JP3148140U - 溝付き保持リング - Google Patents
溝付き保持リング Download PDFInfo
- Publication number
- JP3148140U JP3148140U JP2008600019U JP2008600019U JP3148140U JP 3148140 U JP3148140 U JP 3148140U JP 2008600019 U JP2008600019 U JP 2008600019U JP 2008600019 U JP2008600019 U JP 2008600019U JP 3148140 U JP3148140 U JP 3148140U
- Authority
- JP
- Japan
- Prior art keywords
- retaining ring
- channel
- channels
- angle
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
- 化学機械的研磨用保持リングにおいて、
2つ以上のチャネルを含む底部表面を有する実質的に環状のリングであって、前記チャネルのうち第1チャネルは、前記チャネルの前記第1チャネルと交差する前記保持リングの半径区分に対して第1角度にあり、前記チャネルの第2チャネルは、前記チャネルの前記第2チャネルと交差する前記保持リングの半径区分に対し第2角度にあり、前記第1角度は、前記第2角度と異なり、前記第1チャネルは、前記第2チャネルと交差しない、前記保持リング。 - 前記第1角度は、前記第2角度に対し約90度にある、請求項1に記載の保持リング。
- 前記リングは、少なくとも18個のチャネルを有する、請求項1に記載の保持リング。
- 前記第1チャネルは、前記第2チャネルと接触しない、請求項1に記載の保持リング。
- 前記底部表面は、各々が第1角度にある第1組のチャネルと、各々が第2角度にある第2組のチャネルと、を含み、前記第1組のチャネルは、前記基板の前記底部表面にわたり第2組のチャネルと交流する、請求項1に記載の保持リング。
- 前記第1組のチャネルは、各チャネルに対応する半径区分に対し約45度にあるチャネルを含み、前記第2組のチャネルは、各チャネルに対応する半径区分に対し約135度にあるチャネルを含む、請求項5に記載の保持リング。
- 前記リングは、36個のチャネルを含む、請求項1に記載の保持リング。
- 前記環状リングは、上部と下部とを有する、請求項1に記載の保持リング。
- 請求項1に記載の保持リングを作る方法。
- 請求項1に記載の保持リングを使用する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71310305P | 2005-08-30 | 2005-08-30 | |
PCT/US2006/034106 WO2007027944A1 (en) | 2005-08-30 | 2006-08-30 | Grooved retaining ring |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3148140U true JP3148140U (ja) | 2009-02-05 |
Family
ID=37440946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008600019U Expired - Fee Related JP3148140U (ja) | 2005-08-30 | 2006-08-30 | 溝付き保持リング |
Country Status (5)
Country | Link |
---|---|
US (1) | US7520795B2 (ja) |
JP (1) | JP3148140U (ja) |
CN (1) | CN201346739Y (ja) |
TW (2) | TW200710983A (ja) |
WO (1) | WO2007027944A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100138359A (ko) * | 2009-06-25 | 2010-12-31 | 신한다이아몬드공업 주식회사 | 다이아몬드 공구 |
US9227297B2 (en) * | 2013-03-20 | 2016-01-05 | Applied Materials, Inc. | Retaining ring with attachable segments |
KR102323430B1 (ko) * | 2014-03-31 | 2021-11-09 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마 장치 및 연마 방법 |
US9368371B2 (en) | 2014-04-22 | 2016-06-14 | Applied Materials, Inc. | Retaining ring having inner surfaces with facets |
US10500695B2 (en) * | 2015-05-29 | 2019-12-10 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
CN113997194B (zh) * | 2016-07-25 | 2024-04-05 | 应用材料公司 | 用于化学机械抛光的保持环 |
CN113519117B (zh) * | 2019-03-08 | 2023-11-21 | 三菱电机株式会社 | 旋转电机的检查方法、旋转电机以及旋转电机的检查系统 |
KR20220116322A (ko) * | 2020-07-08 | 2022-08-22 | 어플라이드 머티어리얼스, 인코포레이티드 | 다치형, 자기 제어 리테이닝 링 |
CN113276018B (zh) * | 2021-06-15 | 2022-10-04 | 北京烁科精微电子装备有限公司 | 一种化学机械抛光用保持环 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5944593A (en) | 1997-09-01 | 1999-08-31 | United Microelectronics Corp. | Retainer ring for polishing head of chemical-mechanical polish machines |
US6251215B1 (en) | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
US6527624B1 (en) * | 1999-03-26 | 2003-03-04 | Applied Materials, Inc. | Carrier head for providing a polishing slurry |
US6224472B1 (en) | 1999-06-24 | 2001-05-01 | Samsung Austin Semiconductor, L.P. | Retaining ring for chemical mechanical polishing |
JP2005515904A (ja) | 2002-01-22 | 2005-06-02 | マルチ プレイナー テクノロジーズ インコーポレイテッド | スラリー分配のための形状付けされた表面を持つ保持リングを有する化学的機械研磨装置及び方法 |
US6869335B2 (en) * | 2002-07-08 | 2005-03-22 | Micron Technology, Inc. | Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces |
US20050126708A1 (en) * | 2003-12-10 | 2005-06-16 | Applied Materials, Inc. | Retaining ring with slurry transport grooves |
CN101022920A (zh) | 2004-05-13 | 2007-08-22 | 应用材料股份有限公司 | 具有导电部分的固定环 |
US7608173B2 (en) | 2004-12-02 | 2009-10-27 | Applied Materials, Inc. | Biased retaining ring |
US7029375B2 (en) * | 2004-08-31 | 2006-04-18 | Tech Semiconductor Pte. Ltd. | Retaining ring structure for edge control during chemical-mechanical polishing |
-
2006
- 2006-08-29 US US11/468,267 patent/US7520795B2/en not_active Expired - Fee Related
- 2006-08-30 TW TW095132055A patent/TW200710983A/zh unknown
- 2006-08-30 WO PCT/US2006/034106 patent/WO2007027944A1/en active Application Filing
- 2006-08-30 JP JP2008600019U patent/JP3148140U/ja not_active Expired - Fee Related
- 2006-08-30 CN CNU2006900000509U patent/CN201346739Y/zh not_active Expired - Lifetime
- 2006-08-30 TW TW097204117U patent/TWM356214U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWM356214U (en) | 2009-05-01 |
WO2007027944A1 (en) | 2007-03-08 |
CN201346739Y (zh) | 2009-11-18 |
TW200710983A (en) | 2007-03-16 |
US7520795B2 (en) | 2009-04-21 |
US20070044913A1 (en) | 2007-03-01 |
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