US20110041553A1 - Method for inlaying gold ornament and housing made by the method - Google Patents

Method for inlaying gold ornament and housing made by the method Download PDF

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Publication number
US20110041553A1
US20110041553A1 US12/720,789 US72078910A US2011041553A1 US 20110041553 A1 US20110041553 A1 US 20110041553A1 US 72078910 A US72078910 A US 72078910A US 2011041553 A1 US2011041553 A1 US 2011041553A1
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US
United States
Prior art keywords
substrate
groove
gold ornament
ornament
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/720,789
Inventor
Liang Xiong
You-Li Liu
Hsiang-Jung Su
Wen-Te Lai
Gang-Qiang Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Futaihong Precision Industry Co Ltd
FIH Hong Kong Ltd
Original Assignee
Shenzhen Futaihong Precision Industry Co Ltd
FIH Hong Kong Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Futaihong Precision Industry Co Ltd, FIH Hong Kong Ltd filed Critical Shenzhen Futaihong Precision Industry Co Ltd
Assigned to FIH (HONG KONG) LIMITED, SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. reassignment FIH (HONG KONG) LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAI, WEN-TE, LIU, Gang-qiang, LIU, YOU-LI, SU, HSIANG-JUNG, XIONG, Liang
Publication of US20110041553A1 publication Critical patent/US20110041553A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/26—Inlaying with ornamental structures, e.g. niello work, tarsia work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49588—Jewelry or locket making

Definitions

  • the present disclosure generally relates to a method for inlaying a gold ornament into a metal substrate and a housing for electronic devices with the gold ornament.
  • Fusion welding is a typical method for inlaying gold ornaments in metal housings. Specifically, a gold welding rod is melted and filled into a groove to form an ornament. However, it is difficult to accurately control the quantity of gold melted into the grooves resulting in too little or too much gold being used which may degrade the appearance of the housing.
  • FIG. 1 is a schematic cross-section view of an exemplary embodiment of the present housing without any ornament inlaid.
  • FIG. 2 is a schematic cross-section view of the housing shown in FIG. 1 inlaid with a gold ornament.
  • FIG. 2 shows an exemplary housing 10 made according to an exemplary method for inlaying a gold ornament into a metal substrate.
  • the method includes at least the following steps: providing a substrate, the substrate having an outer surface; defining a groove in the substrate through the outer surface; manufacturing a gold ornament by numerical control of slow speed wire-cutting according to the shape of the groove; placing the gold ornament in the groove in which is positioned metallic solder; and heating the substrate, the metallic solder melting and bonding the gold ornament to the substrate. Each step is described in more detail below.
  • a substrate 12 such as a preformed housing for a mobile phone, is provided.
  • the substrate 12 may be made of metal material, e.g., stainless steel, copper, magnesium alloy, aluminum alloy, or titanium alloy.
  • the substrate 12 has an outer surface 120 .
  • a groove 121 is defined into the substrate 12 through the outer surface 120 .
  • the groove 121 may be formed using a computer numerical controlled (CNC) milling machine to ensure high precision.
  • the groove 121 has a shape desired for the shape of a gold ornament, e.g., line shape, arc shape, or wave shape.
  • a gold ornament 16 is manufactured by using a numerical controlled (NC) slow speed wire-cutting machine according to the shape of the groove 121 .
  • the gold ornament 16 can have a dimension tolerance of about ⁇ 0.02 mm or less.
  • Metallic solder 14 is positioned in the groove 121 , such as on the bottom wall 123 of the groove 121 .
  • the metallic solder 14 can be tin paste or metallic powder.
  • the gold ornament 16 is placed in the groove 121 .
  • the gold ornament 16 may be coplanar with or protrude from the outer surface 120 .
  • the substrate 12 combined with the gold ornament 16 is heated.
  • the metallic solder 14 is melted and then when it cools, bonds the gold ornament 16 and the substrate 12 .
  • the heating step may be carried out in a furnace.
  • the protruding portion of the gold ornament 16 may be treated after the heating to be coplanar with the outer surface 120 .
  • the housing 10 for electronic device made by the method as described above includes a substrate 12 , and a gold ornament 16 inlaid in the substrate 12 .
  • the substrate 12 may be made of a metal material selected from a group consisting of stainless steel, copper, magnesium alloy, aluminum alloy, and titanium alloy.
  • the substrate 12 has an outer surface 120 and defines a groove 121 through the outer surface 120 .
  • the gold ornament 16 is accommodated in the groove 121 .
  • Metallic solder 14 is positioned in the groove 121 (such as the bottom wall 123 ) and bonds the gold ornament 16 to the substrate 12 .
  • the metallic solder 14 may be tin paste or metallic powder.
  • the groove 121 and the gold ornament 16 are formed using numerical controlling machines, therefore, the gold ornament 16 engages precisely in the groove 121 with a nice appearance on the whole. Additionally, the gold ornament 16 is fixed to the substrate 12 by a soldering process to ensure a secure bonding between the gold ornament 16 and the substrate 12 .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adornments (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A method for inlaying a gold ornament is disclosed. A substrate is provided which has an outer surface. A groove is defined in the substrate through the outer surface. A gold ornament is manufactured. The gold ornament has substantially the same shape as the groove. The gold ornament is placed in the groove wherein is positioned with metallic solder. Then the substrate is heated, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate. A housing for electronic device inlaid with a gold ornament made by the present method is also provided.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure generally relates to a method for inlaying a gold ornament into a metal substrate and a housing for electronic devices with the gold ornament.
  • 2. Description of Related Art
  • Housings for electronic devices, such as mobile phones, inlaid with gold ornaments may be popular. Fusion welding is a typical method for inlaying gold ornaments in metal housings. Specifically, a gold welding rod is melted and filled into a groove to form an ornament. However, it is difficult to accurately control the quantity of gold melted into the grooves resulting in too little or too much gold being used which may degrade the appearance of the housing.
  • Therefore, there is room for improvement within the art.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the method for inlaying gold ornament and housing made by the method can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present method and the housing made by the same.
  • FIG. 1 is a schematic cross-section view of an exemplary embodiment of the present housing without any ornament inlaid.
  • FIG. 2 is a schematic cross-section view of the housing shown in FIG. 1 inlaid with a gold ornament.
    •  DETAILED DESCRIPTION
  • FIG. 2 shows an exemplary housing 10 made according to an exemplary method for inlaying a gold ornament into a metal substrate. The method includes at least the following steps: providing a substrate, the substrate having an outer surface; defining a groove in the substrate through the outer surface; manufacturing a gold ornament by numerical control of slow speed wire-cutting according to the shape of the groove; placing the gold ornament in the groove in which is positioned metallic solder; and heating the substrate, the metallic solder melting and bonding the gold ornament to the substrate. Each step is described in more detail below.
  • A substrate 12, such as a preformed housing for a mobile phone, is provided. The substrate 12 may be made of metal material, e.g., stainless steel, copper, magnesium alloy, aluminum alloy, or titanium alloy. The substrate 12 has an outer surface 120.
  • Referring to FIG. 1, a groove 121 is defined into the substrate 12 through the outer surface 120. The groove 121 may be formed using a computer numerical controlled (CNC) milling machine to ensure high precision. The groove 121 has a shape desired for the shape of a gold ornament, e.g., line shape, arc shape, or wave shape.
  • A gold ornament 16 is manufactured by using a numerical controlled (NC) slow speed wire-cutting machine according to the shape of the groove 121. The gold ornament 16 can have a dimension tolerance of about ±0.02 mm or less.
  • Metallic solder 14 is positioned in the groove 121, such as on the bottom wall 123 of the groove 121. The metallic solder 14 can be tin paste or metallic powder.
  • The gold ornament 16 is placed in the groove 121. The gold ornament 16 may be coplanar with or protrude from the outer surface 120.
  • The substrate 12 combined with the gold ornament 16 is heated. The metallic solder 14 is melted and then when it cools, bonds the gold ornament 16 and the substrate 12. The heating step may be carried out in a furnace.
  • It should be understood that, when the gold ornament 16 provided protrudes from the outer surface 120, the protruding portion of the gold ornament 16 may be treated after the heating to be coplanar with the outer surface 120.
  • The housing 10 for electronic device made by the method as described above includes a substrate 12, and a gold ornament 16 inlaid in the substrate 12. The substrate 12 may be made of a metal material selected from a group consisting of stainless steel, copper, magnesium alloy, aluminum alloy, and titanium alloy. The substrate 12 has an outer surface 120 and defines a groove 121 through the outer surface 120. The gold ornament 16 is accommodated in the groove 121. Metallic solder 14 is positioned in the groove 121 (such as the bottom wall 123) and bonds the gold ornament 16 to the substrate 12. The metallic solder 14 may be tin paste or metallic powder.
  • In the present embodiment, the groove 121 and the gold ornament 16 are formed using numerical controlling machines, therefore, the gold ornament 16 engages precisely in the groove 121 with a nice appearance on the whole. Additionally, the gold ornament 16 is fixed to the substrate 12 by a soldering process to ensure a secure bonding between the gold ornament 16 and the substrate 12.
  • It should be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (12)

1. A method for inlaying a gold ornament, comprising:
providing a substrate, the substrate having an outer surface;
defining a groove in the substrate through the outer surface;
manufacturing a gold ornament having substantially the same shape as the groove;
placing metallic solder in the groove;
placing the gold ornament in the groove with the metallic solder; and
heating the substrate, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate.
2. The method as claimed in claim 1, wherein the gold ornament is formed by numerical control of slow speed wire-cutting.
3. The method as claimed in claim 1, wherein the metallic solder is tin paste or metallic powder.
4. The method as claimed in claim 1, wherein the substrate is metal.
5. The method as claimed in claim 1, wherein the groove is formed by a computer numerical controlled milling machine.
6. The method as claimed in claim 1, wherein the gold ornament is coplanar with the outer surface when placed in the groove.
7. The method as claimed in claim 1, wherein the gold ornament protrudes from the outer surface when placed in the groove.
8. The method as claimed in claim 6, wherein the method further comprises treating the gold ornament to be coplanar with the outer surface after the heating step.
9. A housing for electronic device, comprising:
a substrate, the substrate defining a groove;
a gold ornament, the gold ornament being accommodated in the groove; and
a metallic solder positioned in the groove, the metallic solder bonding the gold ornament and the substrate.
10. The housing as claimed in claim 9, wherein the metallic solder is tin paste or metallic powder.
11. The housing as claimed in claim 9, wherein the metallic solder is formed on the bottom wall of the groove.
12. The housing as claimed in claim 9, wherein the substrate is metal.
US12/720,789 2009-08-18 2010-03-10 Method for inlaying gold ornament and housing made by the method Abandoned US20110041553A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200910305717.6 2009-08-18
CN2009103057176A CN101992651A (en) 2009-08-18 2009-08-18 Gold inlaying method and gold-inlaid electronic device shell prepared thereby

Publications (1)

Publication Number Publication Date
US20110041553A1 true US20110041553A1 (en) 2011-02-24

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US (1) US20110041553A1 (en)
JP (1) JP2011037259A (en)
CN (1) CN101992651A (en)

Cited By (19)

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Publication number Priority date Publication date Assignee Title
US20110050055A1 (en) * 2009-08-28 2011-03-03 Shenzhen Futaihong Precision Industry Co., Ltd. Method for making device housing and device housing thereof
US20110183091A1 (en) * 2010-01-26 2011-07-28 Shenzhen Futaihong Precision Industry Co., Ltd. Housing for electronic device and method of fabricating the same
US20130291367A1 (en) * 2012-05-02 2013-11-07 Apple Inc. Multi-step pattern formation
CN103660754A (en) * 2012-09-03 2014-03-26 蒋荣昌 Metal embedding craft and making method thereof
US20150124573A1 (en) * 2012-05-22 2015-05-07 The Swatch Group Research And Development Ltd Brazed bimetal external part of a timepiece
US9451065B2 (en) 2014-04-03 2016-09-20 Apple Inc. Adaptive plug for edge protection
US9852723B2 (en) 2014-03-27 2017-12-26 Apple Inc. Acoustic modules
CN108406030A (en) * 2018-03-19 2018-08-17 张家港市欧微自动化研发有限公司 A kind of USB line material automatic soldering method
US10071539B2 (en) 2014-09-30 2018-09-11 Apple Inc. Co-sintered ceramic for electronic devices
US10086484B2 (en) 2012-10-12 2018-10-02 Apple Inc. Manufacturing of computing devices
CN108990345A (en) * 2018-08-24 2018-12-11 Oppo（重庆）智能科技有限公司 The decoration and installation method of shell and shell
US10207387B2 (en) 2015-03-06 2019-02-19 Apple Inc. Co-finishing surfaces
US10216233B2 (en) 2015-09-02 2019-02-26 Apple Inc. Forming features in a ceramic component for an electronic device
US10335979B2 (en) 2014-09-30 2019-07-02 Apple Inc. Machining features in a ceramic component for use in an electronic device
US20190320540A1 (en) * 2016-04-05 2019-10-17 Huawei Technologies Co., Ltd. Terminal and Method for Assembling Collection Module of Terminal
US10532428B2 (en) 2012-02-16 2020-01-14 Apple Inc. Interlocking flexible segments formed from a rigid material
US10542628B2 (en) 2017-08-02 2020-01-21 Apple Inc. Enclosure for an electronic device having a shell and internal chassis
CN111976359A (en) * 2020-08-21 2020-11-24 陈学 Method for inlaying gold and silver decorations on purple pottery of construction water
US11511519B2 (en) 2019-07-08 2022-11-29 Apple Inc. Titanium part having an etched surface

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CN102950952A (en) * 2011-08-25 2013-03-06 深圳富泰宏精密工业有限公司 Decorative housing and manufacturing method thereof
CN103449739B (en) * 2012-05-31 2017-04-05 深圳富泰宏精密工业有限公司 The surface treatment method and product of glass basis
CN104146563B (en) * 2013-05-15 2015-08-05 李甲栈 A kind of preparation method of technique teacup
CN104337136B (en) * 2013-08-05 2017-05-24 深圳市宝福珠宝首饰有限公司 Machining method and device for gold and platinum jewelry and combined type jewelry structure
CN104582366B (en) * 2014-12-31 2018-01-23 广东欧珀移动通信有限公司 Terminal shell and its terminal of application, and terminal shell preparation method
CN106159525B (en) * 2015-03-27 2018-03-06 富士康(昆山)电脑接插件有限公司 Magnetic-extraction connector and micro coaxial cable connector assembly
CN105196773A (en) * 2015-09-02 2015-12-30 范轩 Metal inlaid structure, vase and color plate, and metal inlaying method
KR101946125B1 (en) 2016-12-26 2019-02-08 김경록 inlay method of jade products
CN107379861B (en) * 2017-07-31 2020-02-14 太仓市双凤镇薄彩工艺品厂 Device for manufacturing colored glaze inlaid with gold
CN108244782B (en) * 2018-01-26 2019-11-12 深圳市铭冠珠宝首饰有限公司 A kind of ornaments Jewel inlaying technique
CN108937006A (en) * 2018-07-10 2018-12-07 唐文瀚 Processing of ornament method
CN117279249A (en) * 2019-07-08 2023-12-22 苹果公司 Titanium component with etched surface
CN111466687A (en) * 2020-05-20 2020-07-31 东莞美景实业有限公司 Manufacturing process of mobile phone ornament
CN113561694A (en) * 2021-08-03 2021-10-29 浙江银之源贵金属有限公司 24K gold inlaying process on silver coin

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US3499211A (en) * 1967-02-09 1970-03-10 Texas Instruments Inc Metal inlay and method for making the same
JPS63149090A (en) * 1986-12-11 1988-06-21 Nippon Stainless Steel Co Ltd Method for joining metallic materials of different kind
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Cited By (22)

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Publication number Priority date Publication date Assignee Title
US20110050055A1 (en) * 2009-08-28 2011-03-03 Shenzhen Futaihong Precision Industry Co., Ltd. Method for making device housing and device housing thereof
US20110183091A1 (en) * 2010-01-26 2011-07-28 Shenzhen Futaihong Precision Industry Co., Ltd. Housing for electronic device and method of fabricating the same
US10532428B2 (en) 2012-02-16 2020-01-14 Apple Inc. Interlocking flexible segments formed from a rigid material
US20130291367A1 (en) * 2012-05-02 2013-11-07 Apple Inc. Multi-step pattern formation
US9132510B2 (en) * 2012-05-02 2015-09-15 Apple Inc. Multi-step pattern formation
US20150124573A1 (en) * 2012-05-22 2015-05-07 The Swatch Group Research And Development Ltd Brazed bimetal external part of a timepiece
US9733622B2 (en) * 2012-05-22 2017-08-15 The Swatch Group Research And Development Ltd Brazed bimetal external part of a timepiece
CN103660754A (en) * 2012-09-03 2014-03-26 蒋荣昌 Metal embedding craft and making method thereof
US10086484B2 (en) 2012-10-12 2018-10-02 Apple Inc. Manufacturing of computing devices
US9852723B2 (en) 2014-03-27 2017-12-26 Apple Inc. Acoustic modules
US9451065B2 (en) 2014-04-03 2016-09-20 Apple Inc. Adaptive plug for edge protection
US10071539B2 (en) 2014-09-30 2018-09-11 Apple Inc. Co-sintered ceramic for electronic devices
US10335979B2 (en) 2014-09-30 2019-07-02 Apple Inc. Machining features in a ceramic component for use in an electronic device
US10207387B2 (en) 2015-03-06 2019-02-19 Apple Inc. Co-finishing surfaces
US10216233B2 (en) 2015-09-02 2019-02-26 Apple Inc. Forming features in a ceramic component for an electronic device
US20190320540A1 (en) * 2016-04-05 2019-10-17 Huawei Technologies Co., Ltd. Terminal and Method for Assembling Collection Module of Terminal
US10757825B2 (en) * 2016-04-05 2020-08-25 Huawei Technologies Co., Ltd. Terminal and method for assembling collection module of terminal
US10542628B2 (en) 2017-08-02 2020-01-21 Apple Inc. Enclosure for an electronic device having a shell and internal chassis
CN108406030A (en) * 2018-03-19 2018-08-17 张家港市欧微自动化研发有限公司 A kind of USB line material automatic soldering method
CN108990345A (en) * 2018-08-24 2018-12-11 Oppo（重庆）智能科技有限公司 The decoration and installation method of shell and shell
US11511519B2 (en) 2019-07-08 2022-11-29 Apple Inc. Titanium part having an etched surface
CN111976359A (en) * 2020-08-21 2020-11-24 陈学 Method for inlaying gold and silver decorations on purple pottery of construction water

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CN101992651A (en) 2011-03-30

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