CN102031065B - 无磨料的化学机械抛光组合物 - Google Patents

无磨料的化学机械抛光组合物 Download PDF

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Publication number
CN102031065B
CN102031065B CN2010102981564A CN201010298156A CN102031065B CN 102031065 B CN102031065 B CN 102031065B CN 2010102981564 A CN2010102981564 A CN 2010102981564A CN 201010298156 A CN201010298156 A CN 201010298156A CN 102031065 B CN102031065 B CN 102031065B
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CN
China
Prior art keywords
weight
methacrylic acid
acid
composition
acidic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2010102981564A
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English (en)
Chinese (zh)
Other versions
CN102031065A (zh
Inventor
王红雨
S·A·伊比特森
T·高希
M·R·温克勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROHM AND HAAS ELECTRONIC MATER
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ROHM AND HAAS ELECTRONIC MATER
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Publication date
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Publication of CN102031065A publication Critical patent/CN102031065A/zh
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Publication of CN102031065B publication Critical patent/CN102031065B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN2010102981564A 2009-09-25 2010-09-21 无磨料的化学机械抛光组合物 Expired - Fee Related CN102031065B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/586,642 US20110073800A1 (en) 2009-09-25 2009-09-25 Abrasive-free chemical mechanical polishing compositions
US12/586,642 2009-09-25

Publications (2)

Publication Number Publication Date
CN102031065A CN102031065A (zh) 2011-04-27
CN102031065B true CN102031065B (zh) 2013-09-11

Family

ID=43779265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102981564A Expired - Fee Related CN102031065B (zh) 2009-09-25 2010-09-21 无磨料的化学机械抛光组合物

Country Status (5)

Country Link
US (1) US20110073800A1 (https=)
JP (1) JP2011082512A (https=)
KR (1) KR20110033786A (https=)
CN (1) CN102031065B (https=)
TW (1) TW201127924A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013137192A1 (ja) * 2012-03-16 2013-09-19 株式会社フジミインコーポレーテッド 研磨用組成物
WO2014034425A1 (ja) * 2012-08-31 2014-03-06 株式会社 フジミインコーポレーテッド 研磨用組成物及び基板の製造方法
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
CN104002252B (zh) * 2014-05-21 2016-06-01 华侨大学 超细磨料生物高分子柔性抛光膜及其制备方法
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
CN113969173B (zh) * 2021-09-23 2022-05-13 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1455784A (zh) * 1999-04-30 2003-11-12 综研化学株式会社 丙烯酸类聚合物的制造方法
US20060110924A1 (en) * 2004-11-24 2006-05-25 Tirthankar Ghosh Abrasive-free chemical mechanical polishing compositions and methods relating thereto

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001300285A (ja) * 2000-04-18 2001-10-30 Sanyo Chem Ind Ltd 研磨用砥粒分散剤及び研磨用スラリー
JP2004517980A (ja) * 2000-09-21 2004-06-17 ローム　アンド　ハース　カンパニー 極性モノマーと多価カチオンとに関わる方法および組成物
US6433061B1 (en) * 2000-10-24 2002-08-13 Noveon Ip Holdings Corp. Rheology modifying copolymer composition
US7288616B2 (en) * 2002-01-18 2007-10-30 Lubrizol Advanced Materials, Inc. Multi-purpose polymers, methods and compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1455784A (zh) * 1999-04-30 2003-11-12 综研化学株式会社 丙烯酸类聚合物的制造方法
US20060110924A1 (en) * 2004-11-24 2006-05-25 Tirthankar Ghosh Abrasive-free chemical mechanical polishing compositions and methods relating thereto

Also Published As

Publication number Publication date
CN102031065A (zh) 2011-04-27
TW201127924A (en) 2011-08-16
US20110073800A1 (en) 2011-03-31
JP2011082512A (ja) 2011-04-21
KR20110033786A (ko) 2011-03-31

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Granted publication date: 20130911

Termination date: 20150921

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