201018328 九、發明說明： , 【發明所屬之技術領域】 本發明涉及一種電路板結構。 【先前技術】 軟性電路板（Flexible Printed Circuits, FPC)由絕緣基 材、接著劑和銅導體層疊而成，因其採用了具有可撓性之 有機薄膜做為絕緣基材所以具有可撓、輕薄等物理特性， 可配合實際電路設計之需要以彎曲之形狀嵌入經過加工之 ® 導體，大大地增強了電路設計之靈活性。 現有之軟性電路板與印刷電路板（Printed Circuit Board) 之間之連接方法通常為：1、通過零插拔力連接器（Zero Insertion Force Connector，ZIF Connector)進行連接；2、通 過焊接熱壓製程（Thermal Compression Bond，TCB)把軟性 電路板焊接於印刷電路板上；3、通過手工焊接製程將軟性 電路板焊接於印刷電路板上。但是，使用零插拔力連接器 為進行連接會增加因使用連接器所帶來之成本，而且連接器 之存在也會增加產品之厚度而不利於實現薄型化。若使用 焊接熱壓製程和手工焊接製程則需要在生產過程中增加工 序從而會降低產品良率和生產效率。 可考慮之係通過自動化程度較高之表面貼裝技術 (Surface Mounted Technology, SMT)直接把軟性電路板貼裝 在印刷電路板上以提高產品良率和生產效率，但因軟性電 路板過於柔軟而不便於在貼裝機上進行操作。 201018328 【發明内容】 . 有鑒於此，有必要提供一種可通過表面貼裝技術與印 . 刷電路板直接連接之電路板結構。 一種電路板結構，其包括一軟性電路板及與該軟性電 路板相黏接之板材。該軟性電路板包括一用於與電子元件 連接之第一表面以及一與該第一表面相對之第二表面，該 第二表面用於與印刷電路板連接。該板材黏接於該軟性電 路板之第一表面上。該板材上開設有通孔，該通孔用於露 出軟性電路板之第一表面上與電子元件進行連接之部分區 域。該板材對應該軟性電路板需要彎折之位置設有折斷線。 相對於先前技術，本發明所提供之電路板結構通過在 軟性電路板上黏接板材，增強了軟性電路板之強度，使得 軟性電路板可通過表面貼裝製程直接貼裝於印刷電路板上 從而減少了軟性電路板因使用連接器與印刷電路板連接而 增加之厚度，縮短了連接工序，提高了產品良率。其次， Q 通過在板材上對應軟性電路板需要彎折之地方設置折斷線 從而保持了軟性電路板之可撓性，增加了電路設計時立體 佈線之靈活性。 【實施方式】 如圖1、圖2和圖3所示，本發明一實施方式所提供之 電路板結構2包括一軟性電路板22以及一與該軟性電路板 22黏接之板材24。該軟性電路板22包括一第一表面220 以及一與第一表面220相對之第二表面221。該板材24通 201018328 過黏合劑與該軟性電路板22之第一表面220黏接。該軟性 ， 電路板22之第一表面220用於與電子元件23相連接，該 . 軟性電路板22之第二表面221通過表面貼裝技術直接與印 刷電路板連接。 如圖2所示，該軟性電路板22之第二表面221於與印 刷電路板電連接之位置處開設有連接孔222。該連接孔222 用於在表面貼裝之回流焊接過程中增加軟性電路板22之吃201018328 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a circuit board structure. [Prior Art] Flexible Printed Circuits (FPC) are formed by laminating an insulating substrate, an adhesive, and a copper conductor, and are flexible, thin, etc. because they use a flexible organic film as an insulating substrate. The physical characteristics, which can be embedded in the machined® conductor in a curved shape to meet the needs of the actual circuit design, greatly enhance the flexibility of the circuit design. The connection between the existing flexible circuit board and the printed circuit board is usually as follows: 1. Connecting through a Zero Insertion Force Connector (ZIF Connector); 2. Passing a hot pressing process by soldering (Thermal Compression Bond, TCB) solders the flexible circuit board to the printed circuit board; 3. solders the flexible circuit board to the printed circuit board by a manual soldering process. However, the use of a zero insertion force connector increases the cost of using the connector, and the presence of the connector also increases the thickness of the product and is not conducive to thinning. If welding hot stamping and manual soldering processes are used, it is necessary to increase the number of steps in the production process, which will reduce product yield and productivity. It can be considered that the flexible circuit board is directly mounted on the printed circuit board by the highly automated Surface Mounted Technology (SMT) to improve product yield and production efficiency, but the flexible circuit board is too soft. It is not convenient to operate on the placement machine. 201018328 SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a circuit board structure that can be directly connected to a printed circuit board by surface mount technology. A circuit board structure comprising a flexible circuit board and a board bonded to the flexible circuit board. The flexible circuit board includes a first surface for connection to the electronic component and a second surface opposite the first surface for connection to the printed circuit board. The sheet is adhered to the first surface of the flexible circuit board. The plate is provided with a through hole for exposing a portion of the first surface of the flexible circuit board to which the electronic component is connected. The sheet is provided with a broken line at a position where the flexible circuit board needs to be bent. Compared with the prior art, the circuit board structure provided by the present invention enhances the strength of the flexible circuit board by bonding the board on the flexible circuit board, so that the flexible circuit board can be directly mounted on the printed circuit board through the surface mount process. The thickness of the flexible circuit board is increased due to the connection of the connector to the printed circuit board, the connection process is shortened, and the product yield is improved. Secondly, Q maintains the flexibility of the flexible circuit board by providing a break line on the board where the corresponding flexible circuit board needs to be bent, thereby increasing the flexibility of the three-dimensional wiring during circuit design. [Embodiment] As shown in FIG. 1, FIG. 2 and FIG. 3, a circuit board structure 2 according to an embodiment of the present invention includes a flexible circuit board 22 and a board 24 bonded to the flexible circuit board 22. The flexible circuit board 22 includes a first surface 220 and a second surface 221 opposite the first surface 220. The sheet 24 is connected to the first surface 220 of the flexible circuit board 22 by an adhesive. The softness, the first surface 220 of the circuit board 22 is for connection to the electronic component 23, and the second surface 221 of the flexible circuit board 22 is directly connected to the printed circuit board by surface mount technology. As shown in FIG. 2, the second surface 221 of the flexible circuit board 22 is provided with a connection hole 222 at a position electrically connected to the printed circuit board. The connecting hole 222 is used for adding the soft circuit board 22 during the surface mount reflow soldering process.
錫效果以加強該軟性電路板22與印刷電路板之間之電連接 A 可靠性。 該板材24之厚度之選擇範圍為0.1毫米至0.3毫米。 該板材24用於增強軟性電路板22之強度以使得該電路板 結構2可被貼裝機之真空吸嘴吸取而運送至需要安裝之印 刷電路板上進行貼裝。如圖1所示，該板材24上開設有通 孔240。該通孔240用於露出軟性電路板22之第一表面220 上用於與電子元件23進行連接之部分區域，以使得電子元 φ 件23之引腳（圖未示）可直接與該軟性電路板22連接。該通 孔240之形狀及大小根據需要連接之電子元件23之引腳排 佈而定。 如圖1和圖3所示，為了增強該電路板結構2之可撓 性，該板材24對應該軟性電路板22需要折彎之位置設置 有折斷線242。該電路板結構2可根據電路組裝之需要沿該 折斷線242進行彎折，以增加電路設計時立體佈線之靈活 性。 在本發明中之實施方式中5該板材24為财而溫之硬質 8 201018328 材料，如：聚碳酸醋、環氧樹脂、紛媒樹脂等，以防止該 . 板材24於表面貼裝之回流焊接過程中因高溫分解而導致該 . 電路板結構2之強度降低。 當需要對貼裝好之該軟性電路板22進行重新加工時， 將軟性電路板22需要重新加工之部分所對應之板材24撕 開便可直接對軟性電路板22之該部分進行重新加工。 本發明實施方式所提供之電路板結構通過在軟性電路 板上黏接板材，以增強軟性電路板之強度，使得軟性電路 ^ 板可通過表面貼裝製程直接貼裝在印刷電路板上而無需使 用連接器從而減少軟性電路板與印刷電路板之連接厚度， 縮短連接工序，提高產品良率。其次，板材上對應軟性電 路板需要彎折之地方設置之折斷線使電路板結構仍具有一 定之可撓性，有利於增加電路設計時立體佈線之靈活性。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 φ 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明一實施方式所提供之電路板結構之立體 圖。 圖2係圖1所示之電路板結構之另一角度立體圖。 圖3係圖1所示之電路板結構與電子元件之立體分解 201018328 【主要元件符號說明】 電路板結構 2 軟性電路板 22 板材 24 第一表面 220 第二表面 221 電子元件 23 連接孔 222 通孔 240 折斷線 242The tin effect enhances the electrical connection A reliability between the flexible circuit board 22 and the printed circuit board. The thickness of the sheet 24 can be selected from 0.1 mm to 0.3 mm. The sheet 24 is used to reinforce the strength of the flexible circuit board 22 such that the board structure 2 can be picked up by the vacuum nozzle of the placement machine and transported to the printed circuit board to be mounted for mounting. As shown in Fig. 1, the plate member 24 is provided with a through hole 240. The through hole 240 is used to expose a portion of the first surface 220 of the flexible circuit board 22 for connecting with the electronic component 23, so that the pin (not shown) of the electronic component φ 23 can directly connect to the flexible circuit. The plates 22 are connected. The shape and size of the through hole 240 depends on the pin arrangement of the electronic component 23 to be connected. As shown in Figs. 1 and 3, in order to enhance the flexibility of the circuit board structure 2, the plate member 24 is provided with a break line 242 at a position where the flexible circuit board 22 needs to be bent. The circuit board structure 2 can be bent along the break line 242 as needed for circuit assembly to increase the flexibility of the three-dimensional wiring during circuit design. In the embodiment of the present invention, the plate material 24 is a hard and hard material 8 201018328 material, such as polycarbonate, epoxy resin, varnish resin, etc., to prevent the plate 24 from being reflow soldered on the surface mount. The strength of the circuit board structure 2 is reduced due to pyrolysis during the process. When it is necessary to rework the mounted flexible circuit board 22, the portion of the flexible circuit board 22 can be directly reworked by tearing the board 24 corresponding to the portion of the flexible circuit board 22 that needs to be reworked. The circuit board structure provided by the embodiment of the present invention enhances the strength of the flexible circuit board by bonding the board on the flexible circuit board, so that the flexible circuit board can be directly mounted on the printed circuit board through the surface mount process without using The connector thus reduces the thickness of the connection between the flexible circuit board and the printed circuit board, shortens the connection process, and improves product yield. Secondly, the broken line provided on the board corresponding to the flexible circuit board needs to be bent to make the circuit board structure still have certain flexibility, which is beneficial to increase the flexibility of the three-dimensional wiring during circuit design. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of a circuit board according to an embodiment of the present invention. 2 is another perspective view of the circuit board structure shown in FIG. 1. 3 is a perspective exploded view of the circuit board structure and electronic components shown in FIG. 1 201018328 [Main component symbol description] Circuit board structure 2 Flexible circuit board 22 Plate 24 First surface 220 Second surface 221 Electronic component 23 Connection hole 222 Through hole 240 broken line 242