CN102013389A - 基板处理设备和基板处理方法 - Google Patents

基板处理设备和基板处理方法 Download PDF

Info

Publication number
CN102013389A
CN102013389A CN2010102721001A CN201010272100A CN102013389A CN 102013389 A CN102013389 A CN 102013389A CN 2010102721001 A CN2010102721001 A CN 2010102721001A CN 201010272100 A CN201010272100 A CN 201010272100A CN 102013389 A CN102013389 A CN 102013389A
Authority
CN
China
Prior art keywords
substrate
droplet
nozzle
droplets
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102721001A
Other languages
English (en)
Chinese (zh)
Inventor
菊池勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Engineering Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Engineering Works Co Ltd filed Critical Shibaura Engineering Works Co Ltd
Publication of CN102013389A publication Critical patent/CN102013389A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2010102721001A 2009-09-03 2010-09-02 基板处理设备和基板处理方法 Pending CN102013389A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-203402 2009-09-03
JP2009203402A JP5650896B2 (ja) 2009-09-03 2009-09-03 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
CN102013389A true CN102013389A (zh) 2011-04-13

Family

ID=43623023

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102721001A Pending CN102013389A (zh) 2009-09-03 2010-09-02 基板处理设备和基板处理方法

Country Status (5)

Country Link
US (1) US20110048471A1 (enExample)
JP (1) JP5650896B2 (enExample)
KR (1) KR101179838B1 (enExample)
CN (1) CN102013389A (enExample)
TW (1) TWI443722B (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102354662A (zh) * 2011-08-10 2012-02-15 长春理工大学 半导体激光器芯片p面清洗和n面抛光方法
CN104415930A (zh) * 2013-09-03 2015-03-18 亿力鑫系统科技股份有限公司 清洗基板方法、流体喷头及流体喷头装置
CN104971916A (zh) * 2014-04-01 2015-10-14 株式会社荏原制作所 清洗装置及清洗方法
CN107615457A (zh) * 2015-05-26 2018-01-19 株式会社斯库林集团 基板处理装置
CN112735986A (zh) * 2020-12-31 2021-04-30 至微半导体(上海)有限公司 一种晶圆复合清洗方法
CN112735987A (zh) * 2020-12-31 2021-04-30 至微半导体(上海)有限公司 一种可将供酸效率化的单晶圆清洗设备
CN112735984A (zh) * 2020-12-30 2021-04-30 上海至纯洁净系统科技股份有限公司 一种晶圆表面清洗组件
CN112750688A (zh) * 2020-12-31 2021-05-04 至微半导体(上海)有限公司 一种晶圆清洗方法
CN112768378A (zh) * 2020-12-31 2021-05-07 上海至纯洁净系统科技股份有限公司 一种交错式晶圆表面湿法清洗系统及清洗方法
CN112792036A (zh) * 2020-12-31 2021-05-14 至微半导体(上海)有限公司 一种半导体湿法工艺中晶圆清洗液循环利用系统及方法
CN112885739A (zh) * 2019-11-29 2021-06-01 东京毅力科创株式会社 基片处理装置和基片处理方法
US11164758B2 (en) 2014-04-01 2021-11-02 Ebara Corporation Washing device and washing method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9349405B1 (en) * 2013-05-22 2016-05-24 Western Digital Technologies, Inc. Methods, devices and systems for dispensing material on an electronic device
TWI462148B (zh) * 2013-07-10 2014-11-21 Fluid nozzle and fluid nozzle device
KR101964204B1 (ko) * 2016-11-09 2019-04-02 무진전자 주식회사 유체 혼합 노즐
US20200306931A1 (en) * 2019-03-25 2020-10-01 Applied Materials, Inc. Methods and apparatus for removing abrasive particles
JP2021048336A (ja) * 2019-09-20 2021-03-25 三菱電機株式会社 処理液生成方法、処理液生成機構、半導体製造装置及び半導体製造方法
US12138745B2 (en) * 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1180447A (zh) * 1996-03-05 1998-04-29 塞姆特里克斯公司 使用底层涂料的材料沉积方法及装置
CN1184715A (zh) * 1996-12-02 1998-06-17 三菱电机株式会社 清洗用双流体喷嘴与采用该喷嘴的清洗装置及清洗方法
TW583732B (en) * 2001-11-02 2004-04-11 Dainippon Screen Mfg Substrate cleaning apparatus and substrate cleaning method
TW591712B (en) * 2001-06-18 2004-06-11 Dainippon Screen Mfg Substrate cleaning apparatus and method
CN101009208A (zh) * 2006-01-26 2007-08-01 大日本网目版制造株式会社 基板处理装置以及基板处理方法
CN101209450A (zh) * 2006-12-29 2008-07-02 财团法人金属工业研究发展中心 一种以高密相流体去除基板表面污染物的方法
JP2009054755A (ja) * 2007-08-27 2009-03-12 Dainippon Screen Mfg Co Ltd 基板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3277404B2 (ja) 1993-03-31 2002-04-22 ソニー株式会社 基板洗浄方法及び基板洗浄装置
JP3519118B2 (ja) * 1994-04-07 2004-04-12 島田理化工業株式会社 洗浄装置
JP2003051478A (ja) * 2001-08-07 2003-02-21 Sumitomo Heavy Ind Ltd 微細粒子洗浄方法及び装置
JP2004223378A (ja) * 2003-01-22 2004-08-12 Shimada Phys & Chem Ind Co Ltd 液滴噴射装置
JP2006128332A (ja) * 2004-10-28 2006-05-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007173277A (ja) * 2005-12-19 2007-07-05 Fujitsu Ltd スピン洗浄装置およびウエハ洗浄方法
JP2008159989A (ja) * 2006-12-26 2008-07-10 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1180447A (zh) * 1996-03-05 1998-04-29 塞姆特里克斯公司 使用底层涂料的材料沉积方法及装置
CN1184715A (zh) * 1996-12-02 1998-06-17 三菱电机株式会社 清洗用双流体喷嘴与采用该喷嘴的清洗装置及清洗方法
TW591712B (en) * 2001-06-18 2004-06-11 Dainippon Screen Mfg Substrate cleaning apparatus and method
TW583732B (en) * 2001-11-02 2004-04-11 Dainippon Screen Mfg Substrate cleaning apparatus and substrate cleaning method
CN101009208A (zh) * 2006-01-26 2007-08-01 大日本网目版制造株式会社 基板处理装置以及基板处理方法
CN101209450A (zh) * 2006-12-29 2008-07-02 财团法人金属工业研究发展中心 一种以高密相流体去除基板表面污染物的方法
JP2009054755A (ja) * 2007-08-27 2009-03-12 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102354662A (zh) * 2011-08-10 2012-02-15 长春理工大学 半导体激光器芯片p面清洗和n面抛光方法
CN104415930A (zh) * 2013-09-03 2015-03-18 亿力鑫系统科技股份有限公司 清洗基板方法、流体喷头及流体喷头装置
CN104971916A (zh) * 2014-04-01 2015-10-14 株式会社荏原制作所 清洗装置及清洗方法
US11837477B2 (en) 2014-04-01 2023-12-05 Ebara Corporation Washing device and washing method
US11164758B2 (en) 2014-04-01 2021-11-02 Ebara Corporation Washing device and washing method
CN107615457A (zh) * 2015-05-26 2018-01-19 株式会社斯库林集团 基板处理装置
CN112885739A (zh) * 2019-11-29 2021-06-01 东京毅力科创株式会社 基片处理装置和基片处理方法
CN112735984B (zh) * 2020-12-30 2023-01-06 上海至纯洁净系统科技股份有限公司 一种晶圆表面清洗组件
CN112735984A (zh) * 2020-12-30 2021-04-30 上海至纯洁净系统科技股份有限公司 一种晶圆表面清洗组件
CN112768378A (zh) * 2020-12-31 2021-05-07 上海至纯洁净系统科技股份有限公司 一种交错式晶圆表面湿法清洗系统及清洗方法
CN112792036A (zh) * 2020-12-31 2021-05-14 至微半导体(上海)有限公司 一种半导体湿法工艺中晶圆清洗液循环利用系统及方法
CN112750688A (zh) * 2020-12-31 2021-05-04 至微半导体(上海)有限公司 一种晶圆清洗方法
CN112750688B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种晶圆清洗方法
CN112735987B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种可将供酸效率化的单晶圆清洗设备
CN112792036B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种半导体湿法工艺中晶圆清洗液循环利用系统及方法
CN112735986B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种晶圆复合清洗方法
CN112735987A (zh) * 2020-12-31 2021-04-30 至微半导体(上海)有限公司 一种可将供酸效率化的单晶圆清洗设备
CN112735986A (zh) * 2020-12-31 2021-04-30 至微半导体(上海)有限公司 一种晶圆复合清洗方法

Also Published As

Publication number Publication date
TW201133582A (en) 2011-10-01
US20110048471A1 (en) 2011-03-03
TWI443722B (zh) 2014-07-01
KR20110025096A (ko) 2011-03-09
JP2011054819A (ja) 2011-03-17
KR101179838B1 (ko) 2012-09-04
JP5650896B2 (ja) 2015-01-07

Similar Documents

Publication Publication Date Title
TWI443722B (zh) 基板處理裝置及基板處理方法
JP4005326B2 (ja) 基板処理装置および基板処理方法
EP1724820B1 (en) Two-fluid nozzle for cleaning substrate and substrate cleaning device
KR101486165B1 (ko) 기판처리장치 및 노즐
JP4349606B2 (ja) 基板洗浄方法
US20070246081A1 (en) Methods and apparatus for cleaning a substrate
JP5470306B2 (ja) ２流体ノズル、基板液処理装置、基板液処理方法、及び基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体
CN100541709C (zh) 基板处理装置以及基板处理方法
TW201720538A (zh) 二相流霧化噴射清洗裝置
KR20030038377A (ko) 기판세정장치 및 방법
TW201303987A (zh) 基板處理裝置及基板處理方法
JP2005353739A (ja) 基板洗浄装置
JP4464850B2 (ja) 基板洗浄用２流体ノズル及び基板洗浄装置
JP4442911B2 (ja) 基板処理装置
JP2004349501A (ja) 基板処理方法および基板処理装置
JP5837788B2 (ja) ノズル、基板処理装置、および基板処理方法
JP5785462B2 (ja) 基板処理装置および基板処理方法
JP4259939B2 (ja) 基板処理装置および基板処理方法
JP2009117826A (ja) 基板処理装置及び方法
JP5650897B2 (ja) 基板処理装置
JP2008108829A (ja) 二流体ノズルおよびそれを用いた基板処理装置
JP2008130643A (ja) ノズル、基板処理装置および基板処理方法
JP2005166792A (ja) 基板処理装置
JP4707730B2 (ja) 半導体ウェーハの洗浄装置、及び半導体ウェーハの洗浄方法
JP2008159989A (ja) ノズル、基板処理装置および基板処理方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110413