CN101778697B - 具有成形轮廓的保持环 - Google Patents

具有成形轮廓的保持环 Download PDF

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Publication number
CN101778697B
CN101778697B CN2008800252700A CN200880025270A CN101778697B CN 101778697 B CN101778697 B CN 101778697B CN 2008800252700 A CN2008800252700 A CN 2008800252700A CN 200880025270 A CN200880025270 A CN 200880025270A CN 101778697 B CN101778697 B CN 101778697B
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CN
China
Prior art keywords
retaining ring
radius
curvature
ring
polishing
Prior art date
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Active
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CN2008800252700A
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English (en)
Chinese (zh)
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CN101778697A (zh
Inventor
高帕拉克里什那·B·普拉霍
原茵
俊宏·欧
格雷戈里·E·曼克
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of CN101778697A publication Critical patent/CN101778697A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T292/00—Closure fasteners
    • Y10T292/20—Clamps
    • Y10T292/205—Ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN2008800252700A 2007-07-19 2008-07-18 具有成形轮廓的保持环 Active CN101778697B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/780,335 2007-07-19
US11/780,335 US8033895B2 (en) 2007-07-19 2007-07-19 Retaining ring with shaped profile
PCT/US2008/070463 WO2009012444A1 (en) 2007-07-19 2008-07-18 Retaining ring with shaped profile

Publications (2)

Publication Number Publication Date
CN101778697A CN101778697A (zh) 2010-07-14
CN101778697B true CN101778697B (zh) 2012-10-31

Family

ID=39832643

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800252700A Active CN101778697B (zh) 2007-07-19 2008-07-18 具有成形轮廓的保持环

Country Status (7)

Country Link
US (2) US8033895B2 (enExample)
EP (1) EP2180977B1 (enExample)
JP (1) JP5355563B2 (enExample)
KR (1) KR101485410B1 (enExample)
CN (1) CN101778697B (enExample)
TW (1) TWI518009B (enExample)
WO (1) WO2009012444A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090311945A1 (en) * 2008-06-17 2009-12-17 Roland Strasser Planarization System
TWD139504S1 (zh) * 2009-08-19 2011-03-11 Ｓｍｃ股份有限公司 活塞之襯墊
US9074686B2 (en) * 2010-12-06 2015-07-07 Microflex Technologies Llc Ring seal retainer assembly and methods
US20130225050A1 (en) * 2012-02-24 2013-08-29 Apple Inc. Localized spot lapping on a larger work surface area
JP5957277B2 (ja) * 2012-04-28 2016-07-27 光洋機械工業株式会社 工作物の外周ｒ面研削用治具および外周ｒ面研削装置
US9193027B2 (en) * 2012-05-24 2015-11-24 Infineon Technologies Ag Retainer ring
KR101392401B1 (ko) * 2012-11-30 2014-05-07 이화다이아몬드공업 주식회사 컨디셔너 겸용 웨이퍼 리테이너링 및 상기 리테이너링 제조방법
US9487386B2 (en) 2013-01-16 2016-11-08 Infineon Technologies Ag Comb MEMS device and method of making a comb MEMS device
USD733560S1 (en) * 2013-06-25 2015-07-07 Lincoln Global, Inc. Packing bead ring for a wire coil
CN103394996B (zh) * 2013-08-14 2015-12-23 上海华力微电子有限公司 固定环
CN103419125B (zh) * 2013-08-14 2015-12-23 上海华力微电子有限公司 固定环
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
KR102173323B1 (ko) 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
US10252397B2 (en) 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10322492B2 (en) * 2016-07-25 2019-06-18 Applied Materials, Inc. Retaining ring for CMP
CN109420969B (zh) * 2017-08-29 2020-12-01 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
WO2019070757A1 (en) * 2017-10-04 2019-04-11 Applied Materials, Inc. RING RING DESIGN
CN109693174A (zh) * 2017-10-23 2019-04-30 中芯国际集成电路制造(上海)有限公司 一种研磨头和化学机械研磨装置
KR102485810B1 (ko) * 2018-03-02 2023-01-09 주식회사 윌비에스엔티 화학적 기계적 연마 장치의 리테이너 링
KR102702996B1 (ko) 2018-12-10 2024-09-04 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
CN115151376B (zh) 2020-07-08 2024-05-24 应用材料公司 多齿磁控保持环
KR102500158B1 (ko) * 2021-03-09 2023-02-15 (주)아이에스티 리테이너 링
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
WO2024049890A1 (en) * 2022-09-01 2024-03-07 Applied Materials, Inc. Retainer for chemical mechanical polishing carrier head
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19732175A1 (de) * 1996-07-30 1998-02-05 Tokyo Seimitsu Co Ltd Wafer-Poliermaschine
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
DE20309051U1 (de) * 2003-02-05 2003-11-20 Applied Materials, Inc., Santa Clara, Calif. Haltering mit Flansch für chemisch-mechanisches Polieren
JP2005005398A (ja) * 2003-06-10 2005-01-06 Seiko Epson Corp 研磨装置およびリテナーリング
DE10332624A1 (de) * 2003-07-17 2005-02-24 Siltronic Ag Verrundete Retainerringe

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US20020173242A1 (en) * 1999-04-19 2002-11-21 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6506105B1 (en) * 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6893327B2 (en) 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
US6869335B2 (en) 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
KR20040017126A (ko) * 2002-08-20 2004-02-26 삼성전자주식회사 화학적 기계적 연마 장치의 연마헤드
US6974371B2 (en) 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
KR101252751B1 (ko) * 2003-11-13 2013-04-09 어플라이드 머티어리얼스, 인코포레이티드 성형 표면을 갖는 유지 링
US20050113002A1 (en) * 2003-11-24 2005-05-26 Feng Chen CMP polishing heads retaining ring groove design for microscratch reduction
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US20050129708A1 (en) * 2003-12-15 2005-06-16 Makoto Fujii Fucoidan-based health food
US7033252B2 (en) * 2004-03-05 2006-04-25 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US7029375B2 (en) 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
US7186171B2 (en) * 2005-04-22 2007-03-06 Applied Materials, Inc. Composite retaining ring
KR20080031870A (ko) 2005-05-24 2008-04-11 엔테그리스, 아이엔씨. Ｃｍｐ 리테이닝 링
US7530153B2 (en) 2005-09-21 2009-05-12 Applied Materials, Inc. Attaching components of a carrier head
US7575504B2 (en) * 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
DE102006062017A1 (de) * 2006-12-29 2008-07-03 Advanced Micro Devices, Inc., Sunnyvale Haltering für ein chemisch-mechanisches Poliergerät

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19732175A1 (de) * 1996-07-30 1998-02-05 Tokyo Seimitsu Co Ltd Wafer-Poliermaschine
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
DE20309051U1 (de) * 2003-02-05 2003-11-20 Applied Materials, Inc., Santa Clara, Calif. Haltering mit Flansch für chemisch-mechanisches Polieren
JP2005005398A (ja) * 2003-06-10 2005-01-06 Seiko Epson Corp 研磨装置およびリテナーリング
DE10332624A1 (de) * 2003-07-17 2005-02-24 Siltronic Ag Verrundete Retainerringe

Also Published As

Publication number Publication date
US8388412B2 (en) 2013-03-05
JP5355563B2 (ja) 2013-11-27
US20090021024A1 (en) 2009-01-22
KR20100057815A (ko) 2010-06-01
JP2010533604A (ja) 2010-10-28
US8033895B2 (en) 2011-10-11
EP2180977A1 (en) 2010-05-05
WO2009012444A1 (en) 2009-01-22
CN101778697A (zh) 2010-07-14
TWI518009B (zh) 2016-01-21
US20120028548A1 (en) 2012-02-02
TW200920661A (en) 2009-05-16
EP2180977B1 (en) 2012-11-21
KR101485410B1 (ko) 2015-01-23

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