CN101882615A - Nano particle light distribution LED - Google Patents

Nano particle light distribution LED Download PDF

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Publication number
CN101882615A
CN101882615A CN 201010224232 CN201010224232A CN101882615A CN 101882615 A CN101882615 A CN 101882615A CN 201010224232 CN201010224232 CN 201010224232 CN 201010224232 A CN201010224232 A CN 201010224232A CN 101882615 A CN101882615 A CN 101882615A
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CN
China
Prior art keywords
led
nano particle
powder layer
light distribution
transmission substance
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Pending
Application number
CN 201010224232
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Chinese (zh)
Inventor
张方辉
刘丁菡
蒋谦
阎洪刚
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Shaanxi University of Science and Technology
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Shaanxi University of Science and Technology
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Publication date
Application filed by Shaanxi University of Science and Technology filed Critical Shaanxi University of Science and Technology
Priority to CN 201010224232 priority Critical patent/CN101882615A/en
Publication of CN101882615A publication Critical patent/CN101882615A/en
Pending legal-status Critical Current

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Abstract

The invention belongs to the technical field of LED light distribution, and discloses a nano particle light distribution LED. The nano particle light distribution LED comprises a substrate and a plurality of LED chips fixed on the substrate; a fluorescent powder layer is arranged outside the LED chips; an encapsulation layer is arranged outside the fluorescent powder layer; the encapsulation layer is formed by mixing 0.2 to 0.3 part of nano particles of a light transmission substance and 1 part of filling glue in part by mass; the height of conductive silver glue does not exceed 1/3 of the height of the LED chips; the fluorescent powder layer is formed by mixing fluorescent powder and silica gel in a mass ratio of 1: 30; the fluorescent powder layer is a yellow fluorescent powder layer; and the LED chips emit blue light. Rays are subjected to multiple scattering and refraction in the encapsulation layer of the LED by adding the nano particles of the light transmission substance, so the diffusion degree of emergent rays is improved, and the dazzling problem of the LED is solved; and meanwhile, the light distribution design is performed based on the conventional encapsulation structure and the light transmission substance has wide source, so the production cost is low.

Description

A kind of nano particle light distribution LED
Technical field
The invention belongs to LED luminous intensity distribution technical field, be specifically related to a kind of nano particle light distribution LED.
Background technology
LED is a competitive novel solid light source of 21st century, it as the 4th generation electric light source, possesses the title of " green illumination light source ", it is little to have volume, the electro-optical efficiency height, photochromic pure, energy consumption is low, life-span is long, response speed is fast, reliability and durability, energy-conserving and environment-protective, pollution-free, control advantages such as flexible, will replace traditional incandescent lamp, tungsten halogen lamp and fluorescent lamp and become the light source of new generation of 21 century, it is in the oil field, petrochemical industry, railway, the mine, special industries such as army, decor, landscape light in city, display screen, various indicated number backlights, stadiums are with a wide range of applications in the Special Work light fixture.
Yet, being subjected to the influence of factors such as the characteristic of led chip itself and encapsulating structure, the formed illuminating ray of LED is often inhomogeneous, and direction of light is strong, forms dazzling hot spot easily.
Summary of the invention
The technical problem to be solved in the present invention is: at the shortcoming and deficiency that prior art exists, the invention discloses a kind of bright dipping dispersion, uniform nano particle light distribution LED.
At above-mentioned technical problem, the present invention proposes following technical scheme.
A kind of nano particle light distribution LED, comprise substrate and be fixed on several led chips on the substrate by conductive silver glue, led chip is outside equipped with phosphor powder layer, phosphor powder layer is outside equipped with encapsulated layer, and described encapsulated layer mixes by mass fraction nano particle and 1 part of filling glue by 0.2-0.3 part transmission substance.
The height of described conductive silver glue is no more than 1/3 of led chip height.
Described phosphor powder layer is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer is the yellow fluorescence bisque, led chip emission blue light.
Described transmission substance is meant SiO 2, BaO, B 2O 3, ZnO, Na 2O or K 2O.
Described filling glue is meant epoxy resin or silica gel.
Beneficial effect of the present invention is embodied in: LED of the present invention makes in the encapsulated layer of light at LED by the nano particle that adds transmission substance in filling glue and carries out repeatedly scattering and refraction, improved the degree of divergence of emergent ray, make bright dipping dispersiveness and the uniformity of LED all obtain remarkable improvement, solved LED owing to light is too concentrated the thorn eye problem that produces; Nano particle light distribution LED of the present invention serves as that basic emergent ray to LED carries out the luminous intensity distribution design with existing encapsulating structure, transmission substance wide material sources, cheap, thereby production cost is lower.
Description of drawings
Fig. 1 is the structural representation of LED of the present invention.
Fig. 2 is a LED luminous intensity angle distribution map: the filling glue encapsulated LED sample that does not contain the transmission substance particle is adopted in the curve A representative, and the filling glue encapsulated LED sample that contains the transmission substance particle is adopted in the curve B representative.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Embodiment 1
A kind of nano particle light distribution LED, comprise substrate 1 and be fixed on several led chips 2 on the substrate 1 by conductive silver glue 3, led chip 2 is outside equipped with phosphor powder layer 4, phosphor powder layer 4 is outside equipped with encapsulated layer 5, and described encapsulated layer 5 mixes by mass fraction nano particle and 1 part of filling glue by 0.2 part of transmission substance.
The height of described conductive silver glue 3 is no more than 1/3 of led chip 2 height.
Described phosphor powder layer 4 is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer 4 is the yellow fluorescence bisque, led chip 2 emission blue lights, because led chip 2 emission blue lights, blue-light excited yellow fluorescent powder forms the white light of outgoing.
Described transmission substance is meant SiO 2
Described filling glue is meant epoxy resin.
Embodiment 2
A kind of nano particle light distribution LED, comprise substrate 1 and be fixed on several led chips 2 on the substrate 1 by conductive silver glue 3, led chip 2 is outside equipped with phosphor powder layer 4, phosphor powder layer 4 is outside equipped with encapsulated layer 5, and described encapsulated layer 5 mixes by mass fraction nano particle and 1 part of filling glue by 0.3 part of transmission substance.
The height of described conductive silver glue 3 is no more than 1/3 of led chip 2 height.
Described phosphor powder layer 4 is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer 4 is the yellow fluorescence bisque, led chip 2 emission blue lights, because led chip 2 emission blue lights, blue-light excited yellow fluorescent powder forms the white light of outgoing.
Described transmission substance is meant BaO.
Described filling glue is meant epoxy resin.
Embodiment 3
A kind of nano particle light distribution LED, comprise substrate 1 and be fixed on several led chips 2 on the substrate 1 by conductive silver glue 3, led chip 2 is outside equipped with phosphor powder layer 4, phosphor powder layer 4 is outside equipped with encapsulated layer 5, and described encapsulated layer 5 mixes by mass fraction nano particle and 1 part of filling glue by 0.25 part of transmission substance.
The height of described conductive silver glue 3 is no more than 1/3 of led chip 2 height.
Described phosphor powder layer 4 is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer 4 is the yellow fluorescence bisque, led chip 2 emission blue lights, because led chip 2 emission blue lights, blue-light excited yellow fluorescent powder forms the white light of outgoing.
Described transmission substance is meant B 2O 3
Described filling glue is meant epoxy resin.
Embodiment 4
A kind of nano particle light distribution LED, comprise substrate 1 and be fixed on several led chips 2 on the substrate 1 by conductive silver glue 3, led chip 2 is outside equipped with phosphor powder layer 4, phosphor powder layer 4 is outside equipped with encapsulated layer 5, and described encapsulated layer 5 mixes by mass fraction nano particle and 1 part of filling glue by 0.22 part of transmission substance.
The height of described conductive silver glue 3 is no more than 1/3 of led chip 2 height.
Described phosphor powder layer 4 is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer 4 is the yellow fluorescence bisque, led chip 2 emission blue lights, because led chip 2 emission blue lights, blue-light excited yellow fluorescent powder forms the white light of outgoing.
Described transmission substance is meant ZnO.
Described filling glue is meant silica gel.
Embodiment 5
A kind of nano particle light distribution LED, comprise substrate 1 and be fixed on several led chips 2 on the substrate 1 by conductive silver glue 3, led chip 2 is outside equipped with phosphor powder layer 4, phosphor powder layer 4 is outside equipped with encapsulated layer 5, and described encapsulated layer 5 mixes by mass fraction nano particle and 1 part of filling glue by 0.26 part of transmission substance.
The height of described conductive silver glue 3 is no more than 1/3 of led chip 2 height.
Described phosphor powder layer 4 is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer 4 is the yellow fluorescence bisque, led chip 2 emission blue lights, because led chip 2 emission blue lights, blue-light excited yellow fluorescent powder forms the white light of outgoing.
Described transmission substance is meant Na 2O.
Described filling glue is meant silica gel.
Embodiment 6
A kind of nano particle light distribution LED, comprise substrate 1 and be fixed on several led chips 2 on the substrate 1 by conductive silver glue 3, led chip 2 is outside equipped with phosphor powder layer 4, phosphor powder layer 4 is outside equipped with encapsulated layer 5, and described encapsulated layer 5 mixes by mass fraction nano particle and 1 part of filling glue by 0.28 part of transmission substance.
The height of described conductive silver glue 3 is no more than 1/3 of led chip 2 height.
Described phosphor powder layer 4 is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer 4 is the yellow fluorescence bisque, led chip 2 emission blue lights, because led chip 2 emission blue lights, blue-light excited yellow fluorescent powder forms the white light of outgoing.
Described transmission substance is meant K 2O.
Described filling glue is meant silica gel.
Referring to Fig. 1, Fig. 2, because the angle of divergence of existing LED is less, light distribution is very big in the lateral angles decay, for this characteristic is made improvement, the present invention has obtained having the LED encapsulating material of luminous intensity distribution effect by the particle that evenly disperses transmission substance in filling glue, after using this encapsulating material that LED is encapsulated, the particle of formed encapsulated layer iuuminting material is dispersed the light intensity of normal orientation by refraction, when reducing the normal orientation light intensity, weak excessively side direction light intensity is remedied, make the light intensity of LED slow down with the trend that angle changes.
By curve A among Fig. 2, B as can be seen, when 0 spends, the LED sample luminous intensity that does not contain the transmission substance particle in the encapsulated layer is considerably beyond containing the LED sample of transmission substance particle, but by 0 the degree deviate to ± when 40-50 spends, the light intensity value of two kinds of samples is almost equal, surpassing this angular range continuation when be partial to both sides, for the LED sample that contains the transmission substance particle in the encapsulated layer, its light intensity has surpassed the LED sample that does not add the transmission substance particle, particularly reach ± 90 when spending, its light intensity has not contained the LED sample of transmission substance particle in the encapsulated layer.From the curve global analysis, the LED sample light intensity angle distribution curve that contains the transmission substance particle in the encapsulated layer is tending towards circular-arc, and the decay of both sides comparatively relaxes, and it is too strong not contain the decay of LED sample both sides of transmission substance particle.Can draw by analysis Fig. 2, the filling glue that employing contains the transmission substance particle encapsulates the LED that obtains, its luminous intensity angle Uniformity of Distribution is compared the LED that does not contain the transmission substance particle and has been obtained tangible improvement, the adding of filling transmission substance particle in the glue makes the light intensity angle of divergence of LED be greatly improved, and light-emitting uniformity, the dispersiveness of LED are significantly improved.
The chemical property of transmission substance must be stablized, can not react with filling glue or be dissolved in and fill in the glue, simultaneously should good, the good dispersion of transparency, and has higher refractive index, more little then being easy to more of the particle of transmission substance is uniformly dispersed, the particle of transmission substance adds very little, particle can not play the effect of dispersed light, can not carry out repeatedly scattering when light is propagated simultaneously in filling glue, the light of outgoing still can be more concentrated, then be difficult for too much stirring if added, cause producing total reflection and delustring takes place.

Claims (5)

1. nano particle light distribution LED, comprise substrate (1) and be fixed on several led chips (2) on the substrate (1) by conductive silver glue (3), led chip (2) is outside equipped with phosphor powder layer (4), phosphor powder layer (4) is outside equipped with encapsulated layer (5), it is characterized in that: described encapsulated layer (5) mixes by mass fraction nano particle and 1 part of filling glue by 0.2-0.3 part transmission substance.
2. according to the described a kind of nano particle light distribution LED of claim 1, it is characterized in that: the height of described conductive silver glue (3) is no more than 1/3 of led chip (2) height.
3. according to the described a kind of nano particle light distribution LED of claim 1, it is characterized in that: described phosphor powder layer (4) is mixed by fluorescent material and the silica gel mass ratio according to 1: 30, and phosphor powder layer (4) is the yellow fluorescence bisque, led chip (2) emission blue light.
4. according to the described a kind of nano particle light distribution LED of claim 1, it is characterized in that: described transmission substance is meant SiO 2, BaO, B 2O 3, ZnO, Na 2O or K 2O.
5. according to the described a kind of nano particle light distribution LED of claim 1, it is characterized in that: described filling glue is meant epoxy resin or silica gel.
CN 201010224232 2010-07-12 2010-07-12 Nano particle light distribution LED Pending CN101882615A (en)

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Application Number Priority Date Filing Date Title
CN 201010224232 CN101882615A (en) 2010-07-12 2010-07-12 Nano particle light distribution LED

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Application Number Priority Date Filing Date Title
CN 201010224232 CN101882615A (en) 2010-07-12 2010-07-12 Nano particle light distribution LED

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102263193A (en) * 2011-07-19 2011-11-30 四川九洲光电科技股份有限公司 Luminous chip capable of increasing brightness of light-emitting diode and packaging method for luminous chip
CN103579460A (en) * 2013-11-11 2014-02-12 中山市晶得光电有限公司 High-brightness white light LED and manufacturing method thereof
CN107681033A (en) * 2017-10-26 2018-02-09 业成科技(成都)有限公司 Miniature LED component and preparation method, display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1372330A (en) * 2001-02-26 2002-10-02 华上光电股份有限公司 LED using scattered light media to make light conversion
CN1549355A (en) * 2003-05-08 2004-11-24 连营科技股份有限公司 Luminous diode and producing method thereof
US20070096140A1 (en) * 2005-10-28 2007-05-03 Iled Photoelectronics, Inc. Sealing structure for a white light LED
CN101694857A (en) * 2009-10-16 2010-04-14 中外合资江苏稳润光电有限公司 Manufacture method of low-attenuation white light LED

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1372330A (en) * 2001-02-26 2002-10-02 华上光电股份有限公司 LED using scattered light media to make light conversion
CN1549355A (en) * 2003-05-08 2004-11-24 连营科技股份有限公司 Luminous diode and producing method thereof
US20070096140A1 (en) * 2005-10-28 2007-05-03 Iled Photoelectronics, Inc. Sealing structure for a white light LED
CN101694857A (en) * 2009-10-16 2010-04-14 中外合资江苏稳润光电有限公司 Manufacture method of low-attenuation white light LED

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102263193A (en) * 2011-07-19 2011-11-30 四川九洲光电科技股份有限公司 Luminous chip capable of increasing brightness of light-emitting diode and packaging method for luminous chip
CN102263193B (en) * 2011-07-19 2013-01-02 四川九洲光电科技股份有限公司 Luminous chip capable of increasing brightness of light-emitting diode and packaging method for luminous chip
CN103579460A (en) * 2013-11-11 2014-02-12 中山市晶得光电有限公司 High-brightness white light LED and manufacturing method thereof
CN103579460B (en) * 2013-11-11 2016-01-06 中山市晶得光电有限公司 A kind of high-brightness white-light LED and manufacture method thereof
CN107681033A (en) * 2017-10-26 2018-02-09 业成科技(成都)有限公司 Miniature LED component and preparation method, display device

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Application publication date: 20101110