CN101868137B - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
CN101868137B
CN101868137B CN2010101642695A CN201010164269A CN101868137B CN 101868137 B CN101868137 B CN 101868137B CN 2010101642695 A CN2010101642695 A CN 2010101642695A CN 201010164269 A CN201010164269 A CN 201010164269A CN 101868137 B CN101868137 B CN 101868137B
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CN
China
Prior art keywords
air
aforementioned
expanding element
flow
framework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101642695A
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English (en)
Chinese (zh)
Other versions
CN101868137A (zh
Inventor
泽井淳
千叶真嗣
宫原宗敏
野口丰胜
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Sony Corp
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Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN101868137A publication Critical patent/CN101868137A/zh
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Publication of CN101868137B publication Critical patent/CN101868137B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2010101642695A 2009-04-17 2010-04-09 电子设备 Expired - Fee Related CN101868137B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-101387 2009-04-17
JP2009101387A JP2010251620A (ja) 2009-04-17 2009-04-17 電子機器

Publications (2)

Publication Number Publication Date
CN101868137A CN101868137A (zh) 2010-10-20
CN101868137B true CN101868137B (zh) 2012-07-11

Family

ID=42959627

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101642695A Expired - Fee Related CN101868137B (zh) 2009-04-17 2010-04-09 电子设备

Country Status (4)

Country Link
US (1) US8199501B2 (enExample)
JP (1) JP2010251620A (enExample)
CN (1) CN101868137B (enExample)
TW (1) TWI394525B (enExample)

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CN102709974B (zh) * 2012-06-01 2015-01-07 张家港市泓溢电源科技有限公司 一种新型的蓄电池化成电源电柜冷却系统
US9538687B2 (en) * 2013-06-12 2017-01-03 Menara Network, Inc. High-density rack unit systems and methods
DE102015101304B3 (de) * 2015-01-29 2016-03-17 Fujitsu Technology Solutions Intellectual Property Gmbh Rackserver für ein Serverrack
TWI544319B (zh) 2015-04-10 2016-08-01 緯創資通股份有限公司 導流機構及具有導流機構的散熱模組與電子裝置
US9696769B1 (en) * 2015-12-31 2017-07-04 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Compute chassis having a lid that secures and removes air baffles
JP2018074102A (ja) * 2016-11-04 2018-05-10 富士通株式会社 電子装置
WO2020034089A1 (en) * 2018-08-14 2020-02-20 Intel Corporation Mechanism to direct coolant flow between circuit components
US10595444B1 (en) * 2018-09-07 2020-03-17 Quanta Computer Inc. Rotatable board configuration to improve cooling
US10762025B1 (en) * 2019-03-08 2020-09-01 Quanta Computer Inc. Swappable add-on card module
US10653040B1 (en) * 2019-05-21 2020-05-12 Quanta Computer Inc. Apparatus for changing airflow in a server
US12250027B2 (en) 2020-06-01 2025-03-11 Nubis Communications, Inc. Polarization-diversity optical power supply
US11621795B2 (en) 2020-06-01 2023-04-04 Nubis Communications, Inc. Polarization-diversity optical power supply
JP2022049327A (ja) 2020-09-16 2022-03-29 キオクシア株式会社 半導体記憶装置
WO2022061160A1 (en) 2020-09-18 2022-03-24 Nubis Communications Inc. Data processing systems including optical communication modules
US11988874B2 (en) 2020-10-07 2024-05-21 Nubis Communications, Inc. Data processing systems including optical communication modules
WO2022109349A1 (en) * 2020-11-20 2022-05-27 Nubis Communications, Inc. Thermal design for rack mount systems including optical communication modules
WO2022169970A1 (en) 2021-02-03 2022-08-11 Nubis Communications, Inc. Communication systems having optical power supplies
US12066653B2 (en) * 2021-04-22 2024-08-20 Nubis Communications, Inc. Communication systems having optical power supplies
US12461322B2 (en) 2021-06-17 2025-11-04 Nubis Communications, Inc. Communication systems having pluggable modules
US12405433B2 (en) 2021-06-17 2025-09-02 Nubis Communications, Inc. Communication systems having pluggable modules
EP4152065A1 (en) 2021-09-16 2023-03-22 Nubis Communications, Inc. Communication systems having co-packaged optical modules
US12250024B2 (en) 2021-09-16 2025-03-11 Nubis Communications, Inc. Data processing systems including optical communication modules
EP4519728A1 (en) 2022-05-02 2025-03-12 Nubis Communications, Inc. Communication systems having pluggable optical modules
US12317451B2 (en) * 2022-09-06 2025-05-27 ZT Group Int'l, Inc. Boiler plates for computing systems

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CN1423918A (zh) * 2000-04-14 2003-06-11 埃默森能源系统有限公司 用于冷却发热单元的装置
CN1788834A (zh) * 2004-12-14 2006-06-21 天津天士力制药股份有限公司 流化喷雾干燥制粒机
CN1842870A (zh) * 2003-09-08 2006-10-04 克西拉特克斯技术有限公司 温度控制装置、盘驱动单元测试设备和测试或操作多个盘驱动单元的方法
CN101174172A (zh) * 2006-10-30 2008-05-07 联想（新加坡）私人有限公司 电子设备的机箱温度抑制构造及便携式计算机

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JP3253534B2 (ja) * 1996-09-11 2002-02-04 富士通株式会社 電子装置
KR100242978B1 (ko) * 1997-05-15 2000-02-01 윤종용 부품고정장치 및 그 부품고정장치가 구비된 컴퓨터
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US6466448B1 (en) * 2001-06-11 2002-10-15 Network Appliance, Inc. Riser board retaining and air ducting structure for printed circuit boards
US7262064B2 (en) * 2001-10-12 2007-08-28 Sony Corporation Magnetoresistive effect element, magnetic memory element magnetic memory device and manufacturing methods thereof
US6744632B2 (en) * 2002-09-20 2004-06-01 Hewlett-Packard Development Company, L.P. Composite construction baffle for modular electronic systems
US6934161B2 (en) * 2002-09-30 2005-08-23 Sun Microsystems, Inc. PCI card retaining device with integrated airflow guide
US6771499B2 (en) * 2002-11-27 2004-08-03 International Business Machines Corporation Server blade chassis with airflow bypass damper engaging upon blade removal
TWI236336B (en) * 2003-10-21 2005-07-11 Quanta Comp Inc Electronic product having airflow-guiding device
US6970363B2 (en) * 2003-11-26 2005-11-29 Hewlett-Packard Development Company, L.P. Expansion card support mechanism
CN2831229Y (zh) * 2005-08-18 2006-10-25 鸿富锦精密工业（深圳）有限公司 扩充卡辅助固定装置
US7344439B2 (en) * 2006-03-06 2008-03-18 International Business Machines Corporation System, method, and apparatus for distributing air in a blade server
US7474528B1 (en) * 2006-04-10 2009-01-06 Sun Microsystems, Inc. Configurable flow control air baffle
CN201097302Y (zh) * 2007-08-03 2008-08-06 鸿富锦精密工业（深圳）有限公司 机箱导风装置
US7876559B2 (en) * 2008-11-17 2011-01-25 Dell Products L.P. Universal blank for air flow management
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director
TWM356971U (en) * 2008-12-24 2009-05-11 Quanta Comp Inc Blocking device adapted in a blade server and blade server

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
CN1423918A (zh) * 2000-04-14 2003-06-11 埃默森能源系统有限公司 用于冷却发热单元的装置
CN1396507A (zh) * 2001-07-09 2003-02-12 株式会社东芝 包括多个散热片和用于送风的风扇的冷却装置以及其上安装有该冷却装置的电子设备
CN1842870A (zh) * 2003-09-08 2006-10-04 克西拉特克斯技术有限公司 温度控制装置、盘驱动单元测试设备和测试或操作多个盘驱动单元的方法
CN1788834A (zh) * 2004-12-14 2006-06-21 天津天士力制药股份有限公司 流化喷雾干燥制粒机
CN101174172A (zh) * 2006-10-30 2008-05-07 联想（新加坡）私人有限公司 电子设备的机箱温度抑制构造及便携式计算机

Non-Patent Citations (1)

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JP特开平10-62047A 1998.03.06

Also Published As

Publication number Publication date
US8199501B2 (en) 2012-06-12
CN101868137A (zh) 2010-10-20
TW201108925A (en) 2011-03-01
JP2010251620A (ja) 2010-11-04
US20100265658A1 (en) 2010-10-21
TWI394525B (zh) 2013-04-21

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