CN101772272A - Design technique for internal layer plate edge of multi-layer printing circuit board - Google Patents
Design technique for internal layer plate edge of multi-layer printing circuit board Download PDFInfo
- Publication number
- CN101772272A CN101772272A CN200810241942A CN200810241942A CN101772272A CN 101772272 A CN101772272 A CN 101772272A CN 200810241942 A CN200810241942 A CN 200810241942A CN 200810241942 A CN200810241942 A CN 200810241942A CN 101772272 A CN101772272 A CN 101772272A
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- internal layer
- circuit board
- film
- plate edge
- printing circuit
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a design technique for an internal layer plate edge of a multi-layer printing circuit board, which can better solve the problem of the quality defect of many short circuits or residual coppers among lines after finishing and can also have less investment. The invention adopts the following technical scheme that an image transfer tool, i.e. a film negative is utilized in the product manufacturing process, and the exposed negative frame is designed into a non-transparent blackness. By using the film negative designed according to the method, the quality of a manufactured product is remarkably enhanced, the previous poor qualities of residual coppers or short circuits in the internal layer plate caused by broken plate edges are effectively improved without increasing the production cost.
Description
Technical field
The invention belongs to electronic devices and components and make the field, refer more particularly to a kind of multilayer line inner cord manufacturing technology, design specific to the exposure film edges of boards in the inner plating manufacture process.
Background technology
Wiring board is the basic raw material of electronic industry, and it will play the effect that connects each electronic devices and components and the mutual conducting of interlayer, transmits signal.In the multilayer line inner cord manufacturing process, the quality defect of more short circuit or residual copper appears between the circuit after exposure, development, etching process are finished.
China's wiring board manufacturing technology also is not very ripe, and most of flow process does not adopt whole automations, and employee's operative skill is unskilled relatively, and the product quality of producing is very unstable.Under this kind condition, China's wiring board manufacturing still has been in inferior position.Present stage, country encourages scientific and technical innovation, how to accomplish the low product quality that just can effectively improve that drops into, and this has become the problem of urgent solution of manufacturing enterprise.
At this problem, follow the trail of in the source of quality defects such as residual copper that we carry out or short circuit, in conjunction with the experience that produced on-site, management work sum up, self-innovation a kind of method that can effectively reduce this quality defect, make this quality defect on original basis, reduce half.
Summary of the invention
The present invention is directed to the existing problem of existing technology, a kind of problem that occurs the quality defect of more short circuit or residual copper after finishing between the circuit that both can solve preferably is provided, can accomplish the low internal layer plate edge of multi-layer printing circuit board designing technique that drops into again.
The present invention is for realizing described quality improving to residual copper or short circuit in the wiring board manufacturing process, adopt following technology: it mainly is the image transfer instrument to using in the manufacture course of products a---film egative film, design especially, prevent that photosensitive material from producing film and going to sticks and staves the entering plate face behind exposure imaging, and cause product defects.
Multi-layer sheet internal layer exposure egative film frame commonly used is generally to be designed to transparence, and the film of the present invention designs especially: we are designed to opaque black powder with it.Like this, in exposure process, just can well protect the photosensitive dry film of inner plating edges of boards or printing ink not to be exposed.
After adopting the method multilayer line inner cord quality improving being had tangible effect, is a kind of more satisfactory residual copper of wiring board or the control device of short circuit quality defect.
Embodiment
Further illustrate the present invention below by case study on implementation, but following case study on implementation must not be interpreted as the restriction to technical scheme of the present invention:
Adopt following technology: it mainly is the image transfer instrument to using in the manufacture course of products a---film egative film, designs especially, prevents that photosensitive material from producing film and going to sticks and staves the entering plate face behind exposure imaging, and causes product defects.
Multi-layer sheet internal layer machining process route is as follows:
Material → pre-treatment → internal layer photosensitive dry film or photosensitive-ink → exposure → development/etching/move back film → AOI → black/brown oxidation → walkthrough (fusion, rivet) → row's plate → pressing plate → brill location hole → pressing plate moulding → outer layer process left by substrate.
Multi-layer sheet internal layer exposure egative film frame commonly used is generally to be designed to transparence, the film is designed especially: it is designed to opaque black powder, like this, just can well protects the photosensitive dry film of inner plating edges of boards or printing ink not to be exposed in exposure process.
Directly wash unnecessary photosensitive dry film of edges of boards or printing ink by liquid medicine in the follow-up developing process, thereby stop the broken generation of film, avoided quality defects such as the residual copper that causes thus or short circuit from the source.
Multi-layer sheet internal layer exposure egative film after the improvement in use is noted that signs such as not inscribing literal on frame, otherwise can destroy the black light blocking layer, causes broken the repeating of film in the exposure process.
Use the film egative film of the method design, the product quality of making has obvious lifting, and edges of boards film residual copper of the broken inner plating that causes or short circuit quality are bad before effectively having improved, and our production cost does not increase fully.Zero input has but been brought huge benefit, and this is the wiring board manufacture method and the skill that press for of enterprise just.
Claims (3)
1. a design technique for internal layer plate edge of multi-layer printing circuit board is characterized in that: the image transfer instrument that uses in manufacture course of products---film egative film.
2. a kind of design technique for internal layer plate edge of multi-layer printing circuit board according to claim 1 is characterized in that: the film is designed especially: it is designed to opaque black powder.
3. a kind of design technique for internal layer plate edge of multi-layer printing circuit board according to claim 1 is characterized in that: the multi-layer sheet internal layer exposure egative film after the improvement in use is noted that signs such as not inscribing literal on frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810241942A CN101772272A (en) | 2008-12-30 | 2008-12-30 | Design technique for internal layer plate edge of multi-layer printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810241942A CN101772272A (en) | 2008-12-30 | 2008-12-30 | Design technique for internal layer plate edge of multi-layer printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101772272A true CN101772272A (en) | 2010-07-07 |
Family
ID=42504729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810241942A Pending CN101772272A (en) | 2008-12-30 | 2008-12-30 | Design technique for internal layer plate edge of multi-layer printing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101772272A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596367A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Printed circuit board inner film and processing method of printed circuit board |
| CN109121302A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Edges of boards design method, the design method of wiring board and the wiring board of wiring board |
-
2008
- 2008-12-30 CN CN200810241942A patent/CN101772272A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596367A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Printed circuit board inner film and processing method of printed circuit board |
| CN109121302A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Edges of boards design method, the design method of wiring board and the wiring board of wiring board |
| CN109121302B (en) * | 2018-09-28 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Circuit board edge design method and circuit board design method |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100707 |