CN101728474A - Manufacturing technology of high heat-conductivity high-power LED substrate - Google Patents
Manufacturing technology of high heat-conductivity high-power LED substrate Download PDFInfo
- Publication number
- CN101728474A CN101728474A CN200910175423A CN200910175423A CN101728474A CN 101728474 A CN101728474 A CN 101728474A CN 200910175423 A CN200910175423 A CN 200910175423A CN 200910175423 A CN200910175423 A CN 200910175423A CN 101728474 A CN101728474 A CN 101728474A
- Authority
- CN
- China
- Prior art keywords
- led
- circuit board
- perforation
- manufacturing technology
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The invention relates to a manufacturing technology of a high heat-conductivity high-power LED substrate, which comprises the following steps: a. punching a hole at the position to preinstall an LED on a double-sided conducting circuit board; b. enlarging the hole on a conducting copper foil of the surface of the circuit board to enable the hole to be slightly bigger than the bottom surface of the LED; c. putting the bottom of the LED on the hole of the conducting copper foil of the surface of the circuit board and welding the pin of the LED and the copper foil of the surface, i.e. the circuit; and d. injecting hot melt solder from the hole on the backside of the circuit board to weld the conducting copper foil of the surface and the LED bottom together. The substrate produced by the manufacturing technology enables the heat produced by the LED to directly and quickly be conducted to a metallic base plate to radiate. The manufacturing technology is applied to not only common LEDs, but also the high-power LED with power more than 1W in the market. The manufacturing technology has the advantages of easy operation, material saving and good effect.
Description
Technical field
The present invention relates to preparation of LED substrate and LED mounting process, particularly is a kind of great power LED cooling substrate preparation technology.
Background technology
Semiconductor light emitting diode LED is a kind of new type electro source, and its basic functional principle is to utilize the solid semiconductor chip as luminescent material.When two ends add voltage, the son that dams in the semiconductor takes place compoundly to cause photo emissions and produce light, the only non-radiative light that is sent, and photochromic pure, light beam is concentrated, color rendering index height, temperature characterisitic height.It is low that it has an electric quantity consumption, and stable performance, life-span be long, pollution-free, use advantages such as simple.Be used for illumination at present in a large number and decorate, 100,000 lamps, 300,000 points just have been installed, LED that can 1,600 ten thousand kinds of colors of conversion as Beijing Olympic venue the Water Cube.But use LED an important techniques difficult problem being arranged, is exactly heat radiation.For this reason, people have adopted various means, but effect is all undesirable.Specifically, a large amount of LED welded and installed are on circuit board, because existing circuit board is generally 2 or 3-tier architecture, from promptly being followed successively by metal back layer, insulating barrier, copper-clad down.Copper-clad is corroded and is circuit.On the pin welding circuit of LED, so the heat of LED exhibition is heavy just is close on the insulating barrier.Because the conductive coefficient of insulating barrier only is 1/10th of a metal, the capacity of heat transmission is very poor, the heat that causes LED to produce is difficult to disperse, the enhance heat of must taking measures, this occasion problem to a large amount of intensive use LED is particularly serious, becomes the technical bottleneck of promoting the use of LED illumination lighting engineering now.
Summary of the invention
Purpose of the present invention is exactly a kind of high thermal conductance high power LED substrate preparation technology who designs for a heat radiation difficult problem that solves LED.It has two kinds of operations, first a, is boring a hole pre-the installation on the LED position on the two-sided conductive circuit board; B, the perforation on the circuit board surface layer copper-foil conducting electricity is enlarged, make it be slightly larger than the LED bottom surface; C, when LED is installed, LED is managed the end place perforation place of circuit board surface layer copper-foil conducting electricity, and do not contact copper-foil conducting electricity, LED pin and surface layer copper foil circuit are welded; D, inject the scolding tin of hot melt from back of circuit board perforation, molten tin penetrates perforation conducting is welded in circuit board bottom surface copper-foil conducting electricity and LED bottom surface.It two is: a, the emptying aperture at the bottom of eroding away the pipe that is slightly larger than pre-mounted LEDs on the surface layer copper-foil conducting electricity of two-sided conductive circuit board; Open perforation on b, the insulation board in emptying aperture, penetrate the back of circuit board copper-foil conducting electricity.C, when LED is installed, LED is managed the end place in the perforation of circuit board surface layer copper-foil conducting electricity, is that circuit welds with LED pin and surface layer Copper Foil; D, inject the scolding tin of hot melt from the back of circuit board perforation, molten tin enters perforation conducting is welded in circuit board bottom surface copper-foil conducting electricity and LED bottom surface.As circuit board is the single face conductive circuit board, the insulation board bottom surface connection conductive copper plate that can be adhesively fixed, and welding sequence was then for using the tin stove.The heat that the present invention can make the LED pipe produce conducts directly, rapidly disperses for circuit board bottom surface copper-foil conducting electricity or conductive copper plate.Thereby be not only applicable to general LED pipe, be more suitable in occur now greater than 1 watt great power LED.This is simple for process, and materials are economized, and are effective.
Description of drawings
Fig. 1 is the embodiment of the invention one processing step a.
Fig. 2 is the embodiment of the invention one processing step b.
Fig. 3 is the embodiment of the invention one processing step c.
Fig. 4 is the embodiment of the invention one processing step d.
Fig. 5 is the embodiment of the invention two processing step a.
Fig. 6 is the embodiment of the invention two processing step b.
Another executes example schematic to Fig. 7 for the present invention.
Embodiment
Shown in accompanying drawing 1-4, embodiment one manufacturing technology of high heat-conductivity high-power LED substrate of the present invention is: a, the pre-LED2 place reach through hole 3 of installing on two-sided conductive circuit board 1; B, the perforation on the circuit board surface layer copper-foil conducting electricity 43 is enlarged, make it be slightly larger than LED bottom surface 5; C, when LED is installed, LED is managed the end place in 4 perforation 3 of circuit board 1 surface layer copper-foil conducting electricity, non-contact face layer copper-foil conducting electricity 4 is with LED pin 6 and the welding of surface layer Copper Foil 4 circuit; D, 3 scolding tin that inject hot melts of boring a hole from circuit board 1 back side, molten tin passes perforation 3 with bottom surface copper-foil conducting electricity 8 and the 5 welding conductings of LED bottom surface.
Shown in figure accompanying drawing 5-6 and 3,4, embodiment two is: a, the emptying aperture 11 at the bottom of eroding away the pipe that is slightly larger than pre-mounted LEDs 2 on the surface layer copper-foil conducting electricity 4 of two-sided conductive circuit board 2; Open perforation 3 on b, the insulation board in emptying aperture 11 9, penetrate circuit board 1 back side copper-foil conducting electricity 4.C, when LED is installed, LED2 is managed the end place in 4 perforation 3 of circuit board 1 surface layer copper-foil conducting electricity, LED pin 6 and 4 welding of surface layer Copper Foil; D, 3 scolding tin that inject hot melts of boring a hole from circuit board 1 back side, molten tin 7 advanced perforation 3 with circuit board 1 bottom surface copper-foil conducting electricity 8 and the 5 welding conductings of LED bottom surface.
As shown in Figure 7, be the single face conductive circuit board as circuit board 1, insulation board 9 bottom surfaces are adhesively fixed and connect the substrate 10 that conduction is responsible for plate.The scolding tin of scolding tin operation was for using the tin stove.
Claims (3)
1. manufacturing technology of high heat-conductivity high-power LED substrate is characterized in that a, locates perforation (3) at the last pre-LED of installation of two-sided conductive circuit board (1) (2); B, the perforation (3) on the circuit board surface layer copper-foil conducting electricity (4) is enlarged, make it be slightly larger than LED (2) bottom surface (5); When c, installation LED, LED (2) the pipe end, placed in circuit board (1) surface layer copper-foil conducting electricity (4) perforation (3), LED pin (6) and surface layer Copper Foil (4) welding; D, inject the scolding tin of hot melt from circuit board (1) back side perforation (3), molten tin (7) passes perforation (3) conducting is welded in circuit board (1) bottom surface copper-foil conducting electricity (8) and LED bottom surface (5).
2. manufacturing technology of high heat-conductivity high-power LED substrate is characterized in that a, the emptying aperture (11) at the bottom of eroding away the pipe that is slightly larger than pre-mounted LEDs (2) on the surface layer copper-foil conducting electricity (4) of two-sided conductive circuit board (2); Open perforation (3) on b, the insulation board (9) in emptying aperture (11), penetrate circuit board (1) back side copper-foil conducting electricity (4).When c, installation LED, LED (2) the pipe end, placed in circuit board (1) surface layer copper-foil conducting electricity (4) perforation (3), LED pin (6) and surface layer Copper Foil (4) welding; D, inject the scolding tin of hot melt from circuit board (1) back side perforation (3), molten tin (7) passes perforation (3) conducting is welded in circuit board (1) bottom surface copper-foil conducting electricity (8) and LED bottom surface (5).
3. manufacturing technology of high heat-conductivity high-power LED substrate according to claim 1 and 2 is characterized in that said circuit board (1) is the single face conductive circuit board, the bonding conductive copper plate in insulation board (9) bottom surface (10), and the scolding tin of scolding tin operation was for using the tin stove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910175423.6A CN101728474B (en) | 2009-11-16 | 2009-11-16 | Manufacturing technology of high heat-conductivity high-power LED substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910175423.6A CN101728474B (en) | 2009-11-16 | 2009-11-16 | Manufacturing technology of high heat-conductivity high-power LED substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101728474A true CN101728474A (en) | 2010-06-09 |
| CN101728474B CN101728474B (en) | 2014-04-16 |
Family
ID=42449037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910175423.6A Active CN101728474B (en) | 2009-11-16 | 2009-11-16 | Manufacturing technology of high heat-conductivity high-power LED substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101728474B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6390872A (en) * | 1986-10-03 | 1988-04-21 | Matsushita Electric Works Ltd | Printed circuit board |
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| CN1355571A (en) * | 2000-11-23 | 2002-06-26 | 诠兴开发科技股份有限公司 | Packaging method for LED |
| US20020175621A1 (en) * | 2001-05-24 | 2002-11-28 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode, light emitting device using the same, and fabrication processes therefor |
| CN101364622A (en) * | 2007-08-08 | 2009-02-11 | 高侨自动化科技股份有限公司 | High-power LED encapsulation construction |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60137972D1 (en) * | 2001-04-12 | 2009-04-23 | Matsushita Electric Works Ltd | LIGHT SOURCE ELEMENT WITH LED AND METHOD FOR THE PRODUCTION THEREOF |
| CN201038159Y (en) * | 2007-01-19 | 2008-03-19 | 瑞仪光电股份有限公司 | Light emitting diode module substrate with heat-conductive efficiency |
| CN201017874Y (en) * | 2007-02-08 | 2008-02-06 | 咸瑞科技股份有限公司 | Heat radiating device of luminous diode |
-
2009
- 2009-11-16 CN CN200910175423.6A patent/CN101728474B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6390872A (en) * | 1986-10-03 | 1988-04-21 | Matsushita Electric Works Ltd | Printed circuit board |
| CN2116944U (en) * | 1992-03-14 | 1992-09-23 | 汉颖电子股份有限公司 | Luminescent diode indicator based on printed circuit board |
| CN1355571A (en) * | 2000-11-23 | 2002-06-26 | 诠兴开发科技股份有限公司 | Packaging method for LED |
| US20020175621A1 (en) * | 2001-05-24 | 2002-11-28 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode, light emitting device using the same, and fabrication processes therefor |
| CN101364622A (en) * | 2007-08-08 | 2009-02-11 | 高侨自动化科技股份有限公司 | High-power LED encapsulation construction |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601246A (en) * | 2018-06-26 | 2018-09-28 | 江西志博信科技股份有限公司 | The production method that high-frequency microwave prints HDI wiring boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101728474B (en) | 2014-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101888740B (en) | Convex metal printed circuit board and manufacturing method thereof | |
| CN201549500U (en) | All-metal heat conducting double-sided radiating LED substrate | |
| CN101520569A (en) | Power chip type LED light source for LCD backlight module | |
| CN101881393A (en) | LED lamp structure capable of conducting heat by using metal base plate and metal solder | |
| CN201576701U (en) | Metal cooling device for LED lamp chip | |
| CN101707234A (en) | LED luminescence module and manufacture method thereof | |
| CN201285010Y (en) | LED radiating module | |
| CN201416868Y (en) | A LED high efficiency heat-yielding and heat-conducting mechanism | |
| CN201053654Y (en) | Large power LED direct touch type heat-conductive circuit board | |
| CN103066193A (en) | Novel light-emitting diode (LED) radiation structure | |
| CN203605189U (en) | Integrated heat dissipation structure applicable to LED lamp and backlight module | |
| CN202521435U (en) | Arc LED (light emitting diode) street lamp capable of radiating efficiently | |
| CN101728474B (en) | Manufacturing technology of high heat-conductivity high-power LED substrate | |
| CN201466057U (en) | High-power led circuit board | |
| CN105161602A (en) | LED circuit board with reinforcement ribs | |
| CN202432487U (en) | High-power integrated LED (light-emitting diode) mining lamp with efficient heat dissipation function | |
| CN201853745U (en) | High-power light emitting diode (LED) ceramic heat sink | |
| CN202065761U (en) | LED light strip, backlight source and liquid crystal panel | |
| CN203131523U (en) | Light-emitting diode (LED) light source module with heat conduction column | |
| CN101581406B (en) | Thermotube type high-power LED lamp | |
| CN101378096A (en) | Packaging structure for light emitting diode | |
| CN202065723U (en) | LED (light-emitting diode) lamp | |
| CN201636635U (en) | Large-power LED lamp | |
| CN102235592B (en) | High-power LED (light emitting diode) lamp | |
| CN102062372A (en) | LED light source electricity-conducting connecting device and manufacturing process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HEBEI DAQI OPTOELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LI YAPING Effective date: 20140529 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140529 Address after: 050800 Wang Quan street, science and Technology Industrial Park, Zhengding County, Hebei, Shijiazhuang Patentee after: Hebei Daqi Optoelectronics Technology Co., Ltd. Address before: 050800 No. 1-2 North st, Heng Zhou county, Zhengding County, Hebei Patentee before: Li Yaping |