CN101992651A - Gold inlaying method and gold-inlaid electronic device shell prepared thereby - Google Patents
Gold inlaying method and gold-inlaid electronic device shell prepared thereby Download PDFInfo
- Publication number
- CN101992651A CN101992651A CN2009103057176A CN200910305717A CN101992651A CN 101992651 A CN101992651 A CN 101992651A CN 2009103057176 A CN2009103057176 A CN 2009103057176A CN 200910305717 A CN200910305717 A CN 200910305717A CN 101992651 A CN101992651 A CN 101992651A
- Authority
- CN
- China
- Prior art keywords
- gold
- matrix
- inlaid
- groove
- jewellery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/26—Inlaying with ornamental structures, e.g. niello work, tarsia work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49588—Jewelry or locket making
Abstract
The invention provides a gold inlaying method comprising the following steps: providing a matrix to be inlaid with gold, wherein the matrix is made of metal; forming a groove on the position to be inlaid with gold on the surface of the matrix, wherein the groove has a preset shape; processing and shaping a gold jewellery by a slow thread cutting machine, wherein the gold jewellery has the shape matched with the groove; coating one layer of metal flux on the bottom of the groove; putting the gold jewellery into the groove; heating and baking the matrix in which the gold jewellery is arranged; fusing the metal flux on the bottom of the groove; and splicing the gold jeweller with the matrix by a cooled metal flux. The invention also provides a gold-inlaid electronic device shell prepared with the method.
Description
Technical field
The invention relates to a kind of method that is inlaid with gold electronic device housing that is inlaid with gold obtained by this method.
Background technology
At present, on electronic product shell such as mobile phone (as display box), be inlaid with gold and become a kind of practices well that improves electronic product class and grade.And complicated and changeable day by day along with the pattern that is inlaid with gold, and be inlaid with gold precision and requirement attractive in appearance are more and more higher, traditional technology that is inlaid with gold faces the challenge.
A kind of existing method of being inlaid with gold is to be filled in the preformed groove after the fusion of gold thread welding rod.But inlay (width such as the groove that requires to be inlaid with gold is equal to or less than 0.52mm, and the degree of depth is equal to or less than 0.50mm) for meticulous gold jewellery, also there is following defective in this method.Also not having so at first, at present on the market, thin gold thread welding rod is used for the fusion filling; In addition, in the process of gold thread filling groove, loading is difficult to control, if fill too much, fusion gold can overflow groove, is set in the outer surface of the product that is inlaid with gold, and is difficult to remove, and influences outward appearance, if fill very fewly, groove is filled discontented or is had the gap, influences attractive in appearance equally.
The another kind of existing method of being inlaid with gold is the groove that forms wedge shape on to be gold product surface, and the opening of this groove is slightly narrow than bottom land, gold jewellery is firmly snapped in the groove, and attached with the colloid cementation.Yet this method need firmly snap in groove with gold jewellery, causes gold jewellery distortion or surface scraping easily, influences outward appearance.And the precision that is inlaid with gold of this method is not high, can't satisfy the required precision of being inlaid with gold of high-grade electronic product.
Summary of the invention
In view of this, be necessary to provide a kind of meticulous gold jewellery and precision method that is inlaid with gold higher, attractive in appearance of inlaying.
In addition, have to have a kind of electronic device housing that is inlaid with gold that is made by said method is provided.
A kind of method that is inlaid with gold, it comprises the steps:
One to be gold matrix is provided, and this matrix is made of metal;
Form groove in the position that this matrix surface is inlaid with gold in advance, this groove has predetermined shape;
The employing silk thread cutting machined of being careful forms a gold jewellery, and this gold jewellery has the shape that matches with this groove;
At the bottom of this groove coating layer of metal solder flux;
This gold jewellery is put into this groove;
This matrix that is placed with gold jewellery is carried out heated baking, make the metal solder flux fusion of bottom portion of groove, bonding this gold jewellery of cooled metal solder flux and this matrix.
A kind of electronic device housing that is inlaid with gold, comprise a metallic matrix one matrix and be embedded in gold jewellery on this matrix, be formed with the groove that cooperates with described gold jewellery on this matrix surface, described gold jewellery is placed in this groove, is formed with the metal solder flux of bonding this gold jewellery and this matrix between the cell wall of this gold jewellery and groove.
The above-mentioned method that is inlaid with gold forms gold jewellery by accurate machined, and the mode by metal solder is fixed in gold jewellery in the groove of matrix surface again, makes gold jewellery firmly combine with matrix, cooperates closely the precision that is inlaid with gold height, exquisite appearance.
Description of drawings
Fig. 1 does not inlay the schematic diagram of gold jewellery for preferred embodiment electronic device housing of the present invention;
Fig. 2 is the be inlaid with gold cross-sectional schematic of electronic device housing of preferred embodiment of the present invention.
The specific embodiment
The present invention's method of being inlaid with gold may further comprise the steps:
Provide a to be gold matrix, as phone housing.This matrix can be made for metal materials such as stainless steel, copper, titanium alloy, magnesium alloy or aluminium alloys.
Form groove in the position that this matrix surface is inlaid with gold in advance.The formation method of this groove can (ComputerNumerical Control, CNC) milling machine be processed to form by computer numerical control.Groove has the shape of the decorations that are inlaid with gold in advance, as linear, arc or waveform etc.
The layer of metal solder flux is formed on the bottom at this groove, such as applying one deck tin cream or sprinkling one deck glass putty.
The employing silk thread cutting machined of being careful forms a gold jewellery.This gold jewellery has the shape that matches with groove, and the dimensional tolerance of control gold jewellery is in ± 0.02mm.
In this groove, put into described gold jewellery.This gold jewellery surface flushes or protrudes in this matrix surface with the matrix surface of this groove periphery.
This matrix that is placed with gold jewellery is carried out heated baking, make the metal solder flux fusion of bottom portion of groove, cooled metal solder flux is bonding firmly with gold jewellery and matrix.If the metal solder flux is tin cream or glass putty, but carry out among this heating steps Yu Yilu.
Be appreciated that, if the surface that surface that this matrix is inlaid with gold and gold jewellery are exposed to matrix is not or not same plane, and the surface that this gold jewellery and this matrix are inlaid with gold is flushed fully, reach incorporate effect, then can make the gold jewellery that before provided exceed groove slightly, treat again finish turning processing to be carried out on the whole surface of being inlaid with gold of matrix behind the above-mentioned baking procedure, make gold jewellery and matrix on same surface.
Be appreciated that in order to guarantee the brightness on gold surface, also can do polishing at last the whole outer surface that is inlaid with gold of this matrix.
Please consult Fig. 1 and Fig. 2 simultaneously, a kind of electronic device housing 10 that is inlaid with gold that is made by said method comprises a matrix 12 and is embedded in gold jewellery 14 on this matrix 12.This matrix 12 can be made by metal materials such as stainless steel, copper, titanium alloy, magnesium alloy or aluminium alloys.Be formed with the groove 121 that cooperates with described gold jewellery 14 on these matrix 12 surfaces.Described gold jewellery 14 is placed in this groove 121, is formed with the metal solder flux 16 of bonding this gold jewellery 14 and this matrix 12 between the cell wall of this gold jewellery 14 and groove 121.This metal solder flux 16 can be tin cream solder flux or glass putty.
The above-mentioned method that is inlaid with gold forms groove and gold jewellery by accurate machined, mode by metal solder is fixed in gold jewellery in the groove of matrix surface again, make gold jewellery firmly combine with matrix, cooperate closely, the precision that is inlaid with gold height, exquisite appearance, and at follow-up gold jewellery difficult drop-off when machined is carried out on the surface of being inlaid with gold.
Claims (10)
1. method that is inlaid with gold, it comprises the steps:
One to be gold matrix is provided, and this matrix is made of metal;
Form groove in the position that this matrix surface is inlaid with gold in advance, this groove has predetermined shape;
The employing silk thread cutting machined of being careful forms a gold jewellery, and this gold jewellery has the shape that matches with this groove;
At the bottom of this groove coating layer of metal solder flux;
This gold jewellery is put into this groove;
This matrix that is placed with gold jewellery is carried out heated baking, make the metal solder flux fusion of bottom portion of groove, bonding this gold jewellery of cooled metal solder flux and this matrix.
2. the method that is inlaid with gold as claimed in claim 1 is characterized in that: described metal solder flux is tin cream solder flux or glass putty.
3. the method that is inlaid with gold as claimed in claim 1 is characterized in that: this matrix is made by stainless steel, copper, titanium alloy, magnesium alloy or aluminium alloy.
4. the method that is inlaid with gold as claimed in claim 1 is characterized in that: the dimensional tolerance of this gold jewellery is in ± 0.02mm.
5. the method that is inlaid with gold as claimed in claim 1 is characterized in that: this gold jewellery surface flushes with the matrix surface of this groove periphery.
6. the method that is inlaid with gold as claimed in claim 1 is characterized in that: this gold jewellery surface protrudes in the matrix surface of this groove periphery.
7. the method that is inlaid with gold as having as described in the claim 6, it is characterized in that: this method that is inlaid with gold is carried out finish turning processing to the whole surface of being inlaid with gold of matrix after also being included in this baking procedure again, makes gold jewellery and matrix on same surface.
8. electronic device housing that is inlaid with gold, comprise a matrix and be embedded in gold jewellery on this matrix, it is characterized in that: be formed with the groove that cooperates with described gold jewellery on this matrix surface, described gold jewellery is placed in this groove, is formed with the metal solder flux of bonding this gold jewellery and this matrix between the cell wall of this gold jewellery and groove.
9. the electronic device housing that is inlaid with gold as claimed in claim 8 is characterized in that: this metal solder flux is tin cream solder flux or glass putty.
10. the electronic device housing that is inlaid with gold as claimed in claim 8 is characterized in that: this matrix is made by stainless steel, copper, titanium alloy, magnesium alloy or aluminium alloy.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103057176A CN101992651A (en) | 2009-08-18 | 2009-08-18 | Gold inlaying method and gold-inlaid electronic device shell prepared thereby |
| US12/720,789 US20110041553A1 (en) | 2009-08-18 | 2010-03-10 | Method for inlaying gold ornament and housing made by the method |
| JP2010115187A JP2011037259A (en) | 2009-08-18 | 2010-05-19 | Gold inlaying method and housing of electronic device inlaid with gold decoration material by the same method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103057176A CN101992651A (en) | 2009-08-18 | 2009-08-18 | Gold inlaying method and gold-inlaid electronic device shell prepared thereby |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101992651A true CN101992651A (en) | 2011-03-30 |
Family
ID=43604200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103057176A Pending CN101992651A (en) | 2009-08-18 | 2009-08-18 | Gold inlaying method and gold-inlaid electronic device shell prepared thereby |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110041553A1 (en) |
| JP (1) | JP2011037259A (en) |
| CN (1) | CN101992651A (en) |
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| CN102950952A (en) * | 2011-08-25 | 2013-03-06 | 深圳富泰宏精密工业有限公司 | Decorative housing and manufacturing method thereof |
| CN104146563A (en) * | 2013-05-15 | 2014-11-19 | 李甲栈 | Craft cup and manufacturing method thereof |
| CN104337136A (en) * | 2013-08-05 | 2015-02-11 | 深圳市宝福珠宝首饰有限公司 | Machining method and device for gold and platinum jewelry and combined type jewelry structure |
| CN105196773A (en) * | 2015-09-02 | 2015-12-30 | 范轩 | Metal inlaid structure, vase and color plate, and metal inlaying method |
| CN106159525A (en) * | 2015-03-27 | 2016-11-23 | 富士康(昆山)电脑接插件有限公司 | Magnetic-extraction connector and micro coaxial cable connector assembly |
| CN103449739B (en) * | 2012-05-31 | 2017-04-05 | 深圳富泰宏精密工业有限公司 | The surface treatment method and product of glass basis |
| CN107379861A (en) * | 2017-07-31 | 2017-11-24 | 太仓市双凤镇薄彩工艺品厂 | It is a kind of to be used to make the device that coloured glaze is inlaid with gold |
| CN104582366B (en) * | 2014-12-31 | 2018-01-23 | 广东欧珀移动通信有限公司 | Terminal shell and its terminal of application, and terminal shell preparation method |
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| CN108937006A (en) * | 2018-07-10 | 2018-12-07 | 唐文瀚 | Processing of ornament method |
| CN111466687A (en) * | 2020-05-20 | 2020-07-31 | 东莞美景实业有限公司 | Manufacturing process of mobile phone ornament |
| CN112203444A (en) * | 2019-07-08 | 2021-01-08 | 苹果公司 | Titanium component with etched surface |
| US11511519B2 (en) | 2019-07-08 | 2022-11-29 | Apple Inc. | Titanium part having an etched surface |
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| CN102006753A (en) * | 2009-08-28 | 2011-04-06 | 深圳富泰宏精密工业有限公司 | Shell making method and shell made by same |
| CN102137554A (en) * | 2010-01-26 | 2011-07-27 | 深圳富泰宏精密工业有限公司 | Housing of electronic device and manufacturing method thereof |
| EP2807529B1 (en) | 2012-02-16 | 2018-01-10 | Apple Inc. | Interlocking flexible segments formed from a rigid material |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110041553A1 (en) | 2011-02-24 |
| JP2011037259A (en) | 2011-02-24 |
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Application publication date: 20110330 |