201108913 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種鑲金方法由該方法製得之鑲金電子裝置外 殼。 【先前技術】 目如’於手機等電子產品之外殼（如顯示桓）上鑲金已成為 提高電子產品檔次及品位之常用做法。而隨著鑲金圖案之曰益複 雜多變，及鑲金精度及美觀要求越來越高，傳統的鑲金工藝面臨 •挑戰。 一種習知之鑲金方法係將金線焊條熔融後填充於預先形成之 凹槽中。然，對於精細之金飾鑲嵌來說（比如要求鑲金凹槽之寬 度專於或小於〇.52mm，深度等於或小於〇 5〇mm)，該方法還存在 如下缺陷。首先，目前市面上還沒有如此細之金線焊條用於溶融 填充，另，於金線填充凹槽之過程中，填充量難以控製，如果填 充過多，縣黃金會溢出凹槽，在鑲金產品之外表面，難以201108913 VI. Description of the Invention: [Technical Field] The present invention relates to a gold-inlaid electronic device casing obtained by the method. [Prior Art] It has become a common practice to improve the quality and grade of electronic products by inserting gold on the outer casing of electronic products such as mobile phones (such as display enamel). With the complexities of gold-plated patterns and the increasing precision and aesthetic requirements of gold, the traditional gold-plated process faces challenges. One conventional gold inlay method is to melt a gold wire electrode and fill it in a pre-formed groove. However, for fine gold inlays (for example, the width of the gold groove is required to be less than or equal to 〇.52 mm and the depth is equal to or less than 〇 5〇mm), the method has the following drawbacks. First of all, there is currently no such fine gold wire electrode for melt filling on the market. In addition, in the process of filling the groove with gold wire, the filling amount is difficult to control. If the filling is too much, the county gold will overflow the groove, in the gold-plated product. Outside surface, difficult
去除’影響外觀’如果填充過少，凹槽填充不滿或存在間隙，同 樣影響美觀。 另-種習知之鑲金方法係於待镶金產品表面上形成模形之凹 二心凹槽之開口域底略窄，將金侧力卡人凹彻，並附以 ^…、。亥方法需要用力將金飾卡入凹槽，容易導致金飾 槽又，該方法之鑲金精度不高，無法 电于產σσ之鑲金精度要求。 【發明内容】 有馨於此’有轉提供-種可職精細金飾且精度較高、美 201108913 觀之鑲金方法。 另外’有必有提供-種由域转製狀縣f子裝置外殼。 種鎖金方法’其包括如下步驟： 採用慢走絲線割機加工形成—金飾，該金飾具有預定之形狀； 提供-待鑲金之基體，該基體由金屬製成； 於該基體表面預鑲金之位置形成凹槽，該凹槽用於容置該金 飾； Φ 於該凹槽之底部塗敷一層金屬焊劑； 將該金飾放入該凹槽内； 對該放置有金飾之基體進行加熱供烤，使凹槽底部之金屬焊 劑炫融’冷卻後之金屬焊_接該金倾該基體。 一種鑲金之電子裝置外殼，包括—金屬基體一基體及職於 體上之金娜，該基體表面上形成有與所述金飾配合之凹槽， 所述金飾容置於該凹槽内，該金飾與凹槽之槽壁之間形成有枯接 該金飾與該基體之金屬焊劑。 • 1賴金綠藉由精密之機加工形成金飾，由金屬焊接 之方式將金飾m定於基體表面之凹勒，使得金飾絲體牢牢結 &，配合緊密，鑲金精度高，外觀精美。 【實施方式】 本發明鑲金方法包括以下步驟： 採用慢走絲線割機加工形成一金飾。該金都具有預定之形 狀，如直線形、狐形或波浪形等。加工時，控製金飾之尺寸公差 在±0.02mm以内。 提供待鑲紅基體，如手機外殼。該基體可為杨鋼、銅、 201108913 鈦合金、鎂合金或鋁合金等金屬材料製成。 面預鑲金之位置形成凹槽。該凹槽之形成方法可 2岭赌控^mputefNumeriealcG咖丨，CNC)銑床加工形 成。凹槽用於容置該金飾，其具有預鑲嵌金飾之形狀。 於該凹槽之底部形成-層金屬焊劑，比如塗覆一層錫膏或撒 上一層錫粉。 於該凹槽内放人所述金錦。該雜表面與該凹槽周邊之基體 鲁表面齊平或突出於該基體表面。 將該放置有金狀基體進行加熱供烤，使凹槽底部之金屬焊 劑溶融，冷卻後之金屬焊劑將金飾與基魏接牢固。若金屬谭劑 為錫貧或錫粉’該加齡料於1流爐中進行。 可以理解，若該基體鑲金之表面與金舞露出於基體之表面不 在同-平面，而需要使該金飾與該基體鑲金之表面完全齊平，達 到-體化之效果，則可使先前提供之金飾稍高出凹槽，待上述烘 烤步驟後再對基體之整個鑲金表面進行精車加工，使金飾與基體 _ 在同一表面。 可以理解，為了保證黃金表面之光亮度，最後還可對該基體 之整個鑲金外表面做拋光處理。 請同時參閱圖i及圖2,一種由上述方法製得之鎮金電子装置 外殼10，包括-基體12及鑲嵌於該基體12上之金飾14。該基體 12可由不錄鋼、銅、鈦合金、鎂合金或铭合金等金屬材料製成。 該基體12絲上形成有與所述金飾w配合之凹槽ΐ2ι。所述金飾 μ容置於該凹槽m内，該金# 14與凹槽121触之間形成有粘 接該金飾I4與該基體12之金屬焊劑。該金屬蟬劍μ可為錫暮 201108913 焊劑或者錫粉。 上述鑲金方法藉由精密之機加工 屬焊mm# 和金飾，再藉由金 枝將金_定於基縣面⑼_，使得金飾與基體 牛牛結合，配合緊密，鑲金精度高，外 外硯精吳，而且後續對鑲金 表面進仃機加工時金飾不易脫落。 【圖式簡單說明】 圖1為本㈣難實_電子錢外殼未做金飾之示意圖; 圖2為本發明健實關鎮金電子綠外&之舰示意圖。 【主要元件符號說明】 鑲金電子裝置外殼 10 凹槽 121 金屬焊劑 16 基體 金飾 12 14Remove the 'affecting appearance'. If the filling is too small, the groove filling is not full or there is a gap, which also affects the appearance. Another conventional method of inserting gold is to form a concave concave surface on the surface of the product to be gold-plated. The open-ended bottom of the two-hearted groove is slightly narrow, and the gold-side force card is recessed, and is attached with ^..., . The method of Hai needs to force the gold ornament into the groove, which is easy to cause the gold groove. The gold incorporation of this method is not high enough to meet the precision requirement of gold in the production of σσ. [Summary of the Invention] There is a good way to provide a fine-grained gold jewelry with a high precision and a beautiful method. In addition, there is a need to provide - a sub-device shell from the domain to the county. The method of locking gold includes the following steps: forming a gold embossing by using a slow wire cutting machine, the gold embossing has a predetermined shape; providing a base body to be gold-plated, the base body being made of metal; pre-preserving the surface of the substrate The position of the gold is formed into a groove for accommodating the gold garnish; Φ is coated with a metal flux at the bottom of the groove; the gold jewel is placed in the groove; The substrate is heated for bake, so that the metal flux at the bottom of the groove is dazzled. After cooling, the metal is welded to the substrate. A gold-inlaid electronic device casing comprises: a metal substrate-base and a body on the body, the surface of the substrate is formed with a groove matching the gold decoration, and the gold decoration is placed in the groove A metal flux is formed between the gold fascia and the groove wall of the groove to abut the gold garnish and the base. • 1 Lai Jin Green forms a gold ornament by precision machining, and the gold decoration m is fixed on the surface of the base by metal welding, so that the gold wire is firmly knotted and tight, and the precision of the gold is high. Beautiful appearance. [Embodiment] The gold inserting method of the present invention comprises the following steps: forming a gold jewellery by using a slow wire cutting machine. The gold has a predetermined shape such as a straight shape, a fox shape or a wave shape. When processing, the dimensional tolerance of the control goldsmith is within ±0.02mm. Provide a red matrix to be inlaid, such as a mobile phone case. The substrate can be made of metal materials such as Yang Gang, copper, 201108913 titanium alloy, magnesium alloy or aluminum alloy. The surface of the surface is pre-inlaid with gold to form a groove. The method of forming the groove can be formed by milling the machine with the mmputefNumeriealcG curry, CNC). The recess is for receiving the gold jewel, which has the shape of a pre-set gold jewel. A layer of metal solder is formed at the bottom of the recess, such as a layer of solder paste or a layer of tin powder. The gold brocade is placed in the groove. The miscellaneous surface is flush with or protrudes from the surface of the substrate at the periphery of the recess. The gold-like substrate is heated and baked to melt the metal solder at the bottom of the groove, and the metal flux after cooling cools the gold and the base. If the metal tantalum is tin lean or tin powder, the ageing material is carried out in a 1 stream furnace. It can be understood that if the surface of the base gold inlay is not in the same plane as the surface of the gold dance exposed on the base body, and the gold jewelry needs to be completely flush with the surface of the base gold inlay, the effect of the body formation can be achieved. The previously provided gold ornaments are slightly higher than the grooves, and after the baking step described above, the entire gold-inlaid surface of the substrate is finished to make the gold ornaments and the substrate _ on the same surface. It can be understood that in order to ensure the brightness of the gold surface, the entire gold-inlaid surface of the substrate can be polished. Referring to Figures i and 2, a gold-plated electronic device housing 10 obtained by the above method includes a base 12 and a gold trim 14 mounted on the base 12. The base 12 may be made of a metal material such as steel, copper, titanium alloy, magnesium alloy or alloy. A groove ΐ2ι that is matched with the gold ornament w is formed on the wire 12 of the base body 12. The gold varnish is placed in the recess m, and a metal flux is adhered between the gold #14 and the recess 121 to bond the jewellery I4 and the base 12. The metal μ sword μ can be tin 暮 201108913 flux or tin powder. The above-mentioned gold-plating method is a precision machining machine that welds mm# and gold ornaments, and then sets gold to the base county (9)_ by gold branches, so that the gold ornaments are combined with the base cattle and cattle, and the tightness is combined with high precision in gold setting. The enamel is fine, and the gold ornaments are not easy to fall off when the surface of the gold-plated surface is machined. [Simple description of the figure] Fig. 1 is a schematic diagram of the (4) difficult to implement _ electronic money shell is not made of gold ornaments; Figure 2 is a schematic diagram of the ship of the safe and honest town of Jin Electronics Green & [Main component symbol description] Gold-encrusted electronic device housing 10 Groove 121 Metal flux 16 Base Gold 12 14