CN202841823U - Pulsed jet fin cooling device - Google Patents
Pulsed jet fin cooling device Download PDFInfo
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- CN202841823U CN202841823U CN 201220544591 CN201220544591U CN202841823U CN 202841823 U CN202841823 U CN 202841823U CN 201220544591 CN201220544591 CN 201220544591 CN 201220544591 U CN201220544591 U CN 201220544591U CN 202841823 U CN202841823 U CN 202841823U
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- jet
- fin
- cooling device
- pulsing jet
- pulsing
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Abstract
The utility model relates to an electronic device cooling device which is a high-efficient cooling device combining pulsed jet cooling technology with fin radiators. The pulsed jet fin cooling device mainly comprises a pulsating flow generating device, a jet flow matrix and the fin radiators, and is characterized in that an acoustical exciting device is driven by an electronic signal to generate instable pulsating flow which is jetted to the fin radiators via the jet flow matrix. Cooling medium can directly impact the surfaces of fins, heat transfer process is strengthened via the instable pulsating flow, so that radiating efficiency is improved, energy consumption is reduced, electronic devices with large heat flux intensity can be effectively and quickly cooled, jet flow parameters can be set as needed, and working condition change can be adapted.
Description
Technical field
The present invention relates to a kind of cooling system of electronic device, particularly a kind of highly efficient cooling device in conjunction with Jet Cooling and finned radiator.
Background technology
Along with the integrated and microminiaturized constantly upgrading of electronic device, its power and integrated level increase substantially, and the density of heat flow rate of power device constantly rises, and heat radiation becomes the major obstacle that microelectronic industry further develops.Only have the heat dissipation element of electronic equipment and complete machine or system are adopted suitable cooling technology and structural design, their temperature rise is controlled, guarantee electronic equipment or system are normally, work reliably.For electronic equipment of new generation, design restriction and the manufacturing technology of traditional cooler can't meet the requirements.
The overall size of electronic equipment, quality, consume metal material and flow resistance performance increases under few prerequisite, adopt finned radiator can increase heat removal surface area, improve heat dissipation capacity.Section Bar Heat Sinks, interdigital radiator and cylindrical needle rib radiator are several finned radiators of commonly using.Although triangular fin is with respect to the difficult processing of rectangle fin, its quality is about half of rectangle fin, so the triangular fin sheet heat radiator often is used.
For the equipment such as supercomputer that are made of high power density electronic components such as microprocessor and control circuits, its density of heat flow rate is very large, and magnitude is at 100W/cm
2About or higher.Because capacity limitation, the density of heat flow rate of high-performance server and notebook is also very high.Finned radiator generally causes the interference in the hot-fluid, and can cause very high thermal resistance and the non-uniform temperature of chip surface.For the problems referred to above, can adopt freely ventilates reduces the thermal resistance of radiator with forced ventilation, but these methods need to consume larger pump merit usually, and high heat flux can produce thermal noise or dark current.In a word, the high heat flux electronic device is very urgent for the demand of efficient cooling technology.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of cooling system of electronic device, this cooling device combines pulsatile impact Jet Cooling and finned radiator, adopt Pulsating Flow to strengthen the heat and mass transfer process of finned radiator, improve radiating efficiency, reduce energy consumption.Its operation principle is: drive the acoustic excitation device by electronic signal and produce astable stream of pulses, and be ejected on the finned radiator through the pulsing jet matrix; The heat that electronic chip produces mainly passes to finned radiator with heat-conducting mode by heat insulating washer, and finned radiator is transferred to surrounding environment by fin.Because fluid directly impacts the fin surface by the slit-type nozzle, flow process lip-deep flow boundary layer short and that impacted is thin, thereby makes the zone of directly being impacted produce very strong heat transfer effect, strengthens the heat radiation process of fin.Drive the acoustic excitation device by electronic signal and produce astable stream of pulses, can upset the boundary layer and then affect the Local Heat Transfer rate, can reduce the energy consumption of cooling system, further improve the efficient of jet cooling.
Wherein said finned radiator can be made by the good material of the heat conductivilitys such as aluminium or copper, and fin adopts the triangular-section, and is highly equal, and equidistantly arranges at substrate surface.The quality of triangular fin is about half of rectangle fin.The jet array is equidistantly arranged by the slit-type nozzle that Open Side Down and is formed, and nozzle location is positioned in the middle of two adjacent fins.The position of the size of fin and spacing and nozzle and size are determined according to chip size and overall package requirements.
Wherein said pulsing jet can drive the acoustic excitation device by pressure-control valve and electronic signal and regulate and control its jet velocity, jet waveform, jet frequency and amplitude, to reach desirable radiating efficiency.
The beneficial effect that the present invention can produce: adopt the coolant impingement heat transfer, heat exchange coefficient is high, for the effective fast cooling of the electronic device of large density of heat flow rate; The unstable state Pulsating Flow can the intensifying impact jet diabatic process, improve radiating efficiency, reduce energy consumption, and jet parameters can be set as required, adaptation condition changes.
Description of drawings
Fig. 1 is structural representation of the present invention
Fig. 2 is the structural representation of jet finned radiator
Fig. 3 is the structure chart of jet array
Fig. 4 has shown the sectional view of triangular fin
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is described in further detail.
As shown in Figure 1, the present invention comprises Pulsating Flow generating means and jet finned radiator two parts.Gas enters air compressing cylinder 2 by entrance 1, the flowing in pipeline 4 by switch valve 3 and pressure-control valve 5 control air-flows, the steady-state gas flow that enters in the electronic signal driving acoustic excitation device 6 converts Pulsating Flow to, and Pulsating Flow enters jet array 7 and directly impacts fin 8 surfaces by the slit-type nozzle.The speed that enters the steady-state gas flow in the electronic signal driving acoustic excitation device 6 is arranged by pressure-control valve 5, and steady-state gas flow enters and can convert astable Pulsating Flow to according to the jet waveform that presets, jet frequency and amplitude after electronic signal drives acoustic excitation device 6.
As shown in Figure 2, the heat that electronic chip 10 produces mainly passes to finned radiator with heat-conducting mode by heat insulating washer 9, and finned radiator is comprised of triangular fin 12 and substrate 13, and finned radiator transfers heat to surrounding environment.Coolant directly impacts fin surface via slit-type nozzle 11, strengthens the Air Flow on fin surface, and heat exchange coefficient is high, for the effective fast cooling of the electronic device of large density of heat flow rate.
As shown in Figure 3, the jet array is equidistantly arranged by slit-type nozzle 11 and is formed, and nozzle location is positioned in the middle of two adjacent fins.The position of the size of fin and spacing and nozzle and size are determined according to chip size and overall package requirements.As shown in Figure 4, finned radiator can be made by the good material of the heat conductivilitys such as aluminium or copper, and fin adopts the triangular-section, and is highly equal, and equidistantly arranges at substrate surface.
Claims (4)
1. pulsing jet fin cooling device, comprise gas access (1), air compressing cylinder (2), switch valve (3), pipeline (4), pressure-regulating valve (5), electronic signal drives acoustic excitation device (6), pulsing jet array (7), finned radiator (8), heat insulating washer (9) and electronic chip (10) is characterized in that: drive acoustic excitation device (6) by electronic signal and produce astable stream of pulses, and be ejected on the finned radiator (8) through pulsing jet array (7).
2. pulsing jet fin cooling device according to claim 1, it is characterized in that: described pulsing jet can drive acoustic excitation device (6) by pressure-control valve (5) and electronic signal and regulate and control its jet velocity, jet waveform, jet frequency and amplitude, to reach desirable radiating efficiency.
3. pulsing jet cooling device according to claim 1 is characterized in that: pulsing jet array (7) is equidistantly arranged by slit-type nozzle (11), and Open Side Down, and nozzle location is positioned in the middle of two adjacent fins.
4. pulsing jet cooling device according to claim 3, wherein said finned radiator can be made by the good material of the heat conductivilitys such as aluminium or copper, and fin adopts triangular-section (12), and is highly equal, and equidistantly arranges at substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220544591 CN202841823U (en) | 2012-10-14 | 2012-10-14 | Pulsed jet fin cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220544591 CN202841823U (en) | 2012-10-14 | 2012-10-14 | Pulsed jet fin cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202841823U true CN202841823U (en) | 2013-03-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220544591 Expired - Fee Related CN202841823U (en) | 2012-10-14 | 2012-10-14 | Pulsed jet fin cooling device |
Country Status (1)
| Country | Link |
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| CN (1) | CN202841823U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153023A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Pulse jet flow finned cooling device |
| CN108551750A (en) * | 2018-03-20 | 2018-09-18 | 山东超越数控电子股份有限公司 | A kind of enhancing jet stream radiator heat-dissipation efficient appliances, radiating subassembly and production method |
| CN111970897A (en) * | 2020-08-06 | 2020-11-20 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
-
2012
- 2012-10-14 CN CN 201220544591 patent/CN202841823U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153023A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Pulse jet flow finned cooling device |
| CN108551750A (en) * | 2018-03-20 | 2018-09-18 | 山东超越数控电子股份有限公司 | A kind of enhancing jet stream radiator heat-dissipation efficient appliances, radiating subassembly and production method |
| CN108551750B (en) * | 2018-03-20 | 2019-09-10 | 山东超越数控电子股份有限公司 | A kind of enhancing jet stream radiator heat-dissipation efficient appliances, radiating subassembly and production method |
| CN111970897A (en) * | 2020-08-06 | 2020-11-20 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
| CN111970897B (en) * | 2020-08-06 | 2022-06-21 | 中国电子科技集团公司第三十八研究所 | Heat exchange radiator is reinforceed to semi-enclosed island type rib pole side hole vortex |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20131014 |