CN101888057B - 激光二极管封装外壳的制备方法 - Google Patents
激光二极管封装外壳的制备方法 Download PDFInfo
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- CN101888057B CN101888057B CN200910111779A CN200910111779A CN101888057B CN 101888057 B CN101888057 B CN 101888057B CN 200910111779 A CN200910111779 A CN 200910111779A CN 200910111779 A CN200910111779 A CN 200910111779A CN 101888057 B CN101888057 B CN 101888057B
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CN200910111779A CN101888057B (zh) | 2009-05-11 | 2009-05-11 | 激光二极管封装外壳的制备方法 |
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CN200910111779A CN101888057B (zh) | 2009-05-11 | 2009-05-11 | 激光二极管封装外壳的制备方法 |
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CN101888057A CN101888057A (zh) | 2010-11-17 |
CN101888057B true CN101888057B (zh) | 2012-10-03 |
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Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103353089B (zh) * | 2013-02-25 | 2015-10-07 | 黄�俊 | 投光灯的灯罩及其制造方法 |
CN103928302B (zh) * | 2014-04-28 | 2016-08-24 | 四川金湾电子有限责任公司 | 一种半导体引线框架制造工艺 |
CN103986058A (zh) * | 2014-05-20 | 2014-08-13 | 深圳市易飞扬通信技术有限公司 | 垂直腔面发射激光器的罐形封装结构及方法 |
CN104555906B (zh) * | 2015-01-26 | 2017-01-04 | 中航(重庆)微电子有限公司 | 芯片封装方法 |
CN105140133A (zh) * | 2015-06-30 | 2015-12-09 | 苏州合欣美电子科技有限公司 | 一种防辐射的金属封装外壳的制备方法 |
CN105914578B (zh) * | 2016-06-28 | 2018-07-20 | 杭州华锦电子有限公司 | 激光多极管封装底座的制备方法 |
CN105914577B (zh) * | 2016-06-28 | 2019-05-03 | 杭州华锦电子有限公司 | 激光多极管封装底座的刻蚀方法 |
CN106652074A (zh) * | 2016-12-20 | 2017-05-10 | 河北敏达电子科技有限公司 | 一种打卡机 |
CN108002716B (zh) * | 2017-10-26 | 2020-07-28 | 潮州三环(集团)股份有限公司 | 透镜管帽制作方法 |
CN110932090B (zh) * | 2019-12-13 | 2020-11-20 | 杭州华锦电子有限公司 | 一种激光二极管及其制备方法 |
CN111584371B (zh) * | 2020-05-25 | 2022-04-01 | 苏州融睿电子科技有限公司 | 一种封装壳体的制作方法、封装壳体 |
CN114156729A (zh) * | 2021-11-24 | 2022-03-08 | 深圳市宏钢机械设备有限公司 | 用于高功率半导体激光器的封装管壳及其制备工艺 |
CN114059120A (zh) * | 2021-12-14 | 2022-02-18 | 江苏固家智能科技有限公司 | 激光泵源芯片底座以及管壳电镀镀银新工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1674373A (zh) * | 2005-03-31 | 2005-09-28 | 武汉电信器件有限公司 | 用于小体积高速激光器件封装的底座 |
CN1870310A (zh) * | 2006-06-08 | 2006-11-29 | 天津大学 | 以纳米银焊膏低温烧结封装连接大功率led的方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1674373A (zh) * | 2005-03-31 | 2005-09-28 | 武汉电信器件有限公司 | 用于小体积高速激光器件封装的底座 |
CN1870310A (zh) * | 2006-06-08 | 2006-11-29 | 天津大学 | 以纳米银焊膏低温烧结封装连接大功率led的方法 |
Non-Patent Citations (1)
Title |
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JP特开2002-9189A 2002.01.11 |
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