TW201127924A - Abrasive-free chemical mechanical polishing compositions - Google Patents

Abrasive-free chemical mechanical polishing compositions Download PDF

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Publication number
TW201127924A
TW201127924A TW099131937A TW99131937A TW201127924A TW 201127924 A TW201127924 A TW 201127924A TW 099131937 A TW099131937 A TW 099131937A TW 99131937 A TW99131937 A TW 99131937A TW 201127924 A TW201127924 A TW 201127924A
Authority
TW
Taiwan
Prior art keywords
acid
composition
weight
methacrylic acid
transfer agent
Prior art date
Application number
TW099131937A
Other languages
English (en)
Chinese (zh)
Inventor
Hong-Yu Wang
Scott A Ibbitson
Tirthankar Ghosh
Mark R Winkle
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW201127924A publication Critical patent/TW201127924A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW099131937A 2009-09-25 2010-09-21 Abrasive-free chemical mechanical polishing compositions TW201127924A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/586,642 US20110073800A1 (en) 2009-09-25 2009-09-25 Abrasive-free chemical mechanical polishing compositions

Publications (1)

Publication Number Publication Date
TW201127924A true TW201127924A (en) 2011-08-16

Family

ID=43779265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099131937A TW201127924A (en) 2009-09-25 2010-09-21 Abrasive-free chemical mechanical polishing compositions

Country Status (5)

Country Link
US (1) US20110073800A1 (https=)
JP (1) JP2011082512A (https=)
KR (1) KR20110033786A (https=)
CN (1) CN102031065B (https=)
TW (1) TW201127924A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102022139B1 (ko) * 2012-03-16 2019-09-17 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
KR102155205B1 (ko) * 2012-08-31 2020-09-11 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 기판의 제조 방법
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
CN104002252B (zh) * 2014-05-21 2016-06-01 华侨大学 超细磨料生物高分子柔性抛光膜及其制备方法
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
CN113969173B (zh) * 2021-09-23 2022-05-13 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270480B2 (ja) * 1999-04-30 2009-06-03 綜研化学株式会社 アクリル系重合体の製造法
JP2001300285A (ja) * 2000-04-18 2001-10-30 Sanyo Chem Ind Ltd 研磨用砥粒分散剤及び研磨用スラリー
BR0113999A (pt) * 2000-09-21 2003-08-12 Rohm & Haas Processo para preparar uma dispersão polimérica aquosa nanocompósita de argila, dispersão nanocompósita aquosa, espessador, dispersante, aglutinante, composição de tinta flexográfica, verniz de sobre impressão, modificador de pó de cimento seco, semente polimérica nanocompósita de argila, composição polimérica nanocompósita de argila, e, método para preparar uma pluralidade de partìculas poliméricas nanocompósitas de argila ocas
US6433061B1 (en) * 2000-10-24 2002-08-13 Noveon Ip Holdings Corp. Rheology modifying copolymer composition
US7288616B2 (en) * 2002-01-18 2007-10-30 Lubrizol Advanced Materials, Inc. Multi-purpose polymers, methods and compositions
US7435356B2 (en) * 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto

Also Published As

Publication number Publication date
CN102031065B (zh) 2013-09-11
CN102031065A (zh) 2011-04-27
US20110073800A1 (en) 2011-03-31
JP2011082512A (ja) 2011-04-21
KR20110033786A (ko) 2011-03-31

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