KR20220023290A - Method for processing a workpiece - Google Patents

Abstract

The present invention provides a novel method for processing a workpiece which can process a flat workpiece having a rectangular processing surface with high precision. The method for processing a workpiece is used when processing a workpiece having a first surface of a rectangular shape with four edges and a second surface of a rectangular shape positioned opposite to the first surface by using a chuck table having a maintaining surface and a processing unit maintained on the chuck table and comprises: an acquisition step of acquiring four XY coordinates representing the positions of the four edges in an XY plane and directions of the edges in the XY plane parallel with the maintaining surface from displacement information obtained by measuring the height of an area including the four edges of the workpiece while the second surface side of the workpiece is maintained on the maintaining surface of the chuck table; and a processing step of processing the workpiece based on the four XY coordinates and the directions of the edges.

Description

The processing method of the workpiece {METHOD FOR PROCESSING A WORKPIECE}

[0001] The present invention relates to a processing method of a workpiece used when processing a plate-shaped workpiece having a rectangular front and back surfaces.

BACKGROUND ART An optical component such as a substrate constituting a screen of a flat panel display is manufactured by processing a workpiece such as a transparent glass plate in a visible region. When processing such a workpiece, for example, a processing apparatus such as a laser processing apparatus that generates and uses a high-power laser beam or a cutting apparatus in which an annular cutting blade containing an abrasive grain is mounted on a spindle (eg, Patent Document 1) is used. Reference).

Generally, such a processing apparatus extracts a pattern, such as a device, which exists in a to-be-processed object from the image obtained by imaging a to-be-processed object with a camera, and confirms the position (processing schedule line) where a to-be-processed object should be processed. On the other hand, in the case of machining a workpiece without a pattern, for example, the workpiece is placed at a determined position on a chuck table provided by the processing device so that the determined position of the workpiece can be machined.

Japanese Laid-Open Patent Publication No. 2006-93333

By the way, although the conveyance mechanism which conveys a to-be-processed object in a processing apparatus is comprised so that a to-be-processed object can be carried in with high precision with respect to a chuck table, the position of the to-be-processed object actually carried in, and the target position of a to-be-processed object A gap of 5 mm or less often occurs between . Therefore, in the above-described method of arranging the workpiece at the position where the chuck table is determined, it is not always possible to process the workpiece with sufficiently high precision.

For example, when machining a workpiece having circular front and back surfaces, by obtaining a position corresponding to the center of the circle from the positions of three points on the outer peripheral edge, the workpiece can be machined with high precision. However, in the case of machining the workpiece having the front and back surfaces of a rectangular shape, the method for processing the workpiece having the circular front and back surfaces cannot be used as it is.

Accordingly, an object of the present invention is to provide a novel processing method of a workpiece capable of processing a plate-shaped workpiece having a rectangular front and back surfaces with high precision.

According to one aspect of the present invention, a plate-shaped to-be-processed object having a first surface in a rectangular shape having four sides and a second surface in a rectangular shape located on the opposite side to the first surface is provided, A processing method for a workpiece used when processing using a chuck table and a processing unit for processing the workpiece held by the chuck table, wherein the second surface side of the workpiece is the holding surface of the chuck table From the displacement information obtained by measuring the height of a region including the four sides of the workpiece while held in the There is provided a processing method of a workpiece, comprising: an acquisition step of acquiring four XY coordinates indicating a position within the body; and a processing step of processing the workpiece based on the direction of the side and the four XY coordinates.

In one aspect of the present invention described above, the acquisition step includes two straight lines parallel to the X direction passing through different positions in the Y direction by relatively moving the measuring device for measuring the height and the chuck table. Measuring the height of the area including one side of the workpiece on the image, calculating XY coordinates indicating two positions where the side and the two straight lines intersect from the obtained displacement information to obtain the direction of the side After adjusting the direction of the chuck table around the rotation axis perpendicular to the XY plane so that the direction of the side acquired in the direction acquiring step and the direction acquiring step is parallel to the Y direction, the measuring device and the By relatively moving the chuck table, the height of a region including the two opposing sides of the workpiece is measured on one straight line parallel to the X direction, and from the obtained displacement information, the two opposing sides are measured. and a first coordinate acquisition step of acquiring two XY coordinates indicating two positions where the one straight line intersects, and a direction of the side obtained in the direction acquisition step so that the direction of the side is perpendicular to the Y direction. After adjusting the peripheral direction of the chuck table, the measuring device and the chuck table are relatively moved to include the two opposite sides of the workpiece on one straight line parallel to the X direction. The method further includes a second coordinate acquisition step of measuring the height of the region and acquiring, from the obtained displacement information, two XY coordinates indicating two positions where the two opposite sides and the one straight line intersect.

In addition, in one aspect of the present invention described above, the acquisition step includes a measuring device for measuring the height and 2 parallel to the X direction through different positions in the Y direction by relatively moving the chuck table. Measuring the height of a region including the two opposite sides of the workpiece on the straight lines of the workpiece, from the obtained displacement information, three or more points indicating three or more positions where the two opposite sides and the two straight lines intersect a first coordinate acquisition step of acquiring XY coordinates, and a state in which the direction of the chuck table around a rotation axis perpendicular to the XY plane is perpendicular to the direction of the chuck table in the first coordinate acquisition step; By relatively moving the measuring device and the chuck table, measuring the height of a region including two different opposite sides of the workpiece on one straight line parallel to the X direction, from the obtained displacement information, A second coordinate acquisition step of acquiring two XY coordinates indicating two positions where the two opposite sides and the one straight line intersect each other; A direction acquisition step of acquiring one direction of the two opposite sides from two XY coordinates indicating two positions where one and the two straight lines intersect, and based on the direction of the side acquired in the direction acquisition step , two XY coordinates obtained in the first coordinate acquisition step and indicating two positions at which two opposite sides and one of the two straight lines intersect, and two XY coordinates acquired in the second coordinate acquisition step The method may further include a corrected coordinate acquisition step of acquiring four corrected XY coordinates by correcting the coordinates.

According to another aspect of the present invention, a plate-shaped to-be-processed object having a first surface of a rectangular shape having four sides and a second surface of a rectangular shape located on the opposite side to the first surface is provided, a holding surface is provided. A processing method for a workpiece used when processing is performed using a chuck table having an having and a processing unit for processing the workpiece held by the chuck table, wherein the second surface side of the workpiece is the holding of the chuck table The direction in the XY plane parallel to the holding surface of the said side is acquired from the image obtained by imaging the area|region including one said side of the said to-be-processed object in the state hold|maintained on the surface, and the said to-be-processed 4 said an acquisition step of acquiring four XY coordinates indicating positions of the four sides in the XY plane from the displacement information obtained by measuring the height of the region including the sides; based on the direction of the sides and the four XY coordinates There is provided a method of processing a workpiece including a processing step of processing the workpiece.

In the method of processing a workpiece according to one aspect and another aspect of the present invention, four XY coordinates indicating the direction of one side of the first surface of the workpiece and the positions of the four sides of the first surface are obtained. , based on this, the workpiece can be processed with high precision.

1 : is a perspective view which shows a laser processing apparatus.
Fig. 2 is a flowchart showing a processing method of a to-be-processed object.
Fig. 3 is a plan view showing the outline of the direction acquisition step.
4 : is a side view which shows a mode that the height of a to-be-processed object is measured.
5 is a graph showing an example of displacement information.
6 is a plan view showing an outline of the first coordinate acquisition step.
Fig. 7 is a plan view showing the outline of the second coordinate acquisition step.
8 : is a side view which shows the outline|summary of a processing step.
9 is a flowchart showing a processing method of a workpiece according to a first modification.
Fig. 10 is a plan view showing the outline of the first coordinate acquisition step according to the first modification.
11 is a plan view showing an outline of the second coordinate acquisition step according to the first modification.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing. 1 : is a perspective view which shows the laser processing apparatus (processing apparatus) 2 used by this embodiment. In addition, in FIG. 1, some components of the laser processing apparatus 2 are abbreviate|omitted. In addition, the X direction (front-back direction, machining feed direction), Y direction (left-right direction, indexing feed direction), and Z direction (vertical direction, plunging feed direction) used in the following description are mutually perpendicular|vertical.

As shown in FIG. 1, the laser processing apparatus 2 is equipped with the base 4 which supports a some component. At the rear end of this base 4, a pillar-shaped or wall-shaped support structure 6 protruding upward is provided. In addition, a columnar accommodating portion 4a protruding upward is provided at the front edge portion of the base 4 .

An opening is formed in the upper surface of the accommodating portion 4a. A space communicating to the outside through an opening in the upper surface is formed inside the accommodating portion 4a, the cassette support 8 having a substantially flat upper surface, and a lifting mechanism for raising and lowering the cassette support 8 (not shown) is accepted. A cassette 10 capable of accommodating a plurality of workpieces 11 is disposed on the upper surface of the cassette support 8 exposed from the opening of the accommodating portion 4a.

The to-be-processed object 11 is formed in a plate shape using, for example, a transparent glass material in a visible region, and has a rectangular shape with four sides, the 1st surface (surface) 11a, the 1st surface 11a, has a rectangular second surface (rear surface) 11b (refer to FIG. 4 and the like) located on the opposite side. The structure, such as a device, is not provided in the 1st surface 11a and the 2nd surface 11b of this to-be-processed object 11. As shown in FIG.

Moreover, the tape (dicing tape) 13 whose diameter is larger than the to-be-processed object 11 is affixed on the 2nd surface 11b side of the to-be-processed object 11. As shown in FIG. The outer peripheral portion of the tape 13 is fixed to an annular frame 15 arranged to surround the workpiece 11 . That is, the to-be-processed object 11 is accommodated in the cassette 10 in a state supported by the frame 15 via the tape 13 .

However, there is no limitation on the material, shape, structure, size, etc. of the to-be-processed object 11 . For example, a substrate made of a material such as a semiconductor, ceramics, resin, or metal typified by silicon may be used as the workpiece 11 . Similarly, devices, such as an IC (Integrated Circuit) and LED (Light Emitting Diode), may be formed in the to-be-processed object 11. FIG. In addition, the to-be-processed object 11 does not need to be supported by the frame 15 via the tape 13. FIG.

At a position adjacent to the accommodating portion 4a, a positioning unit 12 capable of roughly aligning the frame 15 supporting the workpiece 11 is disposed. The positioning unit 12 includes, for example, a pair of guide rails that are approached and spaced apart while remaining parallel to the Y direction. Each guide rail has a bottom surface supporting the frame 15, and a side surface perpendicular to the bottom surface.

For example, by arranging the frame 15 taken out from the cassette 10 on the guide rail of the positioning unit 12, and fitting the frame 15 in the X direction with the guide rail, the frame 15 (that is, The workpiece 11) can be adjusted to a predetermined position. Above the positioning unit 12 , a conveying unit 14 for conveying the frame 15 is disposed.

In a region on the side of the positioning unit 12 , a moving mechanism (a machining transfer mechanism, an indexing transfer mechanism) 16 is disposed. The moving mechanism 16 is provided with a pair of Y-axis guide rails 18 fixed to the upper surface of the base 4 and substantially parallel to the Y direction. The Y-axis moving table 20 is attached to the Y-axis guide rail 18 in a slidable manner.

A nut portion (not shown) is formed on the lower surface side of the Y-axis movement table 20 . A Y-axis ball screw 22 substantially parallel to the Y-axis guide rail 18 is connected to this nut portion in a rotatable manner. A Y-axis pulse motor 24 is connected to one end of the Y-axis ball screw 22 . When the Y-axis ball screw 22 is rotated by the Y-axis pulse motor 24 , the Y-axis movement table 20 moves along the Y-axis guide rail 18 in the Y direction.

A pair of X-axis guide rails 26 substantially parallel to the X-direction are fixed to the upper surface of the Y-axis moving table 20 . An X-axis moving table 28 is attached to the X-axis guide rail 26 in a slidable manner. A nut portion (not shown) is formed on the lower surface side of the X-axis movement table 28 .

An X-axis ball screw 30 substantially parallel to the X-axis guide rail 26 is connected to this nut portion in a rotatable manner. An X-axis pulse motor 32 is connected to one end of the X-axis ball screw 30 . When the X-axis ball screw 30 is rotated by the X-axis pulse motor 32 , the X-axis movement table 28 moves in the X direction along the X-axis guide rail 26 .

A θ table 34 is provided on the upper surface side of the X-axis movement table 28 . The θ table 34 includes a table base 34a (refer to FIG. 4 and the like) configured to be rotatable around a rotation axis that is substantially parallel to the Z direction, and a rotational driving source such as a motor connected to the table base 34a ( not shown) are included. A chuck table 36 is fixed to the upper surface of the table base 34a.

The chuck table 36 includes, for example, a disc-shaped frame 38 (refer to FIG. 4 and the like) formed using a metal typified by stainless steel. On the upper surface side of the frame 38, a concave portion 38a (see FIG. 4 and the like) having a circular opening at the upper end is formed. A holding plate 40 (refer to Fig. 4 and the like) formed in a porous disk shape using ceramics or the like is fixed to the recessed portion 38a. The upper surface of the holding plate 40 is substantially parallel to the X direction and the Y direction, and serves as a holding surface 40a holding the second surface 11b side of the workpiece 11 via the tape 13 .

The lower surface of the holding plate 40 is connected to a suction source (not shown) such as an ejector via a flow path 38b provided inside the frame 38, a valve (not shown), or the like. Therefore, when the tape 13 is brought into contact with the holding surface 40a, the valve is opened, and the negative pressure of the suction source is applied, the workpiece 11 is sucked by the chuck table 36 via the tape 13. . Around the chuck table 36, four clamps 42 capable of fixing the annular frame 15 supporting the workpiece 11 from all directions are arranged.

The support structure 6 is provided with the support arm 6a which protrudes from the front surface. At the distal end of the support arm 6a, an irradiation head (processing unit) 44 is disposed. This irradiation head 44 irradiates the laser beam 44a (refer FIG. 8) pulse-oscillated by the laser oscillator (processing unit) (not shown) to the downward object, for example.

Although there is no particular limitation on the wavelength of the laser beam 44a generated by the laser oscillator, in the present embodiment, the laser beam 44a (transmissive laser beam 44a) having a wavelength that penetrates the workpiece 11 can be generated. A capable laser oscillator is used. By condensing the laser beam 44a of this wavelength into the inside of the workpiece 11 by, for example, the irradiation head 44, the inside of the workpiece 11 is modified.

A camera (imaging unit) 46 is arranged in a region on one side of the irradiation head 44 in the X direction. The camera 46 includes, for example, a two-dimensional optical sensor such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or CCD (Charge Coupled Device) image sensor having sensitivity to light in the visible region, and a lens for imaging, The upper surface side (first surface 11a side) of the to-be-processed object 11 held by the chuck table 36 is imaged, and the image which the to-be-processed object 11 reflected is produced|generated.

In an area on one side of the camera 46 in the X direction, an optical displacement measuring device (measuring device) 48 for measuring the distance to the object with a laser beam is disposed. This displacement measuring device 48 includes, for example, an irradiation unit that irradiates a laser beam 48a (refer to FIG. 4 ) to a lower target, and a light receiving unit that receives a laser beam 48a reflected from the target, and includes a chuck table. By measuring the height of the upper surface (first surface 11a) of the workpiece 11 held by (36), and the like, information about displacement (hereinafter, displacement information) is generated.

Y-axis pulse motor 24 and X-axis pulse motor 32 and θ table 34 of a lifting mechanism for raising and lowering the cassette support 8 , positioning unit 12 , conveying unit 14 , and moving mechanism 16 . ) of the rotation drive source, the valve connected to the chuck table 36, the irradiation head 44 and laser oscillator, the camera 46, and the components such as the displacement measuring device 48 are respectively connected to the control unit 50, there is. The control unit 50 controls each of the above-described components in accordance with a series of steps required for processing the workpiece 11 .

The control unit 50 includes, for example, an arithmetic unit 50a constituted by a processing device such as a CPU (Central Processing Unit), and a main storage device such as a DRAM (Dynamic Random Access Memory) or an auxiliary storage device such as a flash memory. It is a computer including the storage part 50b comprised. The function of the control unit 50 is realized by operating the arithmetic unit 50a or the like in accordance with software stored in the storage unit 50b. However, the function of the control unit 50 may be realized only by hardware.

For example, the to-be-processed object 11 (frame 15) carried out from the above-mentioned cassette 10 and adjusted to a predetermined position by the positioning unit 12 is carried into the chuck table 36 by the conveying unit 14. and the second surface 11b side is held by the holding surface 40a. At this time, due to the precision of the position of the tape 13 affixed to the workpiece 11, the precision of the conveying operation by the conveying unit 14, etc., the to-be-processed object 11 which is actually carried into the chuck table 36 A shift occurs in many cases between the position of , and the position of the target to-be-processed object 11 .

Therefore, in the present embodiment, information such as the direction and position of the workpiece 11 is acquired so that the influence of such position shift can be excluded, and then the workpiece 11 is processed. Fig. 2 is a flowchart showing a processing method of a to-be-processed object according to the present embodiment. As shown in FIG. 2, in the processing method of the to-be-processed object of this embodiment, first, the direction acquisition step ST11 which acquires the direction of the side which the 1st surface 11a of the to-be-processed object 11 has is performed. 3 is a plan view showing the outline of the direction acquisition step ST11. In addition, in FIG. 3, some elements, such as the tape 13, are abbreviate|omitted.

In the direction acquisition step ST11, first, the height of the area including at least one side 11c of the workpiece 11 is measured, and from the obtained displacement information, XY coordinates indicating the position of this neighborhood 11c are calculated. do. 4 : is a side view which shows a mode that the height of the to-be-processed object 11 is measured. In addition, in FIG. 4, some elements are shown in cross section.

For example, as shown in FIG. 4 , the control unit 50 operates the displacement measuring device 48 while moving the chuck table 36 holding the workpiece 11 in the X direction in the X direction. Get the relationship between position and height in . That is, the control unit 50 relatively moves the displacement measuring device 48 and the chuck table 36 to determine the height of the region including the side 11c of the workpiece 11 on a straight line parallel to the X direction. measure

5 is a graph showing an example of displacement information obtained by this measurement. As described above, by relatively moving the displacement measuring device 48 and the chuck table 36 to measure the height of the area including the side 11c of the workpiece 11 on a straight line parallel to the X direction, this The displacement information corresponding to the profile of the thickness of the to-be-processed object 11 can be acquired along a straight line. The obtained displacement information is stored in the storage unit 50b.

More specifically, first, along the 1st straight line 21a shown in FIG. 3, the height of the area|region including the side 11c of the to-be-processed object 11 is measured. Here, there is a large difference ( difference) exists.

Therefore, as shown in FIG. 5, the X coordinate ( _X1 ) of the position A is computable by extracting the position with a large elevation difference from the obtained displacement information. In addition, all Y coordinates of arbitrary positions on the 1st straight line 21a parallel with respect to the X direction are the same. Therefore, by using the information etc. which show the position of the Y-axis movement table 20 (chuck table 36) at the time of a measurement, the Y _- coordinate Y1 of the position A is computable.

That is, the calculation unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₁ ) of the position A at which the first straight line 21a and the side 11c intersect, and at the time of measurement The Y coordinate (Y ₁ ) of the position (A) is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₁ , Y ₁ ) of the position A are stored in the storage unit 50b.

After measuring the height of the area including the side 11c of the workpiece 11 along the first straight line 21a, the chuck table 36 (Y-axis movement table 20) is moved in the Y direction, , the same measurement is performed. That is, the height of the region including the side 11c of the workpiece 11 is measured along the second straight line 21b parallel to the X direction through a position different from the first straight line 21a in the Y direction. .

Then, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₂ ) of the position B where the second straight line 21b and the side 11c intersect, and at the time of measurement The Y coordinate Y ₂ of the position B is calculated using information indicating the position of the Y-axis movement table 20 (the chuck table 36) and the like. The calculated coordinates (X ₂ , Y ₂ ) of the position B are stored in the storage unit 50b.

In addition, in this embodiment, the position where the rotation axis of the chuck table 36 and the XY plane parallel with respect to the holding surface 40a intersect is made into the origin O, and coordinates indicating each position are calculated. The position may be set as the origin of the coordinate system.

After the coordinates (X ₁ , Y ₁ ) indicating the position (A) and the coordinates (X ₂ , Y ₂ ) indicating the position (B) are calculated, using these, XY parallel to the holding surface 40a The direction of the side 11c in the plane is acquired. For example, the calculating unit 50a applies trigonometry to the coordinates (X ₁ , Y ₁ ) of the position (A) and the coordinates (X ₂ , Y ₂ ) of the position (B), and the side 11c and the Y direction An angle (θ ₁ ) formed by this is calculated. The calculated angle θ ₁ is stored in the storage unit 50b as the direction of the side 11c.

In addition, as the direction of the side 11c, the calculating part 50a may calculate the angle which the side 11c and the X direction make|form. In addition, in this embodiment, the coordinates of the position A where the first straight line 21a and the side 11c intersect and the coordinates of the position B where the second straight line 21b and the side 11c intersect are calculated. is used to obtain the direction of the side 11c, for example, the direction of the side 11d may be obtained using the coordinates of two positions on the side 11d opposite to the side 11c.

After the direction acquisition step ST11, as shown in FIG. 2, two coordinates indicating the positions of two opposing sides of the workpiece 11 in the XY plane parallel to the holding surface 40a are acquired. A first coordinate acquisition step ST12 is performed. 6 is a plan view showing the outline of the first coordinate acquisition step ST12. In addition, also in FIG. 6, some elements, such as the tape 13, are abbreviate|omitted.

In the first coordinate obtaining step ST12, first, the control unit 50 sets the rotation axis perpendicular to the XY plane so that the direction of the side 11c obtained in the direction obtaining step ST11 is parallel to the Y direction. Orient the chuck table 36 around the perimeter of That is, from the state shown in FIG. 3, the chuck table 36 is rotated only by the angle of (theta) ₁ (in this embodiment, it is the angle of θ ₁ clockwise in plan view). Thereby, the opposing side 11c and side 11d of the to-be-processed object 11 become parallel with respect to the Y direction.

Thereafter, the control unit 50 operates the displacement measuring device 48 while moving the chuck table 36 holding the workpiece 11 in the X direction to obtain a position and a height in the X direction. get a relationship with That is, by relatively moving the displacement measuring device 48 and the chuck table 36, the height of the region including the two opposing sides 11c and 11d of the workpiece 11 on a straight line parallel to the X direction. measure The obtained displacement information is stored in the storage unit 50b.

More specifically, first, along the third straight line 21c shown in FIG. 6 , the height of the region including the opposite sides 11c and 11d of the workpiece 11 is measured. Here, there is a large difference between the height of the position C1 at which the third straight line 21c and the side 11c intersect and the height of the position adjacent to the position C1 outside the workpiece 11 . exists Moreover, there is a large difference between the height of the position C2 where the third straight line 21c and the side 11d intersect and the height of the position adjacent to the position C2 outside the workpiece 11 . exists

Accordingly, by extracting a position with a large elevation difference from the obtained displacement information, the X coordinate (X ₃₁ ) of the position C1 and the X coordinate (X ₃₂ ) of the position C2 can be calculated. In addition, all Y coordinates of arbitrary positions on the 3rd straight line 21c parallel with respect to the X direction are the same. Therefore, by using information indicating the position of the Y-axis movement table 20 (chuck table 36) during measurement, the Y coordinates Y ₃ of the positions C1 and C2 can be calculated. can

That is, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₃₁ ) of the position C1 where the third straight line 21c and the side 11c intersect, and at the time of measurement The Y coordinate Y ₃ of the position C1 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₃₁ , Y ₃ ) of the position C1 are stored in the storage unit 50b.

Further, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₃₂ ) of the position C2 where the third straight line 21c and the side 11d intersect, at the time of measurement. The Y coordinate Y ₃ of the position C2 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₃₂ , Y ₃ ) of the position C2 are stored in the storage unit 50b.

After the first coordinate acquisition step ST12, as shown in FIG. 2, two coordinates indicating the positions of two opposite sides of the workpiece 11 in the XY plane parallel to the holding surface 40a A second coordinate acquisition step ST13 of acquiring . 7 is a plan view showing the outline of the second coordinate acquisition step ST13. In addition, also in FIG. 7, some elements, such as the tape 13, are abbreviate|omitted.

In the second coordinate obtaining step ST13, first, the control unit 50 sets the rotation axis perpendicular to the XY plane so that the direction of the side 11c obtained in the direction obtaining step ST11 is perpendicular to the Y direction. Orient the chuck table 36 around the perimeter of That is, from the state shown in FIG. 6, the chuck table 36 is rotated only by an angle of 90 degrees (in this embodiment, it is an angle of 90 degrees clockwise in planar view). Thereby, the opposing side 11e and the side 11f of the to-be-processed object 11 become parallel with respect to the Y direction.

Thereafter, the control unit 50 operates the displacement measuring device 48 while moving the chuck table 36 holding the workpiece 11 in the X direction to obtain a position and a height in the X direction. get a relationship with That is, by relatively moving the displacement measuring device 48 and the chuck table 36, an area including two different opposite sides 11e and 11f of the workpiece 11 on a straight line parallel to the X direction. measure the height of The obtained displacement information is stored in the storage unit 50b.

More specifically, first, along the fourth straight line 21d shown in FIG. 7 , the height of the region including the opposite sides 11e and 11f of the workpiece 11 is measured. Here, there is a large difference between the height of the position D1 where the fourth straight line 21d and the side 11e intersect and the height of the position adjacent to the position D1 outside the workpiece 11 . exists Moreover, there is a large difference between the height of the position D2 where the fourth straight line 21d and the side 11f intersect and the height of the position adjacent to the position D2 outside the workpiece 11 . exists

Accordingly, by extracting a position with a large elevation difference from the obtained displacement information, the X coordinate (X ₄₁ ) of the position D1 and the X coordinate (X ₄₂ ) of the position D2 can be calculated. In addition, all Y coordinates of arbitrary positions on the 4th straight line 21d parallel to the X direction are the same. Therefore, by using information indicating the position of the Y-axis movement table 20 (chuck table 36) during measurement, the Y coordinates Y ₄ of the positions D1 and D2 can be calculated. can

That is, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate (X ₄₁ ) of the position D1 where the fourth straight line 21d and the side 11e intersect, and at the time of measurement The Y coordinate Y ₄ of the position D1 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₄₁ , Y ₄ ) of the position D1 are stored in the storage unit 50b.

Further, the calculating unit 50a calculates the X coordinate (X ₄₂ ) of the position D2 where the fourth straight line 21d and the side 11f intersect by using the displacement information obtained by the measurement, The Y coordinate Y4 of the position D2 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₄₂ , Y ₄ ) of the position D2 are stored in the storage unit 50b.

As described above, after measuring the height of the workpiece 11 along the third straight line 21c, when measuring the height of the workpiece 11 along the fourth straight line 21d, the chuck table 36 is rotated by an angle of 90°. Therefore, the coordinates (X ₃₁ , Y ₃ ) of the position (C1), the coordinates (X ₃₂ , Y ₃ ) of the position (C2), the coordinates (X ₄₁ , Y ₄ ) of the position (D1), and the position (D2) of the Even if the coordinates (X ₄₂ , Y ₄ ) are used as they are, the position of the workpiece 11 is not properly expressed.

Therefore, after the second coordinate acquisition step ST13, as shown in FIG. 2 , the coordinates X ₃₁ , Y ₃ of the position C1 and the coordinates X ₃₂ , Y ₃ of the position C2 and the position A correction coordinate acquisition step ST14 of acquiring correction coordinates by correcting one of the coordinates (X ₄₁ , Y ₄ ) of the position (D1) and the coordinates (X ₄₂ , Y ₄ ) of the position (D2) is performed.

Specifically, for example, the calculating unit 50a calculates each of the coordinates X ₄₁ , Y ₄ of the position D1 and the coordinates X ₄₂ , Y ₄ of the position D2 at an angle of -90° (this In the embodiment, an arithmetic process of rotating only 90 degrees counterclockwise in plan view) is performed, and the coordinates of the position D1 and the coordinates of the position D2 (correction coordinates) after correction are obtained. The obtained coordinates of the position D1 and the coordinates of the position D2 after correction are stored in the storage unit 50b.

In the control unit 50 of the cutting device 2, the shape of the to-be-processed object 11 (the shape of the 1st surface 11a) is a well-known thing. Therefore, the coordinates of the position D1 and the coordinates of the position D2 after the correction obtained in this way, and the coordinates of the position C1 (X ₃₁ , Y ₃ ) and the coordinates of the position C2 (X ₃₂ ) , Y ₃ ), the control unit 50 can appropriately grasp the position of the to-be-processed object 11 .

Note that, in the present embodiment, the corrected coordinates of the position D1 and the coordinates of the position D2 are acquired, but the corrected coordinates of the position C1 and the coordinates of the position C2 may be acquired. In this case, according to the coordinates (X ₄₁ , Y ₄ ) of the position (D1) and the coordinates (X ₄₂ , Y ₄ ) of the position (D2), the coordinates (X ₃₁ , Y ₃ ) of the position (C1) and the position ( Calculation processing of rotating each of the coordinates (X ₃₂ , Y ₃ ) of C2) by an angle of 90° (in the present embodiment, an angle of 90° clockwise in planar view) is performed.

After the correction coordinate acquisition step ST14, the above-described series of acquisition steps (direction acquisition step ST11, first coordinate acquisition step ST12, second coordinate acquisition step ST13, and corrected coordinate acquisition step ST14) A processing step (ST15) of processing the to-be-processed object 11 is performed using the information regarding the position and direction of the to-be-processed object 11 acquired in this. That is, in the machining step ST15, the workpiece 11 is machined based on the direction of the side and the four XY coordinates indicating the position of each side. 8 : is a side view which shows the outline|summary of processing step ST15. In addition, also in FIG. 8, some elements are shown in cross section.

In the processing step ST15 of this embodiment, the inside of the to-be-processed object 11 is modified along a processing schedule line. Specifically, first, the control unit 50 adjusts the direction of the chuck table 36 in consideration of the direction of the side described above, and makes the target processing line parallel to the X direction. Next, the control unit 50 adjusts the position of the chuck table 36 in consideration of the four XY coordinates described above, and aligns the position of the irradiation head 44 above the extension line of the target processing line.

Then, as shown in FIG. 8 , the chuck table 36 is moved in the X direction while irradiating the laser beam 44a from the irradiation head 44 toward the workpiece 11 . That is, the chuck table 36 and the irradiation head 44 are relatively moved in a direction parallel to the processing schedule line. Here, the irradiation head 44 is adjusted to focus the laser beam 44a into the inside of the workpiece 11, for example.

In this way, by condensing the laser beam 44a (transmissive laser beam 44a) of the wavelength that transmits the workpiece 11 to the inside of the workpiece 11, the inside of the workpiece 11 is modified, A modified layer 17 is formed. In this embodiment, the chuck table 36 and the irradiation head 44 are relatively moved to irradiate the laser beam 44a to the processing schedule line, so that the modified layer 17 is formed along the processing schedule line. The above-described operation is repeated until the workpiece 11 is processed along all the processing scheduled lines.

As mentioned above, in the processing method of the to-be-processed object which concerns on this embodiment, the direction of the side (side 11c) of the 1st surface 11a of the to-be-processed object 11, and the 4 direction of the 1st surface 11a 4 indicating positions (position C1, position C2, position D1, and position D2) of the sides (side 11c, side 11d, side 11e, and side 11f), respectively Since the XY coordinates are acquired, the to-be-processed object 11 can be processed with high precision based on these.

Moreover, in the processing method of the to-be-processed object which concerns on this embodiment, since the direction of a side and four XY coordinates are acquired using the displacement measuring device 48 which measures the distance to an object, for example, the to-be-processed object 11 is Even when it is transparent or when a structure (pattern), such as a device, is not formed in the to-be-processed object 11, the position of the to-be-processed object 11 can be grasped|ascertained accurately.

Therefore, when processing the to-be-processed object 11, when it is not desired to irradiate the laser beam 44a to the periphery, etc., the processing method of the to-be-processed object which concerns on this embodiment is very effective. Moreover, according to the processing method of the to-be-processed object which concerns on this embodiment, irradiating the laser beam 44a by mistake to the outside of the to-be-processed object 11, etc. can also be prevented.

In addition, this invention is not restrict|limited to description of embodiment mentioned above, It can change variously and implement. 9 is a flowchart showing a processing method of a workpiece according to a first modification. As shown in FIG. 9 , in the processing method of the workpiece according to the first modification, four coordinates indicating the direction of the side of the workpiece 11 and the positions of the four sides of the workpiece 11 are obtained. A series of acquisition steps is different from the above-described embodiment.

Specifically, first, on two straight lines parallel to the X direction, the height of the region including two opposing sides of the workpiece 11 is measured, and from the obtained displacement information, the two opposing sides and the two straight lines are A first coordinate acquisition step ST21 of acquiring three or more XY coordinates indicating three or more intersecting positions is performed. Fig. 10 is a plan view showing the outline of the first coordinate acquisition step ST21 according to the first modification. In addition, also in FIG. 10, some elements, such as the tape 13, are abbreviate|omitted.

In the first coordinate acquisition step ST21 of the first modification, the control unit 50 operates the displacement measuring device 48 while moving the chuck table 36 holding the workpiece 11 in the X direction. By doing so, the relationship between the position and the height in the X direction is obtained. That is, the displacement measuring device 48 and the chuck table 36 are relatively moved to measure the height of the area including the two opposing sides of the workpiece 11 on a straight line parallel to the X direction. The obtained displacement information is stored in the storage unit 50b.

More specifically, first, along the first straight line 31a shown in FIG. 10 , the height of the region including the opposing sides 11c and 11d of the workpiece 11 is measured. Here, there is a large difference between the height of the position E1 where the first straight line 31a and the side 11c intersect and the height of the position adjacent to the position E1 outside the workpiece 11 . exists Moreover, there is a large difference between the height of the position E2 where the first straight line 31a and the side 11d intersect and the height of the position adjacent to the position E2 outside the workpiece 11 . exists

Therefore, by extracting a position with a large elevation difference from the obtained displacement information, the X coordinate (X51) of the position E1 and the X coordinate ( _X52 ) of the position E2 are _computable . In addition, all Y coordinates of arbitrary positions on the 1st straight line 31a parallel to the X direction are the same. Therefore, by using information indicating the position of the Y-axis movement table 20 (chuck table 36) at the time of measurement, the Y coordinates Y ₅ of the positions E1 and E2 can be calculated. can

That is, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X51 ) of the position E1 where the first straight line 31a and the side 11c intersect, and at the time of measurement The Y coordinate Y ₅ of the position E1 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₅₁ , Y ₅ ) of the position E1 are stored in the storage unit 50b.

In addition, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X52 ) of the position E2 where the first straight line 31a and the side 11d intersect, and at the time of measurement The Y coordinate Y ₅ of the position E2 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₅₂ , Y ₅ ) of the position E2 are stored in the storage unit 50b.

After measuring the height of the region including the opposing sides 11c and 11d of the workpiece 11 along the first straight line 31a, the chuck table 36 (Y-axis movement table 20) is moved in the Y direction, and then the same measurement is performed. That is, the area including the side 11c and the side 11d of the workpiece 11 along the second straight line 31b parallel to the X direction through a position different from the first straight line 31a in the Y direction. measure the height of

And the calculating part 50a calculates the X coordinate ( _X61 ) of the position F1 where the 2nd straight line 31b and the side 11c intersect using the displacement information obtained by the measurement, The Y coordinate Y ₆ of the position F1 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₆₁ , Y ₆ ) of the position F1 are stored in the storage unit 50b.

Further, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X62 ) of the position F2 where the second straight line 31b and the side 11d intersect, at the time of measurement. The Y coordinate Y ₆ of the position F2 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₆₂ , Y ₆ ) of the position F2 are stored in the storage unit 50b.

In addition, in the first coordinate acquisition step ST21 of this first modification, 4 indicating four positions where the first straight line 31a and the second straight line 31b, and the side 11c and the side 11d intersect Although all of the XY coordinates are acquired, in the present invention, any three of the four XY coordinates may be acquired.

After the first coordinate acquisition step ST21, as shown in FIG. 9, the height of the area including two opposite sides of the workpiece 11 is measured on one straight line parallel to the X direction, and the obtained A second coordinate acquisition step ST22 of acquiring two XY coordinates indicating two positions where two opposite sides and one straight line intersect from the displacement information is performed. 11 is a plan view showing the outline of the second coordinate acquisition step ST22 according to the first modification. In addition, also in FIG. 11, some elements, such as the tape 13, are abbreviate|omitted.

In the second coordinate acquisition step ST22, first, the direction of the chuck table 36 is adjusted perpendicularly to the direction of the chuck table 36 in the above-described first coordinate acquisition step ST21. That is, the control unit 50 rotates the chuck table 36 by an angle of 90° (in the first modification, an angle of 90° clockwise in plan view) from the state shown in FIG. 10 .

Thereafter, the control unit 50 operates the displacement measuring device 48 while moving the chuck table 36 holding the workpiece 11 in the X direction to obtain the position and height in the X direction and get the relationship of That is, the displacement measuring device 48 and the chuck table 36 are relatively moved to measure the height of a region including two opposite sides of the workpiece 11 on a straight line parallel to the X direction. The obtained displacement information is stored in the storage unit 50b.

More specifically, for example, along the third straight line 31c shown in FIG. 11 , the height of the region including the opposite sides 11e and 11f of the workpiece 11 is measured. Here, there is a large difference between the height of the position G1 where the third straight line 31c and the side 11e intersect and the height of the position adjacent to the position G1 outside the workpiece 11 . exists Moreover, there is a large difference between the height of the position G2 where the third straight line 31c and the side 11f intersect and the height of the position adjacent to the position G2 outside the workpiece 11 . exists

Therefore, by extracting a position with a large elevation difference from the obtained displacement information, the X coordinate (X71) of the position G1 and the X coordinate ( _X72 ) of the position G2 are _computable . In addition, all Y coordinates of arbitrary positions on the 3rd straight line 31c parallel with respect to the X direction are the same. Therefore, the Y coordinate Y ₇ of the position G1 and the position G2 can be calculated by using information etc. indicating the position of the Y-axis movement table 20 (chuck table 36) at the time of measurement. can

That is, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X71 ) of the position G1 where the third straight line 31c and the side 11e intersect, and at the time of measurement The Y coordinate Y ₇ of the position G1 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₇₁ , Y ₇ ) of the position G1 are stored in the storage unit 50b.

Further, the calculating unit 50a uses the displacement information obtained by the measurement to calculate the X coordinate ( _X72 ) of the position G2 where the third straight line 31c and the side 11f intersect, and at the time of measurement The Y coordinate Y ₇ of the position G2 is calculated using information indicating the position of the Y-axis movement table 20 and the like. The calculated coordinates (X ₇₂ , Y ₇ ) of the position G2 are stored in the storage unit 50b.

After the second coordinate acquisition step ST22, as shown in Fig. 9, 2 is acquired in the first coordinate acquisition step ST21 and indicates two positions where one of two opposite sides and two straight lines intersect. A direction acquisition step (ST23) of acquiring one direction of two opposing sides from the XY coordinates is performed.

For example, the calculating unit 50a may include coordinates X ₅₁ , Y ₅ of a position E1 where the side 11c and the first straight line 31a intersect, and the side 11c and the second straight line 31b intersect with each other. Trigonometry is applied to the coordinates (X ₆₁ , Y ₆ ) of the position F1 to be made, and the angle (θ ₂ ) formed between the side 11c and the Y direction is calculated. The calculated angle θ ₂ is stored in the storage unit 50b as the direction of the side 11c.

In addition, as the direction of the side 11c, the calculating part 50a may calculate the angle which the side 11c and the X direction make|form. In addition, the calculating unit 50a is configured such that the coordinates X ₅₂ , Y ₅ of the position E2 where the side 11d and the first straight line 31a intersect, and the side 11d and the second straight line 31b intersect The angle between the side 11d and the Y direction or the X direction may be calculated by applying a trigonometric method to the coordinates (X ₆₂ , Y ₆ ) of the position F2 to be made.

After the direction acquiring step ST23, based on the direction of the side acquired in the direction acquiring step ST23, the two XY coordinates acquired in the first coordinate acquiring step ST21 and the second coordinate acquiring step ST22 A correction coordinate acquisition step (ST24) of acquiring correction coordinates by correcting the two XY coordinates obtained in is performed.

Specifically, for example, the calculating unit 50a calculates the coordinates X ₅₁ and Y ₅ of the position E1 where the side 11c and the first straight line 31a intersect, the side 11d and the first straight line ( Calculation processing is performed to rotate each of the coordinates (X ₅₂ , Y ₅ ) of the position E2 where 31a) intersects by an angle of θ ₂ (in this embodiment, an angle of θ ₂ clockwise in plan view) Then, the coordinates of the position E1 and the coordinates of the position E2 (correction coordinates) after correction are acquired. The obtained coordinates of the post-correction position E1 and the coordinates of the position E2 are stored in the storage unit 50b.

In addition, the calculation unit 50a is configured such that the coordinates X ₆₁ , Y ₆ of the position F1 where the side 11c and the second straight line 31b intersect, and the side 11d and the second straight line 31b intersect Calculation processing is performed to rotate each of the coordinates (X ₆₂ , Y ₆ ) of the position F2 to be performed by an angle of θ ₂ (in this embodiment, an angle of θ ₂ clockwise in planar view) after correction The coordinates of the position F1 and the coordinates of the position F2 may be acquired.

In addition, the calculating unit 50a is configured to intersect the coordinates X ₇₁ and Y ₇ of the position G1 where the side 11e and the third straight line 31c intersect, and the side 11f and the third straight line 31c intersect. arithmetic processing for rotating each of the coordinates (X ₇₂ , Y ₇ ) of the position G2 to be made by an angle of θ ₂ - 90° (in the present embodiment, an angle of θ ₂ - 90° in a planar view clockwise) , and the coordinates of the position G1 after correction and the coordinates of the position G2 (correction coordinates) are acquired. The obtained coordinates of the post-correction position G1 and the coordinates of the position G2 are stored in the storage unit 50b.

The correction coordinates obtained in this way show the position E1, the position E1, the position G1, and the position G2 in a state in which the direction of the side 11c is adjusted to be parallel to the Y direction. Therefore, by using such correction coordinates, the to-be-processed object 11 can be processed accurately. Further, in the same manner, correction coordinates indicating each position may be acquired in a state in which the direction of the side 11c is adjusted perpendicular to the Y direction.

After the corrected coordinate acquisition step ST24, the above-described series of acquisition steps (first coordinate acquisition step ST21, second coordinate acquisition step ST22, direction acquisition step ST23, and corrected coordinate acquisition step ST24) A processing step (ST25) of processing the workpiece 11 is performed using the information about the position and direction of the workpiece 11 obtained in FIG. That is, in the machining step ST25, the workpiece 11 is machined based on the direction of the side and the four XY coordinates indicating the position of each side. The specific procedure of the processing step ST25 may be the same as the processing step ST15 according to the embodiment.

Also in the processing method of the to-be-processed object which concerns on this 1st modification, the direction of the side (side 11c) which the 1st surface 11a of the to-be-processed object 11 has, and the 4 sides which the 1st surface 11a has (side 11c, side 11d, side 11e, and side 11f) of four representing positions (position E1, position E2, position G1, and position G2), respectively. Since XY coordinates are acquired, the to-be-processed object 11 can be processed with high precision based on these.

Also, in the processing method of the workpiece according to the first modification, the direction of the edge and the four XY coordinates are acquired by using the displacement measuring device 48 that measures the distance to the object, so for example, the workpiece 11 Even in this transparent case or when a structure (pattern), such as a device, is not formed in the to-be-processed object 11, the position of the to-be-processed object 11 can be grasped|ascertained accurately.

Therefore, when processing the workpiece 11, when it is not desired to irradiate the laser beam 44a to the periphery, the processing method of the workpiece according to the first modification is very effective. Moreover, according to the processing method of the to-be-processed object which concerns on the 1st modified example, irradiating the laser beam 44a by mistake to the outside of the to-be-processed object 11, etc. can also be prevented.

In addition, in the above-mentioned embodiment, the direction of the side which the 1st surface 11a of the to-be-processed object 11 has is acquired by obtaining the displacement information using the displacement measuring device 48, For example, the camera 46 The direction of the side of the first surface 11a can also be acquired by the method of imaging the to-be-processed object 11 using

That is, in the direction acquisition step of the processing method of the workpiece according to the second modification, for example, from the image obtained by imaging the area including one side of the workpiece 11 with the camera 46, the calculation unit 50a The direction of the side is obtained by calculating the coordinates of the two positions of the side. Other steps may be the same as in the above-described embodiment.

In addition, in the above-described embodiment and each modification, the second coordinate acquisition step ST13 or the second coordinate acquisition step ST22 is performed after the first coordinate acquisition step ST12 or the first coordinate acquisition step ST21 However, this order may be replaced. Further, in the first modification described above, the direction acquisition step ST23 is performed after the second coordinate acquisition step ST22, but the direction acquisition step ST23 is performed after the first coordinate acquisition step ST21 and the second It may be performed before the coordinate acquisition step ST22.

In addition, in the above-mentioned embodiment and each modification, although the modified layer 17 is formed in the to-be-processed object 11 in processing step ST15 and processing step ST25, in the processing step of this invention, to-be-processed object (11) Abrasion processing may be performed with this laser beam. In this case, a laser processing apparatus provided with a laser oscillator capable of generating a laser beam (absorptive laser beam) of a wavelength absorbed by the workpiece 11 is used.

In addition, in the processing step of the present invention, the workpiece 11 may be processed by a method in which an annular cutting blade (processing unit) formed by fixing the abrasive grains with a binder is cut into the workpiece 11 . In this case, for example, instead of the irradiation head 44 or the laser oscillator, a cutting device (machining device) provided with a spindle (machining unit) to which an annular cutting blade is mounted is used.

In addition, in the above-mentioned embodiment and each modified example, although the optical displacement measuring device 48 which measures the distance to an object with the laser beam 48a is used, instead of this optical displacement measuring device 48, a back pressure sensor Alternatively, an ultrasonic sensor or the like may be used as a displacement measuring device (measuring device).

In addition, the processing method of the to-be-processed object which concerns on the above-mentioned embodiment and each modification may be implemented in the state which replaced the relationship between an X direction and a Y direction in the range which does not produce a contradiction. For example, in the embodiment and each modification described above, the height of a region including an arbitrary side is measured by relatively moving the chuck table 36 and the displacement measuring device 48 in the X direction. By moving (36) and the displacement measuring device 48 relatively in the Y direction, the height of the region including any side can also be measured.

In addition, based on the direction of the side obtained in the embodiment and each modification described above and the four XY coordinates, the coordinates of any position of the workpiece 11 (eg, the coordinates of the center of the workpiece 11) It may be acquired and used for the subsequent processing of the to-be-processed object 11.

In addition, the structure, method, etc. which concern on embodiment and each modified example mentioned above can be implemented by changing suitably, unless it deviates from the scope of the objective of this invention.

11: Workpiece
11a: first side (surface)
11b: second side (back side)
11c: side
11d: side
11e: side
11f: side
13: Tape (dicing tape)
15: frame
17: modified layer
21a: first straight line
21b: second straight line
21c: third straight line
21d: fourth straight line
31a: first straight line
31b: second straight line
31c: third straight line
2: Laser processing unit (processing unit)
4: Bass
4a: receptacle
6: support structure
6a: support arm
8: Cassette support
10: cassette
12: positioning unit
14: conveying unit
16: moving mechanism (machining transfer mechanism, indexing transfer mechanism)
18: Y-axis guide rail
20: Y-axis movement table
22: Y-axis ball screw
24: Y-axis pulse motor
26: X-axis guide rail
28: X-axis movement table
30: X-axis ball screw
32: X-axis pulse motor
34: θ table
34a: table base
36: chuck table
38: frame
38a: recess
38b: Euro
40: maintenance plate
40a: retaining surface
42: clamp
44: irradiation head (machining unit)
44a: laser beam
46: camera (imaging unit)
48: displacement measuring instrument (measuring instrument)
48a: laser beam
50: control unit
50a: arithmetic unit
50b: memory

Claims (4)

A plate-shaped workpiece having a first surface having a rectangular shape having four sides and a second surface having a rectangular shape positioned on the opposite side to the first surface is placed on a chuck table having a holding surface and the chuck table As a processing method of a workpiece used when processing using a processing unit processing the held workpiece,
From the displacement information obtained by measuring the height of an area including the four sides of the workpiece while the second surface side of the workpiece is held on the holding surface of the chuck table, the holding surface of the side is placed on the holding surface an acquisition step of acquiring four XY coordinates indicating directions in the parallel XY plane and positions in the XY plane of the four sides;
A processing step of processing the workpiece based on the direction of the side and the four XY coordinates
A method of processing a workpiece comprising a. According to claim 1, wherein the acquiring step,
By relatively moving the measuring device for measuring the height and the chuck table, the height of the area including one side of the workpiece on two straight lines parallel to the X direction passing through different positions in the Y direction is determined. a direction obtaining step of calculating XY coordinates indicating two positions where the side and the two straight lines intersect from the displacement information obtained by measuring, and obtaining the direction of the side;
After adjusting the direction of the chuck table around the rotation axis perpendicular to the XY plane so that the direction of the side acquired in the direction acquiring step is parallel to the Y direction, the measuring device and the chuck table are relatively By moving, the height of the area including the two opposing sides of the workpiece is measured on one straight line parallel to the X direction, and from the obtained displacement information, the two opposing sides and the one straight line are measured. A first coordinate acquisition step of acquiring two XY coordinates indicating the two intersecting positions;
After adjusting the direction of the chuck table around the rotation shaft so that the direction of the side obtained in the direction obtaining step is perpendicular to the Y direction, by relatively moving the measuring device and the chuck table, On one straight line parallel to the X direction, the height of a region including two different opposite sides of the workpiece is measured, and from the obtained displacement information, 2 opposite two opposite sides and the one straight line intersect A second coordinate acquisition step of acquiring two XY coordinates representing the positions of
A processing method of a workpiece further comprising a. According to claim 1, wherein the acquiring step,
By relatively moving the measuring device for measuring the height and the chuck table, the area including the two opposite sides of the workpiece on two straight lines parallel to the X direction passing through different positions in the Y direction. A first coordinate acquisition step of measuring the height and acquiring three or more XY coordinates indicating three or more positions where the two opposite sides and the two straight lines intersect from the obtained displacement information;
relatively moving the measuring device and the chuck table in a state in which the direction of the chuck table around the rotation axis perpendicular to the XY plane is perpendicular to the direction of the chuck table in the first coordinate acquisition step Thus, on one straight line parallel to the X direction, the height of a region including two opposite sides of the workpiece is measured, and from the obtained displacement information, the two opposite sides and the one straight line are measured. A second coordinate acquisition step of acquiring two XY coordinates indicating the two intersecting positions;
Direction acquisition for acquiring the direction of one of the two opposite sides from two XY coordinates obtained in the first coordinate acquisition step and indicating two positions where one of the two opposite sides and the two straight lines intersect step and
two XY coordinates obtained in the first coordinate acquiring step based on the direction of the side acquired in the direction acquiring step, and indicating two positions where the two opposite sides and one of the two straight lines intersect; , A correction coordinate acquisition step of acquiring the corrected four XY coordinates by correcting the two XY coordinates acquired in the second coordinate acquisition step
A processing method of a workpiece further comprising a. A plate-shaped workpiece having a first surface having a rectangular shape having four sides and a second surface having a rectangular shape positioned on the opposite side to the first surface is placed on a chuck table having a holding surface and the chuck table As a processing method of a workpiece used when processing using a processing unit processing the held workpiece,
From an image obtained by imaging a region including one of the sides of the workpiece with the second surface side of the workpiece held by the holding surface of the chuck table, XY parallel to the holding surface of the side Obtaining the direction in the plane, and obtaining four XY coordinates indicating the positions of the four sides in the XY plane from the displacement information obtained by measuring the height of the area including the four sides of the workpiece acquisition stage,
A processing step of processing the workpiece based on the direction of the side and the four XY coordinates
A method of processing a workpiece comprising a.

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