CN106132148A - The molding mode of housing, case of electronic device and electronic installation - Google Patents
The molding mode of housing, case of electronic device and electronic installation Download PDFInfo
- Publication number
- CN106132148A CN106132148A CN201610499147.9A CN201610499147A CN106132148A CN 106132148 A CN106132148 A CN 106132148A CN 201610499147 A CN201610499147 A CN 201610499147A CN 106132148 A CN106132148 A CN 106132148A
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- CN
- China
- Prior art keywords
- housing
- molding mode
- metal shell
- electronic device
- case
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention discloses the molding mode of a kind of housing, relates to electronic installation processing technique field.The molding mode of this housing is, first sheet metal is carried out punch forming and processes metal shell, then forms structural member in inside of metal outershell injection, processes finally by surface and obtains housing.Meanwhile, disclose a kind of case of electronic device using above-mentioned molding mode to process and there is the electronic installation of this case of electronic device.The present invention substantially reduces the process-cycle of housing, improves working (machining) efficiency, reduces processing cost, effectively prevent due to the problem of the bad order using CNC processing mode to bring simultaneously.
Description
Technical field
The present invention relates to electronic installation processing technique field, particularly relate to the molding mode of a kind of housing, use this molding
Case of electronic device that mode processes and there is the electronic installation of this case of electronic device.
Background technology
Along with electronic device appearance fineness requires more and more higher, housing use on electronic device appearance face the most more comes
The most.At present, the molding mode of integral housing is primarily present following two: one is all to use Digit Control Machine Tool (CNC) place
Reason mode processes；Another kind is that sheet metal first carries out punching press or forging and stamping formation housing, uses CNC processing mode afterwards
Milling finally processes except waste material.Both processing modes all refer to housing interior structure or the large-area CNC of appearance adds
Work, therefore, the process-cycle is long, and working (machining) efficiency is low, and processing cost is high, and easily produces product and knock damage, cause bad outside
The defects such as sight.
Based on the above, need the molding mode proposing a kind of housing badly, to solve what existing housing molding mode existed
Above-mentioned technical problem.
Summary of the invention
An object of the present invention is to propose the molding mode of a kind of housing, to solve existing housing processing mode processing week
Phase is long, and working (machining) efficiency is low, and processing cost is low and the problem of bad order.
The two of the purpose of the present invention are to propose a kind of case of electronic device using above-mentioned molding mode to process.
The three of the purpose of the present invention are to propose a kind of electronic installation with above-mentioned case of electronic device.
For reaching this purpose, the present invention by the following technical solutions:
The molding mode of a kind of housing, first carries out punch forming to sheet metal and processes metal shell, then at gold
Belong to injection inside shell and form structural member, process finally by surface and obtain housing.
As the preferred version of the molding mode of a kind of housing, described sheet metal is carried out punch forming process metal
Shell comprises the following steps:
By mould, sheet metal carries out blanking, stretching, side are cut and shaping series of steps.
As the preferred version of the molding mode of a kind of housing, sheet metal is carried out punch forming process gold described
Belong to after shell, described before inside of metal outershell injection forms structural member further comprising the steps of:
The surface of metal shell is carried out T process so that it is surface forms nanoscale aperture layer.
As the preferred version of the molding mode of a kind of housing, described T process comprises the following steps:
Metal shell is put in T liquid and soak so that it is surface forms micropore；
Metal shell after soaking is put in pure water and is rinsed, and is then dried process.
As the preferred version of the molding mode of a kind of housing, described micropore size scope is 6-12nm.
As the preferred version of the molding mode of a kind of housing, described T liquid is acid solution.
As the preferred version of the molding mode of a kind of housing, described surface processes and includes polishing, polishing, sandblasting and anode
Oxidation.
As the preferred version of the molding mode of a kind of housing, the thickness of described sheet metal is 0.4-1.2mm
A kind of case of electronic device, described case of electronic device use housing as described above molding mode processing and
Become.
A kind of electronic installation, including case of electronic device as described above.
The invention have the benefit that
The present invention carries out punch forming to sheet metal and processes metal shell, is then formed in inside of metal outershell injection
Structural member, processes finally by surface and obtains housing, compare with existing housing processing mode, and the present invention substantially reduces housing
Process-cycle, improve working (machining) efficiency, reduce processing cost, effectively prevent simultaneously due to use CNC processing mode band
The problem of the bad order come.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the metal shell that the embodiment of the present invention two provides；
Fig. 2 is the axonometric chart of the structural member that the embodiment of the present invention two provides；
Fig. 3 is the axonometric chart of the housing that the embodiment of the present invention two provides；
Fig. 4 is the flow chart of the molding mode of the housing that the embodiment of the present invention two provides.
In figure:
1, metal shell；2, structural member；3, housing.
Detailed description of the invention
Technical scheme and the technique effect reached for making to present invention solves the technical problem that, using are clearer, below
By combining accompanying drawing, the technical scheme of the embodiment of the present invention is described in further detail, it is clear that described embodiment is only
It is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, those skilled in the art exist
Do not make the every other embodiment obtained under creative work premise, broadly fall into the scope of protection of the invention.
Long in order to solve the existing housing processing mode process-cycle, working (machining) efficiency is low, and processing cost is low and bad order
Problem, the application proposes the molding mode of a kind of housing, the case of electronic device using this molding mode to process and has
The electronic installation of this case of electronic device, referring specifically to following example.
Embodiment one
The present embodiment proposes the molding mode of the first preferred housing, and this molding mode is, first enters sheet metal
Row punch forming processes metal shell, then forms structural member in inside of metal outershell injection, processes finally by surface and obtains
Obtain housing.
Comparing with existing housing processing mode, the present invention substantially reduces the process-cycle of housing, improves and adds work efficiency
Rate, reduces processing cost, effectively prevent due to the problem of the bad order using CNC processing mode to bring simultaneously.
Embodiment two
As shown in Figures 1 to 4, the present embodiment proposes the molding mode of the preferred housing of the second, and this molding mode includes
Following steps:
A, sheet metal is carried out punch forming process metal shell 1.
Preferably, first according to the size of sheet metal needed for the Size calculation of housing 3, then metallic plate raw material is led to
Cross the sheet metal before blanking die cuts out punch forming, finally by mould, sheet metal carried out blanking, stretching, side are cut
And shaping series of steps, punch forming goes out metal shell 1.
In the present embodiment, sheet metal selects rustless steel panel beating or aluminium alloy panel beating, not only increases the wear-resisting of housing 3
Degree, and extend service life.In order to make housing 3 more lightening, the thickness of sheet metal selects the model of 0.4-1.2mm
Enclose.
B, surface to metal shell 1 carry out T process so that it is surface forms nanoscale aperture layer.
Preferably, T handling process is specific as follows:
Metal shell 1 is put in alkali liquor soak certain time carry out defat；Metal shell 1 is immersed in acid solution and carries out
Neutralize；Metal shell 1 is put in T liquid and soak so that it is surface forms micropore, and wherein, micropore size scope is 6-12nm, T liquid
Can be selected for acid solution, example hydrochloric acid；Metal shell 1 after soaking is put in pure water and is rinsed, and is then dried process.
C, metal shell 1 is placed in plastic mould the injection in inner side forms the structure that is fixed together with metal shell 1
Part 2.
Preferably, metal shell 1 is placed in plastic mould, the structural member 2 injection formed by injection molding
Tighten together with metal shell 1, form one housing 3.Owing to structural member 2 can penetrate into gold by injection containing resin, resin
Belonging in the micropore formed after shell 1T processes, therefore, resin combines with metal in close, thus realize metal shell 1 and
The one of structural member 2 connects.
D, housing 3 to the integral type of step C carry out surface process, final obtain housing 3.
Preferably, surface processes and includes the operation such as polishing, polishing, sandblasting and anodic oxidation.Such as, to housing 3 surface
Excess waste is polished and polishes, and it is overheated that the flushing that needs to add water at any time during grinding and buffing prevents.Shell in polishing
Body 3 surface carries out blasting treatment, makes polished surface have granular sensation, beneficially the embodiment of casing metal gloss.Table at housing 3
Different metals is electroplated by anodized mode or other surface treatment modes in face, makes housing present various metals color,
Strengthen extremely dazzling property and the multiformity of housing outward appearance, improve the market competitiveness of shell product, meet the different needs of user, improve
Consumer's Experience.
The present invention utilizes above step to process housing 3, and not uses CNC processing mode, is substantially shorter the process-cycle,
Improve working (machining) efficiency, reduce processing cost, improve appearance.
Embodiment three
The present embodiment proposes a kind of case of electronic device, and this case of electronic device uses such as embodiment one or embodiment two institute
The molding mode of the housing stated processes.The present embodiment also proposes a kind of electronic installation, including this case of electronic device.Electronics
Device case can be electronic device battery cover, such as mobile phone battery cover etc..
Case of electronic device and the electronic installation process-cycle of the present invention are short, and working (machining) efficiency is high, and processing cost is low, and outward appearance is good
Good.
To describe the know-why of the present invention in conjunction with specific embodiments.These describe and are intended merely to explain that the present invention's is former
Reason, and limiting the scope of the invention can not be construed to by any way.Based on explanation herein, those skilled in the art
Member need not pay performing creative labour and can associate other detailed description of the invention of the present invention, and these modes fall within this
Within the protection domain of invention.
Claims (10)
1. the molding mode of a housing, it is characterised in that first sheet metal is carried out punch forming and process metal shell
(1), then form structural member (2) in the injection of metal shell (1) inner side, process finally by surface and obtain housing (3).
The molding mode of housing the most according to claim 1, it is characterised in that described sheet metal is carried out punch forming
Process metal shell (1) to comprise the following steps:
By mould, sheet metal carries out blanking, stretching, side are cut and shaping series of steps.
The molding mode of housing the most according to claim 1, it is characterised in that sheet metal is struck out described
After type processes metal shell (1), described also included before the injection of metal shell (1) inner side forms structural member (2) with
Lower step:
The surface of metal shell (1) is carried out T process so that it is surface forms nanoscale aperture layer.
The molding mode of housing the most according to claim 3, it is characterised in that described T process comprises the following steps:
Metal shell (1) is put in T liquid and soak so that it is surface forms micropore；
Metal shell (1) after soaking is put in pure water and is rinsed, and is then dried process.
The molding mode of housing the most according to claim 4, it is characterised in that described micropore size scope is 6-12nm.
The molding mode of housing the most according to claim 4, it is characterised in that described T liquid is acid solution.
The molding mode of housing the most according to claim 1, it is characterised in that described surface process include polishing, polishing,
Sandblasting and anodic oxidation.
The molding mode of housing the most according to claim 1, it is characterised in that the thickness of described sheet metal is 0.4-
1.2mm。
9. a case of electronic device, it is characterised in that described case of electronic device uses such as any one of claim 1 to 8 institute
The molding mode of the housing stated processes.
10. an electronic installation, it is characterised in that include case of electronic device as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610499147.9A CN106132148A (en) | 2016-06-27 | 2016-06-27 | The molding mode of housing, case of electronic device and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610499147.9A CN106132148A (en) | 2016-06-27 | 2016-06-27 | The molding mode of housing, case of electronic device and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106132148A true CN106132148A (en) | 2016-11-16 |
Family
ID=57285866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610499147.9A Pending CN106132148A (en) | 2016-06-27 | 2016-06-27 | The molding mode of housing, case of electronic device and electronic installation |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535537A (en) * | 2016-11-30 | 2017-03-22 | 奥捷科技（厦门）有限公司 | Forming method of metal rear cover of mobile electronic product and metal rear cover |
| CN106738621A (en) * | 2016-12-30 | 2017-05-31 | 深圳天珑无线科技有限公司 | Housing and preparation method thereof, electronic installation |
| CN106816687A (en) * | 2017-01-17 | 2017-06-09 | 广东欧珀移动通信有限公司 | Method for producing shell and mobile terminal |
| CN106848538A (en) * | 2017-01-17 | 2017-06-13 | 广东欧珀移动通信有限公司 | Method for producing shell and mobile terminal |
| CN107087365A (en) * | 2017-05-09 | 2017-08-22 | 广东欧珀移动通信有限公司 | Metal center processing technology, metal center and electronic installation |
| CN107377656A (en) * | 2017-07-27 | 2017-11-24 | 珠海市魅族科技有限公司 | Clad metal sheet and preparation method thereof, shell and its processing method and electronic equipment |
| CN108155304A (en) * | 2017-11-23 | 2018-06-12 | 合肥国轩高科动力能源有限公司 | Processing method of battery shell |
| CN108309017A (en) * | 2017-01-17 | 2018-07-24 | 佛山市顺德区美的电热电器制造有限公司 | Cookware and preparation method thereof and cooking apparatus |
| CN109940342A (en) * | 2017-12-20 | 2019-06-28 | 天津三星通信技术研究有限公司 | A kind of forming method of equipment metal shell |
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| CN104607884A (en) * | 2015-02-13 | 2015-05-13 | 广东欧珀移动通信有限公司 | Processing technique of cellphone shell with metal luster |
| CN104646968A (en) * | 2015-03-11 | 2015-05-27 | 深圳市旺鑫精密工业有限公司 | Metal nanometer forming technology |
| CN105555089A (en) * | 2015-12-25 | 2016-05-04 | 深圳市卓怡恒通电脑科技有限公司 | Fabrication method of metal housing |
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| CN104607884A (en) * | 2015-02-13 | 2015-05-13 | 广东欧珀移动通信有限公司 | Processing technique of cellphone shell with metal luster |
| CN104646968A (en) * | 2015-03-11 | 2015-05-27 | 深圳市旺鑫精密工业有限公司 | Metal nanometer forming technology |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106535537A (en) * | 2016-11-30 | 2017-03-22 | 奥捷科技（厦门）有限公司 | Forming method of metal rear cover of mobile electronic product and metal rear cover |
| CN106738621B (en) * | 2016-12-30 | 2019-11-05 | 江苏一开电力科技有限公司 | Shell and preparation method thereof, electronic device |
| CN106738621A (en) * | 2016-12-30 | 2017-05-31 | 深圳天珑无线科技有限公司 | Housing and preparation method thereof, electronic installation |
| EP3553884A4 (en) * | 2017-01-17 | 2019-12-11 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing manufacturing method and mobile terminal |
| CN106848538A (en) * | 2017-01-17 | 2017-06-13 | 广东欧珀移动通信有限公司 | Method for producing shell and mobile terminal |
| CN108309017B (en) * | 2017-01-17 | 2023-08-29 | 佛山市顺德区美的电热电器制造有限公司 | Pot, preparation method thereof and cooking utensil |
| US10931800B2 (en) | 2017-01-17 | 2021-02-23 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Method for manufacturing housing and mobile terminal |
| CN108309017A (en) * | 2017-01-17 | 2018-07-24 | 佛山市顺德区美的电热电器制造有限公司 | Cookware and preparation method thereof and cooking apparatus |
| WO2018133732A1 (en) * | 2017-01-17 | 2018-07-26 | 广东欧珀移动通信有限公司 | Housing manufacturing method and mobile terminal |
| CN106848538B (en) * | 2017-01-17 | 2020-03-24 | Oppo广东移动通信有限公司 | Shell manufacturing method and mobile terminal |
| CN106816687A (en) * | 2017-01-17 | 2017-06-09 | 广东欧珀移动通信有限公司 | Method for producing shell and mobile terminal |
| CN106816687B (en) * | 2017-01-17 | 2019-12-06 | Oppo广东移动通信有限公司 | Shell manufacturing method and mobile terminal |
| CN107087365A (en) * | 2017-05-09 | 2017-08-22 | 广东欧珀移动通信有限公司 | Metal center processing technology, metal center and electronic installation |
| CN107377656A (en) * | 2017-07-27 | 2017-11-24 | 珠海市魅族科技有限公司 | Clad metal sheet and preparation method thereof, shell and its processing method and electronic equipment |
| CN108155304A (en) * | 2017-11-23 | 2018-06-12 | 合肥国轩高科动力能源有限公司 | Processing method of battery shell |
| CN108155304B (en) * | 2017-11-23 | 2021-04-09 | 合肥国轩高科动力能源有限公司 | Processing method of battery shell |
| CN109940342A (en) * | 2017-12-20 | 2019-06-28 | 天津三星通信技术研究有限公司 | A kind of forming method of equipment metal shell |
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Application publication date: 20161116 |