KR20110033786A - 무연마제 화학 기계 연마 조성물 - Google Patents

무연마제 화학 기계 연마 조성물 Download PDF

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Publication number
KR20110033786A
KR20110033786A KR1020100090903A KR20100090903A KR20110033786A KR 20110033786 A KR20110033786 A KR 20110033786A KR 1020100090903 A KR1020100090903 A KR 1020100090903A KR 20100090903 A KR20100090903 A KR 20100090903A KR 20110033786 A KR20110033786 A KR 20110033786A
Authority
KR
South Korea
Prior art keywords
acid
methacrylic acid
weight
composition
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020100090903A
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English (en)
Korean (ko)
Inventor
훙위 왕
스콧 에이. 이빗슨
티르탄카르 고쉬
마크 알. 윈클
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20110033786A publication Critical patent/KR20110033786A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020100090903A 2009-09-25 2010-09-16 무연마제 화학 기계 연마 조성물 Withdrawn KR20110033786A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/586,642 2009-09-25
US12/586,642 US20110073800A1 (en) 2009-09-25 2009-09-25 Abrasive-free chemical mechanical polishing compositions

Publications (1)

Publication Number Publication Date
KR20110033786A true KR20110033786A (ko) 2011-03-31

Family

ID=43779265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100090903A Withdrawn KR20110033786A (ko) 2009-09-25 2010-09-16 무연마제 화학 기계 연마 조성물

Country Status (5)

Country Link
US (1) US20110073800A1 (https=)
JP (1) JP2011082512A (https=)
KR (1) KR20110033786A (https=)
CN (1) CN102031065B (https=)
TW (1) TW201127924A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140129175A (ko) * 2012-03-16 2014-11-06 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
CN113969173A (zh) * 2021-09-23 2022-01-25 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102155205B1 (ko) * 2012-08-31 2020-09-11 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 기판의 제조 방법
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
CN104002252B (zh) * 2014-05-21 2016-06-01 华侨大学 超细磨料生物高分子柔性抛光膜及其制备方法
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270480B2 (ja) * 1999-04-30 2009-06-03 綜研化学株式会社 アクリル系重合体の製造法
JP2001300285A (ja) * 2000-04-18 2001-10-30 Sanyo Chem Ind Ltd 研磨用砥粒分散剤及び研磨用スラリー
BR0113999A (pt) * 2000-09-21 2003-08-12 Rohm & Haas Processo para preparar uma dispersão polimérica aquosa nanocompósita de argila, dispersão nanocompósita aquosa, espessador, dispersante, aglutinante, composição de tinta flexográfica, verniz de sobre impressão, modificador de pó de cimento seco, semente polimérica nanocompósita de argila, composição polimérica nanocompósita de argila, e, método para preparar uma pluralidade de partìculas poliméricas nanocompósitas de argila ocas
US6433061B1 (en) * 2000-10-24 2002-08-13 Noveon Ip Holdings Corp. Rheology modifying copolymer composition
US7288616B2 (en) * 2002-01-18 2007-10-30 Lubrizol Advanced Materials, Inc. Multi-purpose polymers, methods and compositions
US7435356B2 (en) * 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140129175A (ko) * 2012-03-16 2014-11-06 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
CN113969173A (zh) * 2021-09-23 2022-01-25 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液
CN113969173B (zh) * 2021-09-23 2022-05-13 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Also Published As

Publication number Publication date
TW201127924A (en) 2011-08-16
CN102031065B (zh) 2013-09-11
CN102031065A (zh) 2011-04-27
US20110073800A1 (en) 2011-03-31
JP2011082512A (ja) 2011-04-21

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