CN201550394U - Temperature equalizing plate radiating device with heat ducts - Google Patents
Temperature equalizing plate radiating device with heat ducts Download PDFInfo
- Publication number
- CN201550394U CN201550394U CN2009202702713U CN200920270271U CN201550394U CN 201550394 U CN201550394 U CN 201550394U CN 2009202702713 U CN2009202702713 U CN 2009202702713U CN 200920270271 U CN200920270271 U CN 200920270271U CN 201550394 U CN201550394 U CN 201550394U
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- temperature
- heat
- uniforming plate
- heat pipe
- radiating
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Abstract
The utility model relates to a temperature equalizing plate radiating device with heat ducts. The temperature equalizing plate radiating device at least comprises a temperature equalizing plate, at least one heat duct, a radiating component and at least one fixing component, the temperature equalizing plate is provided with a first surface and a second surface which are opposite to each other, the first surface is used for disposing heating bodies, one end of each heat duct is fixed in the temperature equalizing plate, the radiating component is provided with a heat conducting plate, a plurality of radiating fins are arranged on the heat conducting plate in parallel, the radiating component is arranged on the second surface of the temperature equalizing plate via the heat conducting plate and contacts with the heat ducts, the temperature equalizing plate and the radiating component are assembled and fixed mutually via the fixing components, heat sources generated by the heating bodies ( can be electronic components such as light emitting diodes, CPU and GPU) arranged on the temperature equalizing plate can be distributed to the whole temperature equalizing plate body by aid of action of the temperature equalizing plate and can be dissipated by aid of the radiating component, thereby guaranteeing service life of the heating bodies and enhancing radiating effect by aid of action of the heat ducts additionally.
Description
Technical field
The relevant a kind of temperature-uniforming plate heat abstractor of the utility model refers to a kind of heat abstractor that the heater heat radiation is provided especially, and adds that the effect of heat pipe can further increase radiating effect.
Background technology
Press, at electronic product under the demand of more frivolous, rapid, multi-functional and energy-conserving and environment-protective, the caloric value of CPU and GPU is more and more high, high-power LED illumination also has the bottleneck that material luminous efficiency deficiency, heat dissipation technology can't break through and influences the LED life-span, yet common radiating mode, it mainly comprises a substrate, an insulating barrier, a conductive layer and plural LED; This insulating barrier is formed at a surface of this substrate; This conductive layer is formed on this insulating barrier, and with this substrate electrical isolation, this conductive layer has one first electrode and one second electrode; These LED are located at respectively on this insulating barrier, and this LED has one first pin that is electrically connected this first electrode and one second pin that is electrically connected this second electrode; By this, to constitute this LED conductive structure.
When using this LED conductive structure, these LED via this first and second electrifying electrodes after, these LED promptly produce luminous energy and heat energy, its luminous energy then irradiates, heat energy then conducts on this substrate via this insulating barrier, again the heat energy that is produced with these LED of this substrate diversion.
Yet, known LED conductive structure, on using, reality still has following disappearance, slow and heat-conducting effect is limited because of this substrate heat conduction velocity, and the very easy position that concentrates on LED and substrate contacts of this heat energy, and can't effectively heat energy be evenly distributed in substrate surface, in order to do the heat dissipation that influences this LED, and can reduce the life-span that this LED uses.
The utility model content
The technical problem that the utility model solved is promptly providing a kind of temperature-uniforming plate heat abstractor, refers to a kind of heat abstractor that the heater heat radiation is provided especially, and adds that the effect of heat pipe can further increase radiating effect.
The technical solution of the utility model is: a kind of temperature-uniforming plate heat abstractor of tool heat pipe includes at least: a temperature-uniforming plate, and this temperature-uniforming plate is provided with opposite first and second surface, and this first surface is provided with heater; At least one heat pipe, this heat pipe one end is fixed in this temperature-uniforming plate; One radiating subassembly, this radiating subassembly is provided with a heat-conducting plate, and on this heat-conducting plate and be provided with the plurality of radiating fins group, and this radiating subassembly is arranged at the second surface of this temperature-uniforming plate by this heat-conducting plate, and this radiating subassembly and contact with this heat pipe; At least one fixation kit is located between temperature-uniforming plate and the radiating subassembly.
Wherein, be provided with first accommodation space between first, second surface of this temperature-uniforming plate, and be provided with plural number in this accommodation space and be held in support column between first, second surface, and this heat pipe also has second accommodation space, wherein this first, second accommodation space communicates, the internal face of this first, second accommodation space is provided with capillary structure, and is filled with cooling fluid in this first, second accommodation space.
This capillary structure is a wire netting.
This radiating fin group is provided with the radiating fin that plural number is arranged in parallel, and is formed with first heat dissipation channel between each radiating fin, between each radiating fin group and be formed with second heat dissipation channel.
This fixation kit screw.
This fixation kit heat-conducting glue.
The area of this temperature-uniforming plate is less than the area of this radiating subassembly, and this heat pipe contact is arranged at this radiating subassembly.
The first surface of this temperature-uniforming plate is provided with at least one light-emitting diode.
This light-emitting diode one side is provided with metal substrate, and this light-emitting diode is arranged on the first surface of this temperature-uniforming plate by this metal substrate.
This first surface is provided with plural number and this metal substrate geomery size groove opposite.
The beneficial effects of the utility model are: the thermal source that set heater (can be electronic building bricks such as light-emitting diode, CPU, GPU) work is sent on the temperature-uniforming plate, can thermal source be covered with whole temperature-uniforming plate plate body by the effect of this temperature-uniforming plate, and utilize radiating subassembly that thermal source is left, to guarantee the working life of heater.And the work thermal source can further diffuse to heat pipe by temperature-uniforming plate, and contacting with radiating subassembly by heat pipe further increases radiating effect.
Description of drawings
Fig. 1 is the structural representation of temperature-uniforming plate heat abstractor in the utility model;
Fig. 2 is the structural upright exploded view of temperature-uniforming plate heat abstractor in the utility model;
Fig. 3 is the STRUCTURE DECOMPOSITION figure of temperature-uniforming plate and heat pipe in the utility model;
Fig. 4 is the STRUCTURE DECOMPOSITION figure of temperature-uniforming plate heat abstractor in the utility model;
Fig. 5 is the user mode reference diagram of temperature-uniforming plate heat abstractor in the utility model.
[figure number explanation]
Temperature-uniforming plate 1 first surface 11
Cooling fluid 16 radiating subassemblies 2
Heat-conducting plate 21 radiating fin groups 22
Radiating fin 221 first heat dissipation channels 222
Second heat dissipation channel, 223 fixation kits 3
Light-emitting diode 4 metal substrates 41
Embodiment
As shown in Figures 1 and 2, temperature-uniforming plate heat abstractor of the present utility model, at least include: a temperature-uniforming plate 1, this temperature-uniforming plate 1 is provided with opposite first 11 and second surface 12, and this first surface 11 is in order to be provided with heater (can be electronic building bricks such as light-emitting diode, CPU, GPU);
At least one heat pipe 5, these heat pipe 5 one ends are fixed in (available welding manner is fixed) in this temperature-uniforming plate 1, wherein first of this temperature-uniforming plate, second surface 11, be provided with one first accommodation space 13 between 12, please consult shown in Figure 3 simultaneously, and be provided with plural number in this first accommodation space 13 and be held in first, second surface 11,12 support column 14, and this heat pipe 5 also has second accommodation space 51, wherein this first, second accommodation space 13,51 communicate, this is first years old, second accommodation space 13,51 internal face is provided with capillary structure 15,52, this capillary structure 15,52 can be wire netting, and this first, second accommodation space 13, be filled with the cooling fluid 16 of mutual circulation in 51;
One radiating subassembly 2, this radiating subassembly 2 is provided with a heat-conducting plate 21, on this heat-conducting plate 21 and be provided with plurality of radiating fins group 22, and this radiating subassembly 2 is arranged at the second surface 12 of this temperature-uniforming plate by this heat-conducting plate 21, wherein, this radiating fin group 22 is provided with the radiating fin 221 that plural number is arranged in parallel, and 221 of each radiating fins are formed with first heat dissipation channel 222,22 of each radiating fin groups also are formed with second heat dissipation channel 223, can increase radiating effect by the one the second heat dissipation channels 222,223;
At least one fixation kit 3 is located between temperature-uniforming plate 1 and the radiating subassembly 2, and this fixation kit 3 can be screw among the embodiment as shown in the figure; Certainly, this fixation kit can also be heat-conducting glue, in order to fixedly temperature-uniforming plate and radiating subassembly.
Temperature-uniforming plate heat abstractor of the present utility model can be applicable in the light-emitting diode, on the first surface 11 of this temperature-uniforming plate at least one light-emitting diode 4 can be set, as shown in Figure 4, these light-emitting diode 4 one sides are provided with metal substrate 41 (can be silver-colored material), and on this first surface 11 and be provided with plural number and this metal substrate 41 geomeries size groove opposite 111, this light-emitting diode 4 is arranged in the groove 111 of this first surface by this metal substrate 41, and reaches the effect of location.
When light-emitting diode 4 luminous work, as shown in Figure 5, the first surface 11 of this temperature-uniforming plate fits in the bottom surface of light-emitting diode 4, the heat energy that this moment, light-emitting diode 4 sent can be absorbed by temperature-uniforming plate 1, and after temperature-uniforming plate 1 absorbs heat energy, can be to first, second accommodation space 13, cooling fluid 16 in 51 heats, and because first, second accommodation space 13, be in 51 near vacuum state, therefore the boiling point of cooling fluid 16 can reduce, and because of capillary structure 15,52 have increased the contact area of cooling fluid 16, so cooling fluid 16 can seethe with excitement fast and produce steam, and this steam fast rise and touch capillary structure 15,52, and with the heat energy of steam by capillary structure 15,52 conduct to second surface 12, conduct to radiating fin group 22 by second surface 12 again, and do heat exchange so that heat energy is left by plurality of radiating fins 221 and air, and the heat energy of working as steam is by capillary structure 15, after 52 absorptions, can be converted into cooling fluid 16 and fall back first, second accommodation space 13,51 first surface 11, continue to be subjected to temperature-uniforming plate 1 heating again, get final product the fast speed belt of heat energy quick and that constantly temperature-uniforming plate 1 is absorbed by this from temperature-uniforming plate 1 and heat pipe 5, make temperature-uniforming plate 1 can absorb the heat energy that more multiple optical diode 4 is sent.
What deserves to be mentioned is, temperature-uniforming plate of the present utility model contacts with heater with the face way of contact, the work thermal source of heater can be covered with whole temperature-uniforming plate plate body, and this temperature-uniforming plate and contact with radiating subassembly with the face way of contact, can utilize radiating subassembly that thermal source is left, guaranteeing the working life of heater, and add that heat pipe increases the contact area with radiating subassembly, can further increase the radiating effect of integral heat dissipation means.
Claims (10)
1. the temperature-uniforming plate heat abstractor of a tool heat pipe is characterized in that, includes at least:
One temperature-uniforming plate, this temperature-uniforming plate is provided with opposite first and second surface, and this first surface is provided with heater;
At least one heat pipe, this heat pipe one end is fixed in this temperature-uniforming plate;
One radiating subassembly, this radiating subassembly is provided with a heat-conducting plate, and on this heat-conducting plate and be provided with the plurality of radiating fins group, and this radiating subassembly is arranged at the second surface of this temperature-uniforming plate by this heat-conducting plate, and this radiating subassembly and contact with this heat pipe;
At least one fixation kit is located between temperature-uniforming plate and the radiating subassembly.
2. have the temperature-uniforming plate heat abstractor of heat pipe according to claim 1, it is characterized in that, be provided with first accommodation space between first, second surface of this temperature-uniforming plate, and be provided with plural number in this accommodation space and be held in support column between first, second surface, and this heat pipe also has second accommodation space, wherein this first, second accommodation space communicates, and the internal face of this first, second accommodation space is provided with capillary structure, and is filled with cooling fluid in this first, second accommodation space.
3. as the temperature-uniforming plate heat abstractor of tool heat pipe as described in the claim 2, it is characterized in that this capillary structure is a wire netting.
4. have the temperature-uniforming plate heat abstractor of heat pipe as claimed in claim 1 or 2, it is characterized in that, this radiating fin group is provided with the radiating fin that plural number is arranged in parallel, and is formed with first heat dissipation channel between each radiating fin, between each radiating fin group and be formed with second heat dissipation channel.
5. have the temperature-uniforming plate heat abstractor of heat pipe as claimed in claim 1 or 2, it is characterized in that this fixation kit screw.
6. have the temperature-uniforming plate heat abstractor of heat pipe as claimed in claim 1 or 2, it is characterized in that this fixation kit heat-conducting glue.
7. have the temperature-uniforming plate heat abstractor of heat pipe as claimed in claim 1 or 2, it is characterized in that the area of this temperature-uniforming plate is less than the area of this radiating subassembly, and this heat pipe contact is arranged at this radiating subassembly.
8. have the temperature-uniforming plate heat abstractor of heat pipe as claimed in claim 1 or 2, it is characterized in that the first surface of this temperature-uniforming plate is provided with at least one light-emitting diode.
9. as the temperature-uniforming plate heat abstractor of tool heat pipe as described in the claim 8, it is characterized in that this light-emitting diode one side is provided with metal substrate, this light-emitting diode is arranged on the first surface of this temperature-uniforming plate by this metal substrate.
10. as the temperature-uniforming plate heat abstractor of tool heat pipe as described in the claim 9, it is characterized in that this first surface is provided with plural number and this metal substrate geomery size groove opposite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202702713U CN201550394U (en) | 2009-11-27 | 2009-11-27 | Temperature equalizing plate radiating device with heat ducts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202702713U CN201550394U (en) | 2009-11-27 | 2009-11-27 | Temperature equalizing plate radiating device with heat ducts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201550394U true CN201550394U (en) | 2010-08-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202702713U Expired - Fee Related CN201550394U (en) | 2009-11-27 | 2009-11-27 | Temperature equalizing plate radiating device with heat ducts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201550394U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102333436A (en) * | 2011-08-04 | 2012-01-25 | 西安东旺精细化学有限公司 | Gradient composite heat-conducting fin |
| CN101835367B (en) * | 2010-05-11 | 2012-04-25 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN102856476A (en) * | 2012-09-12 | 2013-01-02 | 浙江中博光电科技有限公司 | LED chip packaging structure on basis of vapor chamber and chip support of LED chip packaging structure |
| CN102983259A (en) * | 2012-11-28 | 2013-03-20 | 福建省万邦光电科技有限公司 | LED packaging structure with high cooling efficiency |
| CN102983259B (en) * | 2012-11-28 | 2016-11-30 | 福建省万邦光电科技有限公司 | High cooling efficiency LED encapsulation structure |
| WO2017076329A1 (en) * | 2015-11-04 | 2017-05-11 | 深圳市光峰光电技术有限公司 | Tec heat dissipation assembly and projection device |
| CN107278089A (en) * | 2016-04-07 | 2017-10-20 | 讯凯国际股份有限公司 | Heat conductive structure |
| CN113412031A (en) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | Heating module and electronic equipment |
-
2009
- 2009-11-27 CN CN2009202702713U patent/CN201550394U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835367B (en) * | 2010-05-11 | 2012-04-25 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN102333436A (en) * | 2011-08-04 | 2012-01-25 | 西安东旺精细化学有限公司 | Gradient composite heat-conducting fin |
| CN102856476A (en) * | 2012-09-12 | 2013-01-02 | 浙江中博光电科技有限公司 | LED chip packaging structure on basis of vapor chamber and chip support of LED chip packaging structure |
| CN102983259A (en) * | 2012-11-28 | 2013-03-20 | 福建省万邦光电科技有限公司 | LED packaging structure with high cooling efficiency |
| CN102983259B (en) * | 2012-11-28 | 2016-11-30 | 福建省万邦光电科技有限公司 | High cooling efficiency LED encapsulation structure |
| WO2017076329A1 (en) * | 2015-11-04 | 2017-05-11 | 深圳市光峰光电技术有限公司 | Tec heat dissipation assembly and projection device |
| CN107278089A (en) * | 2016-04-07 | 2017-10-20 | 讯凯国际股份有限公司 | Heat conductive structure |
| CN107278089B (en) * | 2016-04-07 | 2019-07-19 | 讯凯国际股份有限公司 | Heat conductive structure |
| CN113412031A (en) * | 2021-06-21 | 2021-09-17 | 合肥联宝信息技术有限公司 | Heating module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100811 Termination date: 20151127 |