KR20110033786A - 무연마제 화학 기계 연마 조성물 - Google Patents

무연마제 화학 기계 연마 조성물 Download PDF

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Publication number
KR20110033786A
KR20110033786A KR1020100090903A KR20100090903A KR20110033786A KR 20110033786 A KR20110033786 A KR 20110033786A KR 1020100090903 A KR1020100090903 A KR 1020100090903A KR 20100090903 A KR20100090903 A KR 20100090903A KR 20110033786 A KR20110033786 A KR 20110033786A
Authority
KR
South Korea
Prior art keywords
acid
methacrylic acid
weight
composition
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020100090903A
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English (en)
Korean (ko)
Inventor
훙위 왕
스콧 에이. 이빗슨
티르탄카르 고쉬
마크 알. 윈클
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20110033786A publication Critical patent/KR20110033786A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020100090903A 2009-09-25 2010-09-16 무연마제 화학 기계 연마 조성물 Withdrawn KR20110033786A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/586,642 US20110073800A1 (en) 2009-09-25 2009-09-25 Abrasive-free chemical mechanical polishing compositions
US12/586,642 2009-09-25

Publications (1)

Publication Number Publication Date
KR20110033786A true KR20110033786A (ko) 2011-03-31

Family

ID=43779265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100090903A Withdrawn KR20110033786A (ko) 2009-09-25 2010-09-16 무연마제 화학 기계 연마 조성물

Country Status (5)

Country Link
US (1) US20110073800A1 (https=)
JP (1) JP2011082512A (https=)
KR (1) KR20110033786A (https=)
CN (1) CN102031065B (https=)
TW (1) TW201127924A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140129175A (ko) * 2012-03-16 2014-11-06 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
CN113969173A (zh) * 2021-09-23 2022-01-25 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014034425A1 (ja) * 2012-08-31 2014-03-06 株式会社 フジミインコーポレーテッド 研磨用組成物及び基板の製造方法
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
CN104002252B (zh) * 2014-05-21 2016-06-01 华侨大学 超细磨料生物高分子柔性抛光膜及其制备方法
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270480B2 (ja) * 1999-04-30 2009-06-03 綜研化学株式会社 アクリル系重合体の製造法
JP2001300285A (ja) * 2000-04-18 2001-10-30 Sanyo Chem Ind Ltd 研磨用砥粒分散剤及び研磨用スラリー
JP2004517980A (ja) * 2000-09-21 2004-06-17 ローム　アンド　ハース　カンパニー 極性モノマーと多価カチオンとに関わる方法および組成物
US6433061B1 (en) * 2000-10-24 2002-08-13 Noveon Ip Holdings Corp. Rheology modifying copolymer composition
US7288616B2 (en) * 2002-01-18 2007-10-30 Lubrizol Advanced Materials, Inc. Multi-purpose polymers, methods and compositions
US7435356B2 (en) * 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140129175A (ko) * 2012-03-16 2014-11-06 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
CN113969173A (zh) * 2021-09-23 2022-01-25 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液
CN113969173B (zh) * 2021-09-23 2022-05-13 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Also Published As

Publication number Publication date
CN102031065A (zh) 2011-04-27
TW201127924A (en) 2011-08-16
CN102031065B (zh) 2013-09-11
US20110073800A1 (en) 2011-03-31
JP2011082512A (ja) 2011-04-21

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P22-X000 Classification modified

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