米管膜，将该至少碳纳米管膜设置于该第一基体的表面，构成一碳纳米管层状结构；在碳纳米管层状结构上间隔地设置两个电极，该两个电极分别与所述碳纳米管层状结构电连接；提供一第二基体，将该第二基体覆盖于该碳纳米管层状结构设置，使该碳纳米管层状结构位于第一基体和第二基体之间；施加一定电压于该两个电极，使该碳纳米管层状结构升温以使第一基体和第二基体与该碳纳米管层状结构接触的部分软化或液化；施加压力于该第一基体和第二基体之间以粘合所述第一基体与第二基体。

Description

一种粘合两基体的方法
技术领域
本发明涉及一种粘合两基体的方法。
背景技术
现有技术中，通常会遇到将两基体粘合于一体的情况，例如，将两个或多个塑料基体粘合于一体构成一固定的形状或使其具有一定的功能。现有的粘合两基体的方法通常包括直接采用粘结剂粘合的方法或热压的方法。
该直接采用粘合剂粘合两基体的方法为将两个基体需要接触的表面涂覆一定量的粘合剂，然后将两基体粘合，烘干粘合剂之后，两基体便固定形成一体结构。这种粘合方法中，起粘合作用的为粘合剂。然而，由于粘合剂本身易老化且粘结力有限，这种粘合方法所粘合的两基体结合不牢固，易脱离。
所述热压将两基体粘合于一体的方法是将需要粘合的两个基体相互接触后，在一定温度下加热，等基体软化或表面部分开始液化时，对该两个基体施加一定的压力，使两基体粘合于一体，待基体再固化之后，该两基体即牢固的结合。然而，这种方法虽然可以使两个基体牢固的粘合于一体，但是由于需要对整个基体加热使其发生结构改变或形变，易将基体破坏。且这种方法需要将两基体整体加热，消耗的热量较大，不利于节约能源。
发明内容
有鉴于此，确有必要提供一种不破坏基体且有利于节约能源的粘合两基体的方法。
本发明涉及一种粘合两基体的方法。该粘合两基体的方法包括以下步骤：提供一第一基体，该第一基体具有一表面；提供至少一碳纳米管膜，将该至少一碳纳米管膜设置于该第一基体的表面，构成一碳纳米管层状结构；在碳纳米管层状结构上间隔地设置两个电极，该两个电极分别与所述碳纳米管层状结构电连接；提供一第二基体，将该第二基体覆盖于该碳纳米管层状结构设置，使该碳纳米管层状结构位于第一基体和第二基体之间；施加一定电压于该两个电极，使该碳纳米管层状结构升温以使第一基体和第二基体与该碳纳米管层状结构接触的部分软化或液化；施加压力于该第一基体和第二基体之间以粘合所述第一基体与第二基体。
相较于现有技术，本发明所提供的粘合两基体的方法通过采用碳纳米管层状结构设置于第一基体和第二基体之间并与第一基体和第二基体的表面接触，通过碳纳米管层状结构加热，仅使第一基体和第二基体与该碳纳米管层状结构接触的表面的表面软化或液化，无需将第一基体和第二基体整体加热，不会对基体本身造成伤害，且有利于节约能源。
附图说明
图1为本技术方案第一实施例所提供的粘合两基体的方法的流程图。
图2为本技术方案第一实施例所提供的粘合两基体的方法的过程的示意图。
图3为本技术方案第一实施例中将两基体粘合于一体之后的粘合处的扫描电镜照片。
图4为图3中将两基体粘合于一体之后的粘合处的放大后的扫描电镜照片。
具体实施方式
下面将结合附图及具体实施例对本发明作进一步的详细说明。
请参阅图1及图2，本技术方案第一实施例提供一种粘合两基体的方法，其具体包括以下步骤：
步骤一、提供一第一基体100，该基体具有一表面102。
所述第一基体100的形状不限，可以为规则的形状也可以为不规则的形状。所述规则的形状包括正方体、长方体、圆锥或圆柱等。所述第一基体100的材料为绝缘材料，优选地，所述第一基体100的熔点小于600℃。所述第一基体100可以为高分子材料，所述高分子材料包括环氧树脂、双马来酰亚胺树脂、氰酸酯树脂、聚丙烯、聚乙烯、聚乙烯醇、聚苯烯醇、聚碳酸酯或聚甲基丙烯酸甲酯等。所述第一基体100的材料也可以为陶瓷或玻璃等。可以理解，所述第一基体100也可为一表面涂敷或包裹有一绝缘材料层的器件。所述器件的形状与材料不限，可以为高分子材料、金属、陶瓷等。本实施例中，所述第一基体100为一长方体结构，其具有一表面102，其材料为聚碳酸酯。
步骤二、提供至少一碳纳米管膜，将该至少碳纳米管膜设置于该第一基体100的表面102，构成一碳纳米管层状结构120。
所述碳纳米管膜包括多个碳纳米管，碳纳米管之间通过范德华力紧密结合。优选地，所述碳纳米管膜中的多个碳纳米管均匀分布。该碳纳米管膜中的相邻碳纳米管之间具有一定的间隙，因此该碳纳米管膜包括多个微孔，该微孔的直径小于10微米。具体地，该碳纳米管膜中的碳纳米管可为无序或有序排列。这里的无序排列指碳纳米管的排列方向无规律，这里的有序排列指至少多数碳纳米管的排列方向具有一定规律。具体地，当碳纳米管膜包括无序排列的碳纳米管时，碳纳米管相互缠绕或者各向同性排列；当碳纳米管膜包括有序排列的碳纳米管时，碳纳米管沿一个方向或者多个方向择优取向排列。本实施例中，所述碳纳米管膜包括多个碳纳米管沿同一方向择优取向排列且基本平行于碳纳米管膜表面。所述碳纳米管之间通过范德华力首尾相连。所述碳纳米管膜的厚度为0.5纳米～100微米。本实施例中，所述碳纳米管膜为直接从一碳纳米管阵列中拉取获得，该碳纳米管膜的制备方法请参见范守善等人于2007年2月9日申请的，于2008年8月13日公开的第CN101239712A号中国公开专利申请“碳纳米管膜结构及其制备方法”，申请人：清华大学，鸿富锦精密工业(深圳)有限公司。为节省篇幅，仅引用于此，但上述申请所有技术揭露也应视为本发明申请技术揭露的一部分。
所述碳纳米管膜为一自支撑结构，所谓自支撑是指碳纳米管膜无需其它基体支撑，可自支撑保持一膜的形态。因此，所述碳纳米管膜可直接铺设于第一基体100的表面102上，并与该表面102贴合设置。可以理解，可将多个碳纳米管膜层叠或平行无间隙铺设。当碳纳米管膜层叠设置时，相邻的两层碳纳米管膜的层叠角度不限，相邻的碳纳米管膜通过范德华力紧密结合，从而在第一基体100的表面102构成一碳纳米管层状结构120。
另外，也可预先将所述碳纳米管膜层叠设置构成一碳纳米管层状结构120后再直接将碳纳米管层状结构120设置于第一基体100的表面102。其具可包括以下步骤：提供一支撑结构；将至少一层碳纳米管膜设置于该支撑结构的表面形成一碳纳米管层状结构120；将该碳纳米管层状结构120从该支撑结构上取下，铺设于所述第一基体100的表面102。可以理解，所述支撑结构可以为一基底，也可以为一框架结构。当支撑结构为一框架结构时，碳纳米管层状结构120可部分悬空，此时可直接将悬空的碳纳米管层状结构120直接铺设于第一基体100的表面102上，再将该框架结构的支撑结构去除。
步骤三、在碳纳米管层状结构120上间隔设置两个电极126，该两个电极126分别与该碳纳米管层状结构120电连接。
所述两个电极126可设置于碳纳米管层状结构120的表面，位于该碳纳米管层状结构120的两端。优选地，当该碳纳米管层状结构120中多个碳纳米管有序排列时，该多个碳纳米管的轴向方向为沿一个电极126向另一个电极126延伸。所述的两个电极126可通过一导电粘结剂(图未示)设置于该碳纳米管层状结构120的表面，导电粘结剂可以将电极126更好地固定于碳纳米管层状结构120的表面上，还可以使电极126与碳纳米管层状结构120之间保持良好的电接触。该导电粘结剂可以为银胶。所述两个电极126由导电材料制成，其形状不限，可为导电膜、金属片或者金属引线。优选地，该两个电极126分别为一层导电膜，该导电膜的厚度为0.5纳米～100微米。该导电膜的材料可以为金属、合金、铟锡氧化物(ITO)、锑锡氧化物(ATO)、导电银胶、导电聚合物或导电性碳纳米管等。该金属或合金材料可以为铝、铜、钨、钼、金、钛、钕、钯、铯或其任意组合的合金。所述电极126可通过溅射、涂敷、沉积或丝网印刷等方法设置于该碳纳米管层状结构120的表面。本实施例中，所述电极126的材料为金属钯膜，厚度为5微米，其通过丝网印刷方法形成于碳纳米管层状结构120的表面。所述金属钯与碳纳米管具有较好的润湿效果，有利于所述电极126与所述碳纳米管层状结构120之间形成良好的电接触，减少欧姆接触电阻。
另外，可以理解，所述电极126设置的作用为向碳纳米管层状结构120施加电压，因此，所述电极126为可选择结构，任何可向碳纳米管层状结构120施加电压的结构与方式均在本发明的保护范围内。
步骤四、提供一第二基体200，将该第二基体200覆盖于该碳纳米管层状结构120设置，使该碳纳米管层状结构120设置于第一基体100与第二基体200之间。
所述第二基体200所包括的形状和材料与第一基体100所包括的形状和材料相同。可以理解，在同一实施例中，第二基体200的形状可以与第一基体100的形状相同，也可以不同；第二基体200的材料可以与第一基体100的材料相同，也可以不同。本实施例中，所述第二基体200为一板状结构的聚碳酸酯，其体积小于该第一基体100的体积，其具有一表面202。设置于第一基体100与第二基体200之间的碳纳米管层状结构分别与所述第一基体100的表面102及第二基体200的表面202接触。
步骤五、施加一定电压于该两个电极126，使该碳纳米管层状结构120升至一定温度，使所述第一基体100和第二基体200与该碳纳米管层状结构120接触的部分软化或液化。
在两个电极126之间施加的电压的大小由所述第一基体100和第二基体200决定。该电压和碳纳米管层状结构120的电阻也有关，碳纳米管层状结构120的电阻越小，在升高到相同的温度的情况下，所需要的电压越小。碳纳米管层状结构120的电阻的大小与该碳纳米管层状结构120所包括的层叠设置的碳纳米管膜的层数有关，碳纳米管膜的层数越多，其电阻越小，反之则越大。优选地，所述电压为1伏～10伏。在两个电极126之间施加电压后，碳纳米管层状结构120中有电流流过，由于焦耳热的作用碳纳米管层状结构120的温度升高。导致与碳纳米管层状结构120接触的第一基体100的表面102与第二基体200的表面202的温度逐渐升高。当第一基体100的表面102和第二基体200的表面202达到一定温度之后，开始软化或熔化。此时，停止施加电压。本实施例中，第一基体100和第二基体200的材料均为聚碳酸酯，聚碳酸酯的熔点为220℃～230℃，因此当碳纳米管层状结构120的温度达到220℃或略高于聚碳酸酯的熔点时，停止在碳纳米管层状结构120的两端施加电压。可以理解，也可使该碳纳米管层状结构120保持该温度一段时间。
可以理解，上述步骤也可在真空环境下或有保护气体存在的环境下进行。所述真空环境的真空度可以为10-2～10-6帕。所述保护气体包括氮气和惰性气体。由于碳纳米管层状结构120中的碳纳米管在600℃左右时容易被氧化破坏，因此，在真空环境或保护气体存在的情况下，可以保护碳纳米管层状结构120在高温时不被破坏，碳纳米管层状结构120的温度可以达到2000℃左右，可用于粘合熔点较高的基体。
步骤六、施加一定压力于第一基体100和第二基体200以粘合该第一基体100与第二基体200。
由于第一基体100的表面102和第二基体200的表面202已开始软化或熔化，可施加一定的外加压力于第一基体100和第二基体200之间，使第一基体100和第二基体200固定于一体。由于该碳纳米管层状结构120包括多个微孔，在施压过程中，软化或熔化的第一基体100的表面102和第二基体200的表面202可渗透到碳纳米管层状结构120中，并透过该多个微孔相互粘合。由于碳纳米管层状结构120的厚度较小，第一基体100和第二基体200之间不会存在缝隙。
可以理解，可选择地，在第一基体100和第二基体200固定于一体之后，可进一步将碳纳米管层状结构120上的两个电极126去除。当碳纳米管层状结构120的面积大于第一基体100的表面102或第二基体200的表面202时，该至少两个电极126可暴露出来，可直接将该两个电极126揭除。另外，也可以通过剪切上述粘合后的结构将该两个电极126除去。
可以理解，步骤五和步骤六可以同时进行，即在对两个电极126施加电压的同时，对第一基体100和第二基体200施加压力。
请参见图3和图4，该碳纳米管层状结构120可将第一基体100和第二基体200牢固的粘合于一体，且在第一基体100和第二基体200的粘结处不会形成缝隙。而且，第一基体100与第二基体200仅在与所述碳纳米管层状结构120接触的表面部分熔化，第一基体100与第二基体200其他部分的形状与性质不受影响。
本发明所提供的粘合两基体的方法具有以下优点：其一，本发明通过碳纳米管层状结构加热第一基体和第二基体与该碳纳米管层状结构接触的表面，使第一基体和第二基体的表面熔化或液化，无需将第一基体和第二基体整体加热，不会对基体本身造成伤害。其二，当基体与低熔点的器件相连或基体内部包括低熔点的器件时，本发明所提供的粘合两基体的方法无需对基体整体加热，因此不会导致该器件熔化，从而不会破坏该器件的形状和性质，也即本发明所提供的粘合两基体的方法对基体的限制较少，有更广应用范围；其三，由于本发明所提供的粘合两基体的方法仅对基体需要粘合的表面进行加热，无需加热整个基体，因此需要的热量较少，有利于节约能源；其四，碳纳米管层状结构的厚度较小，可以达到纳米级，使用该碳纳米管层状结构粘合两基体不会在两基体之间形成缝隙，因此，本发明所提供的粘合两基体的方法使两基体结合牢固，使两基体粘合于一体之后美观大方；其五，碳纳米管层状结构具有较好的柔韧性，使用该碳纳米管层状结构粘合两基体后，不会对粘合后基体的柔韧性造成影响；其六，本发明通过碳纳米管层状结构加热第一基体和第二基体与该碳纳米管层状结构接触的表面，使第一基体和第二基体的表面熔化或液化后粘合的方法，简单可控，适用于工业化应用。
另外，本领域技术人员还可在本发明精神内做其他变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (15)

1.一种粘合两基体的方法，其包括以下步骤：
提供一第一基体，该第一基体具有一表面；
提供至少一碳纳米管膜，并将该至少一碳纳米管膜设置于第一基体的表面，构成一碳纳米管层状结构；
在碳纳米管层状结构上间隔地设置两个电极，该两个电极分别与所述碳纳米管层状结构电连接；
提供一第二基体，将该第二基体覆盖于该碳纳米管层状结构设置，使该碳纳米管层状结构位于第一基体和第二基体之间；
施加一定电压于该两个电极，使该碳纳米管层状结构升温以使第一基体和第二基体与该碳纳米管层状结构接触的部分软化或液化；
施加压力于该第一基体和第二基体以粘合所述第一基体与第二基体。
2.如权利要求1所述的粘合两基体的方法，其特征在于，所述第一基体及第二基体的材料为绝缘材料。
3.如权利要求1所述的粘合两基体的方法，其特征在于，所述第一基体及第二基体的材料的熔点低于600℃。
4.如权利要求1所述的粘合两基体的方法，其特征在于，所述第一基体及第二基体为一表面涂敷或包裹有一绝缘材料层的器件。
5.如权利要求1所述的粘合两基体的方法，其特征在于，所述碳纳米管层状结构的厚度为0.5纳米～100微米。
6.如权利要求1所述的粘合两基体的方法，其特征在于，所述该碳纳米管膜包括多个碳纳米管通过范德华力相互连接。
7.如权利要求6所述的粘合两基体的方法，其特征在于，所述碳纳米管膜包括多个碳纳米管，该多个碳纳米管基本相互平行且基本平行于碳纳米管膜表面。
8.如权利要求7所述的粘合两基体的方法，其特征在于，所述碳纳米管膜中的碳纳米管通过范德华力首尾相连，且基本沿同一方向择优取向排列。
9.如权利要求1所述的粘合两基体的方法，其特征在于，所述将碳纳米管膜设置在第一基体表面的方法包括将多个碳纳米管膜层叠铺设或平行无间隙铺设于第一基体表面。
10.如权利要求1所述的粘合两基体的方法，其特征在于，所述在第一基体表面形成碳纳米管层状结构的方法包括以下步骤：提供一支撑结构；将至少一层碳纳米管膜设置于该支撑结构的表面形成一碳纳米管层状结构；将该碳纳米管层状结构从该支撑结构上取下，铺设于所述第一基体的表面。
11.如权利要求1所述的粘合两基体的方法，其特征在于，所述两个电极分别设置于碳纳米管层状结构的表面，位于该碳纳米管层状结构的两端。
12.如权利要求1所述的粘合两基体的方法，其特征在于，所述施加一定电压于该两个电极，使该碳纳米管层状结构升温以使第一基体和第二基体与该碳纳米管层状结构接触的部分软化或液化的步骤，在10-2～10-6帕的真空环境或保护气体存在的情况下进行。
13.如权利要求1所述的粘合两基体的方法，其特征在于，所述碳纳米管层状结构包括多个微孔，微孔的直径小于10微米。
14.如权利要求13所述的粘合两基体的方法，其特征在于，在施加压力的过程中，所述第一基体和第二基体软化或液化的部分渗透到该碳纳米管层状结构中，并透过该碳纳米管层状结构的微孔相互接触并粘合于一体。
15.一种粘合两基体的方法，其包括以下步骤：
提供两基体，该两基体分别具有一表面；
提供一碳纳米管层状结构；
将上述两基体贴和设置，并将上述碳纳米管层状结构设置在两基体的表面之间；
施加一电压于碳纳米管层状结构，使该碳纳米管层状结构升温以使两基体的表面软化或液化；
施加压力于两基体之间以粘合所述两基体。
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