CN101740426B - 半导体装置的制造方法 - Google Patents
半导体装置的制造方法 Download PDFInfo
- Publication number
- CN101740426B CN101740426B CN200910208198.1A CN200910208198A CN101740426B CN 101740426 B CN101740426 B CN 101740426B CN 200910208198 A CN200910208198 A CN 200910208198A CN 101740426 B CN101740426 B CN 101740426B
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- solder layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP297573/08 | 2008-11-21 | ||
JP2008297573A JP5427394B2 (ja) | 2008-11-21 | 2008-11-21 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101740426A CN101740426A (zh) | 2010-06-16 |
CN101740426B true CN101740426B (zh) | 2012-05-30 |
Family
ID=42196698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910208198.1A Expired - Fee Related CN101740426B (zh) | 2008-11-21 | 2009-11-02 | 半导体装置的制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8193084B2 (zh) |
JP (1) | JP5427394B2 (zh) |
CN (1) | CN101740426B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9721872B1 (en) | 2011-02-18 | 2017-08-01 | Amkor Technology, Inc. | Methods and structures for increasing the allowable die size in TMV packages |
US9799592B2 (en) | 2013-11-19 | 2017-10-24 | Amkor Technology, Inc. | Semicondutor device with through-silicon via-less deep wells |
KR101366461B1 (ko) | 2012-11-20 | 2014-02-26 | 앰코 테크놀로지 코리아 주식회사 | 반도체 디바이스 및 그 제조 방법 |
KR101607981B1 (ko) | 2013-11-04 | 2016-03-31 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지 |
US9219044B2 (en) * | 2013-11-18 | 2015-12-22 | Applied Materials, Inc. | Patterned photoresist to attach a carrier wafer to a silicon device wafer |
JP2017069380A (ja) * | 2015-09-30 | 2017-04-06 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US10134708B2 (en) | 2016-08-05 | 2018-11-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package with thinned substrate |
US9960328B2 (en) | 2016-09-06 | 2018-05-01 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1832658A (zh) * | 2005-03-10 | 2006-09-13 | 3M创新有限公司 | 一种双层金属的柔性印刷电路板及其制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05200974A (ja) * | 1992-01-28 | 1993-08-10 | Fujitsu Ltd | スクリーン印刷方法 |
JP3267167B2 (ja) * | 1995-09-20 | 2002-03-18 | 富士通株式会社 | 半導体装置とその製造方法 |
TW396462B (en) * | 1998-12-17 | 2000-07-01 | Eriston Technologies Pte Ltd | Bumpless flip chip assembly with solder via |
US6380060B1 (en) * | 2000-03-08 | 2002-04-30 | Tessera, Inc. | Off-center solder ball attach and methods therefor |
JP2002100860A (ja) * | 2000-09-22 | 2002-04-05 | Ibiden Co Ltd | プリント配線板の製造方法 |
JP2002353606A (ja) * | 2002-05-27 | 2002-12-06 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
JP2005303258A (ja) * | 2004-03-16 | 2005-10-27 | Fujikura Ltd | デバイス及びその製造方法 |
TWI288447B (en) * | 2005-04-12 | 2007-10-11 | Siliconware Precision Industries Co Ltd | Conductive bump structure for semiconductor device and fabrication method thereof |
JP2007165696A (ja) * | 2005-12-15 | 2007-06-28 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
-
2008
- 2008-11-21 JP JP2008297573A patent/JP5427394B2/ja active Active
-
2009
- 2009-11-02 CN CN200910208198.1A patent/CN101740426B/zh not_active Expired - Fee Related
- 2009-11-20 US US12/591,491 patent/US8193084B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1832658A (zh) * | 2005-03-10 | 2006-09-13 | 3M创新有限公司 | 一种双层金属的柔性印刷电路板及其制造方法 |
Non-Patent Citations (1)
Title |
---|
JP特开2002-217225A 2002.08.02 |
Also Published As
Publication number | Publication date |
---|---|
US8193084B2 (en) | 2012-06-05 |
CN101740426A (zh) | 2010-06-16 |
US20100130000A1 (en) | 2010-05-27 |
JP5427394B2 (ja) | 2014-02-26 |
JP2010123833A (ja) | 2010-06-03 |
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