CN101740401A - 一种制作高精度定位孔的方法 - Google Patents
一种制作高精度定位孔的方法 Download PDFInfo
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- CN101740401A CN101740401A CN200810227301A CN200810227301A CN101740401A CN 101740401 A CN101740401 A CN 101740401A CN 200810227301 A CN200810227301 A CN 200810227301A CN 200810227301 A CN200810227301 A CN 200810227301A CN 101740401 A CN101740401 A CN 101740401A
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CN200810227301A CN101740401A (zh) | 2008-11-26 | 2008-11-26 | 一种制作高精度定位孔的方法 |
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CN200810227301A CN101740401A (zh) | 2008-11-26 | 2008-11-26 | 一种制作高精度定位孔的方法 |
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CN101740401A true CN101740401A (zh) | 2010-06-16 |
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CN200810227301A Withdrawn CN101740401A (zh) | 2008-11-26 | 2008-11-26 | 一种制作高精度定位孔的方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103203981A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 带有定位点的smt模板及其制造方法 |
CN103745966A (zh) * | 2014-01-23 | 2014-04-23 | 无锡江南计算技术研究所 | 封装基板表层铜柱电镀的辅助图形结构 |
CN103857202A (zh) * | 2012-12-07 | 2014-06-11 | 北大方正集团有限公司 | 印刷电路板及其铜柱制作方法 |
CN113225937A (zh) * | 2021-05-19 | 2021-08-06 | 惠州市金百泽电路科技有限公司 | 一种应用于高密度互连电路板无芯板的制作方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103203981A (zh) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | 带有定位点的smt模板及其制造方法 |
CN103857202A (zh) * | 2012-12-07 | 2014-06-11 | 北大方正集团有限公司 | 印刷电路板及其铜柱制作方法 |
CN103857202B (zh) * | 2012-12-07 | 2017-02-08 | 北大方正集团有限公司 | 印刷电路板及其铜柱制作方法 |
CN103745966A (zh) * | 2014-01-23 | 2014-04-23 | 无锡江南计算技术研究所 | 封装基板表层铜柱电镀的辅助图形结构 |
CN103745966B (zh) * | 2014-01-23 | 2016-04-13 | 无锡江南计算技术研究所 | 封装基板表层铜柱电镀的辅助图形结构 |
CN113225937A (zh) * | 2021-05-19 | 2021-08-06 | 惠州市金百泽电路科技有限公司 | 一种应用于高密度互连电路板无芯板的制作方法 |
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Legal Events
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C06 | Publication | ||
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ZHUHAI YUEYA PACKAGE SUBSTRATE TECHNOLOGY CO., LTD Free format text: FORMER OWNER: BEIDA FANGZHENG GROUP CO. LTD. Effective date: 20110905 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100871 HAIDIAN, BEIJING TO: 519173 ZHUHAI, GUANGDONG PROVINCE |
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TA01 | Transfer of patent application right |
Effective date of registration: 20110905 Address after: 519173 Fangzheng PCB Industrial Park, Toyama Industrial Zone, dry town, Doumen District, Zhuhai, Guangdong Applicant after: Zhuhai Advanced Chip Carriers & Electronic Substrates Solutions Technologie Co., Ltd. Address before: 100871 Beijing, Haidian District Road, building No. 298, founder of the building, Zhongguancun, layer 9 Applicant before: Peking Founder Group Co., Ltd. |
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C04 | Withdrawal of patent application after publication (patent law 2001) | ||
WW01 | Invention patent application withdrawn after publication |
Open date: 20100616 |