CN101687228B - Cleaning process and apparatus - Google Patents
Cleaning process and apparatus Download PDFInfo
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- CN101687228B CN101687228B CN200880021905XA CN200880021905A CN101687228B CN 101687228 B CN101687228 B CN 101687228B CN 200880021905X A CN200880021905X A CN 200880021905XA CN 200880021905 A CN200880021905 A CN 200880021905A CN 101687228 B CN101687228 B CN 101687228B
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- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A method for cleaning an article held by support, the method comprising the steps of applying an acoustic wave to said article and support; rotating said article and support such that an area on the article previously masked by the support is exposed to said acoustic wave.
Description
Technical field
The method that the present invention relates to cleaning systems and be used for cleaning substrate includes but not limited to different materials, for example the discoid substrate of glass, aluminium and silicon.
Background technology
Computer, electronics and entertainment industry use many discoid substrates to be used for the manufacturing of electronic circuit.These substrates typically comprise silicon chip, aluminium, plastics, glass, pottery and meet material.For convenient, said these materials will be discussed aluminium or glass in notice.Yet this should not be construed as the restriction to application of the present invention.
In the mill, these substrates will experience many processing, comprise conduction, the nonconducting and semi-conducting material of the material that applies and remove magnetic, optics and magneto-optic of repetition.
In manufacture process, substrate must repeatedly be polished, polishing, etching and cleaning.Because the trend of substrate design is towards miniaturization, the clean level that requires in the manufacture process of substrate also improves.Particularly, the complicated multilayer circuit substrate that requires to make thereon cleans very much.Otherwise, defective can appear, and cause thus production declining, production time to increase and the product quality variation.
A kind of known design to for the cleaning module that cleans the aluminium dish comprises the cleaning station, and it has two and is set to brush cylinder adjacent one another are.These two brush cylinders form two center longitudinal axis parallel to each other.Then one or more aluminium dishes are arranged between two center longitudinal axis of brush cylinder, thus at brush cylinder around their longitudinal axis whens rotation separately, the opposite side of dish can be cleaned.
First shortcoming of this known cleaning module is that it possibly can't satisfy the desired higher clean level of modern Application (for example integrated circuit of miniaturization).This is that this causes aforesaid defect of substrate inevitably because of every side and not maximization of the contact area between the brush cylinder separately at each dish.
Second shortcoming of this known cleaning module is the substrate limited amount that it cleaned within preset time.This is because be subject to simultaneously the restriction of aluminium dish diameter by the quantity of the aluminium dish of two brush cylinder cleanings.In addition, the contact between brush and dish only is the line contact.Therefore, for the whole diameter of dish, brush must move down in order to guarantee and contact fully between dish and the brush.As a result, the time of staying of dish in the cleaning station is quite long.
In addition, this known cleaning module generally has more than one cleaning station.The 3rd shortcoming of known cleaning module is that these aluminium dishes are individually transferred to another cleaning station from a cleaning station gradually.Therefore, cause in the transfer process between the different cleaning station and loading and unloading " free time " in the process of these dishes.
When these dishes are in the cleaning slot, also produce another problem.In this case, these dishes are kept by support member (often being at two points from the below), and these dishes will stand high frequency waves.Recently, it is more common using mega sonic wave (namely having the sound wave that is typically greater than 700kHz ground frequency).These mega sonic waves are sent by the bottom from groove, in this bottom cleaning fluid flooded these dishes and sound wave produce will be from the get on cavitation bubble of particle-removing of dish.In this layout, dish to stand mega sonic wave then by from groove, remove for the treatment of the next stage.Yet mega sonic wave sends from the bottom of groove inevitably, and the support member that these dishes are installed on it produces shade at dish, thereby hinders these ripples to act on the part of described dish.In the past, when ultrasonic wave more commonly used, these ripples have long wavelength, and since ultrasonic wave around the diffraction of support member with therefore weaken shade on dish, the problem of shade is not to occur so continually.Use more the mega sonic wave with shorter wavelength to be not easy to diffraction, therefore, the problem of " shade " of support member dish is more remarkable.
For the dish in cleaning slot particularly, another problem of the method is that cleaning fluid sticks dish when these dishes are shifted out from groove.After each coating processing, dish need to be cleaned, and will be cleaned again in the final stage before being assembled to hard disk drive fully.Because cleaning process is usually directed to these dishes are immersed in the groove of cleaning fluid with support member, from groove, shift out subsequently these dishes and cause fluid to sticking of coiling, cause staining and spot from the xerantic solvent of differing of solvent.
In another stage of processing, before being transferred to discharge point, these dishes are placed in the baking oven dry.Baking oven depends on many factors to the rate of drying of dish, such as but not limited to:
I) temperature of the air in baking oven;
Ii) speed of the air circulation in baking oven and mode;
Iii) radiation effect of baking oven;
Iv) other thermals source of using in addition, and;
V) air pressure in baking oven.
Relating to capital cost yet baking oven adjusted in order to advantageously affect rate of drying, therefore, is useful although accelerate rate of drying economically, and this expense possibly can't prove can obtain final benefit.
In each case, if the different phase of processing with different layouts in order to avoid at least one determined problem of prior art then better.
Another shortcoming of prior art relates to potential danger and the cleaning efficiency of the cross pollution in the deposit process in the fluid media (medium) in the immersion tank stayed that remove to suspend.Immersion tank is used for providing medium, removes the particle that is shifted by this medium from substrate, and substrate then is rinsed.Purpose is to use the circulation of fluid media (medium) with the outlet of particle deflection, thereby these particles go out from concentrated flow.Therefore, purpose is to keep the medium of relative Particle free to be attached on the substrate of back to prevent particle again.In order to allow immersion tank that cleaning function is provided, it is crucial effectively removing particle.
The groove design relates to an end place that is positioned at groove and enters near the entrance of the medium in bottom.Any particle that has been deposited to the bottom can both be got back to suspension by stirring in the direction that generally makes progress, from the bottom towards the weir that allows MEDIA FLOW near top surface layer.This design dependency is in the particle that will be pushed in this layer, so that their toward weir and being trapped in the weir after precipitation.Remove medium in the scope of weir with pump, so just removed particle.For this design, the result is: make easily the particle aggregation that carries in the formed whirlpool of stream from the entrance to the weir with the inconsistent dead angle of the overall flow of medium from the entrance to the weir in groove.Another problem relates to the overall deflection of particle on the direction of inlet streams.Although entrance is positioned to approach the particle moving that allows to be deposited on the bottom with the bottom, yet this has formed disorderly environment so that particle moves in random direction.The particle of certain percentage will be followed main flow and be located to the weir, and then be removed.Yet quite the particle of percentage in fact only can be along random walk and is therefore stayed in the immersion tank with suspending.Like this, what replacement was removed particle from groove is that the particle that possible avoid polluting substrate is forced in the suspension and thereby the larger problem of generation now.
Summary of the invention
A kind of cleaning module be used to cleaning one or more substrates of first aspect design of the present invention comprises being operable as the one or more brushes that move along the radial path about described substrate.For example, this cleaning module can be more useful, but is not limited to, and is used for cleaning aluminium dish.
Preferably, brush can be near a side of substrate, thereby when brush was shifted to the center of substrate, the appropriate section crossover of the scrubbing part of described brush and substrate was to be in contact with one another.
In a preferred embodiment, cleaning module comprises that also the substrate whirligig is with rotary substrate when substrate contacts with the scrubbing part of brush.The substrate whirligig can comprise the rotatable shaft of the periphery that is connected to described at least one substrate.The surf zone maximization that this scrubbing part that can allow the quilt of substrate to brush cleans.
Preferably, described brush is rotatable with the area of maximization for the scrubbing part of the brush of cleaning substrate.In this embodiment, contact with the line of the brush of prior art longitudinally and to compare, described brush provides " zone " to contact.For the situation of dish stop same time in the cleaning station, this can provide the per unit area actual time of contact longer than vertical brush.
Preferably, substrate and brush are operable as at same direction rotation, thereby the relative frictional force between brush and substrate can more effectively clean the latter.
The radius of gyration of brush is designed to the suboptimization that radius more than or equal to substrate can allow the scrubbing part cleaning that the quilt of substrate brushes.
In addition, this cleaning module can also comprise the one or more periphery brushes for the outer rim of cleaning substrate, and/or is used for cleaning at the one or more interior brush at the edge in the hole of substrate.This can guarantee the higher levels of cleaning of substrate.For the application of the miniaturization that relates to integrated circuit, this will be useful.
A second aspect of the present invention relates to a kind of method of locating one or more brushes during the one or more substrates of cleaning, comprises step: move described brush along the radial path about substrate.The method especially but do not get rid of is used for cleaning aluminium dish.
A third aspect of the present invention relates to a kind of method that cleans one or more substrates, and the method comprises the following steps: to move one or more brushes along the radial path about substrate, and makes the scrubbing part of brush and the appropriate section crossover of substrate.
By rotary substrate when the appropriate section crossover of scrubbing part and the substrate of brush, the surf zone that the scrubbing part that the quilt of substrate is brushed cleans can be optimised.
Preferably, the method for this cleaning substrate can also comprise step: rotating brush is with the area maximization of the scrubbing part of the brush that is used in cleaning substrate.
Preferably, brush and substrate are at same direction rotation, thus the relative frictional force cleaning latter between the scrubbing part of brushing and substrate.
In addition, the method for this cleaning substrate can also comprise step: mobile one or more periphery brushes are adjacent with the edge of substrate, and/or mobile one or more interior brushes are adjacent with the edge in the hole of substrate, with satisfied higher levels of substrate cleaning that may needs.
In fourth aspect, the invention provides a kind of method for cleaning the article that kept by support member, the method comprises the following steps: to apply sound wave on described article and support member; Rotate described article and support member so that before supported the zone of covering on the described article is exposed under the described sound wave.
Therefore by rotation and thereby change the station of article, by the shade displacement that support member causes, therefore allow the part of the previous crested of dish is optionally exposed make cleaning thorough under the mega sonic wave owing to be exposed to.
In a preferred embodiment, article can be dish, substrate, wafer or other objects with flat profile.
In a preferred embodiment, support member can comprise for the support that once engages several article.In a preferred embodiment, engagement means can be by gravity, can also be by article being placed on the outwards outstanding lug.Alternatively, joint can be by vacuum or mechanical engagement, and for those joints or the support of a part that relates to described support member at the part formation shade of article, the present invention is all applicable.
Preferably, rotation has the pivot outside dish.In this example, rotation can realize by the fully rotation of dish and support member.Alternately, thus dish can around its oneself central rotation by support member as roller in case in groove rolling disc.
In aspect the 5th, the invention provides a kind of cleaning systems for clean article, comprising: the support member that article are located thereon; Sonic generator is used for guiding sound wave along the path that overlaps with support member and article; Described support member is arranged as optionally and rotates around pivot, and therefore rotates described article.
In aspect the 6th, the invention provides a kind of method for remove article from cleaning systems, in the groove that comprises the following steps: to provide supported of described article to engage and be immersed in cleaning fluid; Move down described groove in order to article are moved to wherein the station that the part of article at least no longer is submerged from complete submergence station with respect to article; Remove article from described groove.
In aspect the 7th, the invention provides a kind of cleaning systems for clean article, comprising: the groove that comprises clean liquid; Be used in clean liquid, engaging the support member of article; Wherein said groove can optionally moved for the direction of removing described article from described clean liquid with respect to described support member.
In eight aspect, the invention provides a kind of method of dry goods, comprise the following steps: described article are placed in the baking oven; Then remuval of damp and hot air-flow; Guide described thermal current into described baking oven.
By baking oven being made amendment (comprise and for example increase the extra energy, enhancing circulation of air and supercharging), can affect for example factor of the drying of the article of dish in baking oven.Yet another factor comprises the humidity that reduces in baking oven self.By the predrying thermal current that enters in the baking oven before entering baking oven, can get around dexterously the problem relevant with rate of drying.
In a preferred embodiment, in order further to reduce temperature, moisture separator can be added to baking oven.
In aspect the 9th, the invention provides and a kind ofly be suspended in the collecting chamber assembly of the particle in the immersion tank for collection, comprising: the permeable screen cloth that described particle can pass through; Chamber in described assembly, thus described chamber entered by described screen cloth to the particle in the described assembly, described chamber is communicated with the outlet fluid of described groove, and the particle that wherein enters the collecting chamber assembly leaves described groove by outlet.
In aspect the tenth, the invention provides a kind of intake assembly for promoting in the fluid inflow groove, described assembly comprises: aperture array, described opening together homogeneous turbulence body source are communicated with; Described aperture arrangement is for so that be parallel to direction from the stream of each other opening from the direction of the flow of arbitrary opening.
The array that provides access is realized two useful aspects.The firstth, reduce the disturbance in groove.Having single larger entrance according to prior art causes along the stream of the axial path of this entrance.Yet the shear pressure that is between mobile and the stationary fluid at the periphery edge of this stream can form whirlpool, and the therefore disturbance in groove.By the array that provides access, can in groove, produce larger and more uniform stream, thereby the impact of the edge effect of restriction main flow.
In yet another aspect, the invention provides a kind of collecting chamber assembly, have the screen cloth that particle can pass through.This permeable screen cloth can be placed on darker station, groove inherence, and the larger zone that wherein can catch particle can be provided.
Should be noted that the permeability of screen cloth refers to particle by the ability of screen cloth, it may be to pass through by the perforation that is formed in the screen cloth.The accurate dimension of perforation depends on the particle of removing from substrate, and this is common practise for a person skilled in the art.
Screen cloth can be conducive in one direction transfer particle.For example, compared with allowing particle to escape, the easier permission particle of screen cloth is by entering in the collecting chamber assembly.A method that realizes this point is the perforation with taper, thereby perforation can be greater than the aperture in the chamber side in the aperture of " groove side ".This effect can by molded, cold pressing or penetrate screen cloth with taper-type dropper and realize.
Providing the weir to arrange only is in order to be positioned at the particle of near surface.The collecting chamber assembly allows particle to enter in any degree of depth that capture chamber gives prominence to.Thereby the increase of particle collecting zone will be caught more a high proportion of particle inevitably.
Therefore, the dead band relevant with prior art is reduced by larger stream zone, and, formerly be a problem in the prior art scheme at the indoor particle that is in suspension of submergence, then disposed valuably now, because they can be partial to towards capture chamber by larger stream zone subsequently.
Description of drawings
For facility, with further reference to accompanying drawing the present invention is described, possible layout of the present invention shown in the accompanying drawing.The present invention also can adopt other layouts, and therefore, and the details in the accompanying drawing should not be understood to be to replace the generality in the explanation of front of the present invention.
Fig. 1 is illustrated in the cleaning module before substrate cleaning is processed;
Fig. 2 illustrates the example of the robot lift in the cleaning module of Fig. 1;
Fig. 3 illustrates the processing jig pallet in the cleaning module of Fig. 1;
Fig. 4 illustrates the first cleaning station of the cleaning module of Fig. 1;
Fig. 5 is illustrated in the closure diagram that first of Fig. 4 cleans a cleaned substrate of place, station;
Fig. 6 illustrates the second cleaning station of the cleaning module of Fig. 1;
Fig. 7 is illustrated in the closure diagram that second of Fig. 6 cleans a cleaned substrate of place, station;
Fig. 8 illustrates the 3rd cleaning station of the cleaning module of Fig. 1;
Fig. 9 is illustrated in the cleaning module after substrate cleaning is processed;
Figure 10 is illustrated in the side view at the cleaning station in the different structure;
Figure 11 illustrates the cleaning module at the cleaning station that comprises Figure 10;
Figure 12 A and 12B are the planes of dish, and the substrate cleaning method according to two embodiment of the present invention is shown;
Figure 13 A illustrates the according to an embodiment of the invention front view of support member and dish to 13E;
Figure 14 illustrates the according to another embodiment of the present invention sequenced front view of cleaning slot;
Figure 15 illustrates the front view according to the immersion tank of prior art;
Figure 16 A and 16B illustrate the according to an embodiment of the invention front view of collecting chamber assembly;
Figure 17 is illustrated in the interactional schematic diagram of arranging interior adjacent submergence spout according to the entrance of further embodiment of this invention; And
Figure 18 A and 18B illustrate the according to another embodiment of the present invention isometric drawing of immersion tank.
The specific embodiment
Fig. 1 illustrates the cleaning module 101 that is used for cleaning one or more substrates according to an embodiment.In this example, this cleaning module 101 is divided into three parts: loading part 103; Cleaning section 105; With unloading section 107.
Loading part 103 comprises that form is three substrate carrier or the magazine of feed jig pallet 109, and each is used for keeping 20 one folded discoid substrates 110.Be transferred to before pallet 109 is used for according to cleaning of the present invention, these substrates 110 can live through various upstream process (for example Ultrasonic Cleaning).
Before substrate cleaning was processed, the substrate 110 at the place, the station that evenly separates in particular pallet 109 was transferred to the processing jig pallet 113 that cleans in the station 103 by the robot collector.Cleaning section 103 comprises three cleaning stations 401,601,801, and they will be described later.In order to simplify, the details relevant with processing jig pallet 113 that cleaning station only is shown in the drawings.
Fig. 2 provides the robot lift's 201 who is arranged in pallet 109 tops that keep 25 substrates 110 example.Robot lift 210 comprises 5 lifting arms 203 that are arranged in parallel.In addition, each distance between adjacent lifting arm 203 is identical, and can be any multiple of the sum of each substrate 110.Robot lift 201 can be simultaneously risen all (1+kn) individual substrates to processing jig pallet 113 from pallet 109, wherein variable " k " be the multiple of substrate sum and variable " n " can be any integer 0,1,2,3 ... }.For specific present embodiment, as shown in Figure 2, " k " value is 5.Like this, between elementary period, lifting arm 203 can be simultaneously from the 1st, the 6th, the 11st, the 16th and the 21st substrate 110 of pallet 109 rises to processing jig pallet 113 in cleaning.
When lifting arm 203 when substrate 110 in the pallet 109 aligns, their engage simultaneously the periphery edge of (1+kn) individual substrate below the horizontal diameter axis of substrate, so that substrates that these are chosen are transferred to as shown in Figure 3 processing jig pallet 113 from pallet 109.
With reference to figure 1, in the beginning process of clean cycle, the robot lift that the 1st, 3,5,7,9,11,13,15,17 and 19 substrate 110 from the left end of pallet 109 is similar to robot lift 201 transfers to the processing jig pallet 113 the cleaning section 105.At the substrate with varying number or have among another embodiment of robot lift of difference " k " value, will be risen to from pallet 109 substrate of processing jig pallet 113 is determined by expression formula (1+kn), such as explained, n={0,1,2,3, ..., and " k " is the multiple of substrate thickness.
Fig. 4 to 9 illustrates the operation to each station.For simplicity, these stations are considered separately, and a pallet 113 once is shown in the accompanying drawing.In a preferred embodiment, at each station a plurality of pallets are arranged, simultaneously cleaning is carried out at each station.Usually, pallet 113 moves to each station, finishes simultaneously processing, and then pallet moves along conveyer, and new pallet is introduced in the first stop 401, and at far-end, pallet 113 is turned from conveyer and removed.Then empty pallet 113 can be introduced at the section start that is used for receiving new building of operation again, the perhaps replacement by the operator, the independent conveyer of perhaps processing by further automation.Below, this process is described in more detail.
When processing jig pallet 113 and move into the first cleaning station 401, this row brush 403 be lowered with a part of crossover of dish, this part is in the present embodiment less than half of the surface area of each substrate 110.Because brush 402 and substrate 110 crossovers, they contact each other.
Fig. 5 illustrates by the closure figure of one of substrate 110 of a pair of brush 403 cleanings, in every side of substrate 110 brush is arranged.When brush 403 moved along the radial path with respect to substrate 110, the scouring section 501 of each brush and substrate 110 crossovers were to contact the counterpart of substrate 110.
With the axle 205 that rotation motor in the counterclockwise direction drives, substrate 110 is rotated by operation motor 207 at opposite clockwise direction, thereby substrate 110 is cleaned by the scouring section of brush 403.Similarly, brush 403 also is connected to the motor (not shown), thereby they are also rotating with substrate rotating photo clockwise direction together.As a result, clean the latter in the scouring section of brush 403 and the relative frictional force between the substrate 110.
Advantageously, the radius of gyration of brush 403 equals or is preferably more than the radius of substrate 110, thereby because in the scouring section 501 of brush 403 and the separately relative CONTACT WITH FRICTION between the side of substrate 110, substrate 110 is by up hill and dale cleaning of brush 403.Brush 403 the radius of gyration usually can be than the radius of substrate 110 about 5mm that grows up.Therefore, because embodiments of the invention are negated the round effect (circular effects) during cleaning is processed, on the surface that preset time, substrate 110 can be cleaned by prior art greater than substrate by the surfaces of brush 403 cleanings, describe with reference to Figure 12 A and 12B.
In the present embodiment, this row brush 403 rises to former initial station thereafter between 5 to 20 seconds the clean cycle duration.
After having cleaned substrate 110 at place, the first cleaning station, process jig pallet 113 and then move towards the second cleaning station 601 along cleaning section 105.
The second cleaning station 601 comprises 10 one rows' periphery brush 603.When processing jig pallet 113 and move in the second cleaning station 601, thereby this row's periphery brush 603 reduces the periphery edge of contact substrates 110.In addition, the second cleaning station 601 also comprises for the interior brush 605 of cleaning 10 one rows at the edge in the hole of each substrate 110.
Fig. 7 illustrates by the closure figure of one of substrate 110 of periphery brush 603 and interior brush 605 the two cleanings.When both contacted respectively with the edge in the periphery edge of substrate 110 and the hole of substrate 110 when periphery brush 603 and interior brush 605, substrate 110 rotated in the clockwise direction.Like this, the outer ledge of substrate 110 and inside edge are both by substrate 110 with brush opposite CONTACT WITH FRICTION cleaning between 603,605.
Advantageously, interior brush 605 is connected to the motor (not shown), thereby interior brush is rotating about the opposite counter clockwise direction of substrate rotation.This makes the cleaning time of substrate 110 shorter.Thereby, advantageously, allow periphery brush 603 also rotate with substrate rotating photo clockwise direction together.Like this, the relative frictional force cleaning latter between brush 603,605 and the substrate.
After at 601 places, the second cleaning station the cleaning of substrate 110 being finished, process jig pallet 109 and advance to the cleaning of the 3rd shown in Fig. 8 station 801.When processing jig pallet 113 and move into the 3rd cleaning station 801,20 one rows' brush 803 reduce with the only about half of regional crossover on each surface of substrate.Can find out that the 3rd cleaning station 401 is identical with the first cleaning station, does not therefore need further detailed description.
Should be appreciated that the clean level of substrate 110 is enhanced when substrate 110 is sequentially cleaned in three cleaning stations.In addition, consider the modularity at cleaning station 401,601,801, can be adjusted at independently of one another the duration of each clean cycle at 401,601,801 places, cleaning station.
When the substrate cleaning at 801 places, the 3rd cleaning station is finished, process jig pallet 109 moves to cleaning section 105 again along cleaning section 105 opposite end.Another is arranged in the unloading section 107 adjacent with the opposite end of cleaning section 105 for material clamp 901.Dependence operates another robot lift with the robot lift's 201 same or analogous mode of operations with Fig. 2, and then the substrate 110 on the processing jig pallet 109 in cleaning section 105 is raised to the pallet 901 in the unloading section 107 of cleaning module 101.
After substrate 110 was transferred to pallet 901, as required, then substrate can experience various downstream (for example Ultrasonic).
Then, the robot lift of cleaning module 101 moves back to the pallet 109 in the loading part 103, simultaneously lifting arm moves the distance an of substrate thickness (or a dice spaced), processes jig pallet 113 thereby can be transferred to corresponding to lower a series of substrates 110 of the 2nd, 4,6,8,10,12,14,16,18 and 20 substrate 110 from the left end of pallet 109.Then, continue again and identical as mentioned above cleaning.
Like this, when processing jig pallet 113 and move through cleaning station 105, a plurality of substrates 110 are transferred to next cleaning from a cleaning station together and are stood.This and prior art are opposite, and in the prior art, these substrates are generally by single transfer.Thereby, should be appreciated that cleaning module 110 makes reprinting and unload the single substrate caused " free time " that will clean the shortest.
Although three cleaning stations 401,601,801 in cleaning module 101 are disclosed as modularization or independently, should be appreciated that can be with them in conjunction with cleaning the station to form one.The side view at this one cleaning station (being designated as 1001) only is shown in Figure 10 for brevity.
This one cleaning station 1001 comprises and is arranged as parallel to each other and perpendicular to 10 elongated members (one of them is designated as 1002) of the moving direction of processing jig pallet 113.
Elongated member 1002 comprises three arms 1003,1005,1007 that extend from elongated portion, and respectively with identical as previously described one group of brush 403; 603; 605; 803.Thereby, can see that one cleaning station 1001 combines three cleaning stations 401,601,801.Therefore, in this embodiment, elongated member 1002 can be realized cleaning at all stations simultaneously.
When processing jig pallet 113 and be moved in the one cleaning station 1001, one cleaning station 1001 reduces, thereby is processing substrate 110 on the jig pallet 113 by arbitrary group of brush 403; 603; 605; 803 cleanings.Another arm (not shown) can be set during cleaning, to support this dish.Support arm is best to the second cleaning station, and guaranteeing the application of periphery brush 603, it may tend to stablizing of during cleaning destruction dish and thereby it be pushed away alignment.By providing support, dish can be maintained at suitable station.
In addition, support arm can provide extra driving to rotate this dish.Do like this, the contact between support arm and dish can be with roller, and described roller provides the needed torque of all or part in order to drive the rotation of described dish.
Consider this one cleaning station 1001, being to be appreciated that to have the one or more processing jig pallets that cleaning section 105 moves that are parallel to.This is because arm 1003,1005,1007 can be designed to align with substrate 110 in described one or more processing jig pallets, thereby substrate 110 can be simultaneously by the brush 401 of all groups; 601; 605; 803 cleanings.
Figure 11 illustrates the cleaning module 110 with one cleaning station 1001.For brevity, not shown one cleaning station 1001 and robot lift in Figure 11.In this example, cleaning module 110 comprises that three are processed jig pallet 113a-c.To move to next cleaning station opposite with processing anchor clamps 113 cleaning of from cleaning section 105 station on conveyer, and processing anchor clamps 113a-c is fixed on the suitable station in the cleaning section 105.This is because substrate 110 is shifted between adjacent pallet along cleaning module 101 by special robot lift.
Should be appreciated that if the quantity of cleaned substrate 110 during wishing to be increased in substrate cleaning and processing, this design of cleaning module 101 may be suitable.
Can expect that also the substrate whirligig can be the form of the axle that drives of motor, this axle can operate to be fixed on the wall of medium pore of substrate 110.Yet substrate 110 may be risen from processing jig pallet 113, rotates together thereby substrate 110 can be fixed to the axle that the institute's speed motor on it drives with them.
In addition, it will also be appreciated that brush 403,803 also can be fully and the side crossover of substrate 110.Like this, when brush 403,803 or substrate 110 rotation, perhaps when brush 403,803 and substrate 110 all rotate in the opposite direction, so that the relative frictional force between brush 403,803 and substrate 110 cleans the latter.
Figure 12 A and 12B illustrate the effect that changes the scouring pattern based on the radius of gyration of brush with respect to the diameter of dish.
In Figure 12 A, the situation that the radius of gyration 1110 wherein is significantly less than the diameter of the dish 1105 of being cleaned is shown.Although be extreme case, this illustrates dust 1115 and is deposited on the periphery of cleaning radius 1110.Because radius is very little, dust is stayed on dish 1105 surface 1120 whole or at least part of, thereby has offset the benefit of scrub process.
On the contrary, Figure 12 B illustrates the effect that has obviously greater than the radius 1210 of the diameter of dish 1205.Here, dust 1220,1230 is deposited on the internal diameter or hole 1215 and periphery edge 1225 of dish.By hole 1215 and periphery edge 1230 are applied scrub process, dust 1220,1230 is removed from coiling 1205 in two step process.
In fact, the radius of gyration of brush can change, and different benefits is provided.Although illustrate some advantages of relatively large radius, it should not thought limitation of the present invention because no matter the radius of gyration how, the efficient of the method all is better than the effect of prior art.
Thereby, although with preferred embodiment the present invention is described, such as those skilled in the clear, can make within the scope of the claims many changes, and not depart from scope of the present invention as claimed in claim.
Figure 13 A illustrates the detailed diagram of support member 1305, and this support member is used to engage article, for example coils (not shown), when its in cleaning slot the time.Cleaning slot typically is filled with cleaning fluid, for example gentle deionized water or the isopropyl alcohol of dilution.
Typically, this groove has the sonic generator in the bottom, and the support member reduction is coiled and is used for cleaning in the groove thus, and sonic generator produces ripple and produce subsequently the hole with the particle-removing that gets on from dish.The ultrasonic wave of frequency of utilization about 200kHz traditionally, the recent then frequency used has begun to be used more at large greater than the mega sonic wave of 700kHz.Use mega sonic wave ground characteristic shown in Figure 13 A.Because high frequency, its wavelength is shorter, thereby such as less the manifesting of diffraction pattern in the experience of the supersonic cleaning as shown in Figure 13 B.The result is, the undersized shade that subtracts concerning ultrasonic wave shown in Figure 13 B affects 1325 and replaced by larger shadow region 1315 concerning the mega sonic wave cleaning now.These shades by the contact support member 1305 sound wave start cause that this support member is seen from the downstream of described support member and is equivalent to veil.Thereby although known the shade 1325 that has to a certain degree in traditional supersonic cleaning, because the increase of the size of shade 1315, this problem is exaggerated and therefore becomes even more serious for the mega sonic wave cleaning.
Figure 13 C demonstrates according to an embodiment of the invention scheme to 13E.In traditional cleaning slot, dish is by supports support, and support member has lug or the projection at two some place contact discs in the bottom of coiling.Figure 13 C illustrates with the traditional arrangement of 1350 supported supports of its mid-game and similarly arranges, wherein support member can be mounted in a pair of lug 1305 on the larger support that keeps several such dishes.These dishes are lowered in the cleaning slot 1355, therefore are immersed in the cleaning fluid.When sound wave contact lug 1305, keep not cleaned from lug 1305 for the part that the shade 1345 in downstream causes coiling.Scheme according to this embodiment of the invention is that dish 1350 is rotated around pivot 1340.Although hatching effect can not removed in the station by change dish 1350, the shade that is caused by lug 1305 moves to the different piece of dish, previous " hypographous " zone of dish is exposed under the sound wave and thereby cleaned.As from seeing Figure 13 D, dish 1350 has centered on pivot 1340 ROT13s 60, thereby forms new shadow region 1365, but shade before is exposed under the sound wave, so realizes effectively with thoroughly cleaning of coiling.In order to guarantee within usually relevant with the cleaning time of staying up hill and dale cleaning, support member can swing in opposite direction 1370, and thereby make other shadow region 1375, but also it the first two shadow region is exposed so that promotion is cleaned.
At this time of vibration, the quantity of the vibration of dish and used time will change according to the type of the cleaning that will carry out, and it will be apparent to those skilled in the art that needs the time of staying how long in order to clean up hill and dale any zone that lives through shade in liquid.
The rotation of dish can be avoided the problem relevant with the shadow region.The station that should be appreciated that the point of rotation can change according to the character of cleaning, and determines that the desirable point of rotation for any concrete situation only is conventional test.For example, the present invention also comprises the point of rotation that has in the zone of dish, thereby for example in the center dish rotation of dish itself and the support member maintenance is static.Its realization can be by allowing lug take on roller, and the rotation by lug/roller comes rotating disc like this, in order to expose hypographous zone to the cleaning sound wave.
Figure 14 illustrates cleaning slot 1405, wants cleaned article to be in this example dish 1410 in this groove, is immersed in the cleaning fluid and by lug 1415 and supports.Traditional means that shift out article in the cleaning back of following relate to and rise article and without cleaning fluid.Yet this cleaning fluid that will cause quite mentioning is attached on and causes on the article spot occurring when dry goods, and further, owing to the even spot that forms of the uneven drying of staying the fluid on the article.Relate to a plurality of steps according to the solution of the present invention, its purpose is to make fluid that sticking of article minimized.In first step, the rule method is similar to passing, and these article are in this example for dish 1410, and are raised by the lug 1420 of rising support member, until this dish 1410 is near the surface 1406 of cleaning fluid 1407.Then groove 1405 reduces by 1425 rather than coil raised.Therefore, the electrostatic attraction of the fluid of the more volume in groove is tended to fluid is pulled away from the surface of dish, and this is namely, impossible with making in the dish situation about rising from groove in opposite situation.This principle is called " dynamically drying ".Then groove is reduced, until the centre bore 1421 of dish leaves the surface of cleaning slot, stop reduction process 1425 this moment.At last, projection 1430 is inserted in the hole 1421, and dish is lifted away from support member 1415 and takes away in order to will coil from cleaning fluid.
The problem relevant with existing method amplified by the centre bore in coiling.When coiling in a consecutive steps when rising from cleaning slot, this hole produces disturbance on the surface of cleaning fluid.Observed in the place in dish cleaning fluid contact hole broken string has been arranged.Thereby, this programme seek by the level that the hole is coiled in rise then reduce whole cleaning slot rather than from solvent rise coil to reduce this broken string.
To coil another problem that rises from the clean surface in a continuous moving is the relative velocity on the surface of solvent streams placing.Therefore the surf zone that is retained on the cleaning fluid that still is attached on panel surface is more and more less, because different at the flow velocity of the cleaning fluid of panel surface, has increased the speed that forms the cleaning fluid droplet in panel surface.By reducing whole groove, suitable volume, the cleaning fluid that sticks if not whole flows down from panel surface, thereby the danger that forms the cleaning fluid droplet is significantly reduced.
Also have, in order to accelerate dry run, solvent is heated in order to improve any evaporation rate of staying the solvent on the dish.Typically, the temperature of solvent is lifted between 50 ℃ to 60 ℃.
Another problem of prior art is after substrate is removed particle, removes the ability of particle from immersion tank.Therefore typically, after cleaning, substrate is rinsed, and stays the deposit of the particle of suspension or precipitation in the bottom of groove.For fear of the cross pollution of the substrate that in shifting out the substrate that is rinsed, produces, use the layout shown in Figure 15 that particle is removed from groove.As will be described, stay in the groove and the situation of the cleannes of the next group substrate that impact will be rinsed for the particle that significant proportion is arranged, the method is not effective especially.
This groove 1500 of prior art has the fluid that the promotes deionized water for example entrance 1505 that flows in the groove 1500.Because entrance 1505 is as the submergence spout, with the streaming flow of experience with the identical viscosity of immersion fluid, it is typically 1 to 4 dispersion gradient 1511, although it can be subject to the wall of spout and groove and the adjacent restriction of bottom.Thereby for larger-diameter entrance 1505, the diffusion of injection will increase along with being ejected into the length in the groove.The opposite end of groove is flatly pointed in the injection 1530 of diffusion.Remain in the groove 1500 and then the particles 1535 that suspend are pointed to 1540 outsides from spraying, and when the flushing flow filling slot of fluid, upwards flow through it, cross the weir subsequently and be collected in bottom 1555.Typically, bottom 1555 links with pump, and 1515 Fluid Circulation forms the process of removing particle 1550 to the weir from entrance 1505.
Yet, use this entrance 1505 to form the outer disturbance region of diffusion zone.This causes whirlpool 1560A, B, and it is by the mobile fluid outside diffusion zone and the shearing between the stationary fluid and effectively form.Whirlpool 1560A, B will be captured in particle 1565A, B in the whirlpool, therefore make the removal particle more difficult.The more outside in the zone outside near the diffuse flow 1530 these are being positioned at the bottom of groove has formed the dead band, does not wherein have what Fluid Circulation to remove sediment 1565A from such dead band.Therefore, the particle of significant proportion and particularly those have sunk as the sedimental particle of precipitation and will stay in the groove, and may only have by the labor cleaning to groove and just can be removed.
A solution to this problem is at the embodiment shown in Figure 16 A and the 16B according to of the present invention.Because the weir arrangement requirement particle of prior art at first is in suspension, secondly from the bottom of groove, removed, be difficult to guarantee therefore that the weir can collect all particles effectively.Thereby according to the present invention, collecting chamber assembly 1605 can be installed in the groove 1600.In this example, the collecting chamber assembly comprises screen cloth 1620, and it is the thin slice with perforation basically, but can wait be all net or other this type of have a flat member of the opening that can pass through by its particle.
Perforation can change according to the kind of all material the ratio of the gross area of screen cloth.For example, in one embodiment, be of a size of the sheet metal that 300mm takes advantage of 200mm, for example stainless steel can have 0.06m
2The gross area.In this thin slice, opening or perforation can form by for example punching press, and diameter range is 1 to 2mm.Be spaced apart the situation of 10mm, opening or perforation field to the ratio of the area of whole thin slice in 0.7% to 2.9% scope.
Should be appreciated that the replacement sheet metal, also can use plastic tab, for example polyethylene or polypropylene thus can punching press or molded these openings.
In another embodiment, screen cloth can be silk screen, uses for example stainless steel wire of 1mm of diameter.For the opening of 1mm, the interval is reduced to 2mm, and described ratio is brought up to about 20%.
Should be appreciated that preference based on the user can change the selection to practical puncture size and interval, like this equally to the selection of the kind of screen cloth and structure.
Can use many alternative layouts, but in the present embodiment, screen cloth is crossed over the total length of collecting chamber assembly, this assembly has uniform perforation distributions in described screen cloth.Because in the present embodiment, the collecting chamber assembly is crossed over from the bottom of groove to the substantial distance on surface, the particle in any motion in groove but not only those particles near the surface can collect the chamber of being collected.Thereby, in the situation that has formed whirlpool 1640, when whirlpool 1640 during its screw during at moving particles on the direction of screen cloth, the particle 1645 in the whirlpool 1640 that keeps motion may still pass through screen cloth 1620.In case particle 1635 is in the described chamber, screen cloth will be taken on the barrier of a part of delivery chamber 1637 that stops these particles.In addition, screen cloth self will be as obstruction, the mobile dissipation that whirlpool is caused.Thereby in case particle enters chamber 1637, most of the energy that whirlpool 1640 gives will be weakened, and therefore with those Particle Phase ratios at outdoor, particle 1635 is deenergized relatively.Therefore, particle will sink 1636 and sink to the bottom 1639 of chamber, and they are removed 1638 to promote fluid from the outflow of groove 1600 by pump or other devices there.
Thereby the present invention who has merged collecting chamber assembly 1605 can remove particle from groove, no matter whether form whirlpool in the dead band of groove.Thereby, keep particle device at the volley, no matter whether it is directly to be partial to collecting chamber 1605 or only to move near this assembly, will cause the removal of particle.
Another scheme to this problem shown in Figure 15 is to replace single entrance with entrance array 1705A, B, C.This entrance array can be accumulated and have the area identical with the single entrance of prior art.Yet the wider distribution of entrance array 1705A, B, C produces the wider zonation of diffusion 1710, thereby the flow point cloth 1725 at the place, early station in groove 1700 is much bigger.Because 1725 uniformity of flow point cloth is higher, the generation in dead band is significantly reduced (if not the words that are completely eliminated), thereby the particle of collecting in these stations also obviously reduces.Should be appreciated that the distribution and concentrating in groove of the geometry of groove, the flow by entrance and particle can indicate direction from the stream of entrance in order to reach optimum efficiency.
In another embodiment of the present invention, the scheme among Figure 16 A, B and Figure 17 can be incorporated in the scheme shown in Figure 18 A and the 18B.Here, groove 1800 shown in two independent diagrams in order to be clear that two features that are combined among the single embodiment.Therefore, arrange that entrance array 1805 is at an end of roughly elongated groove 1800.This entrance array 1805 is given prominence to by level and is realized across three pipes of groove along an end of described groove.Each pipe has one and enters mouth in order to have the entrance of concentrating level across the height of groove.Three pipes itself also provide the entrance array of two dimension in order to form the very broad flow point cloth that passes through these entrances.These pipes are connected to the manifold with fluid source 1810, are dispersed to entrance by the manifold fluid.Entrance is directed on the direction on the surface that is parallel to groove longitudinally downward along groove 1825, and roughly points to collecting chamber assembly 1815.In the present embodiment, the collecting chamber assembly comprises the screen cloth of the distal end wall of basic covering groove 1800, in order to accept the wide diffuse flow from entrance 1805.Work in the mode shown in Figure 16 A and the 16B, the particle in groove will be diffused the screen cloth 1830 that stream 1825 moved and be guided through collecting chamber assembly 1815.Thereby, at the embodiment shown in Figure 18 A and the 18B benefit of all useful embodiment described herein is shown, because wide diffuse flow is avoided the generation of whirlpool and the gathering of particle in the dead band subsequently.Because from the directed collecting chamber assembly 1815 of the stream of entrance 1805, all particles that are captured in this stream will have very large possibility by screen cloth (if not passing through at once), will finally pass through screen cloth 1825 times in constant flow.Therefore, particle will be trapped in the collecting chamber assembly.Both as the face of accepting also in the situation as the device of dispersion train, the particle that the quilt in assembly 1815 deenergizes will be fallen the bottom of assembly at screen cloth, and near at once can be by the bottom that is positioned at collecting chamber outlet 1820 is removed them.
Thereby can see that various aspects of the present invention can provide benefit individually with respect to prior art, and can provide very effective means in the venue for from groove 1800, removing particle.
Claims (9)
1. cleaning module that is used for cleaning a plurality of substrates, this module comprises:
Pallet for the described substrate of relationship support of opening with predetermined space;
Be positioned at more than first brushes of first stop, in the corresponding described a plurality of substrates of each brush one;
Also comprise more than second brushes that are positioned at second station, and
Be used for described pallet is moved to from described first stop the conveyer of described second station;
Wherein, each brush can operate with about each substrate path movement radially.
2. cleaning module according to claim 1, wherein, the described substrate of described tray support is so that the plane that is limited by described substrate is parallel.
3. cleaning module according to claim 1 also comprises a plurality of periphery brushes, is used for the outer rim of each substrate of cleaning, and a plurality of interior brush, is used for the edge in the hole of each substrate of cleaning;
Described a plurality of periphery brushes and interior brush are located at the 3rd station in the middle of described the first and second stations;
Wherein, described conveyer is suitable for that also described pallet is moved to described the 3rd station from described first stop and then moves to described second station.
One kind the cleaning a plurality of substrates method, the method comprises the following steps:
The described substrate of relationship support of opening with predetermined space by pallet;
More than first brushes that are positioned at first stop are about described substrate path and with the overlapping movement of counterpart of scrubbing part and the substrate of described brush radially, in the described a plurality of substrates of each brush correspondence one;
Described pallet is moved to second station from described first stop;
More than second brushes that are positioned at second station are about described substrate path and with the overlapping movement of counterpart of scrubbing part and the substrate of described brush radially, in the described a plurality of substrates of each brush correspondence one.
5. method according to claim 4, the method also comprises the step of rotating described substrate.
6. method according to claim 5 also comprises the step of rotating described brush.
7. method according to claim 6, wherein said substrate and described brush are at same direction rotation.
8. method according to claim 4 also comprises the step that is adjacent to mobile a plurality of periphery brushes with the edge of described substrate.
9. method according to claim 4, also comprise with described substrate in the edge in hole be adjacent to the step of mobile a plurality of interior brushes.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200702957-2A SG147336A1 (en) | 2007-04-27 | 2007-04-27 | Cleaning process and apparatus |
| SG2007029572 | 2007-04-27 | ||
| SG200702957-2 | 2007-04-27 | ||
| SG200719147-1A SG147361A1 (en) | 2007-04-27 | 2007-12-24 | Cleaning process and apparatus |
| SG200719147-1 | 2007-12-24 | ||
| SG2007191471 | 2007-12-24 | ||
| PCT/SG2008/000133 WO2008133593A2 (en) | 2007-04-27 | 2008-04-22 | Cleaning process and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101687228A CN101687228A (en) | 2010-03-31 |
| CN101687228B true CN101687228B (en) | 2013-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880021905XA Active CN101687228B (en) | 2007-04-27 | 2008-04-22 | Cleaning process and apparatus |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN101687228B (en) |
| SG (3) | SG147336A1 (en) |
| TW (1) | TWI473667B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057273A (en) * | 2015-08-27 | 2015-11-18 | 苏州凯锝微电子有限公司 | Ultrasonic lens cleaning device |
| CN107716273A (en) * | 2016-08-12 | 2018-02-23 | 宁波创润新材料有限公司 | To the processing method of metalliferous material |
| CN107401893A (en) * | 2017-08-21 | 2017-11-28 | 无锡市强力干燥设备厂 | PCR reacts lid plate rubber dedicated drying case |
| JP7101528B2 (en) * | 2018-04-25 | 2022-07-15 | 東京エレクトロン株式会社 | Board processing equipment |
| CN112354764B (en) * | 2020-11-12 | 2021-08-06 | 湖南昕泰装饰材料有限公司 | Surface pretreatment device for aluminum profile machining |
| CN114683163A (en) * | 2020-12-31 | 2022-07-01 | 上海新昇半导体科技有限公司 | Dehumidifying device and polishing equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0173025A1 (en) * | 1984-07-16 | 1986-03-05 | Westinghouse Electric Corporation | Internal tube cutting tool |
| US5937469A (en) * | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0652977U (en) * | 1992-12-22 | 1994-07-19 | 株式会社北村製作所 | Cleaning equipment |
| JPH10323635A (en) * | 1997-05-26 | 1998-12-08 | Sony Corp | Ultrasonic cleaning device |
| JP2001274130A (en) * | 2000-03-24 | 2001-10-05 | Mitsubishi Electric Corp | Method of wet cleaning and manufacturing semiconductor device |
| US6871657B2 (en) * | 2001-04-06 | 2005-03-29 | Akrion, Llc | Low profile wafer carrier |
| US6532974B2 (en) * | 2001-04-06 | 2003-03-18 | Akrion Llc | Process tank with pressurized mist generation |
| TWI234497B (en) * | 2004-08-17 | 2005-06-21 | Yang-Kuan Wang | Device using ultrasonic waves to clean LP records |
| US20070006892A1 (en) * | 2005-07-08 | 2007-01-11 | Imtec Acculine, Inc. | Uniform, far-field megasonic cleaning method and apparatus |
| TWI348939B (en) * | 2006-12-22 | 2011-09-21 | Hon Hai Prec Ind Co Ltd | Apparatus for cleaning article |
-
2007
- 2007-04-27 SG SG200702957-2A patent/SG147336A1/en unknown
- 2007-12-24 SG SG200719147-1A patent/SG147361A1/en unknown
- 2007-12-24 SG SG2010079713A patent/SG180053A1/en unknown
-
2008
- 2008-04-22 CN CN200880021905XA patent/CN101687228B/en active Active
- 2008-04-28 TW TW97115680A patent/TWI473667B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0173025A1 (en) * | 1984-07-16 | 1986-03-05 | Westinghouse Electric Corporation | Internal tube cutting tool |
| US5937469A (en) * | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| SG180053A1 (en) | 2012-05-30 |
| SG147336A1 (en) | 2008-11-28 |
| TWI473667B (en) | 2015-02-21 |
| TW200900166A (en) | 2009-01-01 |
| SG147361A1 (en) | 2008-11-28 |
| CN101687228A (en) | 2010-03-31 |
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