CN101633014A - Method for manufacturing SMD metal cover plate - Google Patents
Method for manufacturing SMD metal cover plate Download PDFInfo
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- CN101633014A CN101633014A CN200910183883A CN200910183883A CN101633014A CN 101633014 A CN101633014 A CN 101633014A CN 200910183883 A CN200910183883 A CN 200910183883A CN 200910183883 A CN200910183883 A CN 200910183883A CN 101633014 A CN101633014 A CN 101633014A
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- metal cover
- cover board
- plating
- base material
- smd metal
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Abstract
The invention discloses a method for manufacturing an SMD metal cover plate, which comprises the following steps: 1. selecting a fernico plate as a base material and stamping and finishing the base material; 2. plating a nickel plated protective layer on the surface of the finished base material; and 3. carrying out heat treatment on the plated base material at a certain temperature to obtain the SMD metal cover plate. The SMD metal cover plate has high corrosion resistance and planeness and short burr as well as improved working stability.
Description
Technical field
The present invention relates to a kind of preparation method of SMD metal cover board.
Background technology
SMD metal cover board in the market is the cost of manufacture height not only, and poor corrosion resistance, and the flatness of base material is poor, and burr is long, the poor reliability of soldering and sealing when welding causes crystal chip soldering and sealing back job stability on this metal cover board to reduce greatly.
Summary of the invention
The present invention is a kind of preparation method of SMD metal cover board, and not only corrosion resistance is strong for the SMD metal cover board that it makes, the flatness height, and burr is short, and can improve the job stability of metal cover board.
The present invention has adopted following technical scheme: a kind of preparation method of SMD metal cover board, and it may further comprise the steps: step 1, selecting iron-nickel alloy sheet material is base material, and base material is carried out punching press, light decorations; Step 2 is scribbling the nickel plating protective layer through the substrate surface plating behind the light decorations; Step 3, base material is heat-treated at a certain temperature and is obtained the SMD metal cover board after then plating being coated with.
The thickness of iron-nickel alloy sheet material is 0.08-0.2mm in the described step 1, and the mode of punching press is two dashing and the high-speed and continuous punching press, the burr≤0.01mm of substrate surface after the punching press, and salient point≤0.03mm, flatness is controlled in the 0.03mm.Adopt grinder to carry out barreling light decorations in the described step 1, in the process of barreling, add washing agent, washing agent accounts for 1 of abrasive material: 3-1: 4, washing agent adds and is the 50-70% of grinder drum volume behind the water, the time of barreling is 20-40 minute, and the burr of substrate surface is in the 0.005mm after the barreling.Adopting vibrating sieving machine to plate in the described step 2 is coated with; the thickness of nickel plating protective layer is 〉=3 μ m; the nickel plating protective layer comprises following composition: nickelous sulfate 20-30g/L; inferior sodium phosphate 15-20g/L; sodium acetate 15-20g/L, natrium citricum 10g/L, lactic acid 5ml; the temperature of plating bath is at 75-80 ℃ when plating is coated with, and the pH value of plating bath is 4.5-4.8.Temperature in the described step 3 during heat treatment is 450-650 ℃, and the time is 90-120 minute.
The present invention has following beneficial effect: plate body of the present invention is an iron-nickel alloy sheet material, and it is to cut down material, its coefficient of expansion and 95%Al
2O
3Pottery is close; punching press is carried out on surface at sheet alloy, like this can the time base material surfacing, burr is short; the surface of sheet alloy is provided with the nickel plating protective layer; so not only can reduce cost of manufacture, corrosion resistance is more intense, avoids occurring the phenomenon of bubble, layering and decortication; cover plate is through also non-scale after the bending; and the reliability can improve soldering and sealing the time, the fusing point when reducing soldering and sealing, thereby the stability when improving work.
The specific embodiment
The invention discloses a kind of preparation method of SMD metal cover board, it may further comprise the steps: step 1, selecting iron-nickel alloy sheet material is base material, the thickness of iron-nickel alloy sheet material is 0.08-0.2mm, base material is carried out punching press, the light decorations, the mode of punching press is two dashing and the high-speed and continuous punching press, burr≤the 0.01mm of substrate surface after the punching press, salient point≤0.03mm, flatness is controlled in the 0.03mm, the light decorations adopt grinder to carry out barreling, add washing agent in the process of barreling, washing agent accounts for 1 of abrasive material: 3-1: 4, and washing agent is the 50-70% of grinder drum volume after adding water, the time of barreling is 20-40 minute, and the burr of substrate surface is in the 0.005mm after the barreling; Step 2, adopting the vibrating sieving machine plating to scribble the nickel plating protective layer through the substrate surface behind the light decorations, the thickness of nickel plating protective layer is 〉=3 μ m, the nickel plating protective layer comprises following composition: nickelous sulfate 20-30g/L, inferior sodium phosphate 15-20g/L, sodium acetate 15-20g/L, natrium citricum 10g/L, lactic acid 5ml, the temperature of plating bath is at 75-80 ℃ when plating is coated with, and the pH value of plating bath is 4.5-4.8; Step 3, base material is heat-treated under 450-650 ℃ and was obtained the SMD metal cover board in 90-120 minute after then plating being coated with.
Claims (5)
1, a kind of preparation method of SMD metal cover board, it may further comprise the steps:
Step 1, selecting iron-nickel alloy sheet material is base material, and base material is carried out punching press, light decorations;
Step 2 is scribbling the nickel plating protective layer through the substrate surface plating behind the light decorations;
Step 3, base material is heat-treated at a certain temperature and is obtained the SMD metal cover board after then plating being coated with.
2, the preparation method of SMD metal cover board according to claim 1, the thickness that it is characterized in that iron-nickel alloy sheet material in the described step 1 is 0.08-0.2mm, the mode of punching press is two dashing and the high-speed and continuous punching press, burr≤the 0.01mm of substrate surface after the punching press, salient point≤0.03mm, flatness is controlled in the 0.03mm.
3, the preparation method of SMD metal cover board according to claim 1, it is characterized in that adopting in the described step 1 grinder to carry out barreling light decorations, in the process of barreling, add washing agent, washing agent accounts for 1 of abrasive material: 3-1: 4, washing agent adds and is the 50-70% of grinder drum volume behind the water, the time of barreling is 20-40 minute, and the burr of substrate surface is in the 0.005mm after the barreling.
4, the preparation method of SMD metal cover board according to claim 1; it is characterized in that adopting in the described step 2 vibrating sieving machine to plate is coated with; the thickness of nickel plating protective layer is 〉=3 μ m; the nickel plating protective layer comprises following composition: nickelous sulfate 20-30g/L, inferior sodium phosphate 15-20g/L, sodium acetate 15-20g/L; natrium citricum 10g/L; lactic acid 5ml, the temperature of plating bath is at 75-80 ℃ when plating is coated with, and the pH value of plating bath is 4.5-4.8.
5, the preparation method of SMD metal cover board according to claim 1, the temperature when it is characterized in that heat treatment in the described step 3 is 450-650 ℃, the time is 90-120 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910183883A CN101633014A (en) | 2009-08-04 | 2009-08-04 | Method for manufacturing SMD metal cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910183883A CN101633014A (en) | 2009-08-04 | 2009-08-04 | Method for manufacturing SMD metal cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101633014A true CN101633014A (en) | 2010-01-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910183883A Pending CN101633014A (en) | 2009-08-04 | 2009-08-04 | Method for manufacturing SMD metal cover plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN101633014A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104388920B (en) * | 2014-11-12 | 2017-02-22 | 华南理工大学 | Chromate-free passivation method for chemically-plated Ni-P coating |
| CN110977362A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Salt-fog-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
-
2009
- 2009-08-04 CN CN200910183883A patent/CN101633014A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104388920B (en) * | 2014-11-12 | 2017-02-22 | 华南理工大学 | Chromate-free passivation method for chemically-plated Ni-P coating |
| CN110977362A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Salt-fog-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
| CN110977362B (en) * | 2019-12-26 | 2024-05-07 | 中国电子科技集团公司第五十八研究所 | Salt spray corrosion resistant parallel seam welding alloy cover plate and preparation method thereof |
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Application publication date: 20100127 |