CN101924092A - 半导体器件 - Google Patents

半导体器件 Download PDF

Info

Publication number
CN101924092A
CN101924092A CN2010101894925A CN201010189492A CN101924092A CN 101924092 A CN101924092 A CN 101924092A CN 2010101894925 A CN2010101894925 A CN 2010101894925A CN 201010189492 A CN201010189492 A CN 201010189492A CN 101924092 A CN101924092 A CN 101924092A
Authority
CN
China
Prior art keywords
silicon substrate
semiconductor device
vss2
high voltage
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010101894925A
Other languages
English (en)
Chinese (zh)
Inventor
小林伸行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN101924092A publication Critical patent/CN101924092A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/28—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels
    • G09G3/288—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using luminous gas-discharge panels, e.g. plasma panels using AC panels
    • G09G3/296—Driving circuits for producing the waveforms applied to the driving electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2010101894925A 2009-06-15 2010-05-26 半导体器件 Pending CN101924092A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-142806 2009-06-15
JP2009142806A JP2010287866A (ja) 2009-06-15 2009-06-15 半導体装置

Publications (1)

Publication Number Publication Date
CN101924092A true CN101924092A (zh) 2010-12-22

Family

ID=43305739

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101894925A Pending CN101924092A (zh) 2009-06-15 2010-05-26 半导体器件

Country Status (3)

Country Link
US (1) US8237261B2 (https=)
JP (1) JP2010287866A (https=)
CN (1) CN101924092A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105897165A (zh) * 2015-02-16 2016-08-24 精工爱普生株式会社 振荡电路、振荡器、电子设备以及移动体
CN104022098B (zh) * 2014-05-29 2016-11-16 京东方科技集团股份有限公司 一种覆晶薄膜及显示装置
CN116569327A (zh) * 2020-12-09 2023-08-08 华为技术有限公司 封装结构及其制备方法、电子设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012164846A (ja) * 2011-02-08 2012-08-30 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、及び表示装置
JP2012164750A (ja) * 2011-02-04 2012-08-30 Canon Inc 電子機器
JP7025948B2 (ja) * 2018-02-13 2022-02-25 ローム株式会社 半導体装置および半導体装置の製造方法
KR20250131658A (ko) * 2024-02-27 2025-09-03 엘지디스플레이 주식회사 표시 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1347146A (zh) * 2000-09-28 2002-05-01 日本电气株式会社 具有绝缘体上硅结构的半导体器件及其制造方法
US6432809B1 (en) * 2000-02-28 2002-08-13 International Business Machines Corporation Method for improved passive thermal flow in silicon on insulator devices
CN1773740A (zh) * 2004-11-12 2006-05-17 国际商业机器公司 集成热电冷却器件及其制作方法
CN101044618A (zh) * 2004-11-16 2007-09-26 国际商业机器公司 制造具有通孔连接的双面soi晶片级封装的装置和方法
CN101252820A (zh) * 2007-02-19 2008-08-27 松下电器产业株式会社 半导体器件和显示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282878A (ja) * 2002-03-20 2003-10-03 Citizen Watch Co Ltd 半導体装置およびその製造方法
JP2004095787A (ja) * 2002-08-30 2004-03-25 Mitsubishi Electric Corp 圧接型半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432809B1 (en) * 2000-02-28 2002-08-13 International Business Machines Corporation Method for improved passive thermal flow in silicon on insulator devices
CN1347146A (zh) * 2000-09-28 2002-05-01 日本电气株式会社 具有绝缘体上硅结构的半导体器件及其制造方法
CN1773740A (zh) * 2004-11-12 2006-05-17 国际商业机器公司 集成热电冷却器件及其制作方法
CN101044618A (zh) * 2004-11-16 2007-09-26 国际商业机器公司 制造具有通孔连接的双面soi晶片级封装的装置和方法
CN101252820A (zh) * 2007-02-19 2008-08-27 松下电器产业株式会社 半导体器件和显示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104022098B (zh) * 2014-05-29 2016-11-16 京东方科技集团股份有限公司 一种覆晶薄膜及显示装置
CN105897165A (zh) * 2015-02-16 2016-08-24 精工爱普生株式会社 振荡电路、振荡器、电子设备以及移动体
CN116569327A (zh) * 2020-12-09 2023-08-08 华为技术有限公司 封装结构及其制备方法、电子设备

Also Published As

Publication number Publication date
US20100314773A1 (en) 2010-12-16
JP2010287866A (ja) 2010-12-24
US8237261B2 (en) 2012-08-07

Similar Documents

Publication Publication Date Title
CN112908939B (zh) 光继电器
CN101924092A (zh) 半导体器件
US7795713B2 (en) Semiconductor device and method for producing the same
US8866291B2 (en) Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
CN101252820B (zh) 半导体器件和显示装置
KR102411667B1 (ko) 동축 상호접속부를 포함하는 통합 디바이스
CN102044449B (zh) 半导体封装和制造半导体封装的方法
CN101090101A (zh) Ic芯片封装和使用该ic芯片封装的图像显示装置
KR100911784B1 (ko) 다중 전압용 분리형 박막 커패시터
CN101814459A (zh) 半导体封装的安装结构及等离子体显示器件
US8698574B2 (en) High-frequency switch
US7649723B2 (en) ESD protection substrate and integrated circuit utilizing the same
WO2020170650A1 (ja) 半導体モジュール、パワー半導体モジュールおよびそれらいずれかを用いたパワーエレクトロニクス機器
CN100369254C (zh) 半导体集成电路器件
KR101340512B1 (ko) 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리
US10256174B2 (en) Film type semiconductor package
US10559513B2 (en) Circuit board and packaged chip
US20080105987A1 (en) Semiconductor device having interposer formed on chip
JP3886905B2 (ja) Ｅｓｄ保護を備える半導体部品
US7015588B2 (en) Semiconductor device
JP2006049766A (ja) 半導体リレー装置
TWI304648B (en) Semiconductor device chip and semiconductor device chip package
KR20080071447A (ko) 연성인쇄회로기판
JP2006337829A (ja) 駆動用ｉｃ及びそれが実装された表示装置
JP2023139458A (ja) 半導体デバイス

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned

Effective date of abandoning: 20101222

C20 Patent right or utility model deemed to be abandoned or is abandoned