CN101835367B - Air-cooling and liquid-cooling combined type heat radiating system - Google Patents
Air-cooling and liquid-cooling combined type heat radiating system Download PDFInfo
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- CN101835367B CN101835367B CN2010101686212A CN201010168621A CN101835367B CN 101835367 B CN101835367 B CN 101835367B CN 2010101686212 A CN2010101686212 A CN 2010101686212A CN 201010168621 A CN201010168621 A CN 201010168621A CN 101835367 B CN101835367 B CN 101835367B
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- peristaltic pump
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Abstract
The invention belongs to a heat radiating system for electronic components and devices, electronic equipment, and the like, in particular to an air-cooling and liquid-cooling combined type heat radiating system. The air-cooling and liquid-cooling combined type heat radiating system comprises a heat radiating mechanism, a temperature sensor and a controller, wherein the heat radiating mechanism is provided with an integral type fin-flow channel cold plate heat radiating assembly, a liquid cooler, a peristaltic pump, a liquid storing tank, a circulating pipe and a fan. Because the air cooling and the liquid cooling are combined into a whole, the sensor transmits the temperature information to the controller in real time, and the controller automatically starts the fan or/and the peristaltic pump and automatically adjusts the rotating speed of the fan and the flow of the peristaltic pump according to the heating amount and the heat radiating requirement on the electronic device and the electronic equipment during working, the heat radiating system has large temperature adjusting range, wide application range, satisfaction of the heat radiating requirements on the large-power electronic device and the electronic device and equipment working in complicated temperature and the working environment with larger temperature difference change, guarantee of efficient, stable and safe working in lower temperature range, prolongation of service life, and the like.
Description
Technical field
The invention belongs to a kind of air-cooled combined type heat radiating system that combines with liquid cooling that adopts; This cooling system in the temperature environment of complicacy is used, can be according to the variation of temperature environment and equipment work situation, both can adopt air-cooled separately or liquid cooling, also can adopt air-cooled simultaneously and liquid cooling is dispelled the heat; This system can be widely used as the electronic equipment under the complicated temperature environment and high-power (comprising that variable power is big) electronics is first, the cooling system of device, uses like the cooling system of waiting until as the electronic chip of electronic equipment in the Aeronautics and Astronautics device and high integration.
Background technology
Along with the development of electronic technology and Aero-Space cause, particularly along with the improving constantly of integrated circuit integrated level, all kinds of electronic component speeds of service and power output constantly promote, and electronic component has produced more heat when work simultaneously.The rising of temperature is to great-power electronic unit, device, and the reliability of work such as electronic equipment causes great threat, thereby needs it is carried out effective radiating treatment.As everyone knows, the residing space environment of Aeronautics and Astronautics equipment is very complicated, and difference such as temperature, humidity, illumination are very big, especially outer space environment down during work, shining upon and nothing when shining upon, ambient temperature differs about 300 ℃.With the environment on the moon is example: daytime temperature is up to 127 ℃ on the moon, and nocturnal temperature is low again to reach-183 ℃, and the weather of extremely hot severe cold like this and temperature difference drastic change makes employed electronic chip on the lunar orbiter be faced with the serious threat of inefficacy.Electronic chip Yin Wendu and the main cause that lost efficacy has following 2 points: the one, cause softening or loosening causing of circuit node to be lost efficacy owing to temperature is too high; The 2nd, owing to the chip difference variation causes chip heat to strengthen when big, thereby make the chip distortion and cause circuit malfunction.
At present, the radiator that is used for electronic equipment mainly has traditional gilled radiator and can leave the more fluid channel liquid cooling radiator of high heat.Traditional gilled radiator mainly utilizes the convection current of air to dispel the heat; Also be referred to as air-cooled radiator; The carried away by air movement heat that this type of radiator utilizes area of dissipation and the fan of fin itself to produce, though have characteristics such as structure and control mode are simple, heat-sinking capability is lower; And fluid channel formula liquid heat radiation (cooling) device is to utilize liquid circulation to loose except that the heat of electronic device etc.; Heat-sinking capability will exceed about 10 times than traditional wind-cooling heat dissipating; But the temperature range that this type of radiator was suitable for is narrower, is difficult to satisfy the requirement be in heat radiations such as electronic equipment under the bigger operational environment of complicated temperature environment and difference variation.Thereby; The above-mentioned background technology exists that temp regulating function is single, little, the narrow application range of adjustment amplitude, be difficult to satisfy high-power electronic device and be operated in complicated temperature environment and operational environment that difference variation is bigger under the defectives such as requirement of electronics unit, device and electronic equipment dissipating heat.
Summary of the invention
The objective of the invention is defective to the background technology existence; A kind of air-cooled, liquid-cooling combined type heat radiating system of research and design; Effectively improve the heat-sinking capability and the thermoregulator amplitude (scope) of cooling system; With fully satisfy high-power electronic device and be operated in complicated temperature environment and operational environment that difference variation is bigger in the heat radiation requirement of electronic equipment etc., guarantee that it is efficient in lower temperature range, stable, work safely, and prolong characteristics such as its useful life.
Solution of the present invention is that air-cooled and liquid cooling are combined into one and caloric value, heat radiation requirement during according to electronics unit, device and electronic device works; Adopt air-cooled respectively or liquid cooling or adopt air-cooled simultaneously and liquid cooling is carried out radiating treatment to it; With its heat-sinking capability of effective raising and thermoregulator scope, thereby realize its goal of the invention.Therefore; Cooling system of the present invention comprises flow channel type liquid heat radiation (cooling) mechanism that contains the cold drawing that is provided with flow path groove and substrate, liquid chiller (heat exchanger), peristaltic pump, liquid-accumulating trough, circulation pipe; Fin and blower fan thereof; Controller, temperature sensor, key is that fin and the cold drawing that is provided with flow path groove are integral type fin-runner cold drawing heat sink; Controller then be can according to cooling extent start blower fan or/and peristaltic pump and no matter blower fan and peristaltic pump be to start respectively or start simultaneously, all can to blower fan and peristaltic pump the controller with the pairing operating voltage of its cooling extent be provided respectively according to the requirement of cooling extent; The plate face that fin is fixedly connected with the back side of runner cold drawing and is integral, the runner cold drawing is provided with runner then is fastenedly connected with the base plate seals formula so that form the runner that the band cooling fluid is imported and exported between the two; Liquid-accumulating trough, peristaltic pump, liquid chiller connect through body successively and are series between the runner import and export through circulation pipe; Blower fan then is fixed in fin top; Temperature sensor is anchored on base plate bottom, and controller connects, is connected and is connected to obtain operation power with external power through power input interface with corresponding temperature sensor respectively through each signal of telecommunication input interface with the power supply input adapter of peristaltic pump and blower fan respectively through two output interfaces.
Processing for ease, the cold drawing of said band flow path groove and substrate are when flow path groove is located on the substrate, the plate face that cooperates with substrate of its cold drawing is plane (not establishing flow path groove on the cold drawing).And said controller comprises the single-chip microcomputer that is provided with external power input interface, blower fan and peristaltic pump working power output interface and the signal input interface corresponding with each temperature sensor.
The present invention is because will be air-cooled and liquid cooling is combined into one, temperature sensor is passed to controller with its temperature information in real time; Caloric value during according to electronic device and electronic device works, heat radiation requirement; Start blower fan or peristaltic pump respectively or start blower fan and peristaltic pump simultaneously by controller again; And the flow that can regulate rotation speed of the fan and peristaltic pump is as required controlled heat dissipation capacity; The adjustment amplitude is big, the scope of application is wide thereby have; Can satisfy high-power electronic device and in the bigger operational environment requirement of electronic device, equipment cooling and the cooling of work down of complicated temperature environment and difference variation, guarantee its in lower temperature range efficiently, stablize, work safely, and prolong characteristics such as its useful life.
Description of drawings
Fig. 1 is the embodiment of the invention 1 structural representation (stereogram);
Fig. 2 is embodiment 1 fin-runner cold drawing heat spreader structure sketch map (stereogram);
Fig. 3 is embodiment 1 a controller architecture sketch map (block diagram);
Fig. 4 is the structural representation of embodiment 2 substrate when flow path groove is located on the substrate.
Among the figure: 1. fin-runner cold drawing heat sink, 1-1. fin, 1-2. runner cold drawing, 1-3. runner (groove), 2. substrate, 2-1. flow path groove, 3. temperature sensor; 4. blower fan, 4-1. fan power joint, 5. liquid-accumulating trough, 6. peristaltic pump; 7. liquid chiller (heat exchanger); 8. circulation pipe, 9. controller, 9-1～9-4. transducer (temperature) information input terminal mouth, 9-5. blower fan work output port of power source, 9-6. peristaltic pump working power output port, 9-7. power input interface, 10. support.
Embodiment
Embodiment 1: be example to go up the cooling system that uses at space computer CPU (maximum power 100W); Fin-runner cold drawing heat sink 1 adopts the moulding of aluminium integral precision casting, and on it: fin 1-1 is totally 11, every (length * height) 100 * 80mm, bottom and the thick 7.5mm in runner cold drawing junction, the thick 2.5mm in top, the total about 174480mm of area of dissipation
2, runner cold drawing 1-2 (long * wide * thick) 100 * 100 * 8mm, runner (groove) 1-3 shaft section (wide * dark) 5 * 5mm, length overall 620mm; Substrate 2 (long * wide * thick) 100 * 100 * 3mm, the plane that is provided with flow path groove with runner cold drawing 1-2 are bonded to one with silica gel sealing; Make the flow path groove that is positioned between the two become the sealed type runner that the band cooling fluid is imported and exported: controller 9 models are CJ1W-TC, establish 4 sensor information input port 9-1,9-2,9-3,9-4 and blower fan work output port of power source 9-5, peristaltic pump working power output port 9-6, power input interface 9-7 on it; Temperature sensor 3 present embodiments adopt four needle-like voltage-type temperature sensors, 0～150 ℃ of temperature detection scope, are divided in the groove of four jiaos of substrate 2 bottom surfaces and respectively through transducer (temperature) information input terminal mouth 9-1,9-2,9-3, the corresponding connection of 9-4 on lead and the controller 9; Blower fan 4 models are PV902512P, be fixed in the top of fin 1-1 and be connected with blower fan work output port of power source 9-5 on the controller 9 through the power connection 4-1 on it and lead; Liquid-accumulating trough 5 volume 20ml; Peristaltic pump 6 models are WX-20A, are connected with peristaltic pump working power output port 9-6 on the controller 9 through lead; Liquid chiller 7 models are FPK2-19808NC; Liquid-accumulating trough 5, peristaltic pump 6, liquid chiller 7 are connected into one through high temperature resistant soft circulation pipe 8 successively; The outlet of liquid-accumulating trough 5 again through circulation pipe 8 is connected with the inlet seal of runner 1-3, the import of liquid chiller 7 also passes through circulation pipe 8 and is connected with the exit seal of runner 1-3, thereby the composition liquid-cooling system; In use directly supply power to cooling system by the power input interface 9-7 on the I/O port via controller 9 of computer main board; It is the single-chip microcomputer of ATmega16-16PT that present embodiment controller 9 adopts model; Wherein: VCC (9-7) is a power input interface; PB0～PB3 (9-5) is that blower fan work output port of power source, PB4～PB7 (9-6) are peristaltic pump working power output port; PA0 (9-1), PA1 (9-2), PA2 (9-3), PA3 (9-4) correspond to four sensor information input ports respectively; The present embodiment controller is made as 10 grades with the specific heat load grade; Wherein when cpu temperature: be in≤during 40 ℃ of state of temperatures, blower fan 4 and peristaltic pump 6 all do not work (startup), when temperature reaches 41～60 ℃, controller 9 provides the 8V operating voltage, 10V voltage is provided, then to blower fan 4 12V is provided operating voltage 66～70 ℃ the time to blower fan 4 61～65 ℃ the time to blower fan 4; When temperature reaches 71～75 ℃, start peristaltic pump 6 and the 12V operating voltage be provided, close blower fan 4 simultaneously to it, the 16V operating voltage is provided, the 20V operating voltage is provided 81～85 ℃ the time, 24V be provided operating voltage 86～90 ℃ the time to peristaltic pump 6 when working temperature reaches 76～80 ℃; When temperature reaches 91～95 ℃, peristaltic pump 6 when keeping 24V voltage power supply state, controller 9 starts blower fans 4 and to it 8V operating voltage (peristaltic pump 6, blower fan 4 are worked simultaneously) is provided, when temperature peristaltic pump 6 up to 96～100 ℃ the time is worked with 12V voltage with 24V, blower fan 4 simultaneously; Thereby guarantee that CPU works under the optimum temperature state.
Embodiment 2: present embodiment is located at the cooling liquid flowing channel groove on the substrate 2; Substrate 2 (long * wide * thick) 100 * 100 * 8mm; The structure of flow path groove 2-1 on it is identical with runner (groove) 1-3 among the embodiment 1; And correspondingly the runner cold drawing 1-2 in fin-runner cold drawing heat sink 1 is changed into (long * wide * thick) 100 * 100 * 5mm and with substrate 2 mating surfaces be the cold drawing of plane (promptly not establishing flow path groove), the set-up mode of fin 1-1 and hot side are long-pending same with embodiment 1 it on; The setting of all the other each modular constructions, model and annexation thereof, parameter is also all identical with embodiment 1.
Claims (3)
1. air-cooled, liquid-cooling combined type heat radiating system; The flow channel type liquid cooling mechanism that comprises the cold drawing that contains substrate and be provided with flow path groove, liquid chiller, peristaltic pump, liquid-accumulating trough, circulation pipe; Fin and blower fan thereof; Controller, temperature sensor is characterized in that fin and the cold drawing that is provided with flow path groove are integral type fin-runner cold drawing heat sink; Controller then be can according to cooling extent start blower fan or/and peristaltic pump and no matter blower fan and peristaltic pump be to start respectively or start simultaneously, all can to blower fan and peristaltic pump the controller with the pairing operating voltage of its cooling extent be provided respectively according to the requirement of cooling extent; The plate face that fin is fixedly connected with the back side of the cold drawing that is provided with flow path groove and is integral, the flow path groove cold drawing is provided with flow path groove then is fastenedly connected with the base plate seals formula so that form the runner that the band cooling fluid is imported and exported between the two; Liquid-accumulating trough, peristaltic pump, liquid chiller connect through circulation pipe successively and are series between the runner import and export through circulation pipe; Blower fan then is fixed in fin top; Temperature sensor is anchored on base plate bottom, and controller connects, is connected and is connected to obtain operation power with external power through power input interface with corresponding temperature sensor respectively through each signal of telecommunication input interface with the power supply input adapter of peristaltic pump and blower fan respectively through two output interfaces.
2. by said air-cooled, the liquid-cooling combined type heat radiating system of claim 1, it is characterized in that said substrate and be provided with the cold drawing of flow path groove, when flow path groove is located on the substrate, the plate face that cooperates with substrate of its cold drawing is the plane.
3. by said air-cooled, the liquid-cooling combined type heat radiating system of claim 1, it is characterized in that said controller comprises the single-chip microcomputer that is provided with external power input interface, blower fan and peristaltic pump working power output interface and the signal input interface corresponding with each temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101686212A CN101835367B (en) | 2010-05-11 | 2010-05-11 | Air-cooling and liquid-cooling combined type heat radiating system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101686212A CN101835367B (en) | 2010-05-11 | 2010-05-11 | Air-cooling and liquid-cooling combined type heat radiating system |
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| CN101835367A CN101835367A (en) | 2010-09-15 |
| CN101835367B true CN101835367B (en) | 2012-04-25 |
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| CN2010101686212A Expired - Fee Related CN101835367B (en) | 2010-05-11 | 2010-05-11 | Air-cooling and liquid-cooling combined type heat radiating system |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201319505A (en) * | 2011-11-08 | 2013-05-16 | Ind Tech Res Inst | Heat dissipation device and heat dissipation system |
| CN106361573A (en) * | 2016-09-13 | 2017-02-01 | 国药集团冯了性（佛山）药业有限公司 | Air cooled disc honey pill wax dipping machine and application thereof |
| CN106873671A (en) * | 2017-03-28 | 2017-06-20 | 中国电子科技集团公司第二十九研究所 | A kind of active multilevel heat management device and method |
| CN107526382A (en) * | 2017-08-21 | 2017-12-29 | 广东合新材料研究院有限公司 | A kind of cooling device and liquid cooling heat radiation system |
| CN108400121B (en) * | 2018-01-16 | 2020-06-05 | 长沙安牧泉智能科技有限公司 | Heat radiator for be used for high heat flux density chip |
| CN109375662A (en) * | 2018-10-31 | 2019-02-22 | 中国运载火箭技术研究院 | A kind of certainly maintenance Active thermal control system of the spacecraft based on liquid metal |
| CN112146178A (en) * | 2019-06-28 | 2020-12-29 | 青岛海尔空调器有限总公司 | Radiating component, radiator and air conditioner |
| CN110958813A (en) * | 2019-12-09 | 2020-04-03 | 华南理工大学 | Water-cooling and air-cooling double cooler for server and control method |
| CN114501917A (en) * | 2020-10-25 | 2022-05-13 | 北京航空航天大学 | Micro-channel radiator with air cooling auxiliary heat dissipation function |
| CN112486285A (en) * | 2020-11-30 | 2021-03-12 | 中国航空工业集团公司西安航空计算技术研究所 | Intelligent thermal management system and thermal management method for computer |
| CN114786413A (en) * | 2022-03-11 | 2022-07-22 | 北京有竹居网络技术有限公司 | Heat dissipation device for electronic equipment and electronic equipment |
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| CN101778554A (en) * | 2010-01-04 | 2010-07-14 | 北京交通大学 | Radiating system |
| CN201550394U (en) * | 2009-11-27 | 2010-08-11 | 唯耀科技股份有限公司 | Temperature equalizing plate radiating device with heat ducts |
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- 2010-05-11 CN CN2010101686212A patent/CN101835367B/en not_active Expired - Fee Related
Patent Citations (5)
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| CN1589094A (en) * | 2004-08-30 | 2005-03-02 | 西安电子科技大学 | Micro channel circulation neat excharging system based on thermoelectric actice control |
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