CN108400121B - Heat radiator for be used for high heat flux density chip - Google Patents
Heat radiator for be used for high heat flux density chip Download PDFInfo
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- CN108400121B CN108400121B CN201810041307.4A CN201810041307A CN108400121B CN 108400121 B CN108400121 B CN 108400121B CN 201810041307 A CN201810041307 A CN 201810041307A CN 108400121 B CN108400121 B CN 108400121B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device for a high heat flux chip in the field of heat dissipation and cooling of high heat flux electronic components, which comprises a heat dissipation fan, a micro pump and a heat dissipation heat sink, the temperature sensor comprises a temperature sensor and a chip, wherein a liquid injection port and a liquid outflow port are arranged on the heat dissipation heat sink, a liquid backflow inlet and a liquid backflow outlet are arranged on the micropump, the liquid injection port is connected with the liquid backflow outlet through a hose, the liquid outflow port is connected with the liquid backflow inlet through a hose, the heat dissipation heat sink is fixed above the chip and is in contact with the chip to absorb heat generated by the work of the chip, a heat dissipation fan is fixed above the heat dissipation heat sink, an upper contact piece and a lower contact piece of the temperature sensor are respectively arranged on the upper surface and the lower surface of the heat dissipation heat sink to obtain the temperature difference between the upper surface and the lower surface of the heat dissipation heat sink, and the chip is connected with the temperature sensor.
Description
Technical Field
The invention relates to the field of heat dissipation and cooling of high-heat-flux-density electronic components, in particular to a heat dissipation device for a high-heat-flux-density chip.
Background
In recent years, electronic information devices are continuously developed towards miniaturization with high precision and high reliability, particularly, the power of chips used for aviation, national defense, new energy trains and the like reaches nearly 350W, and the packaging volume of the chips is continuously reduced, so that the heat flow density of partial chips exceeds 200W/cm2. In the face of such high heat flux density, the heat dissipation technology of electronic devices is becoming the technological bottleneck of the forward development of the information industry. The technology of applying microfluid to chip heat dissipation was first proposed by Tuckerman et al in 1981, and since the size of the microfluid enters the micro or even nano level, there is an uncertain size effect, and the mechanism of convective heat transfer in the microchannel is still in the research and exploration stage. In the last 30 years, heat transfer scholars at home and abroad continuously and deeply dissipate heat of microfluidIn the study, the following results were agreed upon by the academia: firstly, the heat dissipation performance of the micro-channel is better than that of the traditional channel liquid cooling; secondly, the depth-to-width ratio of the micro-channel and the rough element structure in the channel have great influence on the overall heat dissipation performance of the micro-channel; third, the entropy theory based on heat transfer enhancement and the field synergy theory are generally accepted by the academia for microchannel analysis.
When the heat flow density exceeds 100W/cm2In time, the microchannel heat dissipation technology is considered as the most promising high heat flux density heat dissipation technology, and with the continuous reduction of the size, how to realize the optimal heat dissipation structure and mode in the limited space becomes an important bottleneck for the development of future information devices. At present, in part of information devices (such as high-power IGBT, high-integration IC package and the like), a round or rectangular straight micro-channel is adopted for direct water-cooling heat dissipation. However, the better the heat dissipation effect is, the larger the occupied space of the device is, and how to realize the high-efficiency heat dissipation in the minimum space is an urgent problem to be solved at the present stage.
Disclosure of Invention
The invention aims to provide a heat dissipation device for a high-heat-flux-density chip, which aims to overcome the defects which cannot be overcome by the prior art.
In order to achieve the above object, the present invention provides a heat dissipation device for high heat flux density chip, which comprises a heat dissipation fan, a micro pump, and a heat dissipation heat sink, the temperature sensor comprises a temperature sensor and a chip, wherein a liquid injection port and a liquid outflow port are arranged on the heat dissipation heat sink, a liquid backflow inlet and a liquid backflow outlet are arranged on the micropump, the liquid injection port is connected with the liquid backflow outlet through a hose, the liquid outflow port is connected with the liquid backflow inlet through a hose, the heat dissipation heat sink is fixed above the chip and is in contact with the chip to absorb heat generated by the work of the chip, a heat dissipation fan is fixed above the heat dissipation heat sink, an upper contact piece and a lower contact piece of the temperature sensor are respectively arranged on the upper surface and the lower surface of the heat dissipation heat sink to obtain the temperature difference between the upper surface and the lower surface of the heat dissipation heat sink, and the chip is connected with the temperature sensor.
Preferably, the micropump is a micropump with controllable pumping flow rate.
Preferably, the heat sink includes a substrate layer directly disposed on the chip, and a micro channel is etched in the substrate layer.
Preferably, the microchannel includes a hollow structure and a projection structure, and an arrangement density of the projection structure near the liquid inlet is smaller than an arrangement density of the projection structure near the liquid outlet.
Preferably, the protrusion structures include an isosceles triangle protrusion structure, an arc protrusion structure, an isosceles trapezoid protrusion structure and a saw-tooth protrusion structure, an isosceles triangle cave structure, an arc cave structure, an isosceles trapezoid cave structure and a saw-tooth cave structure.
The invention has the following beneficial effects:
1. the invention adopts a heat dissipation mode combining water cooling and air cooling, and adopts different modes to dissipate heat of chips under different working powers, thereby ensuring to obtain the best heat dissipation effect and realizing the best heat dissipation effect in a limited space.
2. The water cooling of the invention adopts micro-channels for heat dissipation, the micro-channels are arranged in a dense way after being thinned, and the micro-channels are of a turbulent flow structure, so the heat dissipation performance is good.
The present invention will be described in further detail below with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a heat dissipation device for a high heat flux chip according to a preferred embodiment of the present invention;
FIG. 2 is an exploded view of a heat dissipation device for high heat flux chips in accordance with a preferred embodiment of the present invention;
FIG. 3 is a half-sectional view of a heat dissipation device for a high heat flux density chip in accordance with a preferred embodiment of the present invention;
FIG. 4 is a heat sink substrate structure diagram of a heat dissipation device for high heat flux density chips in accordance with a preferred embodiment of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
fig. 6 is a schematic diagram of a micro-channel protrusion structure of a heat dissipation device for a high heat flow density chip according to a preferred embodiment of the invention.
In the figure, 1, a small motor; 2. a micro fan support; 3. a fan fixing hole; 4. a heat radiation fan; 5. a PCB board; 6. a heat sink PCB fixing hole; 7. A heat sink fan fixing hole; 8. a heat sink fin; 9. a liquid injection port; 10. a micro-pump; 11. a micro pump fixing pin; 12. a liquid return outlet; 13. a liquid outflow port; 14. a heat sink for dissipating heat; 15. a substrate layer; 16. a liquid return inlet; 17. a microchannel; 1711. an isosceles triangular cave structure; 1712. an isosceles triangle protruding structure; 1721. a circular arc protrusion structure; 1722. an arc-shaped cave structure; 1731. an isosceles trapezoid cave structure; 1732. an isosceles trapezoid protruding structure; 1741. a first saw-tooth-shaped cave structure; 1742. a second saw-tooth-shaped cave structure; 1751. a first saw-tooth shaped projection arrangement; 1752. a second saw-tooth shaped projection arrangement; 18. a chip; 19. a chip pin; 20. a temperature sensor; 201. a lower contact piece; 202. and an upper contact piece.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
The invention provides a heat dissipation device for a high-heat-flow-density chip, which comprises a heat dissipation fan 4, a micro pump 10, a heat dissipation heat sink 14, a temperature sensor 20 and a chip 18, wherein a liquid injection port 9 and a liquid outflow port 13 are arranged on the heat dissipation heat sink 14, a liquid backflow inlet 16 and a liquid backflow outlet 12 are arranged on the micro pump 10, the liquid injection port 9 is connected with the liquid backflow outlet 12 through a hose, the liquid outflow port 13 is connected with the liquid backflow inlet 16 through a hose, the heat dissipation heat sink 14 is fixed above the chip 18 and is in contact with the chip 18 to absorb heat generated by the work of the chip 18, the heat dissipation fan 4 is fixed above the heat dissipation heat sink 14, an upper contact sheet 201 and a lower contact sheet 202 of the temperature sensor 20 are respectively arranged on the upper surface and the lower surface of the heat dissipation heat sink 14 to obtain the temperature difference of the upper surface and the lower surface of the heat dissipation heat sink 14, and the chip 18 is Different control signals are sent.
Referring to fig. 1, 2 and 3, the micro pump 10 is mounted on the PCB board 5 by the micro pump fixing pin 11, and the chip 18 is fixed on the PCB board 5 by the chip pin 19. The heat sink 14 is assembled in two ways, one is directly integrated with the chip 18 and the other is adhered to the chip 18 through a heat conductive material. The micro pump 10 is provided with a liquid return inlet 16 and a liquid return outlet 12, and the heat sink 14 is provided with a liquid inlet 9 and a liquid outlet 13. The small motor 1, the micro fan bracket 2 and the heat dissipation fan 4 are arranged above the heat dissipation heat sink 14, and the heat dissipation heat sink 14 and the heat dissipation fan 4 are fixed through the heat dissipation heat sink fan fixing hole 7 and the fan fixing hole 3. Heat sink fins 8 are arranged on the heat sink 14. The PCB board 5 is connected with the heat sink 14 through the heat sink PCB fixing hole 6. The liquid reflux outlet 12 of the micro pump 10 is connected with a soft thin pipe which is gradually reduced, the minimum end of the soft thin pipe is connected with the liquid injection port 9 on the heat dissipation heat sink 14, and the liquid outflow port 13 on the heat dissipation heat sink 14 and the liquid reflux inlet 16 on the micro pump 10 are also connected through the soft thin pipe to form a complete cooling liquid loop.
The thermal current density of the chip 18 is relatively low at the beginning of operation, typically 5W/cm2Then, the small motor 1 is powered on to drive the fan to rotate, and the heat dissipation fan 4 dissipates heat of the heat dissipation heat sink 14; the heat flux density when the chip 18 is in operation is at 5W/cm2-100W/cm2When the small motor 1 is powered off and stops working, the micro pump 10 is powered on and starts working, the cooling liquid flows out from the liquid backflow outlet 12, enters the liquid injection port 9, absorbs the heat of the heat dissipation heat sink 14, flows out from the liquid outflow port 13 and returns to the liquid backflow inlet 16, and the heat dissipation heat sink 14 is dissipated through the cooling liquid; the heat flux density when the chip 18 is in operation exceeds 100W/cm2When the cooling device is used, the small motor 1 works again, so that air cooling and liquid cooling are combined, and the heat dissipation effect is enhanced.
Preferably, the micropump 10 is a micropump 10 with controllable pumping flow rate.
The heat flux density is calculated by means of heat dissipation point measurement, and the working state of the micro pump 10 is controlled by converting the measured temperature difference of the upper surface and the lower surface of the heat dissipation heat sink 14 into the heat flux density. The temperature difference between the upper and lower bottom surfaces of the heat sink 14 is obtained by the temperature sensor 20, converted into heat flux density by the chip 18, and finally input into the micro-pump controller of the micro-pump 10 to adjust the pumping flow rate of the liquid.
The hydraulic diameter of the micro-pump 10 is between 0.1 mm and 1mm, and when the working temperature of the chip 18 exceeds 80 ℃, the pumping amount of the micro-pump 10 can be automatically increased.
Preferably, the heat sink 14 includes a substrate layer 15, the substrate layer 15 is directly connected to the chip 18, and the inside of the substrate layer 15 is etched with a micro-channel 17.
Preferably, the microchannel 17 includes a hollow structure and a projection structure, and the arrangement density of the projection structure near the liquid injection inlet 9 is smaller than that of the projection structure near the liquid discharge outlet 13.
As shown in fig. 4, the substrate layer 15 is internally composed of a plurality of parallel micro-channels 17, and as seen from fig. 5, i.e., an enlarged view a, the cavities or protrusions in the micro-channels 17 are arranged along the flowing direction of the cooling liquid in a manner that the cavities or protrusions are arranged according to the rule of being sparse at the front and dense at the back. The arrangement of the mode obviously reduces the pressure drop compared with the uniform arrangement mode by the front thinning and back dense arrangement mode, so that the temperature distribution on the chip 18 is more uniform in the cooperation of the speed field and the temperature field, and the optimization of heat dissipation is realized.
The protrusion structures or the cavity structures play a role in stopping and regenerating a thermal boundary layer formed by the fluid, so that the heat transfer Nossel number is improved. The etched protruding structure or the etched cave structure can play a role in disturbing flow and break a thermal boundary layer.
Preferably, the protrusion structures include isosceles triangle protrusion structures 1712, circular arc protrusion structures 1721, isosceles trapezoid protrusion structures 1732, and saw-tooth protrusion structures, isosceles triangle cavern structures 1711, circular arc cavern structures 1722, isosceles trapezoid cavern structures 1731, and saw-tooth cavern structures.
As shown in fig. 6(a), 6(b), 6(c), 6(b) and 6(e), the protruding structures of the microchannels 17 in the substrate layer 15 are not limited to isosceles triangular cavern structures 1711, isosceles triangular cavern structures 1712, circular arc cavern structures 1722, circular arc cavern structures 1721, isosceles trapezoidal cavern structures 1731, isosceles trapezoidal cavern structures 1732, first zigzag cavern structures 1741, second zigzag cavern structures 1742, first zigzag cavern structures 1751 and second zigzag cavern structures 1752.
The various protruding structures and the hollow structures play similar roles in the principle of destroying a thermal boundary layer, and different structures have different heat transfer effects on the specific heat transfer enhancement effect, but have the heat transfer enhancement effect obviously compared with a straight channel.
The invention adopts a method of conjugate heat transfer numerical simulation to carry out heat flow density of 100W/cm respectively2And 180W/cm2The heat dissipation performance of the silicon-based microchannel heat sink is verified. Under the hydraulic diameter of 90-150um, the simulation research is carried out on a rectangular straight channel, micro-channels 17 with uniformly distributed caves or bulges in the interior and a plurality of micro-channel 17 heat sinks with caves or bulges distributed densely at the front part and the back part and distributed densely at the front part and the back part by taking deionized water as a working medium. The results show that: the highest surface temperature of the chip 18 is a rectangular straight channel, the lowest surface temperature is a front sparse and rear dense structure, and the highest temperature difference reaches more than 150 ℃; meanwhile, the pressure drop of different micro-channel 17 structures is compared, wherein the smallest pressure drop is still a front sparse and rear dense structure, and the pressure drop of different structures is even 1 order of magnitude different from that of the former structure. Meanwhile, the same surface temperature of the chip 18 is realized, and the cavities or bulges required by the front sparse and back dense structure are reduced by about half compared with the uniformly distributed structure, so that the pressure drop is greatly reduced, and the working efficiency of the pump is improved.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A heat dissipation device for a chip with high heat flux density is characterized by comprising a heat dissipation fan (4), a micro pump (10), a heat dissipation heat sink (14), a temperature sensor (20) and a chip (18), wherein the heat dissipation heat sink (14) is provided with a liquid injection port (9) and a liquid outflow port (13), the micro pump (10) is provided with a liquid backflow inlet (16) and a liquid backflow outlet (12), the liquid injection port (9) is connected with the liquid backflow outlet (12) through a hose, the liquid outflow port (13) is connected with the liquid backflow inlet (16) through a hose, the heat dissipation heat sink (14) is fixed above the chip (18) and is in contact with the chip (18) to absorb heat generated by the operation of the chip (18), and the heat dissipation fan (4) is fixed above the heat dissipation heat sink (14), an upper contact piece (201) and a lower contact piece (202) of the temperature sensor (20) are respectively arranged on the upper surface and the lower surface of the heat dissipation heat sink (14) to acquire the temperature difference of the upper surface and the lower surface of the heat dissipation heat sink (14), the chip (18) is connected with the temperature sensor (20), the cooling fan (4) and the micropump (10) and used for sending different control signals when obtaining heat flux densities corresponding to different temperature differences, the heat sink (14) comprises a substrate layer (15), the substrate layer (15) is directly arranged on the chip (18), and the substrate layer (15) is internally etched with a micro-channel (17), the micro-channel (17) comprises a hollow structure and a protruding structure, and the arrangement density of the protruding structure close to the liquid injection port (9) is smaller than that of the protruding structure close to the liquid outflow port (13).
2. The heat sink for high heat flux chips of claim 1, wherein said micropump (10) is a controlled pumping flow micropump (10).
3. The heat dissipating device for high heat flux density chips as claimed in claim 1, wherein the protrusion structures comprise isosceles triangle protrusion structures (1712), circular arc protrusion structures (1721), isosceles trapezoid protrusion structures (1732) and saw-tooth protrusion structures, isosceles triangle cavity structures (1711), circular arc cavity structures (1722), isosceles trapezoid cavity structures (1731) and saw-tooth cavity structures.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810041307.4A CN108400121B (en) | 2018-01-16 | 2018-01-16 | Heat radiator for be used for high heat flux density chip |
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| CN201810041307.4A CN108400121B (en) | 2018-01-16 | 2018-01-16 | Heat radiator for be used for high heat flux density chip |
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| CN108400121A CN108400121A (en) | 2018-08-14 |
| CN108400121B true CN108400121B (en) | 2020-06-05 |
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| CN117457602B (en) * | 2023-12-22 | 2024-04-02 | 湘潭大学 | High-heat-flow chip packaging structure and service temperature real-time regulation and control method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835367A (en) * | 2010-05-11 | 2010-09-15 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN104167399A (en) * | 2014-05-14 | 2014-11-26 | 北京工业大学 | Staggered complex micro-channel miniature heat exchanger |
| CN106931815A (en) * | 2017-04-27 | 2017-07-07 | 长沙理工大学 | A kind of reducing series and parallel conduit plate type pulsating heat pipe |
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2018
- 2018-01-16 CN CN201810041307.4A patent/CN108400121B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835367A (en) * | 2010-05-11 | 2010-09-15 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN104167399A (en) * | 2014-05-14 | 2014-11-26 | 北京工业大学 | Staggered complex micro-channel miniature heat exchanger |
| CN106931815A (en) * | 2017-04-27 | 2017-07-07 | 长沙理工大学 | A kind of reducing series and parallel conduit plate type pulsating heat pipe |
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