CN101963710B - 贴合设备 - Google Patents
贴合设备 Download PDFInfo
- Publication number
- CN101963710B CN101963710B CN200910304834.0A CN200910304834A CN101963710B CN 101963710 B CN101963710 B CN 101963710B CN 200910304834 A CN200910304834 A CN 200910304834A CN 101963710 B CN101963710 B CN 101963710B
- Authority
- CN
- China
- Prior art keywords
- substrate
- dyestripping
- abutted equipment
- forming apparatus
- peeling unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 238000007666 vacuum forming Methods 0.000 claims description 30
- 239000000969 carrier Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 21
- 238000010030 laminating Methods 0.000 claims description 11
- 210000001847 Jaw Anatomy 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 6
- 230000032258 transport Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000007664 blowing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 230000001681 protective Effects 0.000 description 2
- 210000001138 Tears Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910304834.0A CN101963710B (zh) | 2009-07-24 | 2009-07-24 | 贴合设备 |
US12/567,910 US8291956B2 (en) | 2009-07-24 | 2009-09-28 | Bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910304834.0A CN101963710B (zh) | 2009-07-24 | 2009-07-24 | 贴合设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101963710A CN101963710A (zh) | 2011-02-02 |
CN101963710B true CN101963710B (zh) | 2014-02-19 |
Family
ID=43496263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910304834.0A Active CN101963710B (zh) | 2009-07-24 | 2009-07-24 | 贴合设备 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8291956B2 (zh) |
CN (1) | CN101963710B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102752959B (zh) * | 2011-04-20 | 2014-12-24 | 富葵精密组件(深圳)有限公司 | 压合装置 |
CN103268034B (zh) * | 2013-06-03 | 2016-03-02 | 郴州市晶讯光电有限公司 | 一种液晶显示屏压条机 |
CN103552345B (zh) * | 2013-10-29 | 2016-08-24 | 深圳市联得自动化装备股份有限公司 | 贴合装置及贴合方法 |
CN104015454B (zh) * | 2014-05-16 | 2016-06-15 | 深圳市深科达智能装备股份有限公司 | 全自动贴合组装智能生产线 |
CN104144572B (zh) * | 2014-07-09 | 2017-07-21 | 东莞市升宇智能科技有限公司 | 微粘带供料机构 |
CN105620004B (zh) * | 2014-10-28 | 2017-09-26 | 福士瑞精密工业(晋城)有限公司 | 贴合设备 |
CN106736373A (zh) * | 2017-01-10 | 2017-05-31 | 广东牧特智能装备股份有限公司 | 一种自动fpc贴合机的机架平台 |
CN107777336B (zh) * | 2017-10-27 | 2019-08-06 | 业成科技(成都)有限公司 | 贴合装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6241839B1 (en) * | 1996-08-13 | 2001-06-05 | Canon Kabushiki Kaisha | Continuous vacuum lamination treatment system and vacuum lamination apparatus |
US6453963B1 (en) * | 1999-07-29 | 2002-09-24 | Hitachi Techno Engineering Co., Ltd. | Vacuum film laminating apparatus |
KR20070071014A (ko) * | 2005-12-29 | 2007-07-04 | 탑 에이앤씨테크 주식회사 | 액정패널용 합착장비 |
CN201242637Y (zh) * | 2008-07-30 | 2009-05-20 | 阳程科技股份有限公司 | 同侧供料的贴附装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2903925B2 (ja) * | 1992-11-16 | 1999-06-14 | 富士電機株式会社 | 板材の積み重ね装置 |
TW283819B (zh) * | 1995-02-03 | 1996-08-21 | Fuji Photo Film Co Ltd |
-
2009
- 2009-07-24 CN CN200910304834.0A patent/CN101963710B/zh active Active
- 2009-09-28 US US12/567,910 patent/US8291956B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6241839B1 (en) * | 1996-08-13 | 2001-06-05 | Canon Kabushiki Kaisha | Continuous vacuum lamination treatment system and vacuum lamination apparatus |
US6453963B1 (en) * | 1999-07-29 | 2002-09-24 | Hitachi Techno Engineering Co., Ltd. | Vacuum film laminating apparatus |
KR20070071014A (ko) * | 2005-12-29 | 2007-07-04 | 탑 에이앤씨테크 주식회사 | 액정패널용 합착장비 |
CN201242637Y (zh) * | 2008-07-30 | 2009-05-20 | 阳程科技股份有限公司 | 同侧供料的贴附装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101963710A (zh) | 2011-02-02 |
US20110017405A1 (en) | 2011-01-27 |
US8291956B2 (en) | 2012-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160801 Address after: 048000 Jincheng economic and Technological Development Zone, Shanxi orchid Road, No. 1216 Patentee after: Fushui Precision Industry (Jincheng) Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. Patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200917 Address after: 048026 Jincheng Development Zone, Shanxi, No. 1216 orchid Road Patentee after: JINCHENG FUTAIHUA PRECISION ELECTRONICS Co.,Ltd. Address before: 048000 Jincheng economic and Technological Development Zone, Shanxi orchid Road, No. 1216 Patentee before: Fushui Precision Industry (Jincheng) Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: No.1216, Lanhua Road, Jincheng Development Zone, Shanxi Province 048026 Patentee after: Fulian Technology (Jincheng) Co.,Ltd. Address before: No.1216, Lanhua Road, Jincheng Development Zone, Shanxi Province 048026 Patentee before: JINCHENG FUTAIHUA PRECISION ELECTRONICS Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |