CN101989568A - 形成金属互连层的方法 - Google Patents
形成金属互连层的方法 Download PDFInfo
- Publication number
- CN101989568A CN101989568A CN2009100558318A CN200910055831A CN101989568A CN 101989568 A CN101989568 A CN 101989568A CN 2009100558318 A CN2009100558318 A CN 2009100558318A CN 200910055831 A CN200910055831 A CN 200910055831A CN 101989568 A CN101989568 A CN 101989568A
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- seed layer
- copper seed
- reaction chamber
- copper
- layer
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2009100558318A CN101989568A (zh) | 2009-08-03 | 2009-08-03 | 形成金属互连层的方法 |
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CN2009100558318A CN101989568A (zh) | 2009-08-03 | 2009-08-03 | 形成金属互连层的方法 |
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CN101989568A true CN101989568A (zh) | 2011-03-23 |
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CN2009100558318A Pending CN101989568A (zh) | 2009-08-03 | 2009-08-03 | 形成金属互连层的方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109817515A (zh) * | 2017-11-22 | 2019-05-28 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制造方法 |
CN110473828A (zh) * | 2019-08-22 | 2019-11-19 | 上海华力集成电路制造有限公司 | 电镀铜填充工艺方法 |
CN116613157A (zh) * | 2023-07-21 | 2023-08-18 | 荣耀终端有限公司 | 芯片堆叠结构及其制作方法、电子设备 |
-
2009
- 2009-08-03 CN CN2009100558318A patent/CN101989568A/zh active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109817515A (zh) * | 2017-11-22 | 2019-05-28 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件的制造方法 |
CN110473828A (zh) * | 2019-08-22 | 2019-11-19 | 上海华力集成电路制造有限公司 | 电镀铜填充工艺方法 |
US11728213B2 (en) * | 2019-08-22 | 2023-08-15 | Shanghai Huali Integrated Circuit Corporation | Method of copper plating filling |
CN116613157A (zh) * | 2023-07-21 | 2023-08-18 | 荣耀终端有限公司 | 芯片堆叠结构及其制作方法、电子设备 |
CN116613157B (zh) * | 2023-07-21 | 2024-03-19 | 荣耀终端有限公司 | 芯片堆叠结构及其制作方法、电子设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121119 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121119 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110323 |