CN102027596B - 发光二极管装置 - Google Patents

发光二极管装置 Download PDF

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CN102027596B
CN102027596B CN2009801175104A CN200980117510A CN102027596B CN 102027596 B CN102027596 B CN 102027596B CN 2009801175104 A CN2009801175104 A CN 2009801175104A CN 200980117510 A CN200980117510 A CN 200980117510A CN 102027596 B CN102027596 B CN 102027596B
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德特勒夫·格哈德
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Abstract

本发明涉及一种LED装置(发光二极管)，该LED装置包括多个相邻布置的近似相同指向地发光的LED(1)以便形成平面延伸的光源，其中，LED安装在金属多薄膜支承件(2)上，所述支承件(2)具有夹层状的绝缘中间层(3)并且带有至少一个台阶的台阶状形成的结构，其中，在每个台阶上至少一个LED芯片(1)安放在金属薄膜上，并且分别位于其上的金属层具有相应的缩短或空隙，使得LED能被安装。

Description

发光二极管装置
技术领域
本发明涉及多个LED(发光二极管)的装置，所述LED安装在共同的支承件上，大致在相同的方向上发光，并且因此形成平面延伸的光源。
背景技术
在基于将多个发光二极管(在下文中称为LED芯片或简称为LED)组装的很强光源的结构中，将多个此类元件安装在共同的支承件上。接触在共同的支承件之外进行，其中单独的元件相互连接。对于其中例如包括2×3个或2×n个LED的较小的装置，这些方法可很好地适用。
对于已知的带有LED的平面的二维排布，目前在LED之间的中间空间提供为用于安装多个LED，如根据US 2004/0233671A1示例性地描述。
根据开发状态而计划的密集的发光二极管封装进一步导致发热，这必须被相应地考虑。
迄今为止例如通过扩大LED的光在其上发出的芯片面积寻求可能的解决方案。但是，面积大的LED难于制造并且随尺寸的增大效率明显下降。在实践中这意味着必须考虑高的生产成本。优化平面布置光源的发光效率的另一个可能性在于，将LED安放在共同的支承件上。然而，这点具有的缺点是，根据不同的平面单元，LED的封装密度不是最优的。
发明内容
本发明要解决的技术问题在于，提供结构尽可能紧凑同时散热更有利的LED装置。
通过权利要求1的特征组合解决该技术问题。有利地构造在从属权利要求中得到。
本发明基于如下认知，即，LED可在平面布置中紧密封装为使得它们给出了具有在一个方向上发光的平面照明。LED在此并非全部安装在共同的平面内，而是在发光方向上具有高度差异。不过，并排布置的LED关于侧向布置保持其相互间相对定向不变地定位，以及根据本发明密集或紧密地封装。
根据本发明将夹层结构用于支承件，该支承件包括多个金属薄膜(也称为金属层)，其中，在薄膜之间分别插入绝缘层。
如果为严格描述将观察方向直接选择在LED的发光面上，则相应地LED的前部可见。在此，LED元件被平面地紧凑相邻封装。在该视图中，例如在图3A、图3C和图5A中表示的那样，可见多薄膜夹层构造具有台阶状结构。在此，薄膜在多层金属薄膜的边缘的方向上相继地结束，使得在金属薄膜平面的每个暴露端或边缘可安放至少一个LED。通过相应的接触线进行接触。
在通过本发明实现的LED在支承件上的紧密封装中，此外有利的是，除台阶状的构造外，将例如安装在梳形支承件的梳齿上的LED串联连接。在此，分别由位于LED芯片的前侧上的焊盘/连接点向相邻的相应地连接的金属薄膜引出接触线，例如结合线。因此形成了在梳齿上台阶状安放的LED的串联连接。
此外有利的是除串联连接外，形成至少部分地并联连接的区域。在特别有利的结构形式中，除紧凑结构方式外提供了各金属薄膜上的LED的良好的热耦合，其中金属薄膜优选地在背部位置处与散热器连接。
也有利的是形成为夹层形式的多层金属薄膜布置在不存在LED排布的区域内向一侧例如提供以90度的角度。因此在背部支承的系统中能够以简单的方式进行接触或传热。
附图说明
在下文中根据示意图描述不限制本发明的实施例。
图1示出了带有高封装密度的LED平面发光器的原理结构，
图2示出了带有三个安放在各梳齿的端部上的LED芯片的金属薄膜梳的图示，
图3A、图3B和图3C分别示出了LED平面发光器的俯视图、侧视图和三维视图，
图4示出了带有插入的绝缘层的金属薄膜支承件的侧视图，所述金属薄膜支承件构造为弓形，并且在截面中部分地给出了带有梳齿的梳，
图5A、图5B和图5C分别示出了LED平面发光器的俯视图、侧视图和三维视图，所述LED平面发光器实现为对称的双重构造，
图6示出了带有发光光学器件和冷却系统的平面发光器的结构的原理。
具体实施方式
根据本发明，发光二极管(LED)并非安装在共同的平面上，而是建议了由多个金属薄膜组成的夹层结构方式，所述夹层结构方式具有插入的绝缘层。关键的是使用此结构方式，在侧向观察时实现了很密集的LED芯片的安放。此外，在LED运行中生成的热可通过金属薄膜分别由LED传出。
用于实现平面发光器的支承件的此排布构思此外可有利地构造为带有如下特征：
为将不同地分组串联连接的LED并联连接，如在图1或图2中所图示，金属薄膜例如构造为梳的形式。在俯视图中，梳的主干提供有垂直地延伸的梳齿，其中多层薄膜分别不同程度地延伸直至梳齿的端部。因此形成了均匀的台阶结构，其中在梳齿端部上每个安放一个LED，所述向下接触在金属薄膜上，或向上与下一个相应地极化的金属薄膜接触。
有利的是，在金属薄膜系统中梳结构从上至下连续形成。但部分地形成也是可以的。
为改进平面发光器的空间设计和/或热设计，金属薄膜可在伸出端部上弯曲成角度使其可容易地安装在上级系统上。
图1示出了带有相应的台阶的LED平面发光器的原理结构。LED基本上安装在不同的金属薄膜上。金属薄膜以夹层结构方式叠置。位于薄膜之间的各绝缘层带有附图标号3。根据图1金属薄膜2具有两层和另外的上方的覆盖层，所述覆盖层通过电接触4向外连接。在图1中示出了每两个LED的串联。这相应地通过金属薄膜2和下一个LED的焊盘9之间的接触线5进行。最下方的三个LED1的布置通过相应的LED芯片与图1中位于其下方的图1中最后侧的形成为梳状的金属薄膜接触，并且由此处也通过电连接向外接出。
图2给出了金属薄膜梳2的图示。在俯视图中示出了带有三个指向左的梳齿的主干。LED芯片1安装在各端部上，并且向下通过接触线5与另外的金属薄膜接触。此外LED芯片1安装在各金属薄膜上，使得其运行热量通过该金属薄膜可传出。在LED芯片1上中心提供了所谓的焊盘9。该焊盘9与所谓连接线的另外的接触线5向上接触。金属薄膜厚度在理想情况中等于LED芯片1的厚度。
图3A按照俯视图示出了多个串联连接的LED的实现。金属薄膜梳2也具有三个梳齿。在每个梳齿上形成总计四个台阶的台阶形结构，这通过使每个金属薄膜不同程度地在梳齿上向前延伸至梳齿的端部来实现。在此，最下方的金属薄膜完全地形成。在梳齿的尖端上相应地分别安装一个芯片。金属薄膜的下一个更高的层缩短了一个LED芯片的平面延伸的量。在相应的自由端上，又每个安装了另外的LED芯片1。在图3A中第三LED和第四LED以相同的方式安装，并且通过接触线5电串联。
图3B示出了根据图3A的图示的侧视图，所述侧视图部分地按照分解图示给出。金属薄膜多层支承件的夹层结构的台阶状构造在此清晰可见。在最下方和最上方金属薄膜上提供了电连接4以用于向外接触。金属薄膜每个从下方接触一个LED芯片1。通过接触线5，将属于LED芯片1的焊盘9与更高的但不位于其上的金属薄膜接触。
图3C给出了根据图3A和图3B的图示的三维视图。
串联连接的LED的布置以理想方式通过由金属薄膜到位于该金属薄膜下方的金属薄膜上的LED的相应的焊盘9的连接实现。
电接触基本上串联或并联地进行，使得不出现短路连接。多层金属薄膜的夹层的结构方式也可构造为使得单独层的金属薄膜具有多于一个梳，其中根据图5或也根据图1，最上方的金属薄膜具有环绕触点，使用所述环绕触点可为平面的所有梳供电。
整个平面发光器包括至少支承了LED的金属薄膜，并且可另外地具有发光光学器件以及冷却系统。
图6示出了带有发光光学器件的平面发光器的原理结构，其带有定位在中心的LED结构和位于下方的冷却系统或者散热器或冷却体。
图5A、图5B和图5C以俯视图、侧视图和三维视图的形式示出了具有高封装密度的LED平面发光器。在此，根据图5B容易地可见至此已描述的LED平面发光器的对称双重实施方式。通过也可由金属薄膜实现的电连接6保证了全部LED的电接触。
图5C在三维视图中示出了根据图5A、图5B的图示。电连接6仅在图5B中可见。

Claims (14)

1.一种LED装置，包括多个相邻布置的近似相同指向地发光的LED芯片以便形成平面延伸的光源，其中，所述LED芯片安装在金属多薄膜支承件上，该支承件具有金属薄膜之间的夹层状的绝缘中间层并且带有多个台阶的台阶状形成的结构，其中：
-所述台阶通过分别位于其上的金属薄膜的相应的缩短或空隙形成，
-所述LED芯片分别安放在台阶的金属薄膜上并且电接触，和
-所述LED芯片分别与位于其上的相邻台阶上的金属薄膜电接触。
2.根据权利要求1所述的LED装置，其中，所述LED芯片至少分组串联连接。
3.根据权利要求1或2所述的LED装置，其中，所述LED芯片的电路设计为至少部分地串联和/或至少部分地并联。
4.根据前述权利要求1或2所述的LED装置，其中，所述LED芯片(1)通过接触线(5)从电连接点(9)联接到相邻的相对极性地连接的金属薄膜。
5.根据前述权利要求1或2所述的LED装置，其中，所述金属薄膜在其背离LED芯片的区域上通过电连接(4)进一步接触。
6.根据前述权利要求1或2所述的LED装置，其中，所述LED芯片为了传热而联接到金属薄膜上。
7.根据权利要求6所述的LED装置，其中，所述金属薄膜在背离所述LED芯片的侧上与散热器连接。
8.根据前述权利要求1或2所述的LED装置，其中，发光光学器件处于所述LED芯片的发光侧上，该发光光学器件至少部分地覆盖LED装置并且由不导电材料制成。
9.根据前述权利要求1或2所述的LED装置，其中，带有位于其间的绝缘层的多层金属薄膜在未装有LED芯片的区域内弯曲90度。
10.根据前述权利要求1或2所述的LED装置，其中，指向外的电连接(4)安装在各上方和下方金属薄膜中的一个上。
11.根据前述权利要求1或2所述的LED装置，其中，所述LED芯片安装在金属薄膜的形成为带有多个梳齿的梳状结构上。
12.根据权利要求11所述的LED装置，其中，所述多个梳结构呈现在唯一的多层夹层金属薄膜上。
13.根据前述权利要求1或2所述的LED装置，其中，至少一个LED装置装配有光学器件，并且在背部侧上具有冷却系统。
14.一种LED装置，其中，多个根据前述权利要求中任一项所述的LED装置相互机械和/或电联接。
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