JP7132042B2 - processing equipment - Google Patents

processing equipment Download PDF

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JP7132042B2
JP7132042B2 JP2018168491A JP2018168491A JP7132042B2 JP 7132042 B2 JP7132042 B2 JP 7132042B2 JP 2018168491 A JP2018168491 A JP 2018168491A JP 2018168491 A JP2018168491 A JP 2018168491A JP 7132042 B2 JP7132042 B2 JP 7132042B2
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wafer
holding
holding table
truncated cone
light
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JP2020043186A (en
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真由美 草川
幸容 増田
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Disco Corp
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Disco Corp
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Priority to JP2018168491A priority Critical patent/JP7132042B2/en
Priority to CN201910776799.6A priority patent/CN110896042B/en
Priority to US16/555,030 priority patent/US11031277B2/en
Priority to KR1020190106580A priority patent/KR102491740B1/en
Priority to TW108131904A priority patent/TWI788591B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
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    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Description

本発明は、円形を呈するウエーハの中心を求め、所定の加工を施す加工装置に関する。 The present invention relates to a processing apparatus that obtains the center of a circular wafer and performs predetermined processing.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画されたデバイス領域と、該デバイス領域を囲繞する外周余剰領域とが表面に形成されたウエーハは、レーザー加工装置、ダイシング装置によって分割予定ラインが加工され、個々のデバイスチップに分割されて携帯電話、パソコン等の電気機器に利用される。 A wafer in which a device region in which a plurality of devices such as ICs and LSIs are partitioned by dividing lines and an outer peripheral surplus region surrounding the device regions is formed on the surface is divided by a laser processing apparatus and a dicing apparatus. It is processed, divided into individual device chips, and used in electrical equipment such as mobile phones and personal computers.

レーザー加工装置は、ウエーハの外周を照射するＬＥＤを備えた保持テーブルにウエーハを保持する回転可能な保持手段と、該保持手段をＸ軸方向の加工送り方向、及びＹ軸方向の割り出し送り方向に移動する移動手段と、該保持手段に保持されたウエーハにレーザー光線を照射するレーザー光線照射手段と、該保持手段に保持されたウエーハの外周を、光を照射する光源（ＬＥＤ等）からの照明のもとで、保持テーブルを９０度ずつ回転させて３点撮像し、該３点の座標に基づいてウエーハの中心を検出し、検出したウエーハの中心と保持テーブルの中心とのずれを求め、該ずれを考慮して加工を実施する際のウエーハの中心位置の補正をすると共に、該補正を考慮して分割予定ラインに対してレーザー加工を施す制御手段と、から概ね構成されていて、ウエーハを高精度に加工することができる（例えば、特許文献１を参照。）。 The laser processing apparatus includes rotatable holding means for holding a wafer on a holding table equipped with an LED for irradiating the outer periphery of the wafer, and the holding means in the X-axis processing feed direction and the Y-axis index feed direction. A moving means for moving, a laser beam irradiation means for irradiating a laser beam to the wafer held by the holding means, and illumination from a light source (LED, etc.) for irradiating the outer periphery of the wafer held by the holding means. , the holding table is rotated by 90 degrees and three points are imaged, the center of the wafer is detected based on the coordinates of the three points, the deviation between the detected center of the wafer and the center of the holding table is obtained, and the deviation is obtained. and a control means for correcting the center position of the wafer when processing is performed in consideration of the It can be processed with precision (see Patent Literature 1, for example).

また、デバイス領域と、該デバイス領域を囲繞する外周余剰領域とが表面に形成されるウエーハにおいて、外周余剰領域以外のデバイス領域に対応する裏面を研削して外周余剰領域に対応する裏面にリング状の補強部を形成し、その後いくつかの工程を経てウエーハを個々のデバイスに分割する加工方法が知られている（例えば、特許文献２を参照。）。前記したリング状の補強部を形成した場合、個々のデバイスに分割する加工を実施する際、外周に形成されたリング状の補強部が邪魔になることから、上記した特許文献１に記載されたウエーハの中心を検出する方法を応用して、ウエーハの中心座標を正確に求めることができ、該中心座標に基づいて精度よくリング状の補強部を切断して除去することができ、ウエーハを良好に個々のデバイスに分割することができる。 Further, in a wafer having a device region and an outer peripheral surplus region surrounding the device region formed on the surface thereof, the back surface corresponding to the device region other than the outer peripheral surplus region is ground to form a ring-shaped back surface corresponding to the outer peripheral surplus region. A processing method is known in which a reinforcing portion is formed on the wafer, and then the wafer is divided into individual devices through several steps (see, for example, Patent Document 2). When the ring-shaped reinforcing portion described above is formed, the ring-shaped reinforcing portion formed on the outer periphery becomes an obstacle when performing processing for dividing into individual devices. By applying the method of detecting the center of the wafer, the center coordinates of the wafer can be obtained accurately, and the ring-shaped reinforcing portion can be accurately cut and removed based on the center coordinates, and the wafer can be improved. can be divided into individual devices.

特開２０１４－０６０２２４号公報JP 2014-060224 A 特開２００７－０１９４６１号公報Japanese Patent Application Laid-Open No. 2007-019461

上記した特許文献１に記載された技術によれば、ウエーハの中心座標を検出することができるものの、ウエーハを保持する保持手段は、ウエーハの大きさに応じて適宜交換される保持テーブルと、保持テーブルを着脱自在に支持する支持基台とから構成され、保持されるウエーハのサイズに応じて異なる保持テーブルが用意されることから、例えば、保持テーブルが着脱される支持基台側の上面の直径よりも小さい直径の保持テーブルを装着する場合に、保持テーブルや支持基台にウエーハの外周を照射するＬＥＤ等を配設することが困難になるという問題がある。また、個々の保持テーブルや、支持基台にＬＥＤ等の光源を配設する必要があることから、生産コストが高くなってしまうという問題がある。 According to the technique described in Patent Document 1, although the central coordinates of the wafer can be detected, the holding means for holding the wafer includes a holding table that can be appropriately exchanged according to the size of the wafer, Since different holding tables are prepared according to the size of the wafer to be held, for example, the diameter When a holding table with a smaller diameter is mounted, there is a problem that it becomes difficult to dispose LEDs or the like for illuminating the outer periphery of the wafer on the holding table or the support base. Moreover, since it is necessary to dispose light sources such as LEDs on individual holding tables and support bases, there is a problem that the production cost increases.

本発明は、上記事実に鑑みなされたものであり、その主たる技術課題は、生産コストを上昇させることなく円形を呈するウエーハの中心を求め、所定の加工を施すことができる加工装置を提供することにある。 SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and its main technical problem is to provide a processing apparatus capable of determining the center of a circular wafer and performing a predetermined processing without increasing the production cost. It is in.

上記主たる技術課題を解決するため、本発明によれば、円形を呈するウエーハの中心を求め、所定の加工を施す加工装置であって、ウエーハを保持する保持手段と、該保持手段に保持されたウエーハの外周を該保持手段に対向する方向から撮像する撮像手段と、から少なくとも構成され、該保持手段は、ウエーハの外周を露出させて吸引保持する保持テーブルと、該保持テーブルを支持する支持基台と、該支持基台に隣接して配設され該保持テーブルの外周に光を照射する光源を備えた発光手段と、該保持テーブルを回転させる駆動部と、から少なくとも構成され、該保持テーブルは、円錐台と、該円錐台の上面に配設されウエーハを保持するウエーハ保持部とを備え、該円錐台の底面の直径は、該ウエーハ保持部が保持するウエーハの直径よりも大きく形成されていて、該発光手段の光源から照射される光が、該円錐台の側面に反射して保持テーブル上に保持されるウエーハの外周を照射し該ウエーハの外周が該撮像手段で撮像される加工装置が提供される。 In order to solve the above main technical problems, according to the present invention, there is provided a processing apparatus for determining the center of a circular wafer and performing predetermined processing, comprising holding means for holding the wafer, and a wafer held by the holding means. an imaging means for imaging the outer circumference of the wafer from a direction facing the holding means, the holding means comprising a holding table for exposing the outer circumference of the wafer and holding it by suction, and a support base for supporting the holding table. The holding table comprises at least a table, a light emitting means provided adjacent to the support base and provided with a light source for irradiating the outer circumference of the holding table with light, and a driving section for rotating the holding table. includes a truncated cone and a wafer holding portion disposed on the upper surface of the truncated cone to hold a wafer, and the diameter of the bottom surface of the truncated cone is formed to be larger than the diameter of the wafer held by the wafer holding portion. The light emitted from the light source of the light emitting means is reflected on the side surface of the truncated cone to irradiate the outer periphery of the wafer held on the holding table, and the outer periphery of the wafer is imaged by the imaging means. An apparatus is provided.

該保持テーブルの外周には、該保持テーブルに保持されるウエーハの外周を支持する補助テーブルが配設され、該補助テーブルには、該円錐台の側面で反射した光を透過して露出したウエーハの外周を照射する開孔が少なくとも３箇所形成されていることが好ましい。また、該円錐台の側面の傾斜角度は、４５°に設定されることが好ましい。 An auxiliary table for supporting the outer circumference of the wafer held by the holding table is arranged on the outer circumference of the holding table. It is preferable that at least three openings for irradiating the outer periphery of the are formed. Also, the inclination angle of the side surface of the truncated cone is preferably set to 45°.

本発明の加工装置は、円形を呈するウエーハの中心を求め、所定の加工を施す加工装置であって、ウエーハを保持する保持手段と、該保持手段に保持されたウエーハの外周を該保持手段に対向する方向から撮像する撮像手段と、から少なくとも構成され、該保持手段は、ウエーハの外周を露出させて吸引保持する保持テーブルと、該保持テーブルを支持する支持基台と、該支持基台に隣接して配設され該保持テーブルの外周に光を照射する光源を備えた発光手段と、該保持テーブルを回転させる駆動部と、から少なくとも構成され、該保持テーブルは、円錐台と、該円錐台の上面に配設されウエーハを保持するウエーハ保持部と、を備え、該円錐台の底面の直径は、該ウエーハ保持部が保持するウエーハの直径よりも大きく形成されていて、該発光手段の光源から照射される光が、該円錐台の側面に反射して保持テーブル上に保持されるウエーハの外周を照射し該ウエーハの外周が該撮像手段で撮像されることから、保持テーブルの直径が、基台の直径よりも小さい場合でも、保持テーブルの円錐台の側面で光を反射して、ウエーハの外周を良好に検出することができる。また、保持テーブル側にＬＥＤを配設する必要がなく、生産コストを抑えることができる。 A processing apparatus according to the present invention is a processing apparatus for determining the center of a circular wafer and performing a predetermined processing, comprising holding means for holding the wafer, and an outer periphery of the wafer held by the holding means attached to the holding means. and an imaging means for imaging from opposite directions, the holding means comprising: a holding table for exposing the outer circumference of the wafer and holding it by suction; a support base for supporting the holding table; The holding table comprises at least a light emitting means provided with a light source for irradiating the outer periphery of the holding table with light, and a driving part for rotating the holding table, wherein the holding table is composed of a truncated cone and a cone. a wafer holding part disposed on the upper surface of the table and holding the wafer, the diameter of the bottom surface of the truncated cone being formed larger than the diameter of the wafer held by the wafer holding part; The light emitted from the light source is reflected on the side surface of the truncated cone to irradiate the outer circumference of the wafer held on the holding table, and the outer circumference of the wafer is imaged by the imaging means. , even if the diameter is smaller than the diameter of the base, the light is reflected by the side surface of the truncated cone of the holding table, and the outer circumference of the wafer can be detected satisfactorily. In addition, since there is no need to arrange LEDs on the holding table side, the production cost can be suppressed.

本実施形態に係るレーザー加工装置の全体斜視図である。1 is an overall perspective view of a laser processing apparatus according to this embodiment; FIG. 図１に示すレーザー加工装置の保持テーブル、及び支持基台の分解斜視図である。2 is an exploded perspective view of a holding table and a support base of the laser processing apparatus shown in FIG. 1; FIG. 保持テーブル及び支持基台の一部拡大断面図である。It is a partial enlarged sectional view of a holding table and a support base. 保持テーブルにウエーハを載置する状態を示す斜視図である。FIG. 4 is a perspective view showing a state in which a wafer is placed on a holding table; 保持テーブルの円錐台の側面に光を照射してウエーハの外周を撮像手段で撮像する状態を示す側面図である。FIG. 4 is a side view showing a state in which the side surface of the truncated cone of the holding table is irradiated with light and the outer circumference of the wafer is imaged by the imaging means; 外周余剰領域に補強部を有するウエーハの外周を撮像手段で撮像する状態を示す側面図である。FIG. 4 is a side view showing a state in which an image of the outer circumference of a wafer having a reinforcing portion in the outer circumference surplus region is imaged by an image pickup means; 保持手段の別実施形態を示す斜視図である。FIG. 5 is a perspective view showing another embodiment of holding means;

以下、本発明の実施形態に係る加工装置について添付図面を参照して、更に詳細に説明する。 Hereinafter, processing apparatuses according to embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

図１には、本実施形態に係る加工装置の一例として示すレーザー加工装置１の全体斜視図が示されている。レーザー装置１は、円形を呈する被加工物(ウエーハ）を保持する保持手段２０と、保持手段２０を移動させる移動手段３０と、保持手段２０に保持された被加工物にレーザー光線を照射するレーザー光線照射手段５０と、を備えている。 FIG. 1 shows an overall perspective view of a laser processing apparatus 1 as an example of a processing apparatus according to this embodiment. The laser device 1 includes holding means 20 for holding a circular workpiece (wafer), moving means 30 for moving the holding means 20, and laser beam irradiation for irradiating the workpiece held by the holding means 20 with a laser beam. means 50;

保持手段２０は、レーザー加工装置１のベースとなる基台２上に配置されており、矢印Ｘで示すＸ軸方向において移動自在に載置される矩形状のＸ方向可動板２１と、図中に矢印Ｙで示すＹ軸方向において移動自在にＸ方向可動板２１に載置される矩形状のＹ方向可動板２２と、Ｙ方向可動板２２の上面に固定された円筒状の支持基台２４と、支持基台２４の上部に回転可能に支持され、ウエーハの外周を露出させて吸引保持する保持テーブル２８と、Ｙ方向可動板２２上で支持基台２４に隣接した位置に、保持テーブル２８に外方向から光を照射する発光手段４０と、が配設されている。 The holding means 20 is arranged on the base 2 serving as the base of the laser processing apparatus 1, and includes a rectangular X-direction movable plate 21 placed movably in the X-axis direction indicated by the arrow X, and a rectangular Y-direction movable plate 22 mounted on an X-direction movable plate 21 so as to be movable in the Y-axis direction indicated by an arrow Y in FIG. , a holding table 28 which is rotatably supported on the upper part of the support base 24 and which exposes and holds the outer periphery of the wafer by suction; and a light emitting means 40 for irradiating light from the outside.

移動手段３０は、基台２上に配設され、保持手段２０をＸ軸方向に加工送りするＸ軸送り手段３１と、保持手段２０をＹ軸方向に割り出し送りするＹ軸送り手段３２と、を備えている。Ｘ軸送り手段３１は、パルスモータ３３の回転運動を、ボールねじ３４を介して直線運動に変換してＸ方向可動板２１に伝達し、基台２上の案内レール２ａ、２ａに沿ってＸ方向可動板２１をＸ軸方向において進退させる。Ｙ軸送り手段３２は、パルスモータ３５の回転運動を、ボールねじ３６を介して直線運動に変換してＹ方向可動板２２に伝達し、Ｘ方向可動板２１上の案内レール２１ａ、２１ａに沿ってＹ方向可動板２２をＹ軸方向において進退させる。 The moving means 30 is disposed on the base 2, and includes an X-axis feeding means 31 for processing and feeding the holding means 20 in the X-axis direction, a Y-axis feeding means 32 for indexing and feeding the holding means 20 in the Y-axis direction, It has The X-axis feed means 31 converts the rotary motion of the pulse motor 33 into linear motion via the ball screw 34 and transmits it to the X-direction movable plate 21, and moves the X-axis along the guide rails 2a, 2a on the base 2. The directional movable plate 21 is moved back and forth in the X-axis direction. The Y-axis feed means 32 converts the rotary motion of the pulse motor 35 into linear motion via the ball screw 36 and transmits it to the Y-direction movable plate 22, along the guide rails 21a, 21a on the X-direction movable plate 21. to move the Y-direction movable plate 22 forward and backward in the Y-axis direction.

移動手段３０の側方には、枠体４が立設される。枠体４は、基台２上に配設される垂直壁部４ａ、及び垂直壁部４ａの上端部から水平方向に延びる水平壁部４ｂと、を備えている。枠体４の水平壁部４ｂの内部には、レーザー光線照射手段５０のレーザー発振器を含む図示しない光学系が内蔵されている。水平壁部４ｂの先端部下面には、レーザー光線照射手段５０の一部を構成する集光器５１が配設され、集光器５１の内部には、レーザー光線を集光する図示しない集光レンズが内蔵されている。レーザー光線照射手段５０の該レーザー発振器から発振されたレーザー光線は、図示しない光学系を通り、集光器５１によって集光され、保持手段２０に保持される被加工物の所望の位置に集光スポットを形成する。 A frame 4 is erected on the side of the moving means 30 . The frame 4 includes a vertical wall portion 4a arranged on the base 2 and a horizontal wall portion 4b extending horizontally from the upper end portion of the vertical wall portion 4a. Inside the horizontal wall portion 4b of the frame 4, an optical system (not shown) including a laser oscillator of the laser beam irradiation means 50 is built. A condenser 51 constituting a part of the laser beam irradiation means 50 is provided on the lower surface of the tip portion of the horizontal wall portion 4b. Built-in. A laser beam oscillated from the laser oscillator of the laser beam irradiation means 50 passes through an optical system (not shown), is condensed by a condenser 51, and forms a condensed spot at a desired position of the workpiece held by the holding means 20. Form.

水平壁部４ｂの先端部下面において、集光器５１のＸ軸方向で隣接する位置には、保持手段２０に保持される被加工物を、保持手段２０に対向する方向から撮像する撮像手段６０が配設される。撮像手段６０は、可視光線により撮像する通常の撮像素子（ＣＣＤ）６２と、被加工物に光線を照射する図示しない照明手段と、を備え、図示しない制御手段に接続されている。撮像手段６０によって撮像された画像の信号は、該制御手段に送られる。なお、被加工物の種類に応じ、撮像手段６０に赤外線照射手段、及び赤外線撮像素子を含んでもよい。 On the lower surface of the tip of the horizontal wall portion 4b, at a position adjacent to the light collector 51 in the X-axis direction, there is an imaging means 60 for imaging the workpiece held by the holding means 20 from a direction facing the holding means 20. is arranged. The imaging means 60 includes a normal imaging device (CCD) 62 for imaging with visible light, and illumination means (not shown) for irradiating the workpiece with light, and is connected to control means (not shown). A signal of an image captured by the imaging means 60 is sent to the control means. Depending on the type of workpiece, the imaging means 60 may include infrared irradiation means and an infrared imaging element.

図示しない制御手段は、コンピュータにより構成され、制御プログラムに従って演算を実行する中央演算処理装置（ＣＰＵ）と、制御プログラム等を格納するリードオンリメモリ（ＲＯＭ）と、検出した検出値、演算結果等を格納するための読み書き可能なランダムアクセスメモリ（ＲＡＭ）と、入力インターフェース、及び出力インターフェースとを備えている。制御手段は、上記した構成に基づき、メモリに記録された制御プログラムによってＸ軸送り手段３１、Ｙ軸送り手段３２、及びレーザー光線照射手段５０を作動させるための制御信号を出力する。また、該制御手段は、撮像手段６０から送られた画像信号を保存し、該画像信号に基づき、撮像位置のＸ座標、及びＹ座標を記録する。 The control means (not shown) is composed of a computer, and includes a central processing unit (CPU) that executes calculations according to a control program, a read-only memory (ROM) that stores control programs and the like, detected values, calculation results, and the like. It has a readable and writable random access memory (RAM) for storage, an input interface, and an output interface. The control means outputs control signals for operating the X-axis feeding means 31, the Y-axis feeding means 32, and the laser beam irradiation means 50 according to the control program recorded in the memory based on the above configuration. The control means also stores the image signal sent from the imaging means 60, and records the X and Y coordinates of the imaging position based on the image signal.

さらに、図２、及び図３を参照しながら、本実施形態の支持基台２４、及び保持テーブル２８について、より具体的に説明する。保持テーブル２８は、被加工物であるウエーハを保持するウエーハ保持部２８１と、ウエーハ保持部２８１を上面で支持する円錐台２８２とを備えている。ウエーハ保持部２８１の上面には、通気性を有する多孔質材料から形成され実質上水平に延在する円形状の吸着チャック２８１ａが配設されている。保持テーブル２８には、後述する保護テープＴを介してウエーハを支持する環状のフレームＦ（図４を参照。）を固定するためのクランプ２９が周方向に均等な間隔で複数配設されている。円錐台２８２には傾斜面からなる側面２８２ａが形成されており、側面２８２ａは、光を良好に反射する鏡面からなる。本実施形態の側面２８２ａは、水平面に対して４５°の傾斜角度で形成されている。 Further, the support base 24 and the holding table 28 of this embodiment will be described more specifically with reference to FIGS. 2 and 3. FIG. The holding table 28 includes a wafer holding portion 281 for holding a wafer, which is a workpiece, and a truncated cone 282 for supporting the wafer holding portion 281 on its upper surface. On the upper surface of the wafer holding part 281, a circular suction chuck 281a made of an air permeable porous material and extending substantially horizontally is arranged. On the holding table 28, a plurality of clamps 29 for fixing an annular frame F (see FIG. 4) supporting the wafer via a protective tape T, which will be described later, are arranged at equal intervals in the circumferential direction. . The truncated cone 282 is formed with an inclined side surface 282a, and the side surface 282a is a mirror surface that reflects light well. The side surface 282a of this embodiment is formed at an inclination angle of 45° with respect to the horizontal plane.

保持テーブル２８を支持する支持基台２４は、保持テーブル２８が上面に載置される回転軸２４ａを備えている。回転軸２４ａの上面の中央には、円錐台２８２の下面との位置合わせに利用される大径凹部２４ｂが配設され、大径凹部２４ｂの底面の中央には、吸着チャック２８１ａに負圧を供給するための第一の吸引孔２４ｃが形成されている。また、回転軸２４ａの上面の大径凹部２４ｂの近傍には、回転軸２４ａに対する保持テーブル２８の回転方向の位置決めとして機能する位置決め凹部２４ｄ、及び、保持テーブル２８を回転軸２４ａの上面に吸着するための第二の吸引孔２４ｅが形成されている。 The support base 24 that supports the holding table 28 has a rotating shaft 24a on which the holding table 28 is mounted. A large-diameter concave portion 24b used for alignment with the lower surface of the truncated cone 282 is disposed in the center of the upper surface of the rotating shaft 24a, and a suction chuck 281a is applied with a negative pressure in the center of the bottom surface of the large-diameter concave portion 24b. A first suction hole 24c for supplying is formed. In the vicinity of the large-diameter concave portion 24b on the upper surface of the rotating shaft 24a, there is provided a positioning concave portion 24d that functions to position the holding table 28 in the rotational direction with respect to the rotating shaft 24a, and the holding table 28 is attracted to the upper surface of the rotating shaft 24a. A second suction hole 24e is formed for the purpose.

図３には、支持基台２４に保持テーブル２８が載置された状態の断面の一部が示されている。図に示すように、回転軸２４ａの上面の中央に形成された大径凹部２４ｂには、保持テーブル２８の円錐台２８２の下面に形成され大径凹部２４ｂに対し僅かに小さい寸法の略同形状で形成された大径凸部２８２ｂが挿入され、さらに、位置決め凹部２４ｄには、円錐台２８２の下面に形成され位置決め凹部２４ｄよりも僅かに小さい寸法の略同形状で形成された位置決め凸部２８２ｃが挿入される。これにより、支持基台２４に対する、保持テーブル２８の中心位置及び、回転方向の位置決めが正確に成される。 FIG. 3 shows a part of the cross section of the holding table 28 placed on the support base 24 . As shown in the figure, the large-diameter recess 24b formed in the center of the upper surface of the rotating shaft 24a has substantially the same shape and is slightly smaller than the large-diameter recess 24b formed in the lower surface of the truncated cone 282 of the holding table 28. Further, in the positioning concave portion 24d, the positioning convex portion 282c formed in the lower surface of the truncated cone 282 and formed in substantially the same shape and having slightly smaller dimensions than the positioning concave portion 24d. is inserted. As a result, the center position and rotation direction positioning of the holding table 28 with respect to the support base 24 are accurately achieved.

上記した第一の吸引孔２４ｃ及び第二の吸引孔２４ｅは、図示しない吸引手段に接続される。第一の吸引孔２４ｃは、ウエーハ保持部２８１の吸着チャック２８１ａの裏面側空間Ｓに接続されて、吸着チャック２８１ａの表面に負圧を作用させ、ウエーハ等を保持する。また、第二の吸引孔２４ｅに負圧を供給することで、円錐台２８２の下面を吸着して保持テーブル２８を支持基台２４に固定する。さらに、図３に示すように、支持基台２４の内部には、回転軸２４ａを回転させる駆動部として機能するパルスモータＭが構成されており、保持テーブル２８を支持基台２４に対して所望の角度だけ回転させることができる。なお、図示は省略するが、Ｘ軸送り手段３１、Ｙ軸送り手段３２、及び保持テーブル２８には、周知のリニアスケール等からなる位置検出手段が配設されており、保持テーブル２８のＸ軸方向の位置、Ｙ軸方向の位置、回転方向の位置が正確に検出される。この検出された各位置情報は、図示しない制御手段に伝達され、該制御手段から指示される指示信号に基づいてＸ軸送り手段３１、Ｙ軸送り手段３２、及び支持基台２４に備えられた上記パルスモータＭが駆動され、保持テーブル２８を、任意のＸ座標位置、Ｙ座標位置、及び回転位置に位置付けることが可能である。本実施形態の加工装置１は、概ね上記したとおりの構成を備えており、以下にその作用について説明する。 The first suction hole 24c and the second suction hole 24e described above are connected to suction means (not shown). The first suction hole 24c is connected to the space S on the back side of the suction chuck 281a of the wafer holding part 281, and applies negative pressure to the surface of the suction chuck 281a to hold the wafer or the like. Also, by supplying a negative pressure to the second suction hole 24 e , the lower surface of the truncated cone 282 is attracted to fix the holding table 28 to the support base 24 . Further, as shown in FIG. 3, inside the support base 24, a pulse motor M functioning as a driving unit for rotating the rotating shaft 24a is configured, and the holding table 28 is moved to the support base 24 as desired. can be rotated by an angle of Although not shown, the X-axis feeding means 31, the Y-axis feeding means 32, and the holding table 28 are provided with position detecting means such as a known linear scale. Directional position, Y-axis position, and rotational position are accurately detected. This detected positional information is transmitted to control means (not shown), and the X-axis feeding means 31, Y-axis feeding means 32, and support base 24 are provided on the basis of an instruction signal instructed by the control means. By driving the pulse motor M, it is possible to position the holding table 28 at an arbitrary X-coordinate position, Y-coordinate position, and rotational position. The processing apparatus 1 of the present embodiment generally has the configuration as described above, and the operation thereof will be described below.

図４には、レーザー加工装置１に配設された保持手段２０の一部を構成するＹ方向可動板２２近傍を一部拡大した斜視図と共に、ウエーハ１０を保持テーブル２８上に載置する状態が示されている。また、図５には、保持テーブル２８にウエーハ１０を載置した状態の側面図を示している。図に示されているように、Ｙ方向可動板２２上であって、支持基台２４に隣接した位置には、保持テーブル２８に向けて光を照射する光源４２を備えた発光手段４０も配設されている。光源４２は、図示しないＬＥＤ等の光源を備えており、保持テーブル２８の円錐台２８２の側面２８２ａと同一の高さに設定され、光源４２から水平方向に照射される光は、円錐台２８２の側面２８２ａに照射される。 FIG. 4 shows a partially enlarged perspective view of the vicinity of the Y-direction movable plate 22 forming part of the holding means 20 disposed in the laser processing apparatus 1, and a state in which the wafer 10 is placed on the holding table 28. It is shown. 5 shows a side view of the wafer 10 placed on the holding table 28. As shown in FIG. As shown in the figure, a light emitting means 40 having a light source 42 for emitting light toward the holding table 28 is also arranged on the Y-direction movable plate 22 and adjacent to the support base 24 . is set. The light source 42 is provided with a light source such as an LED (not shown), and is set at the same height as the side surface 282a of the truncated cone 282 of the holding table 28. The side surface 282a is irradiated.

図４に示すように、円形を呈する被加工物のウエーハ１０は、裏面１０ｂ側がダイシングテープＴに貼着され、ダイシングテープＴを介して環状のフレームＦに保持されている。ウエーハ１０は、表面１０ａ側において、分割予定ライン１２によって格子状に区画された複数の各領域にデバイス１４が形成されている。保持テーブル２８のウエーハ保持部２８１の直径は、ウエーハ１０よりも小さく形成されており、図５から理解されるように、ウエーハ１０の外周がウエーハ保持部２８１の外周からはみ出し露出した状態となる。また、保持テーブル２８を構成する円錐台２８２の底面の直径は、ウエーハ保持部２８１に保持されるウエーハ１０の直径よりも大径になるように設定されている。なお、保持テーブル２８を構成するウエーハ保持部２８１の中心座標Ｐ０（ｘ０，ｙ０）は、上記したリニアスケール等からの情報に基づいて、図示しない制御手段によってその位置が常に管理されている。 As shown in FIG. 4, a circular wafer 10 to be processed is attached to a dicing tape T on the back surface 10b side, and is held by an annular frame F with the dicing tape T therebetween. The wafer 10 has devices 14 formed in each of a plurality of regions partitioned in a grid pattern by division lines 12 on the front surface 10a side. The diameter of the wafer holding portion 281 of the holding table 28 is smaller than that of the wafer 10, and as can be seen from FIG. The diameter of the bottom surface of the truncated cone 282 forming the holding table 28 is set to be larger than the diameter of the wafer 10 held by the wafer holding portion 281 . The center coordinates P0 (x0, y0) of the wafer holder 281 constituting the holding table 28 are always managed by control means (not shown) on the basis of information from the linear scale or the like.

ウエーハ１０を保持テーブル２８上に載置したならば、フレームＦをクランプ２９で固定すると共に、図示しない吸引手段を作動してウエーハ１０を吸引保持する。ウエーハ１０を保持テーブル２８に吸引保持したならば、図示しない制御手段により移動手段３０を作動して、保持テーブル２８を移動し、図５に示すように、円錐台２８２の側面２８２ａにおいて、発光手段４０の光源４２からの光Ｌが照射される位置を撮像手段６０の直下に、すなわち、ウエーハ１０の外周を保持テーブル２８に対向する方向から撮像可能な位置に位置付ける。 After the wafer 10 is placed on the holding table 28, the frame F is fixed by the clamps 29, and a suction means (not shown) is operated to suck and hold the wafer 10. As shown in FIG. After the wafer 10 is sucked and held on the holding table 28, the control means (not shown) operates the moving means 30 to move the holding table 28, and as shown in FIG. The position where the light L from the light source 42 of 40 is irradiated is positioned directly under the imaging means 60 , that is, the position where the outer periphery of the wafer 10 can be imaged from the direction facing the holding table 28 .

撮像手段６０の直下に円錐台２８２の側面２８２ａにおける光Ｌの照射位置を位置付けたならば、発光手段４０を作動し、光源４２から円錐台２８２の側面２８２ａに光Ｌを照射して、側面２８２ａにおいて該光Ｌを上方に９０度方向転換して撮像手段６０に向けて反射し、撮像手段６０に投影する。撮像手段６０に投影されたウエーハ１０の所定の外縁部Ａを第一外縁部Ａとし、この第一外縁部Ａを撮像手段６０によって撮像し、撮像した情報を図示しない制御手段に送信し、該制御手段において、第一外縁部Ａの座標Ａ（ｘ１，ｙ１）を求め、図示しない制御手段のメモリに記憶する。 When the irradiation position of the light L on the side surface 282a of the truncated cone 282 is positioned immediately below the imaging means 60, the light emitting means 40 is operated to irradiate the side surface 282a of the truncated cone 282 with the light L from the light source 42, thereby illuminating the side surface 282a. , the light L is turned upward by 90 degrees, reflected toward the imaging means 60 and projected onto the imaging means 60 . A predetermined outer edge A of the wafer 10 projected onto the imaging means 60 is defined as a first outer edge A, and an image of the first outer edge A is captured by the imaging means 60, and the imaged information is transmitted to a control means (not shown). The control means obtains the coordinates A (x1, y1) of the first outer edge A and stores them in the memory of the control means (not shown).

さらに、上記した状態から、保持テーブル２８を矢印Ｒで示す方向に回転すべく、回転軸２４ａを回転する駆動部（パルスモータＭ）を作動して９０度だけ回転する。次いで、発光手段４０を作動し、光源４２から円錐台２８２の側面２８２ａに光Ｌを照射して、側面２８２ａにおいて該光Ｌを上方に９０度方向転換すべく撮像手段６０に向けて反射する。このとき撮像手段６０に投影されたウエーハ１０の所定の外縁部を第二外縁部Ｂとし、この第二外縁部Ｂを撮像手段６０によって撮像し、第二外縁部Ｂの座標Ｂ（ｘ２，ｙ２）を求め、図示しない制御手段のメモリに記憶する。 Further, in order to rotate the holding table 28 in the direction indicated by the arrow R from the above state, the drive section (pulse motor M) for rotating the rotating shaft 24a is operated to rotate by 90 degrees. Next, the light emitting means 40 is activated to emit light L from the light source 42 to the side surface 282a of the truncated cone 282, and the light L is reflected upwardly by 90 degrees toward the imaging means 60 at the side surface 282a. At this time, the predetermined outer edge portion of the wafer 10 projected onto the imaging means 60 is defined as a second outer edge portion B, and the image of the second outer edge portion B is imaged by the imaging means 60, and the coordinates of the second outer edge portion B (x2, y2 ) is obtained and stored in the memory of the control means (not shown).

さらに、ウエーハ１０の第二外縁部Ｂの座標Ｂを検出した状態から、保持テーブル２８を矢印Ｒで示す方向に９０度だけ回転駆動して、発光手段４０を作動し、光源４２から円錐台２８２の側面２８２ａに光Ｌを照射する。このときの撮像手段６０に投影されたウエーハ１０の所定の外縁部を第三外縁部Ｃとし、この第三外縁部Ｃを撮像手段６０によって撮像し、第三外縁部Ｃの座標Ｃ（ｘ３，ｙ３）を求め、図示しない制御手段のメモリに記憶する。 Further, from the state in which the coordinates B of the second outer edge B of the wafer 10 are detected, the holding table 28 is rotated by 90 degrees in the direction indicated by the arrow R to operate the light emitting means 40, and the truncated cone 282 is emitted from the light source 42 The light L is applied to the side surface 282a of the . A predetermined outer edge portion of the wafer 10 projected onto the imaging means 60 at this time is defined as a third outer edge portion C, and the image of the third outer edge portion C is imaged by the imaging means 60, and the coordinates of the third outer edge portion C (x3, y3) is obtained and stored in the memory of the control means (not shown).

第一外縁部Ａを撮像した状態における、保持テーブル２８の中心座標Ｐ０（ｘ０，ｙ０）及びウエーハ１０の中心座標Ｐ１（ｘ０’，ｙ０’）の間隔、すなわち、中心のずれ量を（ｒ）とし、該（ｒ）とＸ軸との角度をθとした場合のウエーハ１０の中心座標Ｐ１（ｘ０’，ｙ０’）のｘ０’、Ｙ０’は以下のようにして算出される。 The distance between the central coordinates P0 (x0, y0) of the holding table 28 and the central coordinates P1 (x0', y0') of the wafer 10 in the state where the first outer edge A is imaged, that is, the amount of deviation of the center is (r) and x0' and Y0' of the center coordinates P1 (x0', y0') of the wafer 10 when the angle between (r) and the X-axis is θ is calculated as follows.

ｘ０’＝ｘ０＋ｒｃｏｓθ ・・・ （１） x0′=x0+rcos θ (1)

ｙ０’＝ｙ０＋ｒｓｉｎθ ・・・ （２） y0'=y0+rsin θ (2)

さらに、第一外縁部Ａの座標Ａ（ｘ１，ｙ１）とその時のウエーハ１０の中心座標Ｐ１（ｘ０’，ｙ０’）との間隔、すなわちウエーハ１０の半径（Ｒ）については、第一外縁部Ａの座標Ａ及び該ウエーハ１０の中心座標Ｐ１を結ぶ線を斜辺とする直角三角形を想定することにより、以下のような式が成立する。 Furthermore, the distance between the coordinates A (x1, y1) of the first outer edge A and the center coordinates P1 (x0′, y0′) of the wafer 10 at that time, that is, the radius (R) of the wafer 10 is By assuming a right-angled triangle whose hypotenuse is a line connecting the coordinate A of A and the center coordinate P1 of the wafer 10, the following formula holds.

Ｒ２＝［ｘ１－（ｘ０＋ｒｃｏｓθ）］２
＋［ｙ１－（ｙ０＋ｒｓｉｎθ）］２ ・・・（３） R 2 =[x1−(x0+rcos θ)] 2
+[y1-(y0+rsinθ)] 2 (3)

また、第一外縁部Ａを撮像した状態から９０度（π／２）回転させた際に撮像される第二外縁部Ｂの座標Ｂ（ｘ２，ｙ２）と、その時のウエーハ１０の中心座標との間隔、その状態からさらに９０度（π／２）回転させた際に撮像される第三外縁部Ｃの座標Ｃ（ｘ３，ｙ３）と、その時のウエーハ１０の中心座標との間隔はいずれもウエーハ１０の半径（Ｒ）であることから、上記と同様に以下の式が成立する。 Further, the coordinates B (x2, y2) of the second outer edge portion B captured when the first outer edge portion A is rotated by 90 degrees (π/2) from the imaged state, and the center coordinates of the wafer 10 at that time. and the interval between the coordinates C (x3, y3) of the third outer edge portion C imaged when rotated by 90 degrees (π/2) from that state and the center coordinates of the wafer 10 at that time. Since it is the radius (R) of the wafer 10, the following equation holds in the same manner as above.

Ｒ２＝［ｘ２－（ｘ０＋ｒｃｏｓ（θ＋π／２））］２
＋［ｙ２－（ｙ０＋ｒｓｉｎ（θ＋π／２））］２ ・・・（４） R 2 =[x2−(x0+rcos(θ+π/2))] 2
+[y2-(y0+rsin(θ+π/2))] 2 (4)

Ｒ２＝［ｘ３－（ｘ０＋ｒｃｏｓ（θ＋π）］２
＋［ｙ３－（ｙ０＋ｒｓｉｎ（θ＋π））］２ ・・・（５） R 2 =[x3−(x0+rcos(θ+π)] 2
+[y3-(y0+rsin(θ+π))] 2 (5)

そして、上記した式（１）～式（５）に基づいて、第一外縁部Ａを撮像した際のウエーハ１０の中心の座標Ｐ１（ｘ０’，ｙ０’）が算出されることから、保持テーブル２８の中心座標Ｐ０（ｘ０，ｙ０）に対する、ウエーハ１０の中心の座標Ｐ１のずれが正確に把握される。なお、当該ウエーハ１０の中心座標Ｐ１の算出方法については、上記した特許文献１にも記載されており、詳細については省略する。ウエーハ１０の中心座標Ｐ１、及び保持テーブル２８の中心座標Ｐ０に対するずれが検出されたならば、当該ずれに関する情報を該制御手段に補正情報として記憶し、レーザー加工装置１によってウエーハ１０を加工する際に活用する。これにより、保持テーブル２８にウエーハ１０を保持した際に、ウエーハ１０の中心が保持テーブル２８の中心に対してずれていたとしても、保持テーブル２８を適切に移動させて、ウエーハ１０上の分割予定ラインに沿って、正確にレーザー加工を施すことが可能となる。 Then, based on the above formulas (1) to (5), the coordinates P1 (x0', y0') of the center of the wafer 10 when the first outer edge portion A is imaged are calculated, so that the holding table The deviation of the coordinate P1 of the center of the wafer 10 from the center coordinate P0 (x0, y0) of 28 is accurately grasped. The method of calculating the center coordinates P1 of the wafer 10 is also described in the above-mentioned Patent Document 1, and the details thereof are omitted. If a deviation with respect to the center coordinate P1 of the wafer 10 and the center coordinate P0 of the holding table 28 is detected, information about the deviation is stored in the control means as correction information, and when the wafer 10 is processed by the laser processing apparatus 1 to use. As a result, even if the center of the wafer 10 is deviated from the center of the holding table 28 when the holding table 28 holds the wafer 10, the holding table 28 can be appropriately moved to divide the wafer 10 according to the division schedule. Laser processing can be performed accurately along the line.

上記した実施形態によれば、保持テーブル２８の直径が支持基台２４の直径よりも小さい場合であっても、保持テーブル２８の円錐台２８２の側面２８２ａで光を反射してウエーハ１０の外周を撮像でき、ウエーハ１０の外周における所定の外縁部を良好に撮像することができ、ウエーハ１０の中心座標Ｐ１の保持テーブル２８の中心Ｐ０に対するずれを検出することが可能である。また、支持基台２４や保持テーブル２８に光源を配設する必要がないため、生産コストを抑えることが可能となる。 According to the embodiment described above, even if the diameter of the holding table 28 is smaller than the diameter of the support base 24, the light is reflected by the side surface 282a of the truncated cone 282 of the holding table 28 and the outer periphery of the wafer 10 is reflected. It is possible to image a predetermined outer edge portion of the outer circumference of the wafer 10, and detect the shift of the center coordinate P1 of the wafer 10 from the center P0 of the holding table 28. FIG. Moreover, since it is not necessary to dispose the light source on the support base 24 or the holding table 28, it is possible to reduce the production cost.

本発明は、図５に基づいて説明した一般的なウエーハ１０に限定されず、他の円形を呈する被加工物にも適用することが可能である。例えば、ウエーハの外周余剰領域以外のデバイス領域に対応する裏面を研削して裏面の外周余剰領域に対応する裏面にリング状の補強部を形成し、その後いくつかの工程を経てウエーハを個々のデバイスに分割するレーザー加工装置においても上記と同様な格別な効果を奏することができる。以下に、図６を参照しながら、より具体的に説明する。 The present invention is not limited to the general wafer 10 described with reference to FIG. 5, but can also be applied to other circular workpieces. For example, the back surface corresponding to the device region other than the peripheral surplus region of the wafer is ground to form a ring-shaped reinforcing portion on the back surface corresponding to the outer peripheral surplus region of the back surface. A special effect similar to that described above can also be obtained in a laser processing apparatus that divides into two. A more specific description will be given below with reference to FIG.

図６には、裏面１０’ｂ側の外周にリング状の補強部１１が形成されたウエーハ１０’が、ダイシングテープＴを介してフレームＦ（図示は省略する。）に支持され、保持テーブル２８のウエーハ保持部２８１上に吸引保持された状態の側面図が示されている。 In FIG. 6, a wafer 10' having a ring-shaped reinforcing portion 11 formed on the outer circumference of the back surface 10'b side is supported by a frame F (not shown) via a dicing tape T, and a holding table 28. 2 is a side view of the wafer held by suction on the wafer holder 281 of FIG.

図に示すように、ウエーハ保持部２８１の上面は、ウエーハ１０’よりも小径で形成されている。よって、ウエーハ１０’の外周余剰領域に形成されたリング状の補強部１１が外方に露出している。さらに、円錐台２８２の側面２８２ａの底面の直径がウエーハ保持部２８２ａに保持されるウエーハ１０’の直径よりも大径に形成されている。そして、発光手段４０の光源４２から照射される光Ｌが、側面２８２ａで反射することにより、上記した実施形態と同様に、ウエーハ１０’の外縁部を投影し、撮像手段６０により撮像することができる。上記したように、保持テーブル２８のウエーハ保持部２８２ａの直径は、被加工物であるウエーハ１０’の直径よりも小さく設定されていることから、リング状の補強部１１は、ウエーハ保持部２８２aの外側に露出し、補強部１１がウエーハ１０’を保持する際になんら支障をきたさず、ウエーハ１０’の表面１０ａは平坦な状態で保持される。これにより、上記した手順により、ウエーハ１０’の中心と、保持テーブル２８の中心とのずれを良好に検出することができる。 As shown in the figure, the upper surface of the wafer holding portion 281 is formed with a smaller diameter than the wafer 10'. Therefore, the ring-shaped reinforcing portion 11 formed in the peripheral surplus region of the wafer 10' is exposed to the outside. Furthermore, the diameter of the bottom surface of the side surface 282a of the truncated cone 282 is formed to be larger than the diameter of the wafer 10' held by the wafer holding portion 282a. Then, the light L emitted from the light source 42 of the light emitting means 40 is reflected by the side face 282a, so that the outer edge of the wafer 10' can be projected and imaged by the imaging means 60, as in the above-described embodiment. can. As described above, the diameter of the wafer holding portion 282a of the holding table 28 is set to be smaller than the diameter of the wafer 10' which is the workpiece. The surface 10a of the wafer 10' is held flat without causing any trouble when the reinforcing portion 11, which is exposed to the outside, holds the wafer 10'. As a result, the deviation between the center of the wafer 10' and the center of the holding table 28 can be detected satisfactorily by the procedure described above.

本発明によれば、上記した実施形態に限定されず、種々の変形例が提供される。以下に図７を参照しながら、別実施形態として示される保持テーブル２８’について説明する。なお、図７に示す支持基台２４は、図２、及び図３に基づき説明した支持基台２４と同一の部材であり、具体的な説明は省略する。 According to the present invention, various modifications are provided without being limited to the above-described embodiments. A holding table 28' shown in another embodiment will be described below with reference to FIG. The support base 24 shown in FIG. 7 is the same member as the support base 24 described based on FIGS. 2 and 3, and detailed description thereof will be omitted.

保持テーブル２８’は、被加工物であるウエーハ１０を保持するウエーハ保持部２８１’と、ウエーハ保持部２８１’を上面で支持する円錐台２８２’とを備えている。保持テーブル２８’の上面には、通気性を有する多孔質材料から形成され実質上水平に延在する円形状の吸着チャック２８１’ａが配置されている。さらに、保持テーブル２８’のウエーハ保持部２８１’の外周には、保持テーブル２８’に載置されるウエーハ１０の外周を支持すべく、吸着チャック２８１’ａを囲むようにリング状に形成された補助テーブル２８３が配設されている。なお、円錐台２８２’は、図２、及び図３に基づいて説明した円錐台２８２と同一の構成を有しており、具体的な構成についての説明は省略する。 The holding table 28' includes a wafer holding portion 281' that holds the wafer 10, which is a workpiece, and a truncated cone 282' that supports the wafer holding portion 281' on its upper surface. A circular suction chuck 281'a made of a porous material having air permeability and extending substantially horizontally is arranged on the upper surface of the holding table 28'. Further, a ring-shaped ring is formed on the outer periphery of the wafer holding portion 281' of the holding table 28' so as to surround the suction chuck 281'a so as to support the outer periphery of the wafer 10 placed on the holding table 28'. An auxiliary table 283 is provided. Note that the truncated cone 282' has the same configuration as the truncated cone 282 described with reference to FIGS. 2 and 3, and a detailed description of the configuration will be omitted.

補助テーブル２８３には、円錐台２８２’の側面２８２’aで反射した光Ｌを透過して、ウエーハ１０の外縁部（２点鎖線で示す。）を照射する開孔２８３ａが少なくとも８箇所形成されている。開孔２８３ａは、図７に示しているように、ウエーハ保持部２８１’にウエーハ１０が載置され保持された時に、ウエーハ１０の外周と一致する円周上に配設される。また、上記したように、保持テーブル２８’を９０度ずつ回転してウエーハ１０の外縁を投影して少なくとも３箇所撮像する場合は、補助テーブル２８３上の開孔２８３ａは、少なくとも３箇所、好ましくは、均等に４箇所、又は均等に８箇所に形成するのがよい。 The auxiliary table 283 is formed with at least eight apertures 283a for transmitting the light L reflected by the side surface 282'a of the truncated cone 282' and irradiating the outer edge of the wafer 10 (indicated by a two-dot chain line). ing. As shown in FIG. 7, the openings 283a are arranged on a circumference coinciding with the outer circumference of the wafer 10 when the wafer 10 is placed and held on the wafer holder 281'. Further, as described above, when the holding table 28' is rotated by 90 degrees and the outer edge of the wafer 10 is projected to image at least three locations, the apertures 283a on the auxiliary table 283 are at least three locations, preferably , 4 equally, or 8 evenly.

上記したように、ウエーハ保持部２８１’を囲むように、開孔２８３ａを備えた補助テーブル２８３を形成することにより、ウエーハ保持部２８１’がウエーハ１０の直径よりも小さく形成される場合であっても、補助テーブル２８３によって、ウエーハ１０の外周を支持することができ、外周においてウエーハ１０が撓んで変形したりすることが防止されると共に、少なくとも３箇所以上形成された開孔２８３ａによってウエーハ１０の外周が露出されていることで、円錐台２８２’の側面２８２’aで反射された光Ｌによってウエーハ１０の各外縁部を撮像して各外縁部の座標を求めることができ、ウエーハ１０の中心の座標位置を検出することができる。 As described above, by forming the auxiliary table 283 having the opening 283a so as to surround the wafer holding portion 281', the wafer holding portion 281' is formed smaller in diameter than the wafer 10. Also, the outer periphery of the wafer 10 can be supported by the auxiliary table 283, and the wafer 10 is prevented from bending and deforming at the outer periphery. Since the outer periphery is exposed, each outer edge of the wafer 10 can be imaged by the light L reflected by the side surface 282'a of the truncated cone 282' to obtain the coordinates of each outer edge, and the center of the wafer 10 can be obtained. can detect the coordinate position of

また、上記した実施形態では、保持テーブル２８を構成する円錐台２８２の側面２８２ａの傾斜角度を４５度で形成したが、本発明は必ずしも４５度に限定されず、別の傾斜角度であってもよい。円錐台２８２の側面２８２ａを４５度以外の傾斜角度とする場合は、発光手段４０から照射される光Ｌが、ウエーハ１０の外周の外縁部を照射して得られる投影画像を撮像手段６０が撮像できるように、側面２８２ａに向けて光Ｌを照射する角度を、該傾斜角度に合わせて適宜調整することが好ましい。 In the above-described embodiment, the inclination angle of the side surface 282a of the truncated cone 282 constituting the holding table 28 is 45 degrees. good. When the side surface 282a of the truncated cone 282 is inclined at an angle other than 45 degrees, the light L emitted from the light emitting means 40 irradiates the outer edge portion of the outer periphery of the wafer 10, and the image pickup means 60 picks up the projection image obtained. It is preferable to appropriately adjust the angle of irradiation of the light L toward the side surface 282a according to the inclination angle.

上記した実施形態では、ウエーハ１０を９０度ずつ回転し、第一の外縁部Ａ，第二の外縁部Ｂ、及び第三の外縁部Ｃの座標を検出してウエーハ１０の中心座標Ｐ１（ｘ０’，ｙ０’）を検出したが、本発明はこれに限定されず、他の手順を用いて中心Ｐ１の座標を求めるようにしてもよい。例えば、ウエーハ１０の任意の外縁部３箇所の座標を検出したならば、各３箇所の外縁部の点を結ぶ直線を算出し、各直線の垂直二等分線を求め、各垂直二等分線の交点をウエーハ１０の中心Ｐ１の座標として求めることができる。 In the above-described embodiment, the wafer 10 is rotated by 90 degrees, the coordinates of the first outer edge A, the second outer edge B, and the third outer edge C are detected, and the center coordinates P1 (x0 ', y0') are detected, but the present invention is not limited to this, and other procedures may be used to determine the coordinates of the center P1. For example, if the coordinates of three arbitrary outer edge portions of the wafer 10 are detected, a straight line connecting the three outer edge points is calculated, the perpendicular bisector of each straight line is obtained, and each perpendicular bisector is calculated. The intersection point of the lines can be obtained as the coordinates of the center P1 of the wafer 10. FIG.

また、上記した実施形態では、本発明をレーザー加工装置に適用した場合について説明したが、本発明はこれに限定されず、切削ブレードを用いたダイシング装置等に適用してもよい。 Moreover, in the above-described embodiment, the case where the present invention is applied to a laser processing apparatus has been described, but the present invention is not limited to this, and may be applied to a dicing apparatus using a cutting blade or the like.

１：レーザー加工装置
２：基台
１０、１０’：ウエーハ
１１：補強部
１２：デバイス
１４：分割予定ライン
２０：保持手段
２２：Ｙ方向可動板
２４：支持基台
２４ａ：回転軸
２４ｂ：大径凹部
２４ｃ：第一の吸引孔
２４ｄ：位置決め凹部
２４ｅ：第二の吸引孔
２８、２８’：保持テーブル
２８１、２８１’：ウエーハ保持部
２８１ａ、２８１’ａ：吸着チャック
２８２、２８２’：円錐台
２８２ａ、２８２’ａ：側面
２８２ｂ：大径凸部
２８２ｃ：位置決め凸部
３０：移動手段
４０：発光手段
４２：光源 1: Laser processing device 2: Bases 10, 10': Wafer 11: Reinforcement part 12: Device 14: Scheduled division line 20: Holding means 22: Y-direction movable plate 24: Support base 24a: Rotating shaft 24b: Large diameter Recess 24c: first suction hole 24d: positioning recess 24e: second suction holes 28, 28': holding tables 281, 281': wafer holding parts 281a, 281'a: suction chucks 282, 282': truncated cone 282a , 282′a: side surface 282b: large-diameter convex portion 282c: positioning convex portion 30: moving means 40: light emitting means 42: light source

Claims (3)

円形を呈するウエーハの中心を求め、所定の加工を施す加工装置であって、
ウエーハを保持する保持手段と、該保持手段に保持されたウエーハの外周を該保持手段に対向する方向から撮像する撮像手段と、から少なくとも構成され、
該保持手段は、ウエーハの外周を露出させて吸引保持する保持テーブルと、該保持テーブルを支持する支持基台と、該支持基台に隣接して配設され該保持テーブルの外周に光を照射する光源を備えた発光手段と、該保持テーブルを回転させる駆動部と、から少なくとも構成され、
該保持テーブルは、円錐台と、該円錐台の上面に配設されウエーハを保持するウエーハ保持部とを備え、該円錐台の底面の直径は、該ウエーハ保持部が保持するウエーハの直径よりも大きく形成されていて、該発光手段の光源から照射される光が、該円錐台の側面に反射して保持テーブル上に保持されるウエーハの外周を照射し該ウエーハの外周が該撮像手段で撮像される加工装置。 A processing apparatus for determining the center of a circular wafer and performing predetermined processing,
comprising at least holding means for holding a wafer and imaging means for taking an image of the outer circumference of the wafer held by the holding means from a direction facing the holding means,
The holding means includes a holding table that exposes and holds the outer periphery of the wafer by suction, a support base that supports the holding table, and a light that is arranged adjacent to the support base to irradiate the outer periphery of the holding table. and a driving unit for rotating the holding table,
The holding table includes a truncated cone and a wafer holding portion disposed on the upper surface of the truncated cone to hold the wafer, and the diameter of the bottom surface of the truncated cone is larger than the diameter of the wafer held by the wafer holding portion. The light emitted from the light source of the light emitting means is formed to be large, and the light emitted from the light source of the light emitting means is reflected on the side surface of the truncated cone to irradiate the outer circumference of the wafer held on the holding table, and the outer circumference of the wafer is imaged by the imaging means. processing equipment. 該保持テーブルの外周には、該保持テーブルに保持されるウエーハの外周を支持する補助テーブルが配設され、
該補助テーブルには、該円錐台の側面で反射した光を透過して露出したウエーハの外周を照射する開孔が少なくとも３箇所形成されている請求項１に記載の加工装置。 An auxiliary table is arranged around the holding table to support the outer circumference of the wafer held by the holding table,
2. The processing apparatus according to claim 1, wherein said auxiliary table is formed with at least three openings through which the light reflected by the side surface of said truncated cone is transmitted and irradiated to the exposed outer periphery of the wafer. 該円錐台の側面の傾斜角度は、４５°に設定される請求項１、又は２に記載の加工装置。 3. The processing apparatus according to claim 1, wherein the inclination angle of the side surface of the truncated cone is set at 45[deg.].
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