CN101730385A - 电路板结构 - Google Patents

电路板结构 Download PDF

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Publication number
CN101730385A
CN101730385A CN200810304860A CN200810304860A CN101730385A CN 101730385 A CN101730385 A CN 101730385A CN 200810304860 A CN200810304860 A CN 200810304860A CN 200810304860 A CN200810304860 A CN 200810304860A CN 101730385 A CN101730385 A CN 101730385A
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Prior art keywords
circuit board
flexible circuit
sheet material
board
board structure
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CN200810304860A
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CN101730385B (zh
Inventor
曹昌湋
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Shenzhen Futaihong Precision Industry Co Ltd
Chi Mei Communication Systems Inc
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Shenzhen Futaihong Precision Industry Co Ltd
Chi Mei Communication Systems Inc
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Priority to CN2008103048609A priority Critical patent/CN101730385B/zh
Priority to US12/393,152 priority patent/US7989709B2/en
Publication of CN101730385A publication Critical patent/CN101730385A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种电路板结构，其包括一软性电路板及与所述软性电路板相粘接的板材。所述软性电路板包括一用于与电子元件连接的第一表面以及一与所述第一表面相对的第二表面，所述第二表面用于与印刷电路板连接。所述板材粘接于所述软性电路板的第一表面上。所述板材上开设有通孔，所述通孔用于露出软性电路板的第一表面上与电子元件进行连接的部分区域。所述板材对应所述软性电路板需要弯折的位置设有折断线。所述板材加强了所述软性电路板的强度使得所述软性电路板的第二表面可通过表面贴装技术直接与印刷电路板连接。

Description

电路板结构
技术领域
本发明涉及一种电路板结构。
背景技术
软性电路板(Flexible Printed Circuits，FPC)由绝缘基材、接着剂和铜导体层叠而成，因其采用了具有可挠性的有机薄膜做为绝缘基材所以具有可挠、轻薄等物理特性，可配合实际电路设计的需要以弯曲的形状嵌入经过加工的导体，大大地增强了电路设计的灵活性。
现有的软性电路板与印刷电路板(Printed Circuit Board)之间的连接方法通常为：1、通过零插拔力连接器(Zero Insertion Force Connector，ZIF Connector)进行连接；2、通过焊接热压制程(Thermal Compression Bond，TCB)把软性电路板焊接在印刷电路板上；3、通过手工焊接制程将软性电路板焊接在印刷电路板上。但是，使用零插拔力连接器进行连接会增加因使用连接器所带来的成本，而且连接器的存在也会增加产品的厚度而不利于实现薄型化。若使用焊接热压制程和手工焊接制程则需要在生产过程中增加工序从而会降低产品良率和生产效率。
可以考虑的是通过自动化程度较高的表面贴装技术(Surface Mounted Technology，SMT)直接把软性电路板贴装在印刷电路板上以提高产品良率和生产效率，但因软性电路板过于柔软而不便于在贴装机上进行操作。
发明内容
有鉴于此，有必要提供一种可通过表面贴装技术与印刷电路板直接连接的电路板结构。
一种电路板结构，其包括一软性电路板及与所述软性电路板相粘接的板材。所述软性电路板包括一用于与电子元件连接的第一表面以及一与所述第一表面相对的第二表面，所述第二表面用于与印刷电路板连接。所述板材粘接于所述软性电路板的第一表面上。所述板材上开设有通孔，所述通孔用于露出软性电路板的第一表面上与电子元件进行连接的部分区域。所述板材对应所述软性电路板需要弯折的位置设有折断线。
相对于现有技术，本发明所提供的电路板结构通过在软性电路板上粘接板材，增强了软性电路板的强度，使得软性电路板可以通过表面贴装制程直接贴装在印刷电路板上从而减少了软性电路板因使用连接器与印刷电路板连接而增加的厚度，缩短了连接工序，提高了产品良率。其次，通过在板材上对应软性电路板需要弯折的地方设置折断线从而保持了软性电路板的可挠性，增加了电路设计时立体布线的灵活性。
附图说明
图1是本发明一实施方式所提供的电路板结构的立体图。
图2是图1所示的电路板结构的另一角度立体图。
图3是图1所示的电路板结构与电子元件的立体分解图。
具体实施方式
如图1、图2和图3所示，本发明一实施方式所提供的电路板结构2包括一软性电路板22以及一与所述软性电路板22粘接的板材24。所述软性电路板22包括一第一表面220以及一与第一表面220相对的第二表面221。所述板材24通过粘合剂与所述软性电路板22的第一表面220粘接。所述软性电路板22的第一表面220用于与电子元件23相连接，所述软性电路板22的第二表面221通过表面贴装技术直接与印刷电路板连接。
如图2所示，所述软性电路板22的第二表面221在与印刷电路板电连接的位置处开设有连接孔222。所述连接孔222用于在表面贴装的回流焊接过程中增加软性电路板22的吃锡效果以加强所述软性电路板22与印刷电路板之间的电连接可靠性。
所述板材24的厚度的选择范围为0.1毫米至0.3毫米。所述板材24用于增强软性电路板22的强度以使得所述电路板结构2可以被贴装机的真空吸嘴吸取而运送至需要安装的印刷电路板上进行贴装。如图1所示，所述板材24上开设有通孔240。所述通孔240用于露出软性电路板22的第一表面220上用于与电子元件23进行连接的部分区域，以使得电子元件23的引脚(图未示)可直接与所述软性电路板22连接。所述通孔240的形状及大小根据需要连接的电子元件23的引脚排布而定。
如图1和图3所示，为了增强所述电路板结构2的可挠性，所述板材24对应所述软性电路板22需要折弯的位置设置有折断线242。所述电路板结构2可根据电路组装的需要沿所述折断线242进行弯折，以增加电路设计时立体布线的灵活性。
在本发明中的实施方式中，所述板材24为耐高温的硬质材料，如：聚碳酸酯、环氧树脂、酚醛树脂等，以防止所述板材24在表面贴装的回流焊接过程中因高温分解而导致所述电路板结构2的强度降低。
当需要对贴装好的所述软性电路板22进行重新加工时，将软性电路板22需要重新加工的部分所对应的板材24撕开便可直接对软性电路板22的该部分进行重新加工。
本发明实施方式所提供的电路板结构通过在软性电路板上粘接板材，以增强软性电路板的强度，使得软性电路板可以通过表面贴装制程直接贴装在印刷电路板上而无需使用连接器从而减少软性电路板与印刷电路板的连接厚度，缩短连接工序，提高产品良率。其次，板材上对应软性电路板需要弯折的地方设置的折断线使电路板结构仍具有一定的可挠性，有利于增加电路设计时立体布线的灵活性。
最后应说明的是，以上实施方式仅用以说明本发明的技术方案而非限制，尽管参照实施方式对本发明进行了详细说明，本领域的普通技术人员应当理解，对本发明的实时方式进行修改或等同替换，仍不脱离本发明的精神和范围。

Claims (5)

1.一种电路板结构，其包括一软性电路板，所述软性电路板包括一用于与电子元件连接的第一表面以及一与所述第一表面相对的第二表面，所述第二表面用于与印刷电路板连接，其特征在于，所述电路板结构进一步包括一与所述软性电路板粘接的板材，所述板材粘接于所述软性电路板的第一表面上，所述板材上开设有通孔，所述通孔用于露出软性电路板的第一表面上与电子元件进行连接的部分区域，所述板材对应所述软性电路板需要弯折的位置设有折断线。
2.如权利要求1所述的电路板结构，其特征在于，所述板材为耐高温的硬质材料。
3.如权利要求1所述的电路板结构，其特征在于，所述板材的材料为聚碳酸酯、环氧树脂或酚醛树脂中的一种。
4.如权利要求1所述的电路板结构，其特征在于，所述板材的厚度的选择范围为0.1毫米至0.3毫米。
5.如权利要求1所述的电路板结构，其特征在于，所述板材的第二表面在与印刷电路板电连接的位置处开设有连接孔。
CN2008103048609A 2008-10-10 2008-10-10 电路板结构 Expired - Fee Related CN101730385B (zh)

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CN2008103048609A CN101730385B (zh) 2008-10-10 2008-10-10 电路板结构
US12/393,152 US7989709B2 (en) 2008-10-10 2009-02-26 Flexible sheet with electrical connecting locations engaging through holes in a rigid substrate

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CN112074086A (zh) * 2020-08-12 2020-12-11 黄石市星光电子有限公司 一种新型立体3d电路板的制作方法

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US20100091468A1 (en) 2010-04-15
US7989709B2 (en) 2011-08-02
CN101730385B (zh) 2012-07-04

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