JP6356560B2 - Processing method of transparent plate - Google Patents

Description

  The present invention relates to a transparent plate processing method for dividing a transparent plate such as a glass substrate into a plurality of optical components.

  Communication devices such as tablet computers, smartphones, and mobile phones include a liquid crystal screen that displays information (see, for example, Patent Document 1).

  In addition, the front surface of the liquid crystal screen is covered with an optical component made of a transparent plate such as quartz glass or sapphire glass to protect it from damage such as scratches. Thus, the optical component comprised of the transparent plate is cut out from a relatively large transparent plate (500 mm × 700 mm), painted on the outer periphery, etc., and designed with light shielding.

JP2012-120791

As described above, as a method of manufacturing an optical component coated in a predetermined region from a relatively large transparent plate, the region corresponding to the optical component is coated in a state of a relatively large transparent plate, and then the optical component is coated. It is conceivable to divide into individual optical components by irradiating a laser beam along the contour or by cutting with a cutting blade.
However, if the region corresponding to the optical component is coated in the state of the transparent plate and then divided into individual optical components by laser processing, there is a problem that the coating is discolored by heat due to irradiation of the laser beam. In addition, there is a problem that if the transparent plate is coated on an area corresponding to the optical component and then divided into individual optical components by cutting, the coating is peeled off.
Therefore, since the transparent plate is divided into individual optical components and then coated for each optical component, there is a problem that productivity is poor.

  This invention is made | formed in view of the said fact, The main technical subject is providing the processing method of the transparent plate which can manufacture efficiently the optical component by which coating was given to the predetermined area | region.

In order to solve the main technical problem, according to the present invention, a transparent plate processing method for dividing a transparent plate into a plurality of optical components,
Fracture along the contour of the optical component inside the transparent plate by irradiating along the contour of the optical component with the focal point of the pulse laser beam having a wavelength transparent to the transparent plate. A break starting point forming step for forming a starting point;
A coating process for coating a predetermined area of the transparent plate on which the fracture starting point forming process has been performed;
A dividing step of applying an external force to the transparent plate on which the coating step has been performed, and dividing the transparent plate into individual optical components along the break starting point,
A method for processing a transparent plate is provided.

  The processing method of the transparent plate according to the present invention is such that a condensing point of a pulse laser beam having a wavelength that is transparent to the transparent plate is positioned inside the transparent plate and irradiated along the contour of the optical component. After performing the break start point forming process for forming the break start point along the outline of the optical component inside, the coating process for coating the predetermined area of the transparent plate is performed, so that the coating does not change color. And after carrying out the painting process, by applying external force to the transparent plate and dividing the transparent plate into individual optical components along the break starting point, an optical component that has been coated with a light shielding design in a predetermined area Can be manufactured efficiently.

The perspective view of the transparent plate processed by the processing method of the transparent plate by this invention. The perspective view of the laser processing apparatus for implementing the fracture start point formation process in the processing method of the transparent board by this invention. Explanatory drawing of the fracture | rupture starting point formation process in the processing method of the transparent plate by this invention. The figure which shows the relationship between the numerical aperture (NA) of a lens, the refractive index (N) of a transparent plate, and the value (S = NA / N) which remove | divided the numerical aperture (NA) by the refractive index (N). Explanatory drawing of the modified layer formation process implemented by the laser processing apparatus shown in FIG. Explanatory drawing of the coating process in the processing method of the transparent plate by this invention. Explanatory drawing of the division | segmentation process in the processing method of the transparent plate by this invention. The perspective view of the optical component by which the transparent plate was divided | segmented by the processing method of the transparent plate by this invention.

  Hereinafter, a preferred embodiment of a method for processing a transparent plate according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a transparent plate processed by the transparent plate processing method according to the present invention. The transparent plate 10 shown in FIG. 1 is formed of a quartz glass substrate or a sapphire glass substrate in a rectangular shape having a length of 700 mm, a width of 500 mm, and a thickness of 500 μm. On the surface 10 a of the transparent plate 10, contours 101 a of a plurality of optical components 101, contours 102 a of through holes provided in each optical component 101 and a processing start position 103 are set. Note that the contours 101a of the plurality of optical components 101, the contours 102a of the through holes provided in each optical component 101, and the processing start position 103 are not necessarily formed in the transparent plate 10, and control of a laser processing apparatus to be described later. Design values are stored in the memory of the means.

  In order to obtain the optical component in which a predetermined area is coated from the transparent plate 10 described above, in the processing method of the transparent plate according to the present invention, first, a condensing point of a pulsed laser beam having a wavelength transmissive to the transparent plate 10. Is positioned inside the transparent plate 10 and irradiated along the contour 101a of the optical component 101, thereby performing a fracture start point forming step of forming a fracture start point along the contour 101a of the optical component 101 inside the transparent plate 10. . This rupture starting point forming step is performed using a laser processing apparatus 2 shown in FIG. The laser processing apparatus 2 shown in FIG. 2 includes a stationary base 20, a holding table mechanism 3 that is disposed on the stationary base 20 so as to be movable in the X-axis direction indicated by an arrow X, and holds the workpiece. And a laser beam irradiation unit 4 as a laser beam irradiation means disposed above.

  The holding table mechanism 3 is movable in the machining feed direction X on a pair of guide rails 31, 31 arranged in parallel along the machining feed direction X on the stationary base 20. A first sliding block 32 disposed on the first sliding block 32, a second sliding block 33 disposed on the first sliding block 32 so as to be movable in the indexing feed direction Y, and on the second sliding block 33 Are provided with a cover table 35 supported by a cylindrical member 34 and a holding table 36 as a workpiece holding means. The holding table 36 is formed in a rectangular shape, and a suction holding unit 360 for sucking and holding the transparent plate 10 is provided on the surface. A plurality of suction ports 361 corresponding to the plurality of optical components 101 formed on the transparent plate 10 are formed on the upper surface (holding surface) of the suction holding unit 360, and the plurality of suction ports 361 serve as suction means (not shown). It is connected. Accordingly, when a suction unit (not shown) is operated, negative pressure acts on the plurality of suction ports 361 and the plurality of optical components 101 formed on the transparent plate 10 placed on the suction holding unit 360 are sucked and held, respectively. The holding table 36 configured in this manner is rotated by a pulse motor (not shown) disposed in the cylindrical member 34.

  The first sliding block 32 has a pair of guided grooves 321 and 321 fitted to the pair of guide rails 31 and 31 on the lower surface thereof, and is parallel to the upper surface along the Y-axis direction. A pair of formed guide rails 322 and 322 are provided. The first sliding block 32 configured in this manner moves in the X-axis direction along the pair of guide rails 31, 31 when the guided grooves 321, 321 are fitted into the pair of guide rails 31, 31. Configured to be possible. The holding table mechanism 3 in the illustrated embodiment includes a first processing feed means 37 for moving the first sliding block 32 along the pair of guide rails 31 and 31 in the X-axis direction. The first processing feed means 37 includes a male screw rod 371 disposed in parallel between the pair of guide rails 31 and 31, and a drive source such as a pulse motor 372 for rotationally driving the male screw rod 371. It is out. One end of the male screw rod 371 is rotatably supported by a bearing block 373 fixed to the stationary base 20, and the other end is connected to the output shaft of the pulse motor 372 by transmission. The male screw rod 371 is screwed into a penetrating female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the first sliding block 32. Therefore, the first slide block 32 is moved in the X-axis direction along the guide rails 31 and 31 by driving the male screw rod 371 forward and backward by the pulse motor 372.

  The laser processing apparatus 2 shown in FIG. 2 includes X-axis direction position detection means 374 for detecting the X-axis direction position of the holding table 36. The X-axis direction position detection means 374 is a linear scale 374a disposed along the guide rail 31 and a reading which is disposed on the first sliding block 32 and moves along the linear scale 374a together with the first sliding block 32. It consists of a head 374b. In the illustrated embodiment, the reading head 374b of the X-axis direction position detecting means 374 sends a pulse signal of one pulse every 1 μm to a control means (not shown). A control means (not shown) detects the position of the holding table 36 in the X-axis direction by counting the input pulse signals. When the pulse motor 372 is used as the drive source of the first processing feed means 37, the drive table 36 counts the drive pulses of the control means (not shown) that outputs a drive signal to the pulse motor 372. The X-axis direction position can also be detected. When a servo motor is used as the drive source for the first machining feed means 37, a pulse signal output from a rotary encoder that detects the rotation speed of the servo motor is sent to a control means (not shown), and the control means inputs it. The position of the holding table 36 in the X-axis direction can also be detected by counting the number of pulse signals.

  The second sliding block 33 is provided with a pair of guided grooves 331 and 331 which are fitted to a pair of guide rails 322 and 322 provided on the upper surface of the first sliding block 32 on the lower surface thereof. By fitting the guided grooves 331 and 331 to the pair of guide rails 322 and 322, the guided grooves 331 and 331 are configured to be movable in the Y-axis direction. The holding table mechanism 3 in the illustrated embodiment has a second process for moving the second slide block 33 in the Y-axis direction along a pair of guide rails 322 and 322 provided in the first slide block 32. A feeding means 38 is provided. The second processing feed means 38 includes a male screw rod 381 disposed in parallel between the pair of guide rails 322 and 322, and a drive source such as a pulse motor 382 for rotationally driving the male screw rod 381. It is out. One end of the male screw rod 381 is rotatably supported by a bearing block 383 fixed to the upper surface of the first sliding block 32, and the other end is connected to the output shaft of the pulse motor 382. The male screw rod 381 is screwed into a penetrating female screw hole formed in a female screw block (not shown) provided on the lower surface of the central portion of the second sliding block 33. Therefore, by driving the male screw rod 381 forward and backward by the pulse motor 382, the second slide block 33 is moved along the guide rails 322 and 322 in the Y-axis direction.

  The laser processing apparatus 2 shown in FIG. 2 includes Y-axis direction position detecting means 384 for detecting the Y-axis direction position of the second sliding block 33. The Y-axis direction position detecting means 384 is a linear scale 384a disposed along the guide rail 322, and a reading which is disposed along the linear scale 384a together with the second sliding block 33 disposed along the second sliding block 33. And a head 384b. In the illustrated embodiment, the reading head 384b of the Y-axis direction position detecting means 384 sends a pulse signal of 1 pulse per 1 μm to a control means (not shown). A control means (not shown) detects the position of the holding table 36 in the Y-axis direction by counting the input pulse signals. When the pulse motor 382 is used as the drive source of the second machining feed means 38, the drive table 36 counts the drive pulses of the control means (not shown) that outputs a drive signal to the pulse motor 382. It is also possible to detect the position in the Y-axis direction. When a servo motor is used as a drive source for the second machining feed means 38, a pulse signal output from a rotary encoder that detects the rotation speed of the servo motor is sent to a control means (not shown), and the control means inputs The position of the holding table 36 in the Y-axis direction can also be detected by counting the pulse signals.

  The laser beam irradiation unit 4 includes a support member 41 disposed on the stationary base 20, a casing 42 supported by the support member 41 and extending substantially horizontally, and a laser beam disposed on the casing 42. Irradiation means 5 and imaging means 6 that is disposed at the front end of the casing 42 and detects a machining area to be laser machined are provided.

  The laser beam irradiation means 5 includes a pulse laser beam oscillation means (not shown) provided in the casing 42 and a pulse laser beam oscillation means provided with a repetition frequency setting means, and a pulse laser beam oscillation means (not shown) provided at the tip of the casing 42. A condenser 51 having a condenser lens 511 for condensing the oscillated pulse laser beam is provided. The condenser lens 511 of the condenser 51 has a numerical aperture (NA) set as follows. That is, the numerical aperture (NA) of the condenser lens 511 is set to a value obtained by dividing the numerical aperture (NA) by the refractive index (N) of the single crystal substrate in the range of 0.05 to 0.2 (numerical aperture). Setting process). The laser beam irradiating unit 5 includes a condensing point position adjusting unit (not shown) for adjusting the condensing point position of the pulse laser beam condensed by the condensing lens 511 of the condenser 51.

  The imaging means 6 attached to the tip of the casing 42 in which the laser beam irradiation means 5 is disposed includes an illumination means for illuminating the workpiece, an optical system for capturing an area illuminated by the illumination means, and the optical An image pickup device (CCD) for picking up an image captured by the system is provided, and the picked-up image signal is sent to a control means (not shown).

The illustrated laser processing apparatus 2 is configured as described above, and a fracture start point forming process performed using the laser processing apparatus 2 will be described below. In the memory constituting the control means (not shown) of the laser processing apparatus 2, the contour 101a of the plurality of optical components 101 to be formed on the transparent plate 10, the contour 102a of the through-hole provided in each optical component 101, and the processing start position 103 coordinates are stored.
In order to perform the break starting point forming step, first, the transparent plate 10 is placed on the suction holding portion 360 of the holding table 36 of the laser processing apparatus 2 shown in FIG. Then, by operating a suction unit (not shown), the plurality of optical components 101 of the transparent plate 10 placed on the suction holding unit 360 are sucked and held (transparent plate holding step).

  If the transparent plate holding step described above is performed, the holding table 36 that sucks and holds the transparent plate 10 is positioned directly below the image pickup means 6 by operating the first processing feed means 37. Then, an alignment operation for detecting whether or not the upper side 10b of the transparent plate 10 is parallel to the X-axis direction is performed by the imaging unit 6 and a control unit (not shown). If the upper side 10b of the transparent plate 10 is not parallel to the X-axis direction, a pulse motor (not shown) disposed in the cylindrical member 34 that rotates the holding table 36 is operated to set the upper side 10b of the transparent plate 10 to X. Adjust so that it is parallel to the axial direction. Then, the control means operates the first process feed means 37 and the second process feed means 38 to indicate the process start position 103 of the transparent plate 10 held by the holding table 36 as shown in FIG. It is positioned directly below the condenser 51 of the laser beam irradiation means 5. Next, a condensing point position adjusting unit (not shown) is operated so that the condensing point of the pulse laser beam LB condensed by the condensing lens 511 of the concentrator 51 is positioned at a desired position in the thickness direction of the transparent plate 10. Then, the condenser 51 is moved in the optical axis direction (positioning step). In the illustrated embodiment, the condensing point of the pulse laser beam is a desired position (for example, 5 to 10 μm from the surface (upper surface) to the back surface (lower surface) side from the surface 10a (upper surface) on which the pulse laser beam is incident on the transparent plate 10. Position).

  When the positioning step is performed as described above, the laser beam irradiating means 5 is operated, and the first processing feeding means 37 and the second processing feeding means 38 are stored in a memory constituting a control means (not shown). By controlling according to the coordinates of the contours 101a of the plurality of optical components 101 to be formed in 10 and the contours 102a of the through holes provided in the respective optical components 101, the contours 101a of the plurality of optical components 101 and the respective optical components 101 are provided. A shield tunnel forming process for irradiating the pulse laser beam LB along the outline 102a of the through hole is performed.

  By performing the shield tunnel forming process described above, the transparent plate 10 has a back surface (upper surface) from the front surface (upper surface) side where the condensing point P of the pulse laser beam LB is positioned as shown in FIG. The pores 111 and the amorphous 112 formed around the pores 111 grow over the lower surface), and are predetermined along the contour 101a of the optical component 101 and the contour 102a of the through-hole to be formed on the transparent plate 10. (In the illustrated embodiment, an amorphous shield tunnel 110 is formed at an interval of 10 μm (processing feed rate: 500 mm / second) / (repetition frequency: 50 kHz)). As shown in FIGS. 3 (c) and 3 (d), this shield tunnel 110 includes a pore 111 having a diameter of about φ1 μm formed at the center and an amorphous material having a diameter of φ10 μm formed around the pore 111. In the illustrated embodiment, the amorphous 112 adjacent to each other is connected to each other. The amorphous shield tunnel 110 formed in the above-described shield tunnel forming process can be formed from the front surface (upper surface) side to the back surface (lower surface) of the transparent plate 10, and thus the wafer is thick. However, since the pulse laser beam only needs to be irradiated once, the productivity is extremely good.

In the above-described shield tunnel forming process, in order to form a good shield tunnel 110, the numerical aperture (NA) of the condenser lens 511 is set to a numerical aperture (NA) such as a quartz glass substrate or a sapphire substrate as described above. It is important that the value (S) divided by the refractive index (N) of the crystal substrate is set in the range of 0.05 to 0.2.
Here, the relationship between the numerical aperture (NA), the refractive index (N), and the value obtained by dividing the numerical aperture (NA) by the refractive index (N) (S = NA / N) will be described with reference to FIG. . In FIG. 4, the pulsed laser beam LB incident on the condenser lens 511 is condensed at an angle (θ) with respect to the optical axis. At this time, sin θ is the numerical aperture (NA) of the condenser lens 511 (NA = sin θ). When the pulse laser beam LB condensed by the condensing lens 511 is irradiated onto the transparent plate 10 made of a single crystal substrate, the single crystal substrate constituting the transparent plate 10 has a higher density than air, and therefore the pulse laser beam LB has an angle (θ ) Is refracted at an angle (α) and condensed at a condensing point P. At this time, the angle (α) with respect to the optical axis varies depending on the refractive index (N) of the single crystal substrate constituting the transparent plate 10. Since the refractive index (N) is (N = sin θ / sin α), the value obtained by dividing the numerical aperture (NA) by the refractive index (N) of the single crystal substrate (S = NA / N) is sin α. Therefore, it is important to set sin α in the range of 0.05 to 0.2 (0.05 ≦ sin α ≦ 0.2).
Hereinafter, the reason why the value (S = NA / N) obtained by dividing the numerical aperture (NA) of the condenser lens 511 by the refractive index (N) of the single crystal substrate is set in the range of 0.05 to 0.2 will be described. To do.

[Experiment 1-1]
A shield tunnel was formed on a quartz glass substrate (refractive index: 1.45) having a thickness of 500 μm as the transparent plate 10 under the following processing conditions, and the quality of the shield tunnel was determined.

Processing condition wavelength: 1064 nm pulse laser Repetition frequency: 50 kHz
Pulse width: 10 ps
Average output: 2W
Condensing spot diameter: φ10μm
Processing feed rate: 500 mm / sec

Condenser lens numerical aperture (NA) Shield tunnel good / bad S = NA / N
0.05 Defect: None 0.035
0.1 Good 0.069
0.15 Good 0.103
0.2 Good 0.138
0.25 Good 0.172
0.3 Slightly good 0.207
0.35 Defect: A void is formed 0.241
0.4 Defect: A void is formed 0.276

As described above, in a quartz glass substrate (refractive index: 1.45), a value obtained by dividing the numerical aperture (NA) of the condenser lens 511 for condensing the pulse laser beam by the refractive index (N) of the single crystal substrate (S = NA / N) is set in a range of 0.05 to 0.2, a shield tunnel is formed. Therefore, in the quartz glass substrate (refractive index: 1.45), it is important to set the numerical aperture (NA) of the condenser lens 511 for condensing the pulse laser beam to 0.1 to 0.25.

  From Experiment 1-1 described above, the value (S = NA / N) obtained by dividing the numerical aperture (NA) of the condensing lens 511 for condensing the pulsed laser beam by the refractive index (N) of the single crystal substrate is 0.05 to. It was confirmed that a shield tunnel was formed by setting the range to 0.2.

[Experiment 1-2]
A shield tunnel was formed on the sapphire (Al ₂ O ₃ ) substrate (refractive index: 1.76) having a thickness of 500 μm as the transparent plate 10 under the following processing conditions, and the quality of the shield tunnel was judged.

Processing condition wavelength: 1064 nm pulse laser Repetition frequency: 50 kHz
Pulse width: 10 ps
Average output: 2W
Condensing spot diameter: φ10μm
Processing feed rate: 500 mm / sec

Condenser lens numerical aperture (NA) Shield tunnel good / bad S = NA / N
0.05 Defect: None
0.1 Slightly good 0.057
0.15 Good 0.085
0.2 Good 0.114
0.25 Good 0.142
0.3 Good 0.170
0.35 Good 0.198
0.4 Defect 0.227
0.45 Defect: Void is generated 0.5 Defect: Void is formed 0.55 Defect: Void is formed 0.6 Defect: Void is formed

As described above, in the sapphire substrate (refractive index: 1.76), the numerical aperture (NA) of the condensing lens 511 for condensing the pulse laser beam is equal to the refractive index (N) of the single crystal substrate. By setting the value divided by (S = NA / N) in the range of 0.05 to 0.2, a shield tunnel is formed. Therefore, in the sapphire substrate (refractive index: 1.76), it is important to set the numerical aperture (NA) of the condenser lens 511 that condenses the pulse laser beam to 0.1 to 0.35.

  A value obtained by dividing the numerical aperture (NA) of the condenser lens 511 for condensing the pulse laser beam by the refractive index (N) of the single crystal substrate (S = NA / N) from Experiment 1-1 and Experiment 1-2 described above. It was confirmed that a shield tunnel was formed by setting the value in a range of 0.05 to 0.2.

Next, another embodiment of the fracture starting point forming step will be described.
As another embodiment of the fracture starting point forming step, the condensing point P is transparent by setting the numerical aperture (NA) of the condensing lens 511 to 0.7 to 0.9 as shown in FIG. By irradiating a pulsed laser beam having a wavelength that is transparent to the transparent plate 10 while being positioned inside the plate 10, a modified layer serving as a starting point of breakage in the transparent plate 10 as shown in FIG. 120 can be formed (modified layer forming process). Therefore, the modified layer is formed along the contour 101a of the optical component 101 to be formed and the contour 102a of the through hole marked on the transparent plate 10. However, since the depth of the modified layer formed by irradiating the pulse laser beam once is about 30 μm, when the thickness of the transparent plate 10 is 500 μm, six or more layers are formed in the thickness direction of the transparent plate 10. A modified layer is formed. The processing conditions for forming the modified layer on the quartz glass substrate and sapphire substrate having a thickness of 500 μm are the same, and the processing is performed under the following processing conditions.
Processing conditions Numerical aperture (NA) of condensing lens: 0.8
Wavelength: 1064 nm pulse laser Repeat frequency: 50 kHz
Pulse width: 10 ps
Average output: 2W
Condensing spot diameter: φ10μm
Processing feed rate: 500 mm / sec Number of shots: 6 times

If the fracture start point forming process described above is performed, a coating process for coating a predetermined region of the transparent plate 10 is performed.
That is, as shown in FIG. 6, a fracture start point forming step is performed, and a required region on the surface of the transparent plate 10 (in the illustrated embodiment, a contour in which the shield tunnels 110 or the modified layers 120 of the plurality of optical components 101 are formed). The coating 130 is applied to both sides and the lower portion of 101a and the periphery of the through-hole contour 102a in which the shield tunnel 110 or the modified layer 120 provided in each optical component 101 is formed. This coating process can be carried out by, for example, masking the area other than the application of the coating 130 on the surface of the transparent plate 10 by performing the fracture starting point forming process and spraying the paint.

  Next, an external force is applied to the transparent plate 10 on which the painting step has been performed, and a dividing step is performed in which the transparent plate 10 is divided into individual optical components 101 along the break starting point. In this dividing step, as shown in FIG. 7, the transparent plate 10 on which the coating step has been performed is placed on the rubber pad 7, and an external force is applied to the transparent plate 10 by rolling the roller 70 on the transparent plate 10. The transparent plate 10 is divided along the shield tunnel 110 or the modified layer 120 as a starting point of breakage. As a result, the transparent plate 10 is divided into individual optical components 101 along the contours 101a of the plurality of optical components 101 on which the shield tunnel 110 or the modified layer 120 is formed. The shield tunnel 110 or the modified layer 120 formed along the through-hole contour 102a is pressed from the fracture start point by being pressed by an appropriate pressing means along the through-hole contour 102a provided in each optical component 101. Thus, the region surrounded by the outline 102a of the through hole is removed. As a result, the optical component 101 in which the through hole 102 is formed as shown in FIG. 8 is obtained. A coating 130 is applied to the surface of the optical component 101 on both sides and the lower portion and around the through-hole 102.

  As described above, in the illustrated embodiment, the shield tunnel 110 or the modified layer 120 serving as a breakage starting point is formed along the outline 101a of the plurality of optical components 101 and the outline 102a of the through-hole set on the transparent plate 10. After performing the fracture starting point forming process, the painting process is performed in which the coating 130 is applied to the sides 102 and the lower part of the outline 101a of the plurality of optical components 101 and the outline 102a of the through-hole provided in each optical component 101. There is no discoloration. Then, after carrying out the painting process, an external force is applied to the transparent plate 10 and the transparent plate 10 is divided into individual optical components 101 along the breakage starting point, so that both sides and the lower portion of the surface and the periphery of the through-hole 102 In addition, the optical component 101 having the design 130 applied with the light shielding can be efficiently manufactured.

2: Laser processing device 3: Holding table mechanism 36: Holding table 37: First processing feeding means 38: Second processing feeding means 4: Laser beam irradiation unit 5: Laser beam irradiation means 51: Condenser 6: Imaging means 7 : Rubber pad 70: Roller 10: Transparent plate

Claims (1)

A transparent plate processing method for dividing a transparent plate into a plurality of optical components,
Fracture along the contour of the optical component inside the transparent plate by irradiating along the contour of the optical component with the focal point of the pulse laser beam having a wavelength transparent to the transparent plate. A break starting point forming step for forming a starting point;
A coating process for coating a predetermined area of the transparent plate on which the fracture starting point forming process has been performed;
A dividing step of applying an external force to the transparent plate on which the coating step has been performed, and dividing the transparent plate into individual optical components along the break starting point,
A method for processing a transparent plate.