JP2010045252A - Cleaving device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaving device that cleaves a substrate to a width less than the thickness of the substrate. <P>SOLUTION: The substrate 100 is supported in a cantilever state by a first member 18a and a second member 18b of a support means 18, and a push rod 10a is pressed to cleave the substrate at the position of a groove 108. The push rod 10a has an elastic member 24 disposed nearby its chip. Further, an operating member 26 is connected to the elastic member 24, and when the push rod 10a is pressed against the substrate 100, the operating member 26 comes into contact with the substrate 100. Further, slopes having an angle θ being θ>α are formed at ends of the first member 18a and second member 18b on the side of a position detecting mechanism 12, where NA is the numerical aperture of an objective lens of an imaging apparatus constituting the position detecting mechanism 12 and a state observation mechanism 20 and NA=sinα. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cleavage device.

  Conventionally, cutting or cleaving with a dicing saw is known as a method for dividing a semiconductor wafer into chips. Among these, the dividing method by cleavage is a technique in which a groove corresponding to a predetermined dividing line is formed in a semiconductor wafer, and the groove is divided along the dividing line. Patent Document 1 below discloses such a wafer cleaving method and cleaving apparatus.

JP 2004-335930 A

  An object of the present invention is to provide a cleavage apparatus capable of cleaving a substrate with a width smaller than the thickness of the substrate.

  In order to achieve the above object, the invention of the cleavage apparatus according to claim 1 is characterized in that the support means for supporting the substrate in a cantilever state, and an elastic member is disposed in the vicinity of the tip, and connected to the elastic member. And dividing means for pressing the member against the supported substrate and dividing the member along a predetermined dividing line.

  According to a second aspect of the present invention, the invention according to the first aspect further includes a position detection mechanism for detecting an operating position of the dividing means, and the position detection mechanism uses an objective lens having a magnification of 10 times or more. , And the dividing means, which translates in a direction parallel to the surface of the substrate.

  According to a third aspect of the present invention, in the second aspect of the present invention, the position detection mechanism includes an imaging device and a light reflecting unit that changes an imaging direction of the imaging device.

  According to a fourth aspect of the present invention, the invention according to any one of the first to third aspects further includes a state observation mechanism for observing the cleavage state of the substrate, and the state observation mechanism has a magnification of 10 times. Using the above objective lens, the objective lens is translated in a direction parallel to the surface of the substrate.

  The invention according to claim 5 is the invention according to any one of claims 2 to 4, wherein the support means is a first member disposed on the same side as the dividing means with respect to a substrate, and The substrate is sandwiched from both sides by a second member disposed on the opposite side of the dividing means, and the end of the second member is a cleaving groove formed on the substrate from the end of the first member. A distance smaller than the pitch of the substrate is arranged so as to protrude toward the position where the action member of the substrate is pressed.

  According to a sixth aspect of the present invention, in the fifth aspect of the present invention, at the end of the first member on the position detection mechanism side, the numerical aperture of the objective lens of the imaging device is NA, and NA = sin α. Sometimes, an inclined surface having an angle θ satisfying θ> α is formed.

  According to a seventh aspect of the present invention, in the fifth aspect of the present invention, the numerical aperture of the objective lens included in the imaging device constituting the state observation mechanism is set to NA and NA = sin α at the tip of the second member. Sometimes, an inclined surface having an angle θ satisfying θ> α is formed.

  The invention according to claim 8 is the invention according to any one of claims 1 to 7, characterized in that the support means is made of a transparent material.

  According to the first aspect of the present invention, the substrate can be cleaved with a width smaller than the thickness of the substrate as compared with the case where this configuration is not provided.

  According to invention of Claim 2, compared with the case where it does not have this structure, the action position of a division | segmentation means can be determined with high precision.

  According to the third aspect of the present invention, it is possible to eliminate the necessity of translating the imaging device for each cleavage operation, compared to the case where this configuration is not provided.

  According to the fourth aspect of the present invention, it is possible to determine with high accuracy whether or not the substrate has been cleaved normally, as compared with the case where this configuration is not provided.

  According to the fifth aspect of the present invention, the substrate can be prevented from being destroyed at the time of cleavage as compared with the case where the present configuration is not provided.

  According to invention of Claim 6, compared with the case where it does not have this structure, it can avoid that the 1st member obstructs the detection of the action position of the division | segmentation means by a position detection mechanism.

  According to invention of Claim 7, compared with the case where it does not have this structure, it can avoid that a 2nd member obstructs observation of the cleavage state by a state observation mechanism.

  According to the eighth aspect of the present invention, it is possible to avoid the support means from interfering with the detection of the action position of the dividing means by the position detection mechanism and the observation of the cleavage state by the state observation mechanism, as compared with the case without this configuration. .

  Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described with reference to the drawings.

  FIG. 1 shows a configuration example of an embodiment of a cleavage device according to the present invention. In FIG. 1, the cleaving apparatus includes a dividing unit 10 and a position detection mechanism 12, and controls the translation mechanism 14 that translates in a direction parallel to the surface of the substrate 100 (x direction), and the translation mechanism 14. The control unit 16 that controls the positioning of the dividing unit 10, the support unit 18 that supports the substrate 100 in a cantilever state, and the state observation mechanism 20 for observing the cleavage state of the substrate 100 are configured. . The substrate 100 is fixed to a fixing member 102, and a protective film 104 is attached to the surface on the parallel movement mechanism 14, and a dicing tape 106 is attached to the opposite surface. A groove 108 corresponding to a dividing line is formed on the surface of the substrate 100 at a predetermined position.

  The dividing means 10 presses against the substrate 100, cleaves the substrate 100 with the groove 108, and divides the push rod 10a and the push rod 10a into the z direction (indicated by arrow B in the figure) perpendicular to the x direction. And a push rod moving mechanism 10b that moves in the direction toward the substrate 100 and the opposite direction). The push rod 10a will be described later.

  The position detection mechanism 12 is configured by an imaging device such as a camera, and detects position information such as a groove 108 formed on the substrate 100 and determines a position (action position) where the push rod 10a is pressed against the substrate 100. Output to the control unit 16. It is preferable that the imaging device constituting the position detection mechanism 12 uses an objective lens having a magnification of 10 times or more.

  The translation mechanism 14 includes the dividing unit 10 and the position detection mechanism 12 and is a device that translates in the x direction (arrow A direction in the figure) parallel to the surface of the substrate 100 based on the position control of the control unit 16. is there. Thereby, the dividing means 10 and the position detection mechanism 12 can be translated in the x direction.

  The control unit 16 is configured by an appropriate computer or the like, and performs positioning control of the parallel movement mechanism 14 based on the position information received from the position detection mechanism 12, and controls the push rod moving mechanism 10b to thereby push the push rod 10a. Is moved in the z direction. In this positioning control, first, the first position where the push rod 10a is pressed onto the substrate 100 is determined based on the position of the groove 108 and the like. The initial position is not particularly limited, but is, for example, the position of the region arranged at the end of the substrate region divided by the groove 108 formed in the substrate 100. When the push rod 10a pushes the substrate 100 at this position, the first cleavage is performed. Next, the control unit 16 moves the translation mechanism 14 by the interval of the grooves 108. When the push rod 10a pushes the substrate 100 at this position, the next cleavage is performed. Thereafter, the substrate 100 is cleaved in the same manner by the grooves 108, and the parts previously formed on the substrate are divided.

  The support means 18 sandwiches the substrate 100 from both sides and supports it in a cantilever state. The support means 18 includes a first member 18a disposed on the same side as the dividing means 10 with respect to the substrate 100 and a second member disposed on the opposite side of the dividing means 10 in order to sandwich the substrate 100 from both sides. 18b. Further, the distal end portion 22b on the side where the substrate 100 is cleaved in the second member 18b is smaller than the distance (pitch) between the grooves 108 formed in the substrate 100 from the distal end portion 22a of the first member 18a. Only the push bar 10a of the substrate 100 is arranged so as to protrude toward the position where it is pressed. In the present embodiment, the first member 18a and the second member 18b release the substrate 100 for each cleavage operation by the push rod 10a, translate the same distance in the same direction as the translation mechanism 14, and before the cleavage operation starts. The substrate 100 is again sandwiched and fixed from both sides. The shapes of the first member 18a and the second member 18b will be described later.

  The state observation mechanism 20 is configured by an imaging device such as a camera, and observes the cleavage state of the substrate 100. The state observation mechanism 20 is disposed on the opposite side of the dividing unit 10 with respect to the substrate 100. By being pushed by the push rod 10a, the substrate 100 is cleaved at the position of the groove 108. At that time, a minute gap is generated, and light from an illumination device (not shown) arranged on the opposite side of the state observation mechanism 20 is emitted. It leaks to the state observation mechanism 20 side. When the cleavage is performed normally, the light is linear, and when the cleavage is abnormal, the substrate 100 is destroyed and the light is irregularly shaped. Therefore, by observing the light, it can be determined whether or not the substrate 100 has been normally divided by cleavage. This information is output to the control unit 16 and used for control of the control unit 16. It is preferable that the imaging apparatus constituting the state observation mechanism 20 uses an objective lens having a magnification of 10 times or more. In the present embodiment, the state observation mechanism 20 is configured to translate the same distance in the same direction as the translation mechanism 14 for each cleavage operation by the push rod 10a.

  FIG. 2 shows an explanatory diagram of another state in the cleavage device of FIG. In FIG. 2, the parallel movement mechanism 14 moves in parallel under the control of the control unit 16, and the push rod 10 a is positioned at the pressing position on the substrate 100. In this state, the push rod moving mechanism 10b pushes down the push rod 10a and presses it against the substrate 100, thereby cleaving the substrate 100 at the position of the groove 108. At this time, the position detection mechanism 12 is retracted to the first member 18a side. In addition, the state observation mechanism 20 moves to a position near the opposite side of the push rod 10a with respect to the substrate 100, and observes light that leaks during cleavage.

  In the embodiment described above, the translation mechanism 14, the support means 18, and the state observation mechanism 20 are configured to translate each time the cleavage operation is performed by the push rod 10a. However, these positions are fixed and fixed. The substrate 100 fixed to the member 102 may be moved.

  3 (a), (b), and (c) show a configuration example of the push rod 10a. 3A, 3B, and 3C, an elastic member 24 is disposed in the vicinity of the tip of the push rod 10a. An action member 26 is connected to the elastic member 24, and the action member 26 contacts the substrate 100 when the push rod 10 a is pressed against the substrate 100. The material of the elastic member 24 may be natural rubber, urethane rubber, or the like that is excellent in impact resilience, tear resistance, wear resistance, and flex crack resistance, but is not limited thereto. Further, the working member 26 can use SK-based tool steel such as SKS-3 subjected to quenching (heat treatment) and surface treatment, ceramics, and the like together with the base member 28 of the push rod 10a, but is not limited thereto. Is not to be done.

  Further, the shape of the action member 26 is constant with respect to the surface of the substrate 100 as shown in FIG. 3B, as shown in FIG. 3c, and as shown in FIG. 3 (c), there are those that are partially parallel and partially angled with respect to the surface of the substrate 100, but are not limited thereto. It is not something.

4A and 4B are sectional views showing examples of the shapes of the first member 18a and the second member 18b constituting the support means 18. FIG. In FIG. 4A, the front end portion 22a of the first member 18a and the front end portion 22b of the second member 18b are surfaces that are orthogonal to the bottom surface 30 (the surface that contacts the substrate 100). In addition, slopes are formed at the ends of the first member 18a and the second member 18b on the position detection mechanism 12 side. The inclined surfaces are formed at an angle θ with respect to the surfaces of the tip portions 22a and 22b from the upper ends (ends far from the bottom surface 30) of the tip portions 22a and 22b. This angle θ represents the numerical aperture NA of the objective lens of the imaging device that constitutes the position detection mechanism 12 and the state observation mechanism 20 as NA = sin α.
It is preferable that θ> α. For example, when the numerical aperture NA of an objective lens having a magnification of 10 is 0.3, α = 17.5 degrees and θ> 17.5 degrees.

  In FIG. 4B, the tip portions 22 a and 22 b are sides where the inclined surface and the bottom surface 30 form an angle θ with the direction orthogonal to the bottom surface 30. The condition for the angle θ is the same as in the case of FIG.

  The first member 18a and the second member 18b described above are not limited to the combinations shown in FIGS. 4 (a) and 4 (b). For example, the first member 18a may have the shape shown in FIG. 4B, and the second member 18ba may have the shape shown in FIG.

  FIG. 5 is an explanatory diagram of the cleavage operation by the cleavage device according to the present embodiment. In FIG. 5, the substrate 100 is sandwiched from both sides by the first member 18 a and the second member 18 b and supported in a cantilever state, and the action member 26 of the push rod 10 a is pressed downward in the figure to form the groove 108. Cleave at position. In the example of FIG. 5, the protective film 104 and the dicing tape 106 are not shown.

  In the present embodiment, the interval between the grooves 108 is p, and the distance between the tip 22b of the second member 18b and the position where the force is applied by the push rod 10a (the center of the contact surface of the action member 26 to the substrate 100) is w. Then, w <p.

Further, if the force applied by the push rod 10a is F and the couple when the substrate 100 is cleaved is G, then G = F · w
It becomes.

Further, if the maximum couple that can be cleaved without destroying the substrate 100 is Gs, the maximum force that can be cleaved without destroying the substrate 100 is Fs, and the maximum distance that can be cleaved without destroying the substrate 100 is ws.
Gs = Fs · ws
It becomes. Here, in the case of performing division with a width smaller than the thickness of the substrate, the above p becomes small and w also becomes small. When this w becomes smaller than the above ws, the force F needs to be larger than Fs. Therefore, the push rod 10a according to the present embodiment is configured such that the force applied to the substrate 100 is buffered by the elastic member 24 and the substrate 100 is cleaved without being destroyed.

  FIG. 6 shows a flow of an example of the control operation of the control unit 16. In FIG. 6, when position information is received from the position detection mechanism 12 (S1), an initial positioning process is executed (S2). As described above, this process is a process of determining an initial position for pressing the push rod 10a onto the substrate 100 based on the position information. By this processing, the parallel movement mechanism 14, the support means 18, and the state observation mechanism 20 are in the state shown in FIG.

  Next, the push rod 10a is translated in a direction parallel to the surface of the substrate 100, and the operation of pressing the substrate 100 against the substrate 100 at the determined position is controlled (S3). At this time, it is observed whether or not the substrate has been cleaved by the state observation mechanism 20 (S4). Is determined (S5).

  If it is determined in S5 that cleavage has not been completed normally, an alarm to that effect is output (S6). On the other hand, if the cleavage is completed normally, it is determined whether or not all the cleavage of the substrate 100 is completed (S7). If it is determined that the cleavage is not completed, the parallel movement mechanism 14, the support means 18 and The state observation mechanism 20 is translated by the interval of the groove 108 (S8), and the operation from S3 is repeated. Note that whether or not the cleavage of the substrate 100 has been completed can be determined based on whether or not the cleavage operation has been performed a predetermined number of times, for example.

  On the other hand, if it is determined in S7 that all the cleavage of the substrate 100 has been completed, the control unit 16 ends the control operation (S9).

  FIG. 7 shows another configuration example of an embodiment of the cleavage device according to the present invention, and the same elements as those in FIG. In FIG. 7, the position detection mechanism 12 includes a light reflecting means 12a such as a mirror and an imaging device 12b such as a camera. The light reflecting means 12a is provided to change the imaging direction of the imaging device 12b. Light emitted from the position of the groove 108 on the substrate 100 is reflected by the light reflecting means 12a and enters the imaging device 12b, and position detection is performed. The position information detected by the imaging device 12b is input to the control unit 16.

  The light reflecting means 12a can be translated in the direction of arrow C. The mechanism for moving the light reflecting means 12a in parallel is not limited. For example, the light reflecting means 12a may be connected to the parallel moving mechanism 14 and moved in parallel with the dividing means 10. Moreover, in this embodiment, since the light is reflected by the light reflecting means 12a toward the image pickup device 12b, the image pickup device 12b can be disposed at a position away from the push rod 10a. For this reason, it is not necessary for the imaging device 12b to translate and retract during the cleavage operation by the push rod 10a. In the example of FIG. 7, the parallel movement mechanism 14 is moved under the control of the control unit 16, and the push rod 10 a is positioned at the pressing position on the substrate 100.

  FIG. 8 shows an explanatory diagram of another state in the cleavage device of FIG. In FIG. 8, the push rod moving mechanism 10 b pushes down the push rod 10 a and cleaves the substrate 100 at the position of the groove 108. At this time, the light reflecting means 12a is retracted to the first member 18a side. In addition, the state observation mechanism 20 moves to a position near the opposite side of the push rod 10a with respect to the substrate 100, and observes light that leaks during cleavage.

It is a figure which shows the structural example of one Embodiment of the cleavage apparatus concerning this invention. It is explanatory drawing of the other state in the cleavage apparatus of FIG. It is a figure which shows the structural example of a push rod. It is sectional drawing of the example of the shape of the 1st member and 2nd member which comprise a support means. It is explanatory drawing of the cleavage operation | movement by the cleavage apparatus concerning this invention. It is a flowchart of the example of control operation of a control part. It is a figure which shows the other structural example of one Embodiment of the cleavage apparatus concerning this invention. It is explanatory drawing of the other state in the cleavage apparatus of FIG.

Explanation of symbols

  10 dividing means, 10a push rod, 10b push rod moving mechanism, 12 position detecting mechanism, 12a light reflecting means, 12b imaging device, 14 parallel moving mechanism, 16 control unit, 18 support means, 18a first member, 18b second member 20 state observation mechanism, 22a, 22b tip, 24 elastic member, 26 action member, 28 root member, 100 substrate, 102 fixing member, 104 protective film, 106 dicing tape, 108 groove.

Claims (8)

Supporting means for supporting the substrate in a cantilever state;
An elastic member is disposed in the vicinity of the tip, and a dividing means that presses the action member connected to the elastic member against the supported substrate and divides it along a predetermined dividing line;
A cleaving device comprising:   The cleaving apparatus according to claim 1, further comprising a position detection mechanism for detecting an operating position of the dividing means, wherein the position detecting mechanism uses an objective lens having a magnification of 10 times or more, together with the dividing means. A cleaving device that translates in a direction parallel to the surface.   3. The cleavage device according to claim 2, wherein the position detection mechanism includes an imaging device and a light reflecting unit that changes an imaging direction of the imaging device.   The cleavage device according to any one of claims 1 to 3, further comprising a state observation mechanism for observing a cleavage state of the substrate, wherein the state observation mechanism uses an objective lens having a magnification of 10 times or more. A cleaving device that translates in a direction parallel to the surface of the substrate.   5. The cleavage device according to claim 2, wherein the support means is a first member arranged on the same side as the dividing means with respect to a substrate, and is arranged on the opposite side to the dividing means. The end portion of the second member is smaller than the end portion of the first member by a distance smaller than the pitch of the cleaving grooves formed on the substrate. A cleaving device, wherein the cleaving device is arranged so as to protrude toward a position where the action member of the substrate is pressed against.   6. The cleavage device according to claim 5, wherein at the end of the first member on the position detection mechanism side, the numerical aperture of the objective lens included in the imaging device is NA, and when NA = sin α, θ> α A cleaving device characterized in that a slope having an angle θ is formed.   6. The cleavage apparatus according to claim 5, wherein θ> α when the numerical aperture of the objective lens included in the imaging device constituting the state observation mechanism is NA and NA = sin α at the distal end of the second member. A cleaving device characterized in that a slope having an angle θ is formed.   The cleavage device according to any one of claims 1 to 7, wherein the support means is made of a transparent material.

Images