CN101722724A - 液状体的排出方法、滤色器以及有机el装置的制造方法 - Google Patents
液状体的排出方法、滤色器以及有机el装置的制造方法 Download PDFInfo
- Publication number
- CN101722724A CN101722724A CN200910204744A CN200910204744A CN101722724A CN 101722724 A CN101722724 A CN 101722724A CN 200910204744 A CN200910204744 A CN 200910204744A CN 200910204744 A CN200910204744 A CN 200910204744A CN 101722724 A CN101722724 A CN 101722724A
- Authority
- CN
- China
- Prior art keywords
- discharged
- aforementioned
- zone
- aqueous body
- discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000007599 discharging Methods 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 title abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 126
- 239000010410 layer Substances 0.000 claims description 94
- 239000000463 material Substances 0.000 claims description 37
- 230000015572 biosynthetic process Effects 0.000 claims description 19
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 claims description 7
- 239000002346 layers by function Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 144
- 230000007246 mechanism Effects 0.000 description 33
- 238000005192 partition Methods 0.000 description 22
- 238000002347 injection Methods 0.000 description 19
- 239000007924 injection Substances 0.000 description 19
- 238000012546 transfer Methods 0.000 description 19
- 238000005755 formation reaction Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 238000013316 zoning Methods 0.000 description 10
- 238000007789 sealing Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005253 cladding Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000008531 maintenance mechanism Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 241000408529 Libra Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000549 coloured material Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- GRPQBOKWXNIQMF-UHFFFAOYSA-N indium(3+) oxygen(2-) tin(4+) Chemical class [Sn+4].[O-2].[In+3] GRPQBOKWXNIQMF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/441—Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Optical Filters (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP267144/2008 | 2008-10-16 | ||
JP2008267144A JP5187124B2 (ja) | 2008-10-16 | 2008-10-16 | 液状体の吐出方法、カラーフィルタの製造方法および有機el装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410345605.4A Division CN104118211A (zh) | 2008-10-16 | 2009-10-14 | 液状体的排出方法、滤色器以及有机el装置的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101722724A true CN101722724A (zh) | 2010-06-09 |
CN101722724B CN101722724B (zh) | 2014-08-20 |
Family
ID=42109047
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910204744.4A Active CN101722724B (zh) | 2008-10-16 | 2009-10-14 | 液状体的排出方法、滤色器以及有机el装置的制造方法 |
CN201410345605.4A Pending CN104118211A (zh) | 2008-10-16 | 2009-10-14 | 液状体的排出方法、滤色器以及有机el装置的制造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410345605.4A Pending CN104118211A (zh) | 2008-10-16 | 2009-10-14 | 液状体的排出方法、滤色器以及有机el装置的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8580335B2 (zh) |
JP (1) | JP5187124B2 (zh) |
KR (1) | KR20100042585A (zh) |
CN (2) | CN101722724B (zh) |
TW (1) | TWI482668B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106476433A (zh) * | 2015-08-26 | 2017-03-08 | 精工爱普生株式会社 | 液滴排出方法以及有机el装置的制造方法 |
CN106827814A (zh) * | 2017-02-15 | 2017-06-13 | 京东方科技集团股份有限公司 | 喷射量补偿方法、喷射量补偿设备和喷墨打印系统 |
US10276796B2 (en) | 2017-02-15 | 2019-04-30 | Boe Technology Group Co., Ltd. | Ejection volume compensation method, ejection volume compensation device, inkjet printing device, and non-transitory machine readable medium |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5803212B2 (ja) * | 2011-03-30 | 2015-11-04 | セイコーエプソン株式会社 | ノズル吐出量の補正方法、液滴の吐出方法及び有機el素子の製造方法 |
US9707584B2 (en) | 2014-07-09 | 2017-07-18 | Nordson Corporation | Dual applicator fluid dispensing methods and systems |
KR20240033861A (ko) | 2022-09-06 | 2024-03-13 | 세메스 주식회사 | 멀티모델 프린팅 방법, 컴퓨팅 장치 및 멀티모델 프린팅 설비 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6619783B2 (en) * | 1998-11-20 | 2003-09-16 | Seiko Epson Corp | Flushing position controller incorporated in ink-jet recording apparatus and flushing method used for the same |
JP3838964B2 (ja) * | 2002-03-13 | 2006-10-25 | 株式会社リコー | 機能性素子基板の製造装置 |
US7111755B2 (en) * | 2002-07-08 | 2006-09-26 | Canon Kabushiki Kaisha | Liquid discharge method and apparatus and display device panel manufacturing method and apparatus |
JP2004081988A (ja) * | 2002-08-27 | 2004-03-18 | Seiko Epson Corp | 製膜方法と製膜装置及びデバイス製造方法並びにデバイス製造装置 |
JP4363094B2 (ja) * | 2003-06-27 | 2009-11-11 | セイコーエプソン株式会社 | 液滴吐出装置の液滴吐出方法および液滴吐出装置、並びにカラーフィルタ表示装置の製造方法、エレクトロルミネッサンス表示装置の製造方法、プラズマ表示装置の製造方法 |
JP4029895B2 (ja) * | 2004-12-08 | 2008-01-09 | セイコーエプソン株式会社 | 液滴吐出装置、液滴吐出方法、電気光学装置の製造方法、電気光学装置および電子機器 |
CN100443301C (zh) * | 2004-12-08 | 2008-12-17 | 精工爱普生株式会社 | 液滴喷出装置及喷出方法、电光学装置及其制造方法 |
EP1770676B1 (en) * | 2005-09-30 | 2017-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
JP2007136330A (ja) * | 2005-11-17 | 2007-06-07 | Sharp Corp | インク吐出装置及びインク吐出方法 |
JP2007190507A (ja) * | 2006-01-20 | 2007-08-02 | Seiko Epson Corp | 吐出方法、カラーフィルタの製造方法、有機el発光素子の製造方法、電気光学装置の製造方法、電子機器 |
JP4153005B2 (ja) * | 2006-12-26 | 2008-09-17 | シャープ株式会社 | インク吐出装置 |
-
2008
- 2008-10-16 JP JP2008267144A patent/JP5187124B2/ja active Active
-
2009
- 2009-09-18 US US12/562,801 patent/US8580335B2/en active Active
- 2009-09-29 KR KR1020090092168A patent/KR20100042585A/ko active IP Right Grant
- 2009-10-13 TW TW098134674A patent/TWI482668B/zh not_active IP Right Cessation
- 2009-10-14 CN CN200910204744.4A patent/CN101722724B/zh active Active
- 2009-10-14 CN CN201410345605.4A patent/CN104118211A/zh active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106476433A (zh) * | 2015-08-26 | 2017-03-08 | 精工爱普生株式会社 | 液滴排出方法以及有机el装置的制造方法 |
CN111791591A (zh) * | 2015-08-26 | 2020-10-20 | 东京毅力科创株式会社 | 液滴排出方法以及有机el装置的制造方法 |
CN111791591B (zh) * | 2015-08-26 | 2022-09-02 | 东京毅力科创株式会社 | 液滴排出方法以及有机el装置的制造方法 |
CN106827814A (zh) * | 2017-02-15 | 2017-06-13 | 京东方科技集团股份有限公司 | 喷射量补偿方法、喷射量补偿设备和喷墨打印系统 |
CN106827814B (zh) * | 2017-02-15 | 2018-07-24 | 京东方科技集团股份有限公司 | 喷射量补偿方法、喷射量补偿设备和喷墨打印系统 |
US10276796B2 (en) | 2017-02-15 | 2019-04-30 | Boe Technology Group Co., Ltd. | Ejection volume compensation method, ejection volume compensation device, inkjet printing device, and non-transitory machine readable medium |
Also Published As
Publication number | Publication date |
---|---|
CN101722724B (zh) | 2014-08-20 |
US20100099325A1 (en) | 2010-04-22 |
TWI482668B (zh) | 2015-05-01 |
TW201016330A (en) | 2010-05-01 |
US8580335B2 (en) | 2013-11-12 |
CN104118211A (zh) | 2014-10-29 |
KR20100042585A (ko) | 2010-04-26 |
JP2010094600A (ja) | 2010-04-30 |
JP5187124B2 (ja) | 2013-04-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7280933B2 (en) | Method and apparatus for forming a pattern, device and electronic apparatus | |
CN100396492C (zh) | 喷出方法及其装置 | |
CN102388673B (zh) | 有机el显示面板及其制造方法 | |
CN101722728A (zh) | 液状体的排出方法、滤色器的制造方法及有机电致发光装置的制造方法 | |
CN101164784B (zh) | 喷头单元及液滴喷出装置、液状体的喷出方法 | |
CN101195307B (zh) | 描绘系统、液状体的描绘方法、滤色器的制造方法、有机el元件的制造方法 | |
US7784425B2 (en) | Droplet ejecting apparatus, electro-optic device, electronic apparatus, and droplet ejecting method | |
CN101204875A (zh) | 液状体的描绘方法、滤色器及有机el元件的制造方法 | |
CN101722724B (zh) | 液状体的排出方法、滤色器以及有机el装置的制造方法 | |
CN101352962A (zh) | 液状体的喷出方法、滤色片的制造方法、有机el元件的制造方法 | |
JP4370920B2 (ja) | 描画装置 | |
JP4552804B2 (ja) | 液滴吐出方法 | |
JP4370919B2 (ja) | 描画装置 | |
CN100456448C (zh) | 有源矩阵基板及其制造方法、以及电光学装置及电子设备 | |
JP2009198938A (ja) | 液滴吐出装置、液状体の吐出方法、カラーフィルタの製造方法、有機el素子の製造方法 | |
JP4792701B2 (ja) | 液滴吐出装置、液滴吐出方法 | |
JP2007190507A (ja) | 吐出方法、カラーフィルタの製造方法、有機el発光素子の製造方法、電気光学装置の製造方法、電子機器 | |
JP2009198858A (ja) | 液滴吐出装置、液状体の吐出方法、カラーフィルタの製造方法 | |
JP2006130436A (ja) | 液滴吐出装置、液滴吐出方法、電気光学装置の製造方法及び電子機器 | |
JP5055692B2 (ja) | 液滴吐出方法及び電気光学装置の製造方法 | |
JP2009251001A (ja) | 液状体の吐出方法、カラーフィルタの製造方法および有機el素子の製造方法 | |
JP2005199173A (ja) | データ構造、描画方法、描画装置、デバイス及び電子機器 | |
JP2009198857A (ja) | 液滴吐出装置、液状体の吐出方法、カラーフィルタの製造方法、有機el素子の製造方法 | |
JP2005199225A (ja) | 描画方法、描画装置、デバイス及び電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180627 Address after: California, USA Patentee after: KATEEVA, Inc. Address before: Tokyo, Japan Patentee before: Seiko Epson Corp. |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Discharge method of liquid body, color filter and manufacturing method of organic EL device Effective date of registration: 20210112 Granted publication date: 20140820 Pledgee: Shaoxing Binhai New Area integrated circuit industry equity investment fund partnership (L.P.) Pledgor: KATEEVA, Inc. Registration number: Y2021990000035 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221210 Granted publication date: 20140820 Pledgee: Shaoxing Binhai New Area integrated circuit industry equity investment fund partnership (L.P.) Pledgor: KATEEVA, Inc. Registration number: Y2021990000035 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method for discharging liquid bodies, manufacturing of color filters, and organic EL devices Effective date of registration: 20230625 Granted publication date: 20140820 Pledgee: Xinji Co.,Ltd. Pledgor: KATEEVA, Inc. Registration number: Y2023990000311 |