CN101778701B - 抛光垫 - Google Patents

抛光垫 Download PDF

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Publication number
CN101778701B
CN101778701B CN2008801027610A CN200880102761A CN101778701B CN 101778701 B CN101778701 B CN 101778701B CN 2008801027610 A CN2008801027610 A CN 2008801027610A CN 200880102761 A CN200880102761 A CN 200880102761A CN 101778701 B CN101778701 B CN 101778701B
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CN
China
Prior art keywords
polishing
polishing pad
grooves
workpiece
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008801027610A
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English (en)
Chinese (zh)
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CN101778701A (zh
Inventor
凯利·纽厄尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Corp
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Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of CN101778701A publication Critical patent/CN101778701A/zh
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Publication of CN101778701B publication Critical patent/CN101778701B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN2008801027610A 2007-08-16 2008-08-13 抛光垫 Active CN101778701B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US95629307P 2007-08-16 2007-08-16
US60/956,293 2007-08-16
PCT/US2008/009687 WO2009025748A1 (en) 2007-08-16 2008-08-13 Polishing pad

Publications (2)

Publication Number Publication Date
CN101778701A CN101778701A (zh) 2010-07-14
CN101778701B true CN101778701B (zh) 2012-06-27

Family

ID=40378437

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801027610A Active CN101778701B (zh) 2007-08-16 2008-08-13 抛光垫

Country Status (10)

Country Link
US (1) US20110183579A1 (https=)
EP (1) EP2193010B1 (https=)
JP (1) JP5307815B2 (https=)
KR (1) KR101203789B1 (https=)
CN (1) CN101778701B (https=)
IL (1) IL203461A (https=)
MY (1) MY154071A (https=)
SG (1) SG183738A1 (https=)
TW (1) TWI411495B (https=)
WO (1) WO2009025748A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8047899B2 (en) * 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
JP5426469B2 (ja) * 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
US8628384B2 (en) 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8657653B2 (en) * 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
CN102501187A (zh) * 2011-11-04 2012-06-20 厦门大学 区域压力调整抛光盘
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP2014104521A (ja) * 2012-11-26 2014-06-09 Toyo Tire & Rubber Co Ltd 研磨パッド
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
CN104044087B (zh) * 2014-06-18 2016-09-07 蓝思科技股份有限公司 一种蓝宝石抛光用铜盘及其修盘方法
CN106607749B (zh) * 2015-10-22 2019-01-22 中芯国际集成电路制造(上海)有限公司 一种阻挡型化学机械研磨垫及研磨装置
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
KR102777772B1 (ko) * 2018-11-27 2025-03-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
JP7659172B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
JP7659171B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
WO2022202008A1 (ja) * 2021-03-26 2022-09-29 富士紡ホールディングス株式会社 研磨パッド
CN113246015B (zh) * 2021-05-25 2022-09-20 万华化学集团电子材料有限公司 具有终点检测窗的抛光垫及其应用
CN115837633A (zh) * 2022-12-08 2023-03-24 上海芯谦集成电路有限公司 检测窗抛光垫沟槽的加工方法、抛光层及抛光垫
CN120588104B (zh) * 2025-08-08 2025-10-10 万华化学集团电子材料有限公司 抛光垫及晶圆抛光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020020816A (ko) * 1999-08-17 2002-03-15 갤반 마틴 일체식 창을 갖는 성형된 연마 패드
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
CN1614749A (zh) * 2003-11-04 2005-05-11 Jsr株式会社 化学机械抛光垫
CN1684798A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的具有窗口的抛光垫片
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2002001652A (ja) * 2000-06-22 2002-01-08 Nikon Corp 研磨パッド及び研磨装置及び素子製造方法
KR100858392B1 (ko) * 2001-04-25 2008-09-11 제이에스알 가부시끼가이샤 반도체 웨이퍼용 연마 패드와, 이를 구비한 반도체웨이퍼용 연마 적층체와, 반도체 웨이퍼의 연마 방법
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
JP4877448B2 (ja) * 2003-11-04 2012-02-15 Ｊｓｒ株式会社 化学機械研磨パッド
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
KR20060051345A (ko) * 2004-09-22 2006-05-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 유선형의 투시창을 구비한 씨엠피 패드
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020020816A (ko) * 1999-08-17 2002-03-15 갤반 마틴 일체식 창을 갖는 성형된 연마 패드
CN1684798A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的具有窗口的抛光垫片
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
CN1614749A (zh) * 2003-11-04 2005-05-11 Jsr株式会社 化学机械抛光垫
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-159340A 2005.06.16

Also Published As

Publication number Publication date
CN101778701A (zh) 2010-07-14
IL203461A (en) 2014-11-30
EP2193010A1 (en) 2010-06-09
TW200922748A (en) 2009-06-01
KR20100068255A (ko) 2010-06-22
TWI411495B (zh) 2013-10-11
SG183738A1 (en) 2012-09-27
JP2010536583A (ja) 2010-12-02
KR101203789B1 (ko) 2012-11-21
WO2009025748A1 (en) 2009-02-26
EP2193010A4 (en) 2013-10-16
US20110183579A1 (en) 2011-07-28
JP5307815B2 (ja) 2013-10-02
EP2193010B1 (en) 2020-01-08
MY154071A (en) 2015-04-30

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CP01 Change in the name or title of a patent holder

Address after: Illinois, USA

Patentee after: CMC Materials Co.,Ltd.

Address before: Illinois, USA

Patentee before: CABOT MICROELECTRONICS Corp.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Illinois, America

Patentee after: CMC Materials Co.,Ltd.

Address before: Illinois, America

Patentee before: CMC Materials Co.,Ltd.