CN101884098B - 电子部件的安装装置和安装方法 - Google Patents
电子部件的安装装置和安装方法 Download PDFInfo
- Publication number
- CN101884098B CN101884098B CN2008801185239A CN200880118523A CN101884098B CN 101884098 B CN101884098 B CN 101884098B CN 2008801185239 A CN2008801185239 A CN 2008801185239A CN 200880118523 A CN200880118523 A CN 200880118523A CN 101884098 B CN101884098 B CN 101884098B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- adhesive tape
- substrate
- positioning
- tcp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
Landscapes
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-322469 | 2007-12-13 | ||
| JP2007322469A JP5435861B2 (ja) | 2007-12-13 | 2007-12-13 | 電子部品の実装装置及び実装方法 |
| PCT/JP2008/070816 WO2009075164A1 (ja) | 2007-12-13 | 2008-11-14 | 電子部品の実装装置及び実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101884098A CN101884098A (zh) | 2010-11-10 |
| CN101884098B true CN101884098B (zh) | 2012-08-29 |
Family
ID=40755407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801185239A Active CN101884098B (zh) | 2007-12-13 | 2008-11-14 | 电子部件的安装装置和安装方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5435861B2 (https=) |
| KR (1) | KR101148322B1 (https=) |
| CN (1) | CN101884098B (https=) |
| TW (1) | TWI460795B (https=) |
| WO (1) | WO2009075164A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5572575B2 (ja) * | 2010-05-12 | 2014-08-13 | 東京エレクトロン株式会社 | 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体 |
| CN102879395A (zh) * | 2011-07-11 | 2013-01-16 | 昆山华扬电子有限公司 | Pcb板件辅助对位检查装置 |
| US10952360B2 (en) * | 2015-09-30 | 2021-03-16 | Yamaha Hatsudoki Kabushiki Kaisha | Component mounter and component holder imaging method |
| JP6767333B2 (ja) * | 2017-09-28 | 2020-10-14 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| KR102748338B1 (ko) | 2020-03-27 | 2025-01-02 | 삼성디스플레이 주식회사 | 본딩 장치 및 그것을 이용한 표시 장치의 제조 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229453A (ja) * | 2002-02-05 | 2003-08-15 | Shibaura Mechatronics Corp | テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置 |
| JP2004021051A (ja) * | 2002-06-19 | 2004-01-22 | Takatori Corp | フレキシブル基板を液晶パネルに圧着する方法及び装置 |
| CN1842908A (zh) * | 2004-03-05 | 2006-10-04 | 东和株式会社 | 小片接合用粘接带的贴附方法和电子元件的安装方法 |
| JP2007027560A (ja) * | 2005-07-20 | 2007-02-01 | Shibaura Mechatronics Corp | 粘着性テープの貼着装置及び貼着方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006058411A (ja) * | 2004-08-18 | 2006-03-02 | Takatori Corp | 液晶パネルへの偏光板貼り付け方法及び装置 |
| KR100591074B1 (ko) * | 2004-12-13 | 2006-06-19 | (주) 선양디엔티 | 칩 온 필름용 이방성 도전물 부착 시스템 |
| JP4591140B2 (ja) * | 2005-03-16 | 2010-12-01 | パナソニック株式会社 | 表示パネルの組立装置および組立方法 |
-
2007
- 2007-12-13 JP JP2007322469A patent/JP5435861B2/ja active Active
-
2008
- 2008-11-14 CN CN2008801185239A patent/CN101884098B/zh active Active
- 2008-11-14 WO PCT/JP2008/070816 patent/WO2009075164A1/ja not_active Ceased
- 2008-11-14 KR KR1020107015375A patent/KR101148322B1/ko active Active
- 2008-11-20 TW TW097144848A patent/TWI460795B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229453A (ja) * | 2002-02-05 | 2003-08-15 | Shibaura Mechatronics Corp | テープ部材の貼着状態検査装置およびそれを用いたテープ部材貼着装置 |
| JP2004021051A (ja) * | 2002-06-19 | 2004-01-22 | Takatori Corp | フレキシブル基板を液晶パネルに圧着する方法及び装置 |
| CN1842908A (zh) * | 2004-03-05 | 2006-10-04 | 东和株式会社 | 小片接合用粘接带的贴附方法和电子元件的安装方法 |
| JP2007027560A (ja) * | 2005-07-20 | 2007-02-01 | Shibaura Mechatronics Corp | 粘着性テープの貼着装置及び貼着方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5435861B2 (ja) | 2014-03-05 |
| TWI460795B (zh) | 2014-11-11 |
| TW200931542A (en) | 2009-07-16 |
| KR20100093592A (ko) | 2010-08-25 |
| JP2009147089A (ja) | 2009-07-02 |
| CN101884098A (zh) | 2010-11-10 |
| WO2009075164A1 (ja) | 2009-06-18 |
| KR101148322B1 (ko) | 2012-05-25 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |