CN103522434A - Infrared technology based wafer cutting online detecting system - Google Patents
Infrared technology based wafer cutting online detecting system Download PDFInfo
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- CN103522434A CN103522434A CN201310529158.3A CN201310529158A CN103522434A CN 103522434 A CN103522434 A CN 103522434A CN 201310529158 A CN201310529158 A CN 201310529158A CN 103522434 A CN103522434 A CN 103522434A
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Abstract
The invention relates to a detecting system, particularly relates to an infrared technology based wafer cutting online detecting system and belongs to the technical field of wafer cutting detecting. According to the technical scheme, the system comprises a transmission shaft and a flange arranged at the end of the transmission shaft. An infrared sensor for detecting cutting ways is fixed on the flange. According to infrared technology based wafer cutting online detecting system, the infrared sensor is used for detecting the cutting ways of a cutting knife during cutting in real time, an infrared receiving circuit is used for receiving the wafer reflection wave amount, a signal amplification circuit and a filter circuit are used for inputting signals into a data processing circuit, and the data processing circuit is used for determining and controlling the working state of the cutting knife according to the wafer reflection wave amount. The system is compact in structure, high in detection instantaneity, capable of guaranteeing wafer normal cutting and guaranteeing the cutting knife against damage and improving the cutting stability and safe and reliable.
Description
Technical field
The present invention relates to a kind of detection system, especially a kind of wafer cutting on-line detecting system based on infrared technique, belongs to the technical field that wafer cutting detects.
Background technology
During wafer cutting, cutting machine can detect online to tool marks, for but meet the requirement of volume production, general every 20--30 stepping (can set) just can carry out the detection of tool marks cutting quality, therefore can cause blade serious wear and cut-in without ball of causing or do not cut phenomenon completely and occur in cutting process.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of wafer cutting on-line detecting system based on infrared technique, its compact conformation, detect real-time, guarantee that wafer normally cuts and guarantees that cutter are not impaired, improve the stability of cutting, safe and reliable.
According to technical scheme provided by the invention, the described wafer cutting on-line detecting system based on infrared technique, the flange that comprises power transmission shaft and be positioned at described end part of driving shaft; On described flange, be also installed with the infrared sensor for detection of Cutting Road.
Described infrared sensor comprises for launching the infrared transmitting circuit of infrared signal and for receiving the infrared receiving circuit of infrared signal, described infrared receiving circuit is connected with data processing circuit.
Described infrared receiving circuit is connected with data processing circuit by signal amplification circuit and filter circuit.Cutter are also installed on described flange, and the transmitting terminal of infrared sensor is provided with detection window, in described detection window, is provided with blowning installation.
The below of described cutter is provided with wafer, and described wafer is arranged on loading plate by diaphragm.
Advantage of the present invention: the Cutting Road while utilizing infrared sensor to cut cutter detects in real time, by infrared receiving circuit, wafer back wave amount is received, and by signal amplification circuit and filter circuit by signal input data processing circuit, by data processing circuit, according to back wave amount, judged the duty of controlling cutter, compact conformation, detects real-timely, guarantees that wafer normally cuts and guarantees that cutter are not impaired, improve the stability of cutting, safe and reliable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is workflow diagram of the present invention.
Fig. 3 is the structured flowchart of infrared sensor of the present invention.
Description of reference numerals: 1-loading plate, 2-diaphragm, 3-wafer, 4-cutter, 5-flange, 6-power transmission shaft, 7-infrared sensor, 8-installation portion, 9-detection window, 10-infrared transmitting circuit, 11-infrared receiving circuit, 12-signal amplification circuit, 13-filter circuit and 14-data processing circuit.
The specific embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Figure 1, Figure 2 and Figure 3: in order to detect in real time wafer cutting process, guarantee wafer cutting normally carry out and cutter 4 injury-free, the flange 5 that the present invention includes power transmission shaft 6 and be positioned at described power transmission shaft 6 ends; On described flange 5, be also installed with the infrared sensor 7 for detection of Cutting Road.
Particularly, on described flange 5, cutter 4 are also installed, the transmitting terminal of infrared sensor 7 is provided with detection window 9, in described detection window 9, is provided with blowning installation.The below of described cutter 4 is provided with wafer 3, and described wafer 3 is arranged on loading plate 1 by diaphragm 2.Cutting Road when infrared sensor 7 can detect 3 cutting of 4 pairs of wafers of cutter, broken the cutting producing when blowning installation can cut wafer blown away, and avoids the ultrared reception impact of infrared sensor 7 transmitting.Infrared sensor 7 can be followed cutter 4 and be moved together.
Described infrared sensor 7 comprises for launching the infrared transmitting circuit 10 of infrared signal and for receiving the infrared receiving circuit 11 of infrared signal, described infrared receiving circuit 11 is connected with data processing circuit 14.Described infrared receiving circuit 11 is connected with data processing circuit 14 by signal amplification circuit 12 and filter circuit 13.Infrared transmitting circuit 10 can be launched infrared signal, described infrared signal is acting on wafer 3, the Cutting Road of wafer 3 reflects infrared ray, the infrared ray of described reflection is received by infrared receiving circuit 11, infrared receiving circuit 11 is converted to the signal of telecommunication by infrared signal, and 12 pairs of signals of telecommunication of signal amplification circuit amplify, and the signal after 13 pairs of amplifications of filter circuit carries out filtering, with the clutter in filtering back wave, data processing circuit 14 judges according to filtered signal.When reception back wave amount is non-vanishing, data processing circuit 14 is controlled the cutting action that cutter 4 carry out, to cutter 4 are carried out to non-contact detection, guarantees the injury-free of cutter 4.When reception back wave amount is zero, data processing circuit 14 is controlled cutter 4 and is continued to carry out cutting action.Described data processing circuit 14 can adopt conventional micro-chip processor, as single-chip microcomputer etc.Infrared transmitting circuit 10, infrared receiving circuit 11 all can adopt conventional infrared circuit.
Cutting Road when the present invention utilizes 4 cutting of 7 pairs of cutter of infrared sensor detects in real time, by 11 pairs of wafers of infrared receiving circuit, 3 back wave amounts, receive, and by signal amplification circuit 12 and filter circuit 13 by signal input data processing circuit 14, by data processing circuit 14, according to back wave amount, judged the duty of controlling cutter 4, compact conformation, detects real-timely, guarantees that wafer normally cuts and guarantees that cutter are not impaired, improve the stability of cutting, safe and reliable.
Claims (5)
1. the wafer based on infrared technique cuts an on-line detecting system, the flange (5) that comprises power transmission shaft (6) and be positioned at described power transmission shaft (6) end; It is characterized in that: on described flange (5), be also installed with the infrared sensor (7) for detection of Cutting Road.
2. the wafer based on infrared technique according to claim 1 cuts on-line detecting system, it is characterized in that: described infrared sensor (7) comprises infrared transmitting circuit (10) for launching infrared signal and for receiving the infrared receiving circuit (11) of infrared signal, described infrared receiving circuit (11) is connected with data processing circuit (14).
3. the wafer cutting on-line detecting system based on infrared technique according to claim 2, is characterized in that: described infrared receiving circuit (11) is connected with data processing circuit (14) by signal amplification circuit (12) and filter circuit (13).
4. the wafer based on infrared technique according to claim 1 cuts on-line detecting system, it is characterized in that: cutter (4) are also installed on described flange (5), the transmitting terminal of infrared sensor (7) is provided with detection window (9), and described detection window is provided with blowning installation in (9).
5. the wafer cutting on-line detecting system based on infrared technique according to claim 4, is characterized in that: the below of described cutter (4) is provided with wafer (3), and described wafer (3) is arranged on loading plate (1) by diaphragm (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310529158.3A CN103522434A (en) | 2013-10-30 | 2013-10-30 | Infrared technology based wafer cutting online detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310529158.3A CN103522434A (en) | 2013-10-30 | 2013-10-30 | Infrared technology based wafer cutting online detecting system |
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| Publication Number | Publication Date |
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| CN103522434A true CN103522434A (en) | 2014-01-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201310529158.3A Pending CN103522434A (en) | 2013-10-30 | 2013-10-30 | Infrared technology based wafer cutting online detecting system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526891A (en) * | 2014-12-18 | 2015-04-22 | 浙江中纳晶微电子科技有限公司 | Method for cutting wafer through mechanical tool |
| CN104538326A (en) * | 2014-12-16 | 2015-04-22 | 苏州凯锝微电子有限公司 | Detection device for wafer cutting notches |
| CN112447591A (en) * | 2020-11-27 | 2021-03-05 | 华虹半导体(无锡)有限公司 | Method for cutting wafer |
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| JPS617020B2 (en) * | 1978-09-08 | 1986-03-03 | Hitachi Ltd | |
| CN1841702A (en) * | 2005-03-30 | 2006-10-04 | 株式会社迪思科 | Wafer cutting method and device thereof |
| CN101183695A (en) * | 2006-11-02 | 2008-05-21 | 曼兹自动化股份公司 | Method and device for structuring solar modules |
| CN101255004A (en) * | 2006-11-02 | 2008-09-03 | 涩谷工业株式会社 | Method and apparatus for dividing brittle material |
| JP2010045252A (en) * | 2008-08-14 | 2010-02-25 | Fuji Xerox Co Ltd | Cleaving device |
| CN102398114A (en) * | 2010-09-10 | 2012-04-04 | 株式会社迪思科 | Method of dividing workpiece |
| CN103346099A (en) * | 2013-06-17 | 2013-10-09 | 华进半导体封装先导技术研发中心有限公司 | TSV wafer thinning on-line control method and system based on infrared technology |
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- 2013-10-30 CN CN201310529158.3A patent/CN103522434A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS617020B2 (en) * | 1978-09-08 | 1986-03-03 | Hitachi Ltd | |
| CN1841702A (en) * | 2005-03-30 | 2006-10-04 | 株式会社迪思科 | Wafer cutting method and device thereof |
| CN101183695A (en) * | 2006-11-02 | 2008-05-21 | 曼兹自动化股份公司 | Method and device for structuring solar modules |
| CN101255004A (en) * | 2006-11-02 | 2008-09-03 | 涩谷工业株式会社 | Method and apparatus for dividing brittle material |
| JP2010045252A (en) * | 2008-08-14 | 2010-02-25 | Fuji Xerox Co Ltd | Cleaving device |
| CN102398114A (en) * | 2010-09-10 | 2012-04-04 | 株式会社迪思科 | Method of dividing workpiece |
| CN103346099A (en) * | 2013-06-17 | 2013-10-09 | 华进半导体封装先导技术研发中心有限公司 | TSV wafer thinning on-line control method and system based on infrared technology |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538326A (en) * | 2014-12-16 | 2015-04-22 | 苏州凯锝微电子有限公司 | Detection device for wafer cutting notches |
| CN104526891A (en) * | 2014-12-18 | 2015-04-22 | 浙江中纳晶微电子科技有限公司 | Method for cutting wafer through mechanical tool |
| CN112447591A (en) * | 2020-11-27 | 2021-03-05 | 华虹半导体(无锡)有限公司 | Method for cutting wafer |
| CN112447591B (en) * | 2020-11-27 | 2022-06-07 | 华虹半导体(无锡)有限公司 | Method for cutting wafer |
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Application publication date: 20140122 |