CN101714499B - A machining device - Google Patents
A machining device Download PDFInfo
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- CN101714499B CN101714499B CN2009101782151A CN200910178215A CN101714499B CN 101714499 B CN101714499 B CN 101714499B CN 2009101782151 A CN2009101782151 A CN 2009101782151A CN 200910178215 A CN200910178215 A CN 200910178215A CN 101714499 B CN101714499 B CN 101714499B
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- 238000003754 machining Methods 0.000 title claims abstract description 15
- 238000012423 maintenance Methods 0.000 claims description 20
- 238000005520 cutting process Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000005755 formation reaction Methods 0.000 claims description 6
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- -1 calcirm-fluoride Chemical compound 0.000 claims description 3
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 3
- 239000005297 pyrex Substances 0.000 claims description 3
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 235000012431 wafers Nutrition 0.000 description 33
- 239000004065 semiconductor Substances 0.000 description 31
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides a machining device that can shoot an object even if a machined object has opaque layer between a machining unit and a camera shooting object, wherein the machining device is provided with a base part, and comprises the following components: a remain station provided with a remain mat that is formed of transparent body and can hold the machined object; a machining unit that machine the object that remained on the remain station; a machining feed unit that feeds the remain station and the machining unit relatively on X-direction that parallel to surface of the remain station and Y-direction that vertical to the X-direction; and a camera shooting unit that is mounted on the base part on lower side of the remain mat, and shoots the machined object that held on the remain station through the remain mat that formed of transparent body; in the process of shooting the object, the remain station is moved to upper side of the camera shooting unit through the machining feed unit.
Description
Technical field
The present invention relates to processing unit (plant) that semiconductor wafer is processed, particularly relate to the mechanism of the aligning image pickup part of processing unit (plant).
Background technology
In process for fabrication of semiconductor device, by with following semiconductor wafer along spacing track (street, the cut-out preset lines) cut-out is divided into each device and makes each semiconductor chip, this semiconductor wafer is divided a plurality of zones by being arranged in cancellate spacing track on the surface of the semiconductor wafer of disc-shape roughly, and be formed with IC (integrated circuit) on each zone that marks off, the device such as LSI (large scale integrated circuit).
Semiconductor wafer is normally undertaken by the topping machanism that is called as slicing machine along the spacing track cut-out.Except the cutting method of using topping machanism, also develop and use the laser cutting method that has the pulse laser of radioparent wavelength for semiconductor wafer.
In this laser cutting method, the pulse laser that has radioparent wavelength for the machined objects such as semiconductor wafer (workpiece) is aimed at the inside of machined object with focal point and shines along spacing track, thereby at the inner metamorphic layer that forms of machined object, along making the spacing track of intensity decline apply external force owing to forming metamorphic layer, thereby be divided into each chip (for example, with reference to No. 3408805 communique of Japan's special permission and Japanese kokai publication hei 10-305420 communique).
Using these processing unit (plant)s to add man-hour to machined object, front (being formed with the face of circuit pattern) mode up with machined object is settled machined object on Ka Tai, come the assay intervals road and implement to aim at being arranged on aligned units card platform top, that comprise the image unit such as visible light camera, implement processing on spacing track by cutting tip or laser irradiating head are positioned at.
Yet, sometimes with machined object face down and mode that the back side makes progress is placed in machined object that Ka Tai is upper implements processing.For example, use laser to add man-hour to the LED chip that formed luminescent device on sapphire substrate etc., due to the characteristic of worrying to damage the luminescent device layer, therefore preferably make laser beam never be formed with the rear side incident of device.
And, for a part of MEMS that is formed with the fine structure thing in the front (Micro ElectroMechanism Systems, MEMS (micro electro mechanical system)), owing to worrying to damage positive works based on the cutting water in the processing of blade cuts, therefore sometimes the works side is attached on retainer belt and processes from rear side.
And, in the situation that to picture pick-up devices such as CCD and CMOS etc., adhere to the smear metal meeting on device and cause the bad machined object of device to carry out blade cuts, equally sometimes also the front be attached on retainer belt and process from rear side.
Therefore, the method of use IR (infrared) camera has been proposed, even in the situation of processing from rear side as keeping in the prone mode of the formation of circuit pattern or spacing track like this, the method that also can implement to aim at (Japanese kokai publication hei 6-232255 communique and Japanese kokai publication hei 10-312979 communique).
No. 3408805 communique of [patent documentation 1] Japan special permission
[patent documentation 2] Japanese kokai publication hei 10-305420 communique
[patent documentation 3] Japanese kokai publication hei 6-232255 communique
[patent documentation 4] Japanese kokai publication hei 10-312979 communique
Yet, to in the situation that have the machined object of the light non-transmittable layers as metal level on the aligned pattern layer and process, in the situation of perhaps from the back side, the machined object that has overleaf metal level being processed, even using the IR camera takes from the metal level side, can not detect aligned pattern or spacing track, can not implement to aim at.
Summary of the invention
The present invention completes in view of the above problems, the machined object that will have light non-transmittable layers even its purpose is to provide a kind of between machining cell and shooting object is placed on Ka Tai in its mode that faces down and processes from rear side, also can implement to aim at and the processing unit (plant) that can not bring impact to structure and the material of machined object.
According to the present invention, a kind of processing unit (plant) is provided, this processing unit (plant) has base portion, it is characterized in that, and this processing unit (plant) has: keep platform, it has the supporting pad that machined object is kept, formed by the transparent body; Machining cell, it is to keeping the machined object on this maintenance platform to process; The processing feed unit, its make described maintenance platform and described machining cell with the surperficial parallel X-direction of this maintenance platform and the Y direction vertical with this X-direction on relatively feeding; And image unit, its mode with the lower position that is positioned at supporting pad is installed on described base portion, see through the described supporting pad that is formed by the transparent body and take the machined object that remains on described maintenance platform, wherein, when taking machined object, make described maintenance platform move to this image unit top by described processing feed unit.
Preferably, processing unit (plant) also has support box, and this support box carries on the processing feed unit, rotatably supports to keep platform.The annular support part spare that keeps platform to comprise supporting pad and this supporting pad is supported.
Support box comprises: have the upper plate of opening, the annular support part spare of the rotatably chimeric maintenance platform of this opening; Lower plate, it is positioned on the processing feed unit; And connecting plate, it connects upper plate and lower plate in the mode that formation image unit at least a portion of this support box periphery enters peristome.
When taking machined object, move the maintenance platform by the processing feed unit, enter in support box thereby image unit enters peristome by this image unit, and be positioned at keep platform under.
Preferably, supporting pad is made of the material of selecting from following group, and this group is made of quartz glass, Pyrex, sapphire, calcirm-fluoride, lithium fluoride and magnesium fluoride.Preferably, supporting pad has: the attraction path with a plurality of attraction paths forms the zone; And not being formed with non-formations of the attraction path that attracts path zone, the shooting of the machined object that is undertaken by image unit is to see through the attraction path non-zone that forms to implement.
According to the present invention, can provide a kind of can not affect on all machined object enforcement alignings the processing unit (plant) of structure and the material of machined object.Image unit is arranged on base portion, and only will keep platform to be positioned on image unit by the processing feed unit when cutting apart the preset lines detection, thereby need not numerous and diverse structure, but the miniaturization of implement device.
Description of drawings
Fig. 1 is the approximate three-dimensional map of the laser processing device of the present invention's the 1st execution mode.
Fig. 2 is the exploded perspective view of support box and Ka Tai part.
Fig. 3 is the stereogram that carries the Ka Tai on support box.
Fig. 4 is the decomposing section of Ka Tai.
Fig. 5 is the stereogram of the 1st image unit and supporting construction thereof.
Fig. 6 is the face side stereogram of semiconductor wafer.
Fig. 7 carries the rear side stereogram of the semiconductor wafer on ring-shaped frame via cutting belt.
Fig. 8 carries on ring-shaped frame and has overleaf the rear side stereogram of the semiconductor wafer of metal level via cutting belt.
Fig. 9 is the side elevation in partial section of carrying the Ka Tai on support box.
Figure 10 is the broken section enlarged drawing of the A part of Fig. 9.
Figure 11 is the plane graph of supporting pad.
Figure 12 is the longitudinal section of another execution mode of supporting pad.
Figure 13 is the approximate three-dimensional map of the topping machanism of the present invention's the 2nd execution mode.
Label declaration
1: semiconductor wafer; 2: laser processing device; 5: device; 7: target pattern; 9: metal level; 12:X axle feed unit; 16: support box; 22:Y axle feed unit; 23: the processing feed unit; 26: motor; 28: Ka Tai; 34: the laser beam unit; 36: concentrator (laser irradiating head); 38: the 2 image units; 62: annular support part spare; 74: supporting pad; 82: the 1 image units; 84: camera unit; 110: topping machanism; 118: cutting tip.
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.Fig. 1 illustrates the summary construction diagram of the laser processing device that possesses the image unit of the present invention (the 1st image unit) of taking wafer from the below of Ka Tai (maintenance platform).
On the 1st slide block 6 can be equipped with along the mode that Y direction moves support box 16.The Y-axis feed unit (index feed unit) 22 of support box 16 by being made of ball-screw 18 and pulse motor 20 moves on Y direction along pair of guide rails 24.
Rotatably be equipped with card platform 28 on support box 16.As shown in Fig. 2 the best, support box 16 forms roughly U-shaped, and comprises: upper plate 16a; The lower plate 16b of lift-launch on guide rail 24; And the connecting plate 16c that connects upper plate 16a and lower plate 16b.Be formed with circular open 17 on upper plate 16a, this circular open 17 has rotatably been installed the aftermentioned fitting projection of card platform 28.
Ring-type resettlement section 68 has the internal diameter 68a (with reference to Fig. 4) roughly the same with the profile of supporting pad 74, and 68 inside bottom is formed with the annular support part 70 that supporting pad 74 is supported in the ring-type resettlement section.
Supporting pad 74 is formed by transparency materials such as quartz glass, Pyrex, sapphire, calcirm-fluoride, lithium fluoride, magnesium fluorides, and has a plurality of pores 76 in its front (maintenance face) 74a upper shed.
Can find out with reference to Fig. 4, each pore 76 is communicated with attracting groove 78, is formed with the access 72 that is communicated with the attraction groove 78 of supporting pad 74 on the annular support part 70 of annular support part spare 62.Access 72 is connected with vacuum attraction source 80.
On the annular support part 70 that supporting pad 74 is carried at annular support part spare 62, and when the fitting projection 64 of annular support part spare 62 being entrenched in the circular open 17 of support box 16, as shown in Figure 3, become card platform 28 and rotatably carry state on support box 16.
On the connecting plate 16c of support box 16, motor 26 is installed, is wound with belt 30 on the belt winder 66 of pulley 27 that the output shaft with motor 26 is connected and annular support part spare 62.When drive motors 26, make 28 rotations of card platform by belt 30.
Be formed with a plurality of (being 4 in the present embodiment) frame supported seat 29 on the upper plate 16a of support box 16, be supported on these frame supported seats 29 ring-shaped frame that illustrates later.
Referring again to Fig. 1, consist of processing feed unit 23 by X-axis feed unit 12 and Y-axis feed unit 22.Thus, card platform 28 can move on X-direction and Y direction by processing feed unit 23.
Be erected to be provided with post 32 on stationary base 4, the housing 35 of having accommodated laser beam unit 34 is installed on this post 32.Assembled by laser beam unit 34 object lens that the laser beam that is installed in the concentrator (laser irradiating head) 36 of housing 35 front ends that vibrate, and shine on the machined objects such as semiconductor wafer (workpiece) that remain on card platform 28.
At the leading section of housing 35, be provided with alignedly the 2nd image unit 38, the 2 image units 38 detections with concentrator 36 and should carry out by laser beam the machining area of laser processing on X-direction.The 2nd image unit 38 also comprises except the imaging apparatuss such as common CCD that utilize visible light and take: the infrared radiation unit, and it shines infrared ray to workpiece; Optical system, it catches the infrared ray by infrared radiation unit irradiation; And the infrared pick-up unit, it is made of imaging apparatuss such as infrared C CD, exports the signal of telecommunication corresponding with the infrared ray of being caught by this optical system.Captured image is sent to controller 40.
Be imported into the input interface 50 of controller 40 by the picture signal of the 2nd image unit 38 shootings.On the other hand, from the output interface 52 of controller 50 to pulse motor 10, the output control signal such as pulse motor 20, laser beam unit 34.
Regulation position at the base portion 4 of laser processing device 2 is equipped with image unit (the 1st image unit) 82, and this image unit 82 takes from the downside of transparent supporting pad 74 machined objects such as semiconductor wafer that remain on card platform 28.
As shown in Figure 5, image unit 82 comprises camera unit 84, and this camera unit 84 has low range camera 86 and high magnification camera 88.2 lighting devices 90,92 that throw light on to taking the position for when the shooting of camera unit 84 are installed in the side of camera unit 84.
With reference to Fig. 6, show the face side stereogram as the semiconductor wafer 1 of the processing object of laser processing device 2.On the positive 1a of wafer 1, be formed with device 5 by forming in each zone that cancellate spacing track (cutting apart preset lines) marks off.Be formed with at the target pattern 7 to becoming on time detected object on each device 5.
In the processing of laser processing device shown in Figure 12, wafer 1 is attached on cutting belt (splicing tape) T in the mode under its positive 1a side direction, and as shown in Figure 7, the peripheral part of cutting belt T is attached on ring-shaped frame F.Thus, semiconductor wafer 1 is carrying under the state of Fig. 7 on card platform 28 in the mode that its back side 1b makes progress.
With reference to Fig. 8, show the rear side stereogram that carries the semiconductor wafer 1A of another kind on ring-shaped frame F via cutting belt T.Be formed with metal level 9 at the back side of semiconductor wafer 1A.Therefore, for the target pattern 7 of this semiconductor wafer 1A, even comprising the IR camera, can not take the 2nd image unit 38.
But, be arranged on the downside of card platform 28 due to the 1st image unit 82, and take semiconductor wafer 1A across the transparent supporting pad 74 of card platform 28, even therefore have overleaf the semiconductor wafer 1A of metal level 9, also photographic subjects pattern 7 easily.
Machined object (workpiece) as the processing object of processing unit (plant) of the present invention, be not limited to Fig. 6 semiconductor wafer extremely shown in Figure 8 etc., can enumerate encapsulation, pottery, glass system or substrate, various electronic unit, the various driver of silicon system and the various rapidoprints that require the micron order precision that the adhering part such as the DAF that is arranged on chip back surface (Die Attach Film, wafer junctional membrane) of use or semiconductor product are installed as chip.
With reference to Fig. 9, show the side elevation in partial section of support box and Ka Tai part.Support box 16 is U-shaped roughly, therefore is formed with image unit at the opposition side of the connecting plate 16c that connects upper plate 16a and lower plate 16b and enters peristome 19.Be shown schematically in the figure processing feed unit 23.
Figure 10 is the partial sectional view after the A to Fig. 9 partly amplifies, and semiconductor wafer 1 is attached on cutting belt T in the downward mode of its positive 1a, and ring-shaped frame F is positioned in framework and settles on platform 29.
As mentioned above, the supporting pad 74 of card platform 28 is formed by the transparency material of glass etc., and has a plurality of attraction grooves 78.Attract groove 78 to be connected (with reference to Fig. 4) via the access 72 that is formed on annular support part spare 62 with vacuum attraction source 80.
As shown in figure 11, supporting pad 74 has: the attraction path that is formed with a plurality of attraction paths such as pore or attraction groove forms regional 74a; Do not form the regional 74b of the non-formation of criss-cross attraction path that attracts path; And the outer regions 74c that forms the attraction path.For target acquisition pattern clearly, path is non-to be formed regional 74b and carries out through attracting in the shooting of the target pattern that is preferably undertaken by the 1st image unit 82.
With reference to Figure 12, show the longitudinal section of the supporting pad 74A of another execution mode.Supporting pad 74A is formed by transparency materials such as glass, and has a plurality of transverse attractive grooves 75 and a plurality of vertical attraction groove 77 vertical with transverse attractive groove 75.Label 79 is the attraction grooves that are connected with access 72.
Below, the aligning operation that utilizes the 1st image unit 82 is described.As shown in Figure 9, ring-shaped frame F is placed in framework settles on platform 29, make vacuum attraction source 80 work, by the supporting pad 74 attracting holding semiconductor wafers 1 of card platform 28.
Under this state, drive X-axis feed unit 12 and Y-axis feed unit 22, as shown in Figure 9, make the 1st image unit 82 enter peristome 19 by image unit and enter in support box 16, make the 1st image unit 82 be positioned at semiconductor wafer 1 under.
Need to obtain in advance before cut the 1st image unit 82 detect processing to be cut spacing track to the pattern match of carrying out on time in the image that uses.Therefore, when the 1st image unit 82 be positioned to remain on semiconductor wafer 1 on card platform 28 under the time, lighting device 90 or 92 is lighted and is thrown light on from the below to semiconductor wafer 1, utilize low range camera 86 or high magnification camera 82 to see through the front that transparent supporting pad 74 is taken semiconductor wafer 1, captured image is presented on the not shown displays such as LCD.
The operator of laser processing device 2 is by the not shown guidance panel of operation, and driving X-axis feed unit 12 or Y-axis feed unit 22 are searched for the target pattern 7 as the pattern match target.
When the operator has determined target pattern 7, the recording image that comprises this target pattern in the RAM 46 that the controller 40 of laser processing device 2 has.And, obtain the distance between the center line of this target pattern 7 and spacing track 3 according to coordinate figure etc., and should value also be stored in RAM 46.And, obtain adjacent spacing track and the interval between spacing track (spacing track spacing) according to coordinate figure etc., and the spacing track distance values also be stored in the RAM 46 of controller 40.
When cutting off along 3 pairs of semiconductor wafers 1 of spacing track, carry out the image of the target pattern stored and the pattern match between the actual image of being obtained by the 1st image unit 82 shootings.For along the same spacing track 3 that extends on X-direction and these 2 of A point spaced apart from each other and B points locate to carry out this pattern match.
When the pattern match at A point place is completed, card platform 28 is moved on X-direction, carry out on X-direction leaving with the A point pattern match at the B point place of suitable distance.At this moment, not to tap son from A to move to the B point and carry out pattern match, but pattern match is carried out at a plurality of positions in the mobile way of ordering towards B as required, driving should be proofreaied and correct the motor 26 of the deviation of Y direction, a little rotates to carry out θ and proofreaies and correct to make card platform 28, finally carries out the pattern match at B point place.
When the pattern match at A point and B point place is completed, the straight line that connects two target patterns 7 is parallel with spacing track 3, by making the distance of card platform 28 between the center line of moving target pattern 7 on Y direction and spacing track 3, carry out the position alignment of spacing track 3 to be cut and concentrator (laser irradiating head) 36, aligning is completed.
Make the 1st image unit 82 enter into support box 16 when interior, in order to prevent that the 1st image unit 82 from touching the connecting plate 16c of support box 16, preferably the inner face at connecting plate 16c attaches for example belt switch (TapeSwitch) of Tokyo transducer Co., Ltd. (Zhu formula Hui She East capital セ Application サ) manufacturing.This belt switch consists of the contact preventing mechanism of detecting contact by conducting.
Processing unit (plant) of the present invention is not limited to laser processing device shown in Figure 12, and the 1st image unit 82 of the present invention also can be applied to topping machanism shown in Figure 13 (cutter sweep) 110 equally.
Be erected to be provided with vertical column 112 on the base portion 4 of topping machanism 110, on this vertical column 112 can be equipped with along the mode that Z-direction moves cutting unit 114.That is, the Z axis feed unit 124 of the shell 116 of cutting unit 114 by being made of ball-screw 120 and pulse motor 122 moves on Z-direction along pair of guide rails 126.
Contain not shown main shaft and main shaft is rotated the motor of driving in shell 116, be equiped with removably cutting tip 118 at the front end of main shaft.Other structures of present embodiment are identical with laser processing device 2 shown in Figure 1, thereby the description thereof will be omitted.
Claims (6)
1. processing unit (plant), this processing unit (plant) has base portion, it is characterized in that, and this processing unit (plant) has:
Keep platform, it has the supporting pad that machined object is kept, formed by the transparent body;
Machining cell, it is processed the machined object that remains on this maintenance platform;
The processing feed unit, its make described maintenance platform and described machining cell with the surperficial parallel X-direction of this maintenance platform and the Y direction vertical with this X-direction on relatively feeding; And
Image unit, its mode with the lower position that is positioned at this supporting pad is installed on described base portion, and see through the described supporting pad that is formed by the transparent body and take the machined object that remains on described maintenance platform,
When taking machined object, make described maintenance platform move to this image unit top by described processing feed unit,
Wherein, described processing unit (plant) also has support box, and this support box carries on described processing feed unit, rotatably supports described maintenance platform,
The annular support part spare that described maintenance platform comprises described supporting pad and this supporting pad is supported,
Described support box comprises: have the upper plate of opening, the described annular support part spare of the rotatably chimeric described maintenance platform of this opening; Lower plate, it is positioned on described processing feed unit; And connecting plate, it connects described upper plate and described lower plate in the mode that formation image unit at least a portion of this support box periphery enters peristome,
When taking machined object, move described maintenance platform by described processing feed unit, described image unit enters peristome by this image unit and enters in described support box thus, and be positioned at described maintenance platform under.
2. processing unit (plant) according to claim 1, wherein, this processing unit (plant) also has the shooting feed unit, and this shooting feed unit makes described image unit move in vertical direction with respect to described supporting pad.
3. processing unit (plant) according to claim 1, wherein, this processing unit (plant) also has the 2nd image unit, and the 2nd image unit takes from the top of described supporting pad the machined object that remains on described maintenance platform.
4. processing unit (plant) according to claim 1, wherein, described supporting pad is made of the material of selecting from following group, and this group is made of quartz glass, Pyrex, sapphire, calcirm-fluoride, lithium fluoride and magnesium fluoride.
5. processing unit (plant) according to claim 1, wherein, described supporting pad has: the attraction path with a plurality of attraction paths forms the zone; And non-formations of the attraction path that form to attract path zone, the shooting of the machined object that is undertaken by described image unit is to carry out through this attraction path non-zone that forms.
6. processing unit (plant) according to claim 1, wherein, described machining cell comprises the either party in laser irradiating head or cutting tip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008253220A JP5274966B2 (en) | 2008-09-30 | 2008-09-30 | Processing equipment |
| JP2008-253220 | 2008-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101714499A CN101714499A (en) | 2010-05-26 |
| CN101714499B true CN101714499B (en) | 2013-06-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101782151A Active CN101714499B (en) | 2008-09-30 | 2009-09-27 | A machining device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5274966B2 (en) |
| CN (1) | CN101714499B (en) |
| TW (1) | TWI464826B (en) |
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| CN101714499A (en) | 2010-05-26 |
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| JP2010087141A (en) | 2010-04-15 |
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