CN101917818B - Pad structure of circuit board and manufacturing method thereof - Google Patents
Pad structure of circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN101917818B CN101917818B CN2009100355741A CN200910035574A CN101917818B CN 101917818 B CN101917818 B CN 101917818B CN 2009100355741 A CN2009100355741 A CN 2009100355741A CN 200910035574 A CN200910035574 A CN 200910035574A CN 101917818 B CN101917818 B CN 101917818B
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- Prior art keywords
- circuit board
- pad
- line
- thickness
- metal
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- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a pad structure of a circuit board and a manufacturing method thereof. The circuit board is provided with a plurality of pads not covered by a solder mask on the surface of the circuit board and connected with the line of the circuit board, and the pads are higher than the surface of the circuit board. The manufacturing method is performed according to the following steps of: a, covering a protection layer at the pad position of an outer metal layer of the circuit board according to the design; b, thinning the outer metal layer not covered by the protection layer for set thickness by using a micro etching technology; c, washing off the protection layer, and performing the subsequent etching technology of the line and the pad of the circuit board according to the design to manufacture the line and the pad of the circuit board; d, performing a solder resisting technology according to the design to enable the solder mask to cover the line of the circuit board, wherein the thinned set thickness of the outer metal layer in the step b is greater than the thickness of the solder mask in the step d. As the pads are higher than the surface of the circuit board, after the subsequent client correspondingly solders each element to each pad, the weld between the element and the circuit board has good heat dissipation so that high-temperature oxidation is not easy to happen during use.
Description
Technical field
The present invention relates to a kind of board structure of circuit and method for making thereof, pad structure of especially a kind of circuit board and preparation method thereof.
Background technology
The pad of existing circuit board and circuit are that etching forms on the Copper Foil of same thickness; Be obstructed by design after the covering of solder paste China ink in the circuit surface; According to customer demand to pad electroplate, PROCESS FOR TREATMENT such as surface oxidation-resistant, so the pad height generally is lower than circuit board surface or flushes with circuit board surface.Subsequent clients is burn-on each element correspondence behind each pad, because the pad height is lower than circuit board surface or flushes with circuit board surface, it is relatively poor to dispel the heat, and is prone to the high-temperature oxydation phenomenon in the use.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides pad structure of a kind of circuit board and preparation method thereof, can reach higher use radiating effect.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of pad structure of circuit board, circuit board are provided with some some pads that do not covered and be connected with circuit board line by the circuit board surface solder mask, and said pad exceeds circuit board surface; Said pad be with circuit board line at the same metal pad that forms with step etching near the metal level of circuit board surface; The implementation that said pad exceeds circuit board surface is: the metal level of said pad is than the metal bed thickness of circuit board line, and the metal layer thickness difference of the metal level of this pad and circuit board line is greater than the thickness of circuit board surface solder mask.
As further improvement of the present invention, the metal level of said pad than the implementation of the metal bed thickness of circuit board line is: the metal level outside the said pad forms said pad and circuit board line with step etching behind the reduction process attenuate.
As further improvement of the present invention, said circuit board is a kind of in single sided board, double sided board and the multi-layer sheet.
A kind of manufacture method of board pads, carry out as follows:
A. by the pad locations protective mulch (can apply or attach anti-corrosion protection film) of design at the outer layer metal layer of circuit board;
B. through little etching technique the outer layer metal layer attenuate of position not covered by the protective layer is set thickness (because little etching technique is general prior art, Gu no longer detail) here;
C. wash protective layer, carry out subsequent conditioning circuit printed line road and pad etching process (because this circuit board line and pad etching process are general prior art, Gu no longer detail) here, produce circuit board line and pad by design;
D. hinder welder's skill by design, make solder mask covering board circuit,
The setting thickness of said step b ectomesoderm metal level attenuate greater than steps d after the thickness of solder mask.
The invention has the beneficial effects as follows: because pad exceeds circuit board surface, follow-up subsequent clients is burn-on each element correspondence behind each pad, and the heat radiation of the weld of element and circuit board is better, is not prone to the high-temperature oxydation phenomenon in the use.
Description of drawings
Fig. 1 is the structure for amplifying sketch map of pad according to the invention place circuit board;
Fig. 2 is the cross-section structure enlarged diagram of single sided board according to the invention.
Embodiment
Embodiment: a kind of pad structure of circuit board, circuit board 3 are provided with some some pads 1 that do not covered and be connected with circuit board line 2 by circuit board surface solder mask 4, and said pad 1 exceeds circuit board surface; Said pad 1 be with circuit board line 2 at the same metal pad that forms with step etching near the metal level of circuit board surface; The implementation that said pad 1 exceeds circuit board surface is: the metal level of said pad 1 is than the metal bed thickness of circuit board line 2, and the metal layer thickness difference of the metal level of this pad 1 and circuit board line 2 is greater than the thickness of circuit board surface solder mask 4.
The metal level of said pad 1 than the implementation of the metal bed thickness of circuit board line 2 is: the metal level outside the said pad 1 forms said pad 1 and circuit board line 2 with step etching behind the reduction process attenuate.
Said circuit board is a kind of in single sided board, double sided board and the multi-layer sheet.
A kind of manufacture method of board pads, carry out as follows:
A. by the pad locations protective mulch (can apply or attach anti-corrosion protection film) of design at the outer layer metal layer of circuit board;
B. through little etching technique the outer layer metal layer attenuate of position not covered by the protective layer is set thickness (because little etching technique is general prior art, consolidates example and no longer detail);
C. wash protective layer, carry out subsequent conditioning circuit printed line road and pad etching process (, consolidate example and no longer detail), produce circuit board line and pad because this circuit board line and pad etching process are general prior art by design;
D. hinder welder's skill by design, make solder mask covering board circuit,
The setting thickness of said step b ectomesoderm metal level attenuate greater than steps d after the thickness of solder mask.
Because pad exceeds circuit board surface, follow-up subsequent clients is burn-on each element correspondence behind each pad, and the heat radiation of the weld of element and circuit board is better, is not prone to the high-temperature oxydation phenomenon in the use.
Claims (4)
1. the pad structure of a circuit board, circuit board (3) are provided with some some pads (1) that do not covered and be connected with circuit board line (2) by circuit board surface solder mask (4), and it is characterized in that: said pad (1) exceeds circuit board surface; Said pad (1) be with circuit board line (2) at the same metal pad that forms with step etching near the metal level of circuit board surface; The implementation that said pad (1) exceeds circuit board surface is: the metal level of said pad (1) is than the metal bed thickness of circuit board line (2), and the metal layer thickness difference of metal level of this pad (1) and circuit board line (2) is greater than the thickness of circuit board surface solder mask (4).
2. the pad structure of circuit board according to claim 1, it is characterized in that: the metal level of said pad (1) than the implementation of the metal bed thickness of circuit board line (2) is: the metal level outside the said pad (1) forms said pad (1) and circuit board line (2) with step etching behind the reduction process attenuate.
3. the pad structure of circuit board according to claim 1 is characterized in that: said circuit board is a kind of in single sided board, double sided board and the multi-layer sheet.
4. manufacture method of board pads according to claim 1 is characterized in that: carry out as follows:
A. by the pad locations protective mulch of design at the outer layer metal layer of circuit board;
B. through little etching technique the outer layer metal layer attenuate of position not covered by the protective layer is set thickness;
C. wash protective layer, carry out subsequent conditioning circuit printed line road and pad etching process, produce circuit board line and pad by design;
D. hinder welder's skill by design, make solder mask covering board circuit,
The setting thickness of said step b ectomesoderm metal level attenuate greater than steps d after the thickness of solder mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100355741A CN101917818B (en) | 2009-09-25 | 2009-09-25 | Pad structure of circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100355741A CN101917818B (en) | 2009-09-25 | 2009-09-25 | Pad structure of circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101917818A CN101917818A (en) | 2010-12-15 |
| CN101917818B true CN101917818B (en) | 2012-08-22 |
Family
ID=43325170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100355741A Expired - Fee Related CN101917818B (en) | 2009-09-25 | 2009-09-25 | Pad structure of circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101917818B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545222B (en) * | 2013-10-24 | 2017-04-26 | 中国电子科技集团公司第四十一研究所 | High-reliability soft-medium circuit processing manufacturing method |
| CN103702509B (en) * | 2013-12-25 | 2017-09-29 | 深圳市迅捷兴科技股份有限公司 | Step-like wiring board and preparation method thereof |
| CN105513978B (en) * | 2014-09-25 | 2018-03-20 | 欣兴电子股份有限公司 | The preparation method of conductive wires |
| CN104451847A (en) * | 2014-11-27 | 2015-03-25 | 中国船舶重工集团公司第七二四研究所 | Gold plating layer thickness control technology combining gold-tin mutual solution and selective electroplating |
| JP6067135B1 (en) * | 2015-03-31 | 2017-01-25 | 株式会社棚澤八光社 | Printed circuit board and manufacturing method thereof |
| JP2017076698A (en) * | 2015-10-15 | 2017-04-20 | 日本特殊陶業株式会社 | Wiring board and manufacturing method of the same |
| CN107835564A (en) * | 2017-10-19 | 2018-03-23 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
| CN108289388A (en) * | 2017-12-07 | 2018-07-17 | 江门崇达电路技术有限公司 | The undesirable PCB production methods of tin in a kind of prevention |
| CN113314498B (en) * | 2021-05-25 | 2023-05-05 | 业成科技（成都）有限公司 | Circuit board, lamp panel, backlight module and display device |
| WO2022246708A1 (en) | 2021-05-26 | 2022-12-01 | 深南电路股份有限公司 | Circuit board preparation method and circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101171895A (en) * | 2005-06-30 | 2008-04-30 | 揖斐电株式会社 | Printed wiring board |
| CN201509367U (en) * | 2009-09-25 | 2010-06-16 | 昆山市华升电路板有限公司 | Structure of bonding pad for circuit board |
-
2009
- 2009-09-25 CN CN2009100355741A patent/CN101917818B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101171895A (en) * | 2005-06-30 | 2008-04-30 | 揖斐电株式会社 | Printed wiring board |
| CN201509367U (en) * | 2009-09-25 | 2010-06-16 | 昆山市华升电路板有限公司 | Structure of bonding pad for circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101917818A (en) | 2010-12-15 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160630 Address after: 215341 Suzhou city in Jiangsu province Kunshan City Qiandeng Fumin Industrial Development Zone Patentee after: Kunshan Huasheng circuit board research and development base Co Ltd Address before: Henderson Fumin Industrial Zone, Qiandeng Town Road Kunshan City, Jiangsu province 215341 No. 198 Patentee before: Kunshan Huasheng Printed Circuit Board Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120822 Termination date: 20170925 |