CN101974228A - 一种发光元件封装用有机硅胶材料及其制备方法 - Google Patents
一种发光元件封装用有机硅胶材料及其制备方法 Download PDFInfo
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- CN101974228A CN101974228A CN 201010504086 CN201010504086A CN101974228A CN 101974228 A CN101974228 A CN 101974228A CN 201010504086 CN201010504086 CN 201010504086 CN 201010504086 A CN201010504086 A CN 201010504086A CN 101974228 A CN101974228 A CN 101974228A
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- Prior art keywords
- organopolysiloxane
- gel material
- luminous element
- silica gel
- organic silica
- Prior art date
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- Granted
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- 239000000463 material Substances 0.000 title claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 239000000741 silica gel Substances 0.000 title claims abstract description 36
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 229960001866 silicon dioxide Drugs 0.000 title abstract 6
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 97
- -1 polysiloxane Polymers 0.000 claims abstract description 55
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 46
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 45
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 28
- 239000001257 hydrogen Substances 0.000 claims abstract description 27
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 19
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical group [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000002105 nanoparticle Substances 0.000 claims abstract description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 33
- 238000005538 encapsulation Methods 0.000 claims description 27
- 239000003054 catalyst Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 238000010790 dilution Methods 0.000 claims description 10
- 239000012895 dilution Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 230000003197 catalytic effect Effects 0.000 claims description 6
- 238000006068 polycondensation reaction Methods 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 230000035939 shock Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000008859 change Effects 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract 2
- 230000004907 flux Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 11
- 229910004283 SiO 4 Inorganic materials 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000004205 dimethyl polysiloxane Substances 0.000 description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000006555 catalytic reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 230000003245 working effect Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 150000008282 halocarbons Chemical group 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000005543 nano-size silicon particle Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241000370738 Chlorion Species 0.000 description 1
- HDEPFLVKWKPGFZ-UHFFFAOYSA-N Cl(=O)(=O)O.[Pt] Chemical compound Cl(=O)(=O)O.[Pt] HDEPFLVKWKPGFZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- QYSYEILYXGRUOM-UHFFFAOYSA-N [Cl].[Pt] Chemical compound [Cl].[Pt] QYSYEILYXGRUOM-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 238000006136 alcoholysis reaction Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
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CN 201010504086 CN101974228B (zh) | 2010-10-11 | 2010-10-11 | 一种发光元件封装用有机硅胶材料及其制备方法 |
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CN 201010504086 CN101974228B (zh) | 2010-10-11 | 2010-10-11 | 一种发光元件封装用有机硅胶材料及其制备方法 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102424723A (zh) * | 2011-08-19 | 2012-04-25 | 陈蕊丽 | 用于立体痕迹提取的硅胶枪 |
CN102924927A (zh) * | 2012-11-22 | 2013-02-13 | 深圳市森日有机硅材料有限公司 | 全透明液体硅橡胶组合物及其制备方法 |
CN103320087A (zh) * | 2013-06-03 | 2013-09-25 | 曹坚林 | 一种液体光学透明有机硅材料及其制备方法 |
CN105802489A (zh) * | 2014-12-29 | 2016-07-27 | 广州慧谷化学有限公司 | 玻璃防碎胶组合物及玻璃制品及应用 |
CN107527984A (zh) * | 2016-06-22 | 2017-12-29 | 惠州雷通光电器件有限公司 | 硅树脂胶及其在led封装中的应用方法 |
CN109749461A (zh) * | 2018-12-30 | 2019-05-14 | 苏州桐力光电股份有限公司 | 一种光学透明硅树脂 |
CN111148796A (zh) * | 2017-10-20 | 2020-05-12 | 陶氏东丽株式会社 | 硬化性粒状硅酮组合物、其硬化物、及其制造方法 |
CN111154452A (zh) * | 2020-01-17 | 2020-05-15 | 江西赛欧特科新材料有限公司 | 一种光学胶 |
CN112510140A (zh) * | 2020-12-14 | 2021-03-16 | 宁波群芯微电子有限责任公司 | 一种应用于汽车光电耦合器的led封装结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101107324A (zh) * | 2005-01-24 | 2008-01-16 | 迈图高新材料日本合同公司 | 发光元件封装用有机硅组合物及发光装置 |
CN101508882A (zh) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | 一种应用于发光二极管的封装材料及其制备方法 |
CN101735619A (zh) * | 2009-12-28 | 2010-06-16 | 华南理工大学 | 一种无卤阻燃导热有机硅电子灌封胶及其制备方法 |
-
2010
- 2010-10-11 CN CN 201010504086 patent/CN101974228B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101107324A (zh) * | 2005-01-24 | 2008-01-16 | 迈图高新材料日本合同公司 | 发光元件封装用有机硅组合物及发光装置 |
CN101508882A (zh) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | 一种应用于发光二极管的封装材料及其制备方法 |
CN101735619A (zh) * | 2009-12-28 | 2010-06-16 | 华南理工大学 | 一种无卤阻燃导热有机硅电子灌封胶及其制备方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102424723A (zh) * | 2011-08-19 | 2012-04-25 | 陈蕊丽 | 用于立体痕迹提取的硅胶枪 |
CN102924927A (zh) * | 2012-11-22 | 2013-02-13 | 深圳市森日有机硅材料有限公司 | 全透明液体硅橡胶组合物及其制备方法 |
CN103320087A (zh) * | 2013-06-03 | 2013-09-25 | 曹坚林 | 一种液体光学透明有机硅材料及其制备方法 |
CN105802489A (zh) * | 2014-12-29 | 2016-07-27 | 广州慧谷化学有限公司 | 玻璃防碎胶组合物及玻璃制品及应用 |
CN105802489B (zh) * | 2014-12-29 | 2018-06-12 | 广州慧谷化学有限公司 | 玻璃防碎胶组合物及玻璃制品及应用 |
CN107527984A (zh) * | 2016-06-22 | 2017-12-29 | 惠州雷通光电器件有限公司 | 硅树脂胶及其在led封装中的应用方法 |
CN111148796A (zh) * | 2017-10-20 | 2020-05-12 | 陶氏东丽株式会社 | 硬化性粒状硅酮组合物、其硬化物、及其制造方法 |
CN109749461A (zh) * | 2018-12-30 | 2019-05-14 | 苏州桐力光电股份有限公司 | 一种光学透明硅树脂 |
CN111154452A (zh) * | 2020-01-17 | 2020-05-15 | 江西赛欧特科新材料有限公司 | 一种光学胶 |
CN112510140A (zh) * | 2020-12-14 | 2021-03-16 | 宁波群芯微电子有限责任公司 | 一种应用于汽车光电耦合器的led封装结构 |
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Publication number | Publication date |
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CN101974228B (zh) | 2012-12-05 |
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