CN101728474B - Manufacturing technology of high heat-conductivity high-power LED substrate - Google Patents
Manufacturing technology of high heat-conductivity high-power LED substrate Download PDFInfo
- Publication number
- CN101728474B CN101728474B CN200910175423.6A CN200910175423A CN101728474B CN 101728474 B CN101728474 B CN 101728474B CN 200910175423 A CN200910175423 A CN 200910175423A CN 101728474 B CN101728474 B CN 101728474B
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- led
- circuit board
- manufacturing technology
- conducting electricity
- perforation
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- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 title claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000011889 copper foil Substances 0.000 claims abstract description 31
- 239000012943 hotmelt Substances 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims abstract description 5
- 230000005611 electricity Effects 0.000 claims description 26
- 239000002344 surface layer Substances 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to a manufacturing technology of a high heat-conductivity high-power LED substrate, which comprises the following steps: a. punching a hole at the position to preinstall an LED on a double-sided conducting circuit board; b. enlarging the hole on a conducting copper foil of the surface of the circuit board to enable the hole to be slightly bigger than the bottom surface of the LED; c. putting the bottom of the LED in the hole of the conducting copper foil of the surface of the circuit board and welding the pin of the LED and the copper foil of the surface, i.e. the circuit; and d. injecting hot melt solder from the hole on the backside of the circuit board to weld the conducting copper foil of the surface and the LED bottom together. The substrate produced by the manufacturing technology enables the heat produced by the LED to directly and quickly be conducted to the conducting copper foil or conducting copper plate of a metallic base plate to radiate. The manufacturing technology is applied to not only common LEDs, but also the high-power LED with power more than 1W in the market. The manufacturing technology has the advantages of easy operation, material saving and good effect.
Description
Technical field
The present invention relates to the preparation of LED substrate and LED mounting process, specifically a kind of power LED heat dissipating substrate preparation technology.
Background technology
Semiconductor light-emitting-diode LED is a kind of Novel electric light source, and its basic functional principle is to utilize solid semiconductor chip as luminescent material.When two ends add voltage, the son that dams in semiconductor occurs compoundly to cause photo emissions and produce light, the only non-radiative light sending, and photochromic pure, light beam is concentrated, and color rendering index is high, and temperature characterisitic is high.It is low that it has electric quantity consumption, and stable performance, life-span be long, pollution-free, use the advantages such as simple.In a large number for illumination and decoration, as Beijing Olympic venue the Water Cube, 100,000 lamps, 300,000 points have just been installed at present, can have been converted the LED of 1,600 ten thousand kinds of colors.But application LED has an important technical barrier, it is exactly heat radiation.For this reason, people have adopted various means, but effect is all undesirable.Specifically, a large amount of LED welded and installed, on circuit board, because existing circuit board is generally 2 or 3-tier architecture, are followed successively by metal back layer, insulating barrier, copper-clad from bottom to up.Copper-clad is corroded as circuit.The pin of LED is welded on circuit, and therefore the exhibition of the heat of LED is heavy is just close on insulating barrier.Because the conductive coefficient of insulating barrier is only 1/10th of metal, the capacity of heat transmission is very poor, the heat that causes LED to produce is difficult to disperse, the enhance heat of must taking measures, this occasion problem to a large amount of intensive use LED is particularly serious, becomes the technical bottleneck of promoting the use of now LED illumination lighting engineering.
Summary of the invention
Object of the present invention is exactly the heat radiation difficult problem in order to solve LED and a kind of manufacturing technology of high heat-conductivity high-power LED substrate of designing.It has two kinds of operations, the first: a, pre-installation LED place perforation on two-sided conductive circuit board; B, perforation on circuit board surface layer copper-foil conducting electricity is expanded, make it be slightly larger than the bottom surface of LED; C, install during LED, LED is managed the end of to and be placed in the perforation of circuit board surface layer copper-foil conducting electricity, and contact circuit plate surface layer copper-foil conducting electricity not welds LED pin and circuit board surface layer copper-foil conducting electricity; D, from back of circuit board perforation, inject the scolding tin of hot melt, molten tin welds conducting through perforation by back of circuit board copper-foil conducting electricity and LED bottom surface.It two is: a, on the surface layer copper-foil conducting electricity of two-sided conductive circuit board, erode away the emptying aperture at the bottom of the pipe of the LED that is slightly larger than pre-installation; On b, the insulation board in emptying aperture, open perforation, penetrate back of circuit board copper-foil conducting electricity; C, install during LED, LED is managed the end of to and be placed in the perforation of circuit board surface layer copper-foil conducting electricity, LED pin and circuit board surface layer copper-foil conducting electricity are welded; D, from back of circuit board perforation, inject the scolding tin of hot melt, molten tin welds conducting through perforation by back of circuit board copper-foil conducting electricity and LED bottom surface.If circuit board is one side conductive circuit board, its insulation board bottom surface connection conductive copper plate that can be adhesively fixed, welding sequence was for being used tin stove.Direct, the rapid conduction of heat that the present invention can make LED pipe produce disperses to back of circuit board copper-foil conducting electricity or conductive copper plate, thereby is not only applicable to general LED pipe, is more suitable for the great power LED that is greater than 1 watt in the power occurring now.This is simple for process, and materials are economized, effective.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present invention one processing step a.
Fig. 2 is the embodiment of the present invention one processing step b.
Fig. 3 is the embodiment of the present invention one processing step c.
Fig. 4 is the embodiment of the present invention one processing step d.
Fig. 5 is the embodiment of the present invention two processing step a.
Fig. 6 is the embodiment of the present invention two processing step b.
Fig. 7 is another embodiment of the present invention schematic diagram.
Embodiment
As shown in accompanying drawing 1-4, embodiment mono-manufacturing technology of high heat-conductivity high-power LED substrate of the present invention is: a, pre-installation LED 2 places perforation 3 on two-sided conductive circuit board 1; B, the perforation 3 on circuit board surface layer copper-foil conducting electricity 4 is expanded to the bottom surface 5 that makes it be slightly larger than LED 2; C, install during LED, LED 2 is managed the end of to and be placed in the perforation 3 of circuit board surface layer copper-foil conducting electricity 4, and contact circuit plate surface layer copper-foil conducting electricity 4 not welds LED pin 6 and circuit board surface layer copper-foil conducting electricity 4; The scolding tin of d, the 3 injection hot melts of boring a hole from circuit board 1 back side, molten tin 7 welds conducting through perforation 3 by back of circuit board copper-foil conducting electricity 8 and LED bottom surface 5.
As shown in accompanying drawing 5-6 and 3,4, embodiment bis-is: a, on the surface layer copper-foil conducting electricity 4 of two-sided conductive circuit board 1, erode away the emptying aperture 11 at the bottom of the pipe of the LED 2 that is slightly larger than pre-installation; On b, the insulation board in emptying aperture 11 9, open perforation 3, penetrate back of circuit board copper-foil conducting electricity 8; C, install during LED, LED 2 is managed the end of to and be placed in the perforation 3 of circuit board surface layer copper-foil conducting electricity 4, LED pin 6 and circuit board surface layer copper-foil conducting electricity 4 are welded; The scolding tin of d, the 3 injection hot melts of boring a hole from circuit board 1 back side, molten tin 7 welds conducting through perforation 3 by back of circuit board copper-foil conducting electricity 8 and LED bottom surface 5.
As shown in Figure 7, if circuit board is one side conductive circuit board, its insulation board 9 bottom surfaces are adhesively fixed and connect conductive copper plate 10.Welding sequence was used tin stove.
Claims (2)
1. manufacturing technology of high heat-conductivity high-power LED substrate, is characterized in that: a, at the upper pre-installation LED(2 of two-sided conductive circuit board (1)) locate perforation (3); B, perforation (3) on circuit board surface layer copper-foil conducting electricity (4) is expanded, makes it be slightly larger than LED(2) bottom surface (5); C, install during LED, by LED(2) the pipe end is placed in the perforation (3) of circuit board surface layer copper-foil conducting electricity (4), by LED pin (6) and circuit board surface layer copper-foil conducting electricity (4) welding; The scolding tin of hot melt is injected in d, from circuit board (1) back side, bore a hole (3), and molten tin (7) welds conducting through perforation (3) by back of circuit board copper-foil conducting electricity (8) and LED bottom surface (5).
2. manufacturing technology of high heat-conductivity high-power LED substrate according to claim 1, is characterized in that: said claim 1 two-sided conductive circuit board (1) is replaced with by the circuit board that has the one side conductive circuit board of insulation board (9) and surface layer copper-foil conducting electricity and form at the bonding conductive copper plate (10) of the another side of described insulation board (9); And welding sequence was used tin stove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910175423.6A CN101728474B (en) | 2009-11-16 | 2009-11-16 | Manufacturing technology of high heat-conductivity high-power LED substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910175423.6A CN101728474B (en) | 2009-11-16 | 2009-11-16 | Manufacturing technology of high heat-conductivity high-power LED substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101728474A CN101728474A (en) | 2010-06-09 |
| CN101728474B true CN101728474B (en) | 2014-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910175423.6A Expired - Fee Related CN101728474B (en) | 2009-11-16 | 2009-11-16 | Manufacturing technology of high heat-conductivity high-power LED substrate |
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| CN (1) | CN101728474B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108601246B (en) * | 2018-06-26 | 2019-11-29 | 江西志博信科技股份有限公司 | The production method of high-frequency microwave printing HDI wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1436374A (en) * | 2001-04-12 | 2003-08-13 | 松下电工株式会社 | Light source device using LED, and method of producing same |
| CN201017874Y (en) * | 2007-02-08 | 2008-02-06 | 咸瑞科技股份有限公司 | Heat radiating device of luminous diode |
| CN201038159Y (en) * | 2007-01-19 | 2008-03-19 | 瑞仪光电股份有限公司 | Light emitting diode module substrate with heat-conductive efficiency |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07123172B2 (en) * | 1986-10-03 | 1995-12-25 | 松下電工株式会社 | Method for manufacturing printed wiring board |
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| CN1129968C (en) * | 2000-11-23 | 2003-12-03 | 诠兴开发科技股份有限公司 | Packaging method for LED |
| KR100419611B1 (en) * | 2001-05-24 | 2004-02-25 | 삼성전기주식회사 | A Light Emitting Diode, a Lighting Emitting Device Using the Same and a Fabrication Process therefor |
| CN101364622A (en) * | 2007-08-08 | 2009-02-11 | 高侨自动化科技股份有限公司 | High-power LED encapsulation construction |
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2009
- 2009-11-16 CN CN200910175423.6A patent/CN101728474B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1436374A (en) * | 2001-04-12 | 2003-08-13 | 松下电工株式会社 | Light source device using LED, and method of producing same |
| CN201038159Y (en) * | 2007-01-19 | 2008-03-19 | 瑞仪光电股份有限公司 | Light emitting diode module substrate with heat-conductive efficiency |
| CN201017874Y (en) * | 2007-02-08 | 2008-02-06 | 咸瑞科技股份有限公司 | Heat radiating device of luminous diode |
Non-Patent Citations (2)
| Title |
|---|
| JP昭63-261736A 1988.10.28 |
| JP特开2006-114635A 2006.04.27 |
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| CN101728474A (en) | 2010-06-09 |
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Owner name: HEBEI DAQI OPTOELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LI YAPING Effective date: 20140529 |
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Effective date of registration: 20140529 Address after: 050800 Wang Quan street, science and Technology Industrial Park, Zhengding County, Hebei, Shijiazhuang Patentee after: HEBEI DAQI LIGHTING TECHNOLOGY CO.,LTD. Address before: 050800 No. 1-2 North st, Heng Zhou county, Zhengding County, Hebei Patentee before: Li Yaping |
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